Mass laser transfer device
By using a combination of a height measurement sensor and an adjustment module in the laser massive transfer device, the problem of low chip transfer yield caused by the difference in spatial position between wafer and substrate is solved, and precise chip transfer and yield improvement are achieved.
Patent Information
- Application Number
- CN202421989385.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-15
AI Technical Summary
In the existing laser mass transfer technology, the difference in spatial position between the wafer and the substrate leads to a lower yield of chip transfer.
A laser mass transfer device is designed, including a laser processing module, a wafer fixing member, a substrate support table and an adjustment assembly. Multi-point height data is collected through the wafer height measurement sensor and the substrate height measurement sensor, and the adjustment module is used to adjust the inclination angle and spacing of the substrate relative to the wafer, so that the wafer and each area of the substrate are kept consistent in the spatial position.
The chips on each area of the wafer are accurately landed on the corresponding electrodes in the corresponding area on the substrate, which significantly improves the yield of chip transfer.
Smart Images
Figure CN222981930U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a laser mass transfer device. Background Art
[0002] Micro-LED has the advantages of low power consumption, high resolution, fast response, long life, etc., and is expected to become the future mainstream display technology. After the Micro-LED is manufactured, a huge number of chips need to be transferred from the growth wafer to the substrate with a driving circuit. Therefore, the mass transfer technology with both transfer yield and efficiency is of great significance to the mass production and commercialization of Micro-LED.
[0003] The mass transfer technology has extremely high precision requirements (<1um). At present, there are various mass transfer methods for Micro-LED, such as physical pick-up transfer, fluid self-assembly transfer, self-aligning roller transfer printing, laser mass transfer, etc. Among them, the laser mass transfer technology uses a laser to irradiate the interface between the chip and the wafer. After the materials in the interface area absorb the laser energy, a reaction occurs to peel the chip from the wafer and fall on the substrate with electrodes. During the laser transfer process, the distance Gap between the wafer and the substrate directly affects the position and attitude of the chip transferred to the substrate. However, after the wafer and the substrate are placed in place, due to the possible differences in the spatial positions (spacing and tilt angle) of each region of the wafer and the substrate itself, the chips in each region of the wafer cannot accurately fall on the corresponding electrodes in the corresponding regions of the substrate, resulting in a low yield of chip transfer. Summary of the Utility Model
[0004] In view of the above defects or improvement requirements of the prior art, the utility model provides a laser mass transfer device, the purpose of which is to make the corresponding regions on the wafer and the substrate maintain consistent spatial positions during the transfer processing, so that the chips in each region of the wafer can accurately fall on the corresponding electrodes in the corresponding regions of the substrate, thereby improving the yield of chip transfer.
[0005] To achieve the above purpose, the utility model provides a laser mass transfer device, which includes a laser processing module, a wafer fixing member, a substrate support table and an adjusting component;
[0006] The laser processing module, the wafer fixing member and the substrate support table are sequentially arranged at intervals in the first direction. The laser processing module is used to irradiate the chips on the wafer. The wafer fixing member is used to fix the wafer above the substrate. The substrate support table is used to support the substrate;
[0007] The adjustment assembly includes an adjustment module, a wafer height measurement sensor, a substrate height measurement sensor, a lateral movement module, and a control module. The lateral movement module is configured to drive the wafer fixture and the adjustment module to stepwise move in a second direction or a third direction. The wafer height measurement sensor and the substrate height measurement sensor are respectively configured to measure the height in a first direction between an area on the wafer and an area on the substrate each time the wafer fixture and the adjustment module stepwise move once. The output end of the adjustment module is connected to the substrate support platform to adjust the tilt angle and spacing between the substrate and the wafer after each stepwise movement of the wafer fixture and the adjustment module, so that the distances in the first direction between the areas on the wafer and the corresponding areas on the substrate are the same. The control module is electrically connected to the wafer height measurement sensor, the substrate height measurement sensor, and the adjustment module respectively.
[0008] Optionally, the lateral movement module includes two displacement mechanisms. Each displacement mechanism includes a second displacement unit and a third displacement unit. The output shaft of the second displacement unit is connected to the third displacement unit to drive the third displacement unit to move in the second direction. The output end of the third displacement unit of one displacement mechanism is connected to the wafer fixture to drive the wafer fixture to move in the third direction. The output end of the third displacement unit of the other displacement mechanism is connected to the adjustment module to drive the adjustment module to move in the third direction.
[0009] Optionally, the adjustment module includes a bottom plate and three adjustment modules. The substrate support platform is located between the wafer fixture and the bottom plate. The three adjustment modules are circumferentially and equidistantly arranged on the bottom plate. The output end of each adjustment module is movably connected to the substrate support platform to drive the substrate support platform to lift in the first direction.
[0010] Optionally, each adjustment module includes a linear module, a first slider, and a second slider. The linear module is located on the bottom plate. The output end of the linear module is drivingly connected to the first slider to drive the first slider to move towards or away from the central axis of the bottom plate. The second slider is obliquely arranged on the first slider and is slidably engaged with the first slider. The second slider is movably connected to the substrate support platform.
[0011] Optionally, each adjustment module includes a motor, a lead screw, and a lifting block. The motor is located on the bottom plate. The bottom plate has a plurality of columns extending in the first direction. The lead screw extends in the first direction. The output end of the motor is drivingly connected to the lead screw to drive the lead screw to rotate. The lifting block is sleeved on the lead screw, and the lifting block is slidably engaged with the corresponding column. The lifting block is movably connected to the substrate support platform.
[0012] Optionally, the wafer height measurement sensor, the wafer fixing member, the substrate support table, and the substrate height measurement sensor are sequentially arranged at intervals in the first direction.
[0013] Optionally, the adjustment module and the substrate support table are both provided with avoidance holes, and in the first direction, the substrate height measurement sensor is arranged opposite to the avoidance holes.
[0014] Optionally, the distance between the wafer height measurement sensor and the laser processing module in the second direction or the third direction is a unit step distance of the transverse movement module, and when the transverse movement module drives the wafer fixing member and the adjustment module to move one unit step distance in the second direction or the third direction, the current area on the wafer and the current area on the substrate are respectively switched to the next area.
[0015] Optionally, the laser mass transfer device is configured such that when the laser processing module processes an area on the wafer, the wafer height measurement sensor detects the height of an adjacent area on the wafer in the first direction, and the substrate height measurement sensor detects the height of an adjacent area on the substrate in the first direction.
[0016] Optionally, when the current area on the wafer and the current area on the substrate are respectively switched to the next area, the step distance D of the transverse movement module is the distance between adjacent areas on the wafer and / or the distance between adjacent areas on the substrate, and when the wafer height measurement sensor and the substrate height measurement sensor detect the height of the current area on the wafer and the current area on the substrate in the first direction, the step distance d of the transverse movement module is less than D.
[0017] Optionally, the wafer height measurement sensor and the substrate height measurement sensor are spectral confocal sensors.
[0018] As long as the above-mentioned improved technical features do not conflict with each other, they can be combined with each other.
[0019] Generally speaking, compared with the prior art, the beneficial effects of the above technical solutions conceived by the present invention include:
[0020] For a laser mass transfer device provided by an embodiment of the present utility model, when transferring chips from a wafer to a substrate, first, the wafer is fixed on a wafer fixing member, and the substrate is placed on a substrate support table. Then, the chips on the wafer are partitioned, that is, the same number of corresponding regions are formed on the substrate. A wafer height measurement sensor detects the height of a certain point in each region of the wafer in a first direction, and a substrate height measurement sensor detects the height of a certain point in the corresponding region on the substrate in the first direction. Thereafter, a transverse movement module drives the wafer fixing member and an adjustment module to move a small distance (not exceeding the step distance) in a second direction or a third direction, and the height of other points in this region is measured again. The small distance movement is repeated multiple times. By measuring the height data of multiple points (at least 3 points) in the same corresponding region multiple times, the wafer height measurement sensor and the substrate height measurement sensor send the height data of multiple corresponding points in the same region to a control module. The control module processes and adjusts the adjustment module, that is, according to the processing requirements, after adjusting the tilt angle and spacing between the substrate and the wafer, the distances in the first direction between each region on the wafer and the corresponding regions on the substrate are made the same, so that the spatial positions of the corresponding regions of the wafer and the substrate are kept consistent. On this basis, the chips in this region on the wafer are irradiated by a laser processing module, so that the chips accurately fall on the corresponding regions on the substrate. Then, the transverse movement module drives the wafer fixing member and the adjustment module to move a step distance in a second direction or a third direction, so as to perform transfer processing on the chips in adjacent regions on the wafer, and repeat the above steps, that is, also according to the processing requirements, make the spatial positions of the adjacent regions of the substrate and the wafer keep consistent, and irradiate the chips in adjacent regions on the wafer by a laser module. By analogy, the transfer processing of all regions on the wafer is completed, and it can be ensured that the corresponding regions on the wafer and the substrate are all kept consistent in spatial position during the processing, so that the chips in each region on the wafer all accurately fall on the corresponding electrodes in the corresponding regions on the substrate, improving the yield of chip transfer.
[0021] That is to say, a laser mass transfer device provided by an embodiment of the present utility model can make the corresponding regions on the wafer and the substrate keep consistent in spatial position during the transfer processing, so that the chips in each region on the wafer all accurately fall on the corresponding electrodes in the corresponding regions on the substrate, improving the yield of chip transfer. Description of the Drawings
[0022] Figure 1 is a schematic structural diagram of a laser mass transfer device provided by an embodiment of the present utility model;
[0023] Figure 2 is a schematic structural diagram of an adjustment module provided by an embodiment of the present utility model;
[0024] Figure 3It is a schematic structural diagram of an adjustment module provided by an embodiment of the present utility model;
[0025] Figure 4 It is a schematic diagram of the partition of a wafer provided by an embodiment of the present utility model;
[0026] Figure 5 It is a schematic principle diagram of a height measurement sensor in an embodiment of the present utility model for collecting height data in a corresponding area.
[0027] In all the drawings, the same reference numerals represent the same technical features, specifically:
[0028] 1. Laser processing module; 2. Wafer fixing member; 3. Substrate support table; 4. Adjustment module; 41. Bottom plate; 42. Linear module; 43. First slider; 44. Second slider; 45. Motor; 46. Lead screw; 47. Lifting block; 48. Column; 5. Wafer height measurement sensor; 6. Substrate height measurement sensor; 7. Displacement mechanism; 8. Avoidance hole; 100. Wafer; 200. Substrate. Specific embodiments
[0029] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model. In addition, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.
[0030] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.
[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0032] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0033] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on the top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal height than the second feature.
[0034] The applicant's research found that after the wafer and the substrate are placed in place, due to the possible differences in the spatial positions (spacing and inclination angle) of each region of the wafer and the substrate itself, the chips in each region of the wafer cannot accurately fall on the corresponding region of the substrate, resulting in a low yield of chip transfer. Therefore, the applicant divides the wafer and the substrate into multiple partitions respectively, for example Figure 3 as shown in the schematic diagram of the wafer partition. At least three height data are collected for each partition of the wafer and the substrate, and then according to the collected data, the distance between each region on the wafer and the corresponding regions on the substrate in the first direction is adjusted to be the same through the adjustment module, thereby improving the yield of chip transfer.
[0035] Embodiment:
[0036] Figure 1 is a schematic structural diagram of a laser mass transfer device provided by an embodiment of the present utility model, as Figure 1 shown. The laser mass transfer device includes a laser processing module 1, a wafer fixing member 2, a substrate support table 3 and an adjustment component.
[0037] The laser processing module 1, the wafer fixing member 2 and the substrate support table 3 are arranged at intervals in sequence in the first direction (Z-axis direction). The laser processing module 1 is used to irradiate the chips on the wafer 100, the wafer fixing member 2 is used to fix the wafer 100 above the substrate 200, and the substrate support table 3 is used to support the substrate 200.
[0038] The adjustment assembly includes an adjustment module 4, a wafer height measurement sensor 5, a substrate height measurement sensor 6, a transverse movement module, and a control module (not shown in the figure). The transverse movement module is used to drive the wafer fixture 2 and the adjustment module 4 to stepwise move along the second direction (X-axis direction) or the third direction (Y direction). The wafer height measurement sensor 5 and the substrate height measurement sensor 6 are respectively used to measure the height in the first direction between an area on the wafer and an area on the substrate every time the wafer fixture 2 and the adjustment module 4 stepwise move once. The output end of the adjustment module 4 is connected to the substrate support table 3 to adjust the tilt angle and spacing between the substrate 200 and the wafer 100 every time the wafer fixture 2 and the adjustment module 4 stepwise move once, so that the distances in the first direction between the areas on the wafer 100 and the corresponding areas on the substrate 200 are the same. The control module is electrically connected to the wafer height measurement sensor 5, the substrate height measurement sensor 6, and the adjustment module 4 respectively.
[0039] For a laser mass transfer device provided by an embodiment of the present utility model, when transferring a chip from a wafer 100 to a substrate 200, first, the wafer 100 is fixed on a wafer fixing member 2, and the substrate 200 is placed on a substrate support table 3. The chips on the wafer 100 are partitioned, and several laser spots are required to complete the transfer for each area. Correspondingly, the same number of areas are also formed on the substrate 200. A wafer height measurement sensor 5 detects the height of a certain point in each area on the wafer 100 in the first direction, and a substrate height measurement sensor 6 detects the height of a certain point in the corresponding area on the substrate 200 in the first direction. Thereafter, the traverse module drives the wafer fixing member 2 and the adjustment module 4 to move a small distance (not exceeding the step distance) in the second direction or the third direction, and then measures the height of other points in this area again. The small distance movement is repeated multiple times. By measuring the height data of multiple points (at least 3 points) in the same corresponding area multiple times, the wafer height measurement sensor 5 and the substrate height measurement sensor 6 send the height data of multiple points corresponding to the same area to the control module. The control module processes and adjusts the adjustment module 4, that is, according to the processing requirements, after adjusting the tilt angle and spacing between the substrate 200 and the wafer 100, the distance in the first direction between the area on the wafer 100 and the corresponding area on the substrate 200 is made the same, so that the spatial positions of the area of the wafer 100 and the substrate 200 are kept consistent. On this basis, the laser processing module 1 irradiates the chips in this area on the wafer 100, so that the chips accurately fall on the corresponding area on the substrate 200. Then, the traverse module drives the wafer fixing member 2 and the adjustment module 4 to move the step distance in the second direction or the third direction, so as to transfer and process the chips in the adjacent area on the wafer 100, and repeat the above steps, that is, also according to the processing requirements, using the height data of at least 3 points of the currently to-be-processed area of the wafer and the currently to-receive chip area of the substrate measured during the previous processing, the spatial positions of the adjacent areas on the substrate 200 and the wafer 100 are also kept consistent, and the laser processing module 1 irradiates the chips in the adjacent area on the wafer 100. And so on, the transfer processing of all areas on the wafer 100 is completed, and the spatial positions of the corresponding areas on the wafer 100 and the substrate 200 can be kept consistent during the processing, so that the chips in each area on the wafer 100 accurately fall on the corresponding electrodes in the corresponding areas on the substrate 200, improving the yield of chip transfer.
[0040] That is to say, a laser mass transfer device provided by an embodiment of the present utility model can make the spatial positions of the corresponding areas on the wafer 100 and the substrate 200 consistent during the transfer processing, so that the chips in each area on the wafer 100 accurately fall on the corresponding electrodes in the corresponding areas on the substrate 200, improving the yield of chip transfer.
[0041] It should be noted that the control module is a conventional hardware structure in the art, which is used to process data and generate corresponding control signals. In addition, after measuring the height data of multiple points in the same corresponding area multiple times in cooperation with the height measurement sensor and the transverse movement module, the transverse movement module moves the wafer 100 and the substrate 200 to the initial position to prepare for the subsequent partition transfer processing by moving the step distance of the wafer 100 and the substrate 200.
[0042] Exemplarily, the wafer height measurement sensor 5 and the substrate height measurement sensor 6 are spectral confocal sensors. The spectral confocal sensor has high detection accuracy and high sensitivity.
[0043] Exemplarily, the substrate support table 3 is provided with a plurality of vacuum adsorption holes arranged at intervals, and each vacuum adsorption hole is communicated with a vacuum pumping device, so as to realize the adsorption and fixation of the substrate 200. The wafer fixing member 2 can be a mechanical gripper.
[0044] In this embodiment, the transverse movement module includes two displacement mechanisms 7. Each displacement mechanism 7 includes a second displacement unit and a third displacement unit (not shown in the figure). The output shaft of the second displacement unit is connected to the third displacement unit to drive the third displacement unit to move in the second direction. The output end of the third displacement unit of one displacement mechanism 7 is connected to the wafer fixing member 2 to drive the wafer fixing member 2 to move in the third direction. The output end of the third displacement unit of the other displacement mechanism 7 is connected to the adjustment module 4 to drive the adjustment module 4 to move in the third direction.
[0045] In the above embodiment, the two displacement mechanisms 7 can respectively drive and displace the wafer 100 and the substrate 200 in the horizontal direction, so as to realize the horizontal position adjustment. The second displacement unit and the third displacement unit can respectively realize the X-axis direction position adjustment and the Y-axis direction position adjustment in the horizontal direction.
[0046] Exemplarily, the second displacement unit and the third displacement unit can be linear modules or stepping cylinders.
[0047] Figure 2 is a schematic structural diagram of the adjustment module provided by the embodiment of the present invention, as Figure 2 shown, the adjustment module 4 includes a bottom plate 41 and three adjustment modules. The substrate support table 3 is located between the wafer fixing member 2 and the bottom plate 41. The three adjustment modules are circumferentially and equidistantly arranged on the bottom plate 41. The output ends of the adjustment modules are all movably connected to the substrate support table 3 to drive the substrate support table 3 to lift in the first direction.
[0048] It is easy to understand that when a certain area of the substrate 200 is tilted relative to the wafer 100, one or more of the adjustment modules can be controlled to drive the substrate support table 3 to rise and fall from the corresponding position to deflect the substrate support table 3, thereby achieving real-time leveling of the substrate 200 on the substrate support table 3 and ensuring the horizontality of the substrate 200 on the substrate support table 3. In addition, by controlling all the adjustment modules to synchronously drive the substrate support table 3 to rise and fall from their respective corresponding positions, the lifting and lowering adjustment of the substrate support table 3 can be implemented, thereby driving the substrate 200 to rise and fall synchronously, so as to implement the height adjustment of the substrate 200.
[0049] In one implementation of the utility model, each adjustment module includes a linear module 42, a first slider 43 and a second slider 44. The linear module 42 is located on the base plate 41. The output end of the linear module 42 is transmission-connected to the first slider 43 to drive the first slider 43 to move toward the central axis of the base plate 41 or away from the central axis of the base plate 41. The second slider 44 is obliquely arranged on the first slider 43 and slidably cooperates with the first slider 43. The second slider 44 is movably connected to the substrate support table 3.
[0050] In the above embodiment, when the linear module 42 drives the first slider 43 to move outward, the second slider 44 slides upward obliquely relative to the first slider 43, so that the substrate support table 3 rises, and then the substrate support table 3 is tilted accordingly. Similarly, when the linear module 42 drives the first slider 43 to move inward, the second slider 44 slides downward obliquely relative to the first slider 43, so that the substrate support table 3 falls, and then the substrate support table 3 is tilted accordingly.
[0051] Exemplarily, the second slider 44 is connected to the substrate support platform 3 via a universal ball, and the universal ball can rotate freely. The linear module is, for example, a motor or a cylinder.
[0052] In another implementation of the present invention, Figure 3 is a schematic diagram of the structure of an adjustment module provided by an embodiment of the utility model, such as Figure 3 As shown, each adjustment module includes a motor 45, a screw rod 46 and a lifting block 47. The motor 45 is located on the base plate 41. The base plate 41 has a plurality of columns 48 extending along a first direction. The screw rod 46 extends along the first direction. The output end of the motor 45 is transmission-connected with the screw rod 46 to drive the screw rod 46 to rotate. The lifting block 47 is sleeved on the screw rod 46, and the lifting block 47 is slidably matched with the corresponding column 48. The lifting block 47 is movably connected to the substrate support table 3.
[0053] In the above-described embodiment, when the motor 45 drives the lead screw 46 to rotate forward, the lead screw 46 will drive the lifting block 47 to rotate. However, under the limitation of the column 48, the rotation of the lifting block 47 is finally converted into an upward movement along the column 48, so that the substrate support table 3 rises, and thus the substrate support table 3 generates a corresponding inclination. Similarly, when the motor 45 drives the lead screw 46 to rotate reversely, the lead screw 46 will drive the lifting block 47 to rotate. However, under the limitation of the column 48, the rotation of the lifting block 47 is finally converted into a downward movement along the column 48, so that the substrate support table 3 descends, and thus the substrate support table 3 generates a corresponding inclination.
[0054] Exemplarily, the column 48 is located outside the substrate support table 3 to avoid interfering with the lifting of the substrate support table 3. The lifting block 47 is connected to the substrate support table 3 through a universal ball.
[0055] Continue to refer to Figure 1 , the wafer height measurement sensor 5, the wafer fixing member 2, the substrate support table 3, and the substrate height measurement sensor 6 are sequentially arranged at intervals in the first direction, so that the wafer height measurement sensor 5 and the wafer fixing member 2 are arranged opposite to each other in the first direction, and the substrate support table 3 and the substrate height measurement sensor 6 are arranged opposite to each other in the first direction. Then, the detection of the heights of the wafer 100 and the substrate 200 can be directly realized, interference is avoided, and the distance is close, improving the detection accuracy.
[0056] In addition, both the adjustment module 4 and the substrate support table 3 are provided with avoidance holes 8. In the first direction, the substrate height measurement sensor 6 is arranged opposite to the avoidance holes 8. The avoidance holes 8 can prevent the substrate height measurement sensor 6 from interfering with the adjustment module 4 and the substrate support table 3 when detecting the height of the substrate 200.
[0057] Exemplarily, the avoidance hole 8 on the adjustment module 4 is located on the bottom plate 41. The wafer fixing member 2 is also provided with an avoidance hole, which is opposite to the wafer height measurement sensor 5, so as to avoid interfering with the detection of the wafer height measurement sensor 5.
[0058] In one implementation manner of the present invention, the distance between the wafer height measurement sensor 5 and the laser processing module 1 in the second direction or the third direction is a unit step distance h of the transverse movement module, and the transverse movement module drives the wafer fixing member 2 and the adjustment module 4 to move a step distance h along the second direction or the third direction, and the current areas on the wafer 100 and the substrate 200 are respectively switched to the next areas.
[0059] That is to say, in the horizontal direction, the distance between the wafer height measurement sensor 5 and the laser processing module 1 is exactly one unit step distance of the cross - translation module. Therefore, when the current regions on the wafer 100 and the substrate 200 are respectively switched to the next region, the cross - translation module only needs to drive the wafer fixture 2 and the adjustment module 4 to move one unit step distance. That is, when the wafer height measurement sensor 5 and the substrate height measurement sensor 6 perform height detection on the next region (i.e., collect height data for this region in advance before transferring and processing the next region), the laser processing module 1 can simultaneously irradiate the current region, so that while performing height detection, it is possible to irradiate the adjacent driven chips on the wafer 100.
[0060] Specifically, the laser mass transfer device is configured such that when the laser processing module 1 processes a region on the wafer 100, the wafer height measurement sensor 5 detects the height of an adjacent region on the wafer 100 in the first direction, and the substrate height measurement sensor 6 detects the height of an adjacent region on the substrate 200 in the first direction. Thus, by adopting the method of synchronizing transfer processing and height data collection, the processing time is greatly shortened, waiting is avoided, and the transfer processing efficiency is thereby improved.
[0061] Furthermore, when the current region on the wafer and the current region on the substrate are respectively switched to the next region, the step distance D of the cross - translation module is the distance between adjacent regions on the wafer and / or the distance between adjacent regions on the substrate. When the wafer height measurement sensor and the substrate height measurement sensor detect the height of the current region on the wafer and the current region on the substrate in the first direction, the step distance d of the cross - translation module is less than D. That is to say, when it is necessary to detect at least three height data of the current region on the wafer and the current region on the substrate through the wafer height measurement sensor and the substrate height measurement sensor, at this time, the positions of the measurement data points required for switching a region can be changed by moving the wafer and the substrate. Considering that the positions where the chips on the wafer are transferred to the substrate may not exactly correspond, the distance D1 that the wafer needs to be cross - translated each time the current region on the wafer is switched to the next region, for example, is different from the distance D2 that the substrate needs to be cross - translated when the current region on the substrate is respectively switched to the next region. Therefore, the step distance D of the cross - translation module is the distance D1 between adjacent regions on the wafer and the distance D2 between adjacent regions on the substrate. At this time, D means that the wafer and the substrate move separately, and D1 is not equal to D2; when the positions where the chips on the wafer are transferred to the substrate exactly correspond, D is equal to D1 and equal to D2.
[0062] To better understand this laser mass transfer device, specific embodiments are now described for illustration:
[0063] The wafer 100 and the substrate 200 both have a size of 4 inches and a thickness of 0.5 mm. The wafer 100 can be divided into 25 regions, and the area of each region can vary. Each region has multiple chips (see Figure 4 ).
[0064] After the wafer 100 and the substrate 200 are loaded, the expected distance between the wafer 100 and the substrate 200 is set to 0.06 mm. Suppose the chips in regions 13 and 14 are selected for transfer. First, move the wafer 100 and the substrate 200 below (above) the wafer height measurement sensor 5 and the substrate height measurement sensor 6, and collect the Z - coordinate data of 3 points on the surfaces of the wafer 100 and the substrate 200 in region 13 respectively (see Figure 5 ). The specific data is as follows in the table.
[0065]
[0066] It should be noted that the laser transfer of region 12 is in progress at this time.
[0067] After the transfer of region 12 is completed and the data collection of region 13 of the wafer 100 and the substrate 13 is completed, the wafer 100 and the substrate 200 are translated horizontally, and region 13 of the two is moved under the laser processing module 1. The control module calculates the adjustment amount of each adjustment module in the adjustment module 4 according to the collected point - position data, and then adjusts the distance between the corresponding two points of the wafer 100 and the substrate 200 in region 13 to 0.06 mm. After the adjustment, the laser is emitted to start the transfer of the chips in region 13. During this period, the wafer height measurement sensor 5 and the substrate height measurement sensor 6 synchronously collect the Z - coordinate data of 3 points on the surfaces of the wafer 100 and the substrate 200 in the next processing region 14. The specific data is as follows in the table.
[0068]
[0069] After the transfer and processing of region 13 are completed, the spatial positions of the wafer 100 and the substrate 200 in region 14 are adjusted based on the above data. After the adjustment is completed, the transfer and processing of the chips in region 14 are carried out, and the processing of the selected regions is ended.
[0070] Those skilled in the art can easily understand that the above - described is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims
1. A laser mass transfer device, characterized in that: The laser mass transfer device includes a laser processing module, a wafer fixture, a substrate support table and an adjustment component; The laser processing module, the wafer fixing member and the substrate supporting platform are sequentially arranged in a first direction and spaced apart from each other. The laser processing module is used to irradiate the chip on the wafer, the wafer fixing member is used to fix the wafer above the substrate, and the substrate supporting platform is used to support the substrate. The adjustment component includes an adjustment module, a wafer height measurement sensor, a substrate height measurement sensor, a lateral movement module and a control module. The lateral movement module is used to drive the wafer fixture and the adjustment module to step along the second direction or the third direction. The wafer height measurement sensor and the substrate height measurement sensor are respectively used to measure the height of an area on the wafer and an area on the substrate in the first direction each time the wafer fixture and the adjustment module move in a step. The output end of the adjustment module is connected to the substrate support table to adjust the inclination angle and spacing of the substrate relative to the wafer after the wafer fixture and the adjustment module move in a step each time, so that the distances between each area on the wafer and each relative area on the substrate in the first direction are the same. The control module is electrically connected to the wafer height measurement sensor, the substrate height measurement sensor and the adjustment module respectively.
2. The laser mass transfer device according to claim 1, characterized in that: The lateral movement module includes two displacement mechanisms, each of which includes a second displacement unit and a third displacement unit. The output shaft of the second displacement unit is connected to the third displacement unit to drive the third displacement unit to move along the second direction. The output end of the third displacement unit of one displacement mechanism is connected to the wafer fixture to drive the wafer fixture to move along the third direction. The output end of the third displacement unit of the other displacement mechanism is connected to the adjustment module to drive the adjustment module to move along the third direction.
3. The laser mass transfer device according to claim 1, characterized in that: The adjustment module includes a base plate and three adjustment modules. The substrate support platform is located between the wafer fixing member and the base plate. The three adjustment modules are circumferentially equidistantly arranged on the base plate. The output end of each adjustment module is movably connected to the substrate support platform to drive the substrate support platform to rise and fall along a first direction.
4. The laser mass transfer device according to claim 3, characterized in that: Each of the adjustment modules includes a linear module, a first slider and a second slider. The linear module is located on the base plate. The output end of the linear module is transmission-connected with the first slider to drive the first slider to move toward the center axis of the base plate or away from the center axis of the base plate. The second slider is obliquely arranged on the first slider and slidably cooperates with the first slider. The second slider is movably connected to the substrate support platform.
5. The laser mass transfer device according to claim 3, characterized in that: Each of the adjustment modules includes a motor, a screw and a lifting block. The motor is located on the base plate. The base plate has a plurality of columns extending along a first direction. The screw extends along the first direction. The output end of the motor is transmission-connected to the screw to drive the screw to rotate. The lifting block is sleeved on the screw, and the lifting block is slidably matched with the corresponding column. The lifting block is movably connected to the substrate support platform.
6. The laser mass transfer device according to claim 1, characterized in that: The wafer height measurement sensor, the wafer fixing member, the substrate supporting table, and the substrate height measurement sensor are sequentially arranged at intervals in the first direction.
7. The laser mass transfer device according to claim 6, characterized in that: The adjusting module and the substrate supporting platform are both provided with avoidance holes, and in a first direction, the substrate height measuring sensor is arranged relative to the avoidance holes.
8. The laser mass transfer device according to claim 1, characterized in that: The spacing between the wafer height measurement sensor and the laser processing module in the second direction or the third direction is a unit step distance of the lateral movement module, and the lateral movement module drives the wafer fixing member and the adjustment module to move one unit step distance along the second direction or the third direction, and the current area on the wafer and the current area on the substrate are switched to the next area respectively.
9. The laser mass transfer device according to claim 1, characterized in that: The laser mass transfer device is configured such that when the laser processing module processes an area on a wafer, the wafer height measurement sensor detects the height of adjacent areas on the wafer in a first direction, and the substrate height measurement sensor detects the height of adjacent areas on the substrate in the first direction.
10. The laser mass transfer device according to claim 1, characterized in that: When the current area on the wafer and the current area on the substrate are switched to the next area respectively, the stepping distance D of the lateral movement module is the spacing between adjacent areas on the wafer and / or the spacing between adjacent areas on the substrate. When the wafer height measurement sensor and the substrate height measurement sensor detect the height of the current area on the wafer and the current area on the substrate in the first direction, the stepping distance d of the lateral movement module is less than the D.
11. The laser mass transfer device according to claim 1, characterized in that: The wafer height measurement sensor and the substrate height measurement sensor are spectral confocal sensors.