Wafer transmission manipulator of gluing machine

Abstract

The utility model discloses a gluing machine wafer transmission manipulator, which comprises a bottom plate, a portal frame is fixed on the rear side of the upper end face of the bottom plate, a first guide rail is fixed on the portal frame, a servo motor is further fixed on the bottom plate, the output end of the servo motor is connected with a speed reducer, a second gear is fixed at the output end of the speed reducer, and the second gear is connected with the first guide rail. The second gear is meshed with a first toothed belt to achieve the transmission function, the first toothed belt is fixedly connected with a movable frame, a DD motor is fixed to the movable frame, and a mounting frame is fixed to the output end of the DD motor. According to the wafer transmission manipulator of the gluing machine, the lifting Z shaft adopts a portal frame structure, guide rails are symmetrically arranged on two sides and are uniformly stressed, a DD motor is adopted as a rotating motor and is directly connected with a load, and a 4X-axis handle structure is optimally designed, so that the size is reduced, the weight is reduced, and the problems of stability and stability of shaking in the high-speed movement process of a traditional manipulator can be effectively solved. Therefore, the actual use requirements are better met.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transfer manipulators, and specifically relates to a wafer transfer manipulator for a coating machine. Background Technique

[0002] In semiconductor equipment, the wafer transfer manipulator is an indispensable unit. Commonly seen ones include standard multi-joint manipulators and special manipulators made by each equipment manufacturer.

[0003] For the manipulators of similar equipment of other domestic manufacturers, their guide rails are arranged on one side, the rotating handle adopts a cantilever beam structure, the rotating motor uses an ordinary servo motor plus a transmission mechanism, and the four X-axis rotating structures have a relatively large external shape and volume. This structure makes the moving part heavy and the structural stability poor. During high-speed movement, the manipulator generates jitter. Therefore, in view of the above problems, a wafer transfer manipulator for a coating machine is designed to better meet the actual use requirements. Content of the Utility Model

[0004] The purpose of the utility model is to provide a wafer transfer manipulator for a coating machine to solve the problems of poor structural stability and easy generation of jitter during high-speed movement of the existing transfer manipulator mentioned in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A wafer transfer manipulator for a coating machine, including a bottom plate. A gantry is fixed to the rear side of the upper end surface of the bottom plate. A first guide rail is fixed to the gantry. A servo motor is also fixed to the bottom plate. The output end of the servo motor is connected to a speed reducer. The output end of the speed reducer is fixed with a second gear. The second gear meshes with a first toothed belt to achieve a transmission function. The first toothed belt is fixedly connected to a movable frame. A DD motor is fixed to the movable frame. The output end of the DD motor is fixed with a mounting frame.

[0006] Preferably, a first gear is connected to the gantry by bearings, and the first gear meshes with the first toothed belt to achieve a transmission function. Through the meshing transmission of the first gear and the first toothed belt, the normal operation of the device can be ensured.

[0007] Preferably, the first guide rails are symmetrically distributed about the center line of the bottom plate, and positioning blocks are fixed to the first guide rails. Through the function of the first guide rails, a basic guarantee can be provided for the stable movement of the movable frame.

[0008] Preferably, a slider is fixed to the rear side of the movable frame, and the slider is slidably connected to the first guide rail. Moreover, the slider contacts the positioning block to achieve the positioning function. One end of a drag chain is fixed to the movable frame, and the other end of the drag chain is fixed to the gantry. Supporting feet are fixed to the lower end of the movable frame, and the supporting feet are fixed to the bottom plate. Through the sliding guiding function between the slider and the first guide rail, the stability of the movement of the movable frame can be ensured. With the cooperation of the positioning function of the contact between the slider and the positioning block, the extreme positions of the movable frame can be limited to ensure the normal operation of the device.

[0009] Preferably, a first motor is also fixed to the mounting frame, and the output end of the first motor is fixed with a third gear. Moreover, the third gear is meshed with the second toothed belt, and at the same time, the second toothed belt is meshed with the fourth gear. An movable plate is fixed to the second toothed belt. Through the above structure, a basic guarantee can be provided for the movement of the movable plate.

[0010] Preferably, the movable plate is slidably connected to the mounting frame, and four movable plates are provided. Through the four movable plates, the transmission of multiple wafers can be realized at one time.

[0011] Preferably, the movable plate is slidably connected to the second guide rail, and the second guide rail is fixed to the mounting frame. Moreover, the second guide rail and the movable plate are in a one-to-one correspondence relationship. Through the sliding guiding function between the movable plate and the second guide rail, the stability of the movement of the movable plate can be ensured.

[0012] Preferably, a bracket is also fixed to the movable plate, and a tray is fixed to the bracket. Moreover, the tray is located above the mounting frame. Through the function of the tray, the placement of wafers can be facilitated.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: for the wafer transfer manipulator of this glue coater, the lifting Z-axis adopts a gantry structure, which is symmetrically arranged on both sides of the guide rail with uniform force. The rotating motor uses a DD motor and is directly connected to the load. The 4X-axis handle structure is optimized in design, reducing the volume and weight. Thus, the stability of the jitter generated during the high-speed movement of the traditional manipulator can be effectively solved, and further better meet the actual use requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a front view three-dimensional structure schematic diagram of the whole device of the present utility model;

[0015] Figure 2 It is a rear view three-dimensional structure schematic diagram of the movable frame of the present utility model;

[0016] Figure 3 It is a front view three-dimensional structure schematic diagram of the movable frame of the present utility model;

[0017] Figure 4This is a top-down three-dimensional schematic diagram of the internal components of the mounting bracket of the present utility model.

[0018] In the figure: 1, bottom plate; 2, gantry; 201, first gear; 3, first guide rail; 301, positioning block; 4, servo motor; 5, reducer; 6, second gear; 7, first toothed belt; 8, movable frame; 801, slider; 802, drag chain; 803, support foot; 9, DD motor; 10, mounting bracket; 1001, first motor; 1002, third gear; 1003, second toothed belt; 1004, fourth gear; 11, second guide rail; 12, movable plate; 1201, bracket; 1202, tray. Specific embodiments

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0020] Please refer to Figures 1-4 , the present utility model provides a technical solution: a glue coating machine wafer transfer manipulator, including a bottom plate 1, a gantry 2 is fixed on the rear side of the upper end surface of the bottom plate 1, a first guide rail 3 is fixed on the gantry 2, a servo motor 4 is also fixed on the bottom plate 1, the output end of the servo motor 4 is connected to a reducer 5, the output end of the reducer 5 is fixed with a second gear 6, the second gear 6 meshes with a first toothed belt 7 to achieve a transmission function, the first toothed belt 7 is fixedly connected to a movable frame 8, a DD motor 9 is fixed on the movable frame 8, and the output end of the DD motor 9 is fixed with a mounting bracket 10.

[0021] A first gear 201 is connected to the gantry 2 by bearings, and the first gear 201 meshes with the first toothed belt 7 to achieve a transmission function; the first guide rails 3 are symmetrically distributed left and right with respect to the center line of the bottom plate 1, and positioning blocks 301 are fixed on the first guide rails 3; a slider 801 is fixed on the rear side of the movable frame 8, and the slider 801 is slidably connected to the first guide rail 3, and the slider 801 contacts the positioning block 301 to achieve a positioning function. One end of a drag chain 802 is fixed on the movable frame 8, and the other end of the drag chain 802 is fixed on the gantry 2. Support feet 803 are fixed at the lower end of the movable frame 8, and the support feet 803 are fixed on the bottom plate 1;

[0022] When using this glue coating machine wafer transfer manipulator, such as Figures 1-4As shown, first assemble the entire device. During actual use, place the wafer on the tray 1202. When height adjustment of the wafer is required, start the servo motor 4. With the transmission of the speed reducer 5, the second gear 6 can be driven to rotate. Through the transmission between the second gear 6 and the first toothed belt 7 and the transmission between the first toothed belt 7 and the first gear 201, the first toothed belt 7 can be operated, thereby driving the movable frame 8 to move, and further realizing the height adjustment of the tray 1202 and the wafer. When the movable frame 8 moves, with the sliding guiding effect between the slider 801 and the first guide rail 3, the stability of the movement of the movable frame 8 can be ensured. And when the slider 801 contacts the positioning block 301, it can be limited, thereby limiting the extreme height of the movable frame 8, the tray 1202 and the wafer, and ensuring the normal operation of the device;

[0023] A first motor 1001 is also fixed on the mounting frame 10, and the output end of the first motor 1001 is fixed with a third gear 1002. And the third gear 1002 is in meshing connection with the second toothed belt 1003. At the same time, the second toothed belt 1003 is in meshing connection with the fourth gear 1004. A movable plate 12 is fixed on the second toothed belt 1003; The movable plate 12 is in sliding connection with the mounting frame 10, and there are four movable plates 12; The movable plate 12 is in sliding connection with the second guide rail 11, and the second guide rail 11 is fixed on the mounting frame 10, and the second guide rail 11 and the movable plate 12 are in a one-to-one correspondence relationship; A bracket 1201 is also fixed on the movable plate 12, and a tray 1202 is fixed on the bracket 1201, and the tray 1202 is located above the mounting frame 10;

[0024] During the use of the device, when the front and rear positions of the wafer need to be adjusted, as Figures 1-4 shown, start the first motor 1001 to drive the third gear 1002 to rotate. With the meshing connection between the third gear 1002 and the second toothed belt 1003 and the meshing connection between the second toothed belt 1003 and the fourth gear 1004, the second toothed belt 1003 can be operated, thereby driving the movable plate 12 to move. With the sliding guiding effect between the movable plate 12 and the second guide rail 11, the stability of the movement of the movable plate 12 can be ensured. And by controlling the first motors 1001 at different positions, the movable plates 12 at different positions can be controlled to move, thereby driving the bracket 1201, the tray 1202 and the wafer to move, realizing the adjustment of the front and rear positions of the wafer. When the direction of the wafer needs to be adjusted, start the DD motor 9 to drive the mounting frame 10 to rotate, and the horizontal angle adjustment of the wafer can be realized to better meet the wafer transfer requirements. This is the working principle of the wafer transfer manipulator of this coating machine.

[0025] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer transfer robot for a glue coating machine, comprising a bottom plate (1), characterized in that: A gantry (2) is fixed to the rear side of the upper end surface of the base plate (1), a first guide rail (3) is fixed to the gantry (2), a servo motor (4) is also fixed to the base plate (1), an output end of the servo motor (4) is connected to a reducer (5), a second gear (6) is fixed to the output end of the reducer (5), the second gear (6) is meshed with a first toothed belt (7) to achieve a transmission effect, the first toothed belt (7) is fixedly connected to a movable frame (8), a DD motor (9) is fixed to the movable frame (8), and a mounting frame (10) is fixed to the output end of the DD motor (9).

2. The wafer transfer robot for a glue coating machine according to claim 1, characterized in that: The upper bearing of the gantry (2) is connected to a first gear (201), and the first gear (201) is meshed with the first toothed belt (7) to achieve transmission.

3. The wafer transfer robot for a glue coating machine according to claim 1, characterized in that: The first guide rail (3) is symmetrically distributed with respect to the center line of the bottom plate (1), and a positioning block (301) is fixed on the first guide rail (3).

4. The wafer transfer robot for a glue coating machine according to claim 3, characterized in that: A slider (801) is fixed to the rear side of the movable frame (8), and the slider (801) is slidably connected to the first guide rail (3), and the slider (801) contacts the positioning block (301) to achieve a positioning effect. One end of a drag chain (802) is fixed to the movable frame (8), and the other end of the drag chain (802) is fixed to the gantry frame (2). A support leg (803) is fixed to the lower end of the movable frame (8), and the support leg (803) is fixed to the bottom plate (1).

5. The wafer transfer robot for a glue coating machine according to claim 1, characterized in that: A first motor (1001) is also fixed on the mounting frame (10), and a third gear (1002) is fixed to the output end of the first motor (1001), and the third gear (1002) is meshedly connected to the second toothed belt (1003), and the second toothed belt (1003) is meshedly connected to the fourth gear (1004), and a movable plate (12) is fixed to the second toothed belt (1003).

6. The wafer transfer robot for a glue coating machine according to claim 5, characterized in that: The movable plate (12) is slidably connected to the mounting frame (10), and four movable plates (12) are provided.

7. The wafer transfer robot for a glue coating machine according to claim 6, characterized in that: The movable plate (12) and the second guide rail (11) are slidably connected, and the second guide rail (11) is fixed on the mounting frame (10), and there is a one-to-one correspondence between the second guide rail (11) and the movable plate (12).

8. The wafer transfer robot for a glue coating machine according to claim 7, characterized in that: A bracket (1201) is also fixed on the movable plate (12), and a tray (1202) is fixed on the bracket (1201), and the tray (1202) is located above the mounting frame (10).

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