Material receiving box of full-automatic sorting machine

By designing an adjustable fully automatic sorting machine feed box, the problem that existing feed box is difficult to adapt to different models of silicon wafers is solved, and flexible feed range and angle adjustment is achieved, improving feed efficiency and adaptability.

CN222985007UActive Publication Date: 2025-06-17KONCA SOLAR CELL
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Patent Information

Application Number
CN202422062418.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-23
Publication Date
2025-06-17
Estimated Expiration
2034-08-23

AI Technical Summary

Technical Problem

The existing silicon wafer sorting machine material collection box is difficult to adjust the working angle and position, and cannot adapt to the material collection requirements of different models of silicon wafers.

Method used

A fully automatic sorting machine feeding box is designed, using an adjustable frame and a variety of adjusting parts, including horizontal direction adjusting parts and angle adjusting parts. By replacing adjustment blocks of different sizes and rotating adjustment rods, the horizontal position, inclination angle and feeding range of the feeding box are adjusted.

Benefits of technology

It realizes flexible collection of silicon wafers of different models, improves the adaptability and efficiency of the material collection box, and can accurately adjust according to the requirements of silicon wafers of different models.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of material receiving, and discloses a full-automatic sorting machine material receiving box which comprises a rack. The receiving box can adjust the receiving range; the horizontal direction adjusting part is in sliding fit with the rack in the vertical direction and used for adjusting the position of the material collecting box in the horizontal direction; and the angle adjusting part is used for adjusting the inclination angle of the material receiving box. The silicon wafer collecting box has the effect that the silicon wafers of different models can be conveniently collected by the material collecting box.
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Description

Technical Field

[0001] This application relates to the technical field of material receiving, and in particular to a material receiving box for a fully automatic sorting machine. Background Art

[0002] Wafer sorting machines are commonly used equipment in the photovoltaic industry, mainly used to detect quality indicators of wafers such as size, thickness, chamfer, edge breakage, dirt, and hidden cracks.

[0003] After the existing wafer sorting machines sort wafers, the wafers are generally collected by a material receiving box. The existing material receiving boxes are generally fixedly installed on the wafer sorting machines, and the working angle positions of the material receiving boxes are generally difficult to adjust.

[0004] When collecting wafers of different models, the material receiving box often needs to have a working position angle matching the wafer model. The existing material receiving boxes are difficult to meet the material receiving requirements for wafers of different models. Utility Model Content

[0005] In order to facilitate the material receiving box to collect wafers of different models, this application provides a material receiving box for a fully automatic sorting machine.

[0006] The material receiving box for a fully automatic sorting machine provided by this application adopts the following technical solutions:

[0007] A material receiving box for a fully automatic sorting machine, comprising:

[0008] A frame;

[0009] A material receiving box capable of adjusting the material receiving range;

[0010] A horizontal direction adjusting member, which is slidably matched with the frame in the vertical direction and is used to adjust the position of the material receiving box in the horizontal direction;

[0011] An angle adjusting member for adjusting the inclination angle of the material receiving box;

[0012] According to the material receiving requirements of the wafers, the position of the material receiving box in the horizontal direction is adjusted by the horizontal direction adjusting member, and the wafer material receiving angle of the material receiving box is adjusted by the angle adjusting member. At the same time, the material receiving range of the material receiving box is adjusted according to the size of the wafers.

[0013] Optionally, the horizontal direction adjusting member includes a horizontal direction coarse adjustment unit, a support seat, and a horizontal direction fine adjustment unit. The horizontal direction coarse adjustment unit is used to adjust the position of the support seat in the horizontal direction. The support seat is used to support the material receiving box. The horizontal direction fine adjustment unit is used to finely adjust the position of the material receiving box in the horizontal direction.

[0014] Optionally, the horizontal coarse adjustment unit includes an adjustment block which is slidably engaged with the frame in the vertical direction, and the support seat is mounted on the adjustment block.

[0015] Among them, a plurality of adjustment blocks are provided, and the plurality of adjustment blocks have different sizes. The horizontal position of the support seat is adjusted by replacing the adjustment blocks with different sizes.

[0016] Optionally, a horizontal fine adjustment groove is formed at the bottom of the material receiving box. The horizontal fine adjustment unit includes a reference rod placed inside the horizontal fine adjustment groove and a pressing block mounted on the reference rod. The reference rod is used to guide the horizontal movement of the material receiving box, and the pressing block is used to press the material receiving box against the support seat.

[0017] Optionally, the horizontal fine adjustment groove is arranged in a cross shape.

[0018] Optionally, placing grooves are formed on the inner walls of the horizontal fine adjustment groove close to each other, and the placing grooves penetrate through the bottom of the material receiving box, and the pressing block is placed inside the placing grooves.

[0019] Optionally, the reference rod penetrates through the support seat and is threadedly connected to the support seat. The bottom of the pressing block is provided with an arc surface, and the center of the arc of the arc surface is located above the arc surface.

[0020] Optionally, the angle adjusting member includes a plurality of adjusting rods not on the same straight line. Each adjusting rod penetrates through the support seat, and the top of each adjusting rod abuts against the bottom of the material receiving box.

[0021] Optionally, the material receiving box includes a bottom plate, a plurality of side plates slidably mounted on the bottom plate, and a limiting unit for limiting the side plates.

[0022] Optionally, a shock pad is mounted on the side wall of the side plate.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. According to the requirements of silicon wafers of different models, the material receiving range of the material receiving box is adjusted by adjusting the position of the side plate. The horizontal position of the support seat is adjusted by replacing the adjustment blocks with different sizes. By rotating the adjustment rod, the position of the adjustment rod and the support seat is adjusted to adjust the inclination angle of the material receiving box. By moving the material receiving box, the reference rod moves relatively inside the horizontal fine adjustment groove. After the material receiving box reaches the set position, the reference rod is rotated to make the pressing block press the material receiving box against the adjustment rod through the inner wall of the placing groove, so as to complete the adjustment of the material receiving box and adapt to silicon wafers of different models. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0026] Figure 2 It is a schematic diagram showing the relative positions of the horizontal adjustment member and the angle adjustment member in an embodiment of the present application.

[0027] Figure 3 It is a schematic diagram showing the structure of the material receiving box in an embodiment of the present application.

[0028] Explanation of reference numerals:

[0029] 1. Frame; 2. Material receiving box; 21. Bottom plate; 211. Horizontal fine adjustment groove; 212. Placing groove; 22. Side plate; 221. Guide block; 222. Shock pad; 23. Limiting unit; 231. Limiting rod; 232. Limiting plate; 3. Horizontal adjustment member; 31. Horizontal coarse adjustment unit; 32. Support seat; 33. Horizontal fine adjustment unit; 331. Reference rod; 332. Pressing block; 4. Angle adjustment member; 41. Adjusting rod. Detailed implementation manners

[0030] The following will further elaborate on the present application Figures 1-3 with reference to the accompanying drawings.

[0031] An embodiment of the present application discloses a material receiving box for a fully automatic sorting machine.

[0032] A material receiving box for a fully automatic sorting machine includes a frame 1, a material receiving box 2, a horizontal adjustment member 3, and an angle adjustment member 4. The frame 1 is fixed at a position close to the sorting machine. The horizontal adjustment member 3 and the frame 1 are slidably engaged in the vertical direction. Both the material receiving box 2 and the angle adjustment member 4 are installed on the horizontal adjustment member 3.

[0033] According to the collection requirements for silicon wafers of different models, the horizontal position of the material receiving box 2 is adjusted through the horizontal adjustment member 3, and the inclination angle of the material receiving box 2 is adjusted through the angle adjustment member 4, while adjusting the material receiving range of the material receiving box 2, so as to adapt to the collection requirements for different models of silicon wafers.

[0034] The horizontal adjustment member 3 includes a horizontal coarse adjustment unit 31, a support seat 32, and a horizontal fine adjustment unit 33. The support seat 32 is fixedly installed at one end of the horizontal coarse adjustment unit 31 away from the frame 1. Both the horizontal fine adjustment unit 33 and the material receiving box 2 are installed on the support seat 32.

[0035] The horizontal coarse adjustment unit 31 includes adjustment blocks. The adjustment blocks and the frame 1 slide in the vertical direction. There are several adjustment blocks, and each of the several adjustment blocks has a different size. When it is necessary to adjust the position of the support seat 32 in the horizontal direction, different-sized adjustment blocks can be replaced. Thus, the convenience of the horizontal coarse adjustment of the support seat 32 is improved.

[0036] The horizontal fine adjustment unit 33 includes a reference rod 331 and a pressing block 332. The pressing block 332 is located at the top of the reference rod 331, and the reference rod 331 and the pressing block 332 are integrally formed.

[0037] A horizontal fine adjustment groove 211 is formed at the bottom of the material receiving box 2. In the embodiment of the present application, the horizontal fine adjustment groove 211 is integrally arranged in a cross shape.

[0038] The reference rod 331 is placed inside the horizontal fine adjustment groove 211. When it is necessary to finely adjust the position of the material receiving box 2 in the horizontal direction, the material receiving box 2 is moved, and the reference rod 331 guides and positions the material receiving box 2 through the inner wall of the horizontal fine adjustment groove 211.

[0039] After the position adjustment of the material receiving box 2 is completed, the reference rod 331 is rotated to press the material receiving box 2 against the support seat 32 through the pressing block 332.

[0040] In order to reduce the influence of the pressing block 332 on the silicon wafer, placing grooves 212 are formed on the adjacent inner side walls of the horizontal fine adjustment groove 211. The placing grooves 212 penetrate through the bottom of the material receiving box 2, and the pressing block 332 is placed inside the placing grooves 212.

[0041] In order to facilitate the reference rod 331 to press the material receiving box 2 against the support seat 32 through the pressing block 332 during rotation, arc surfaces are provided on the inner wall of the placing groove 212 and the bottom of the pressing block 332.

[0042] The angle adjusting member 4 includes several adjusting rods 41 that are not on the same straight line. Each adjusting rod 41 penetrates through the support seat 32, and the top of each adjusting rod 41 abuts against the bottom of the material receiving box 2. In the embodiment of the present application, four adjusting rods 41 are designed, and the four adjusting rods 41 are circumferentially and evenly distributed along the axial direction of the reference rod 331.

[0043] Each adjusting rod 41 penetrates through the support seat 32, and each adjusting rod 41 is threadedly connected to the support seat 32. By adjusting the relative positions of the multiple adjusting rods 41 and the support seat 32, the angle of the material receiving box 2 is changed, so as to improve the convenience of changing the angle of the material receiving box 2. At the same time, the tilt angle range of the material receiving box 2 is increased. The horizontal fine adjustment unit 33 and the angle adjusting member 4 cooperate with each other to fix the material receiving groove.

[0044] The receiving box 2 includes a bottom plate 21, a plurality of side plates 22 slidably mounted on the bottom plate 21, and a limiting unit 23 for limiting the side plates 22. The horizontal fine-tuning groove 211 is located on the bottom plate 21. There are two side plates 22, and the two side plates 22 and the bottom plate 21 are perpendicular to each other in pairs.

[0045] A guiding groove for guiding the sliding of the side plate 22 is formed on the bottom plate 21. A guiding block 221 is fixedly installed at the bottom of the side plate 22, and the guiding block 221 is slidably engaged with the guiding groove.

[0046] The limiting unit 23 includes a limiting plate 232 and a limiting rod 231 installed at the bottom of the bottom plate 21. The limiting rod 231 penetrates through the limiting plate 232 and the guiding block 221, and the limiting rod 231 is rotationally engaged with the limiting plate 232, and the limiting rod 231 is threadedly connected with the guiding block 221.

[0047] In order to reduce the vibration of the receiving box 2 caused by collision when the silicon wafer enters the receiving box 2, a shock-absorbing pad 222 is fixedly installed on the side wall of the side plate 22. In the embodiment of the present application, the shock-absorbing pad 222 is a silica gel pad, and the impact received by the receiving box 2 is cushioned by the silica gel pad, so as to improve the neatness of silicon wafer collection.

[0048] The implementation principle of the receiving box of the full-automatic sorting machine in the embodiment of the present application is as follows: According to the requirements of silicon wafers of different models, the position of the side plate 22 is adjusted by rotating the limiting rod 231, so as to adjust the receiving range of the receiving box 2. By replacing adjusting blocks of different sizes, the position of the support seat 32 in the horizontal direction is adjusted. By rotating the adjusting rod, the positions of the adjusting rod 41 and the support seat 32 are adjusted to adjust the inclination angle of the receiving box 2. By moving the receiving box 2, the reference rod 331 moves relatively inside the horizontal fine-tuning groove 211. After the receiving box 2 reaches the set position, the reference rod 331 is rotated, so that the pressing block 332 presses the receiving box 2 against the adjusting rod 41 through the inner wall of the placing groove 212, so as to complete the adjustment of the receiving box 2, so as to adapt to silicon wafers of different models.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A material receiving box for a fully automatic sorting machine, characterized in that: include; Rack (1); A material receiving box (2) capable of adjusting the material receiving range; A horizontal adjustment member (3) slidably cooperates with the frame (1) in the vertical direction and is used to adjust the position of the material receiving box (2) in the horizontal direction; An angle adjustment member (4) for adjusting the tilt angle of the material receiving box (2); According to the requirements for collecting silicon wafers, the horizontal position of the collecting box (2) is adjusted by the horizontal direction adjusting member (3), and the silicon wafer collecting angle of the collecting box (2) is adjusted by the angle adjusting member (4). At the same time, the collecting range of the collecting box (2) is adjusted according to the size of the silicon wafers.

2. The material receiving box of a fully automatic sorting machine according to claim 1, characterized in that: The horizontal direction adjustment member (3) comprises a horizontal direction coarse adjustment unit (31), a support seat (32) and a horizontal direction fine adjustment unit (33); the horizontal direction coarse adjustment unit (31) is used to adjust the horizontal position of the support seat (32); the support seat (32) is used to support the material receiving box (2); and the horizontal direction fine adjustment unit (33) is used to finely adjust the horizontal position of the material receiving box (2).

3. The material receiving box of a fully automatic sorting machine according to claim 2, characterized in that: The horizontal coarse adjustment unit (31) comprises an adjustment block, the adjustment block and the frame (1) are slidably matched in the vertical direction, and the support seat (32) is mounted on the adjustment block; There are a plurality of adjustment blocks, each of which has different sizes, and the horizontal position of the support seat (32) can be adjusted by replacing the adjustment blocks of different sizes.

4. The material receiving box of a fully automatic sorting machine according to claim 2, characterized in that: A horizontal fine-tuning groove (211) is provided at the bottom of the material receiving box (2); the horizontal fine-tuning unit (33) comprises a reference rod (331) disposed inside the horizontal fine-tuning groove (211) and a pressing block (332) mounted on the reference rod (331); the reference rod (331) is used to guide the horizontal movement of the material receiving box (2); and the pressing block (332) is used to press the material receiving box (2) onto the support seat (32).

5. The material receiving box of a fully automatic sorting machine according to claim 4, characterized in that: The horizontal direction fine-tuning groove (211) is arranged in a cross shape.

6. The material receiving box of a fully automatic sorting machine according to claim 4, characterized in that: A placement groove (212) is provided on the inner wall of the horizontal fine-tuning groove (211) close to each other, and the placement groove (212) passes through the bottom of the material receiving box (2), and the pressing block (332) is placed inside the placement groove (212).

7. The material receiving box of the fully automatic sorting machine according to claim 6, characterized in that: The reference rod (331) passes through the support seat (32), and the reference rod (331) and the support seat (32) are threadedly connected. The bottom of the pressing block (332) is provided with an arc surface, and the arc center of the arc surface is located above the arc surface.

8. The material receiving box of a fully automatic sorting machine according to claim 4, characterized in that: The angle adjustment member (4) comprises a plurality of adjustment rods (41) that are not in the same straight line, each of the adjustment rods (41) passes through the support seat (32), and the top of each of the adjustment rods (41) contacts the bottom of the material receiving box (2).

9. The material receiving box of a fully automatic sorting machine according to claim 1, characterized in that: The material receiving box (2) comprises a bottom plate (21), a plurality of side plates (22) slidably mounted on the bottom plate (21), and a limiting unit (23) for limiting the position of the side plates (22).

10. The material receiving box of the fully automatic sorting machine according to claim 9, characterized in that: A shock-absorbing pad (222) is installed on the side wall of the side plate (22).