Semiconductor processing equipment

Abstract

The utility model discloses semiconductor processing equipment, which relates to the technical field of semiconductors and comprises a shell. A first motor is fixedly connected to the inner side wall of the shell. The output end of the first motor is fixedly connected with a lead screw. A sliding block is connected to the lead screw in a sliding mode. The bottom end of the sliding block is fixedly connected with a second motor. The output end of the second motor is fixedly connected with a cleaning brush. The lead screw is made to rotate through the first motor, the second motor can be made to move to the position above the semiconductor part through the first motor and the lead screw, then the cleaning brush is made to rotate through the second motor, the surface of the semiconductor part can be cleaned through rotation of the cleaning brush, and after the cleaning brush cleans the semiconductor part, the cleaning brush slides to the next one through the lead screw. After the semiconductor part on the positioning plate frame is cleaned, the positioning plate frame is turned over through the rotating air cylinder, after the positioning plate frame is turned over, the other face of the semiconductor part is cleaned through the cleaning brush, the semiconductor part does not need to be cleaned repeatedly, and the cleaning efficiency of the semiconductor part is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a semiconductor processing device. Background Art

[0002] A semiconductor is a material between a conductor and an insulator, with a conductivity that can vary under specific conditions; the conductivity of a semiconductor material at room temperature is between that of a conductor and an insulator, and its conductivity can be changed by controlling external conditions.

[0003] The Chinese patent with the authorization announcement number CN218049245U discloses a semiconductor cleaning machine, including a cleaning table and a U-shaped wire rack. The U-shaped wire rack is arranged above the cleaning table; a cleaning chamber is opened at the lower end inside the cleaning table, a water pump is fixed on the right side of the upper end of the cleaning table, a liquid suction pipe that penetrates into the cleaning chamber is connected to the left end of the water pump, a liquid guide pipe is connected to the upper end of the water pump, and a cleaning component located above the U-shaped wire rack is arranged on the left side of the liquid guide pipe; the upper and lower ends of the semiconductor are clamped between the upper groove net plate and the lower groove net plate, then the motor is started to drive the rotating shaft and the U-shaped wire rack to rotate, and a cleaning agent is sprayed onto the semiconductor through the cleaning nozzle. Combining the telescopic pipe to expand and contract left and right facilitates the cleaning nozzle to move back and forth left and right and wash the rotating semiconductor, reducing the blind area during the cleaning of the semiconductor and improving the comprehensiveness of the cleaning of the semiconductor.

[0004] The deficiencies of the above existing technical solutions are as follows: In the above solution, the upper and lower ends of the semiconductor are clamped between the upper groove net plate and the lower groove net plate, then the motor is started to drive the rotating shaft and the U-shaped wire rack to rotate, and the telescopic pipe is combined to expand and contract left and right. The cleaning nozzle moves back and forth left and right and washes the rotating semiconductor, reducing the blind area during the cleaning of the semiconductor, but it cannot clean both sides of the semiconductor, and the cleaning work of the semiconductor needs to be completed by cleaning twice, resulting in very cumbersome cleaning steps and reducing work efficiency. Here, we provide a semiconductor processing device. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a semiconductor processing device to solve the technical problem that in the prior art, both sides of the semiconductor cannot be cleaned, and the cleaning work of the semiconductor needs to be completed by cleaning twice, resulting in very cumbersome cleaning steps.

[0006] The technical problem to be solved by the utility model can be realized through the following technical solutions:

[0007] A semiconductor processing device includes a housing; a first motor is fixedly connected to the inner side wall of the housing; a lead screw is fixedly connected to the output end of the first motor; a slider is slidably connected to the lead screw; a second motor is fixedly connected to the bottom end of the slider; a cleaning brush is fixedly connected to the output end of the second motor; a flipping unit is provided inside the housing.

[0008] As a further solution of the present utility model: the flipping unit includes a rotary cylinder; the rotary cylinder is provided on the inner side wall of the housing; a positioning plate frame is fixedly connected to the output end of the rotary cylinder; a plurality of positioning grooves are formed inside the positioning plate frame; a positioning bottom plate is fixedly connected to the inner side wall of the positioning groove; a semiconductor component is installed at one end of the positioning bottom plate.

[0009] As a further solution of the present utility model: a water tank is fixedly connected to the top end of the slider; a ring plate is fixedly connected to the bottom end of the water tank; a plurality of spray heads are provided at the bottom end of the ring plate, and a semiconductor component is provided on one side of the spray head.

[0010] As a further solution of the present utility model: a storage pool is provided inside the housing; a water pump is installed inside the storage pool; a connecting pipe is fixedly connected inside the housing, and one end of the connecting pipe is connected to the water pump; the side end of the water tank is connected to the connecting pipe.

[0011] As a further solution of the present utility model: a rotating plate is rotatably connected to the top end of the positioning plate frame, and a semiconductor component is provided at one end of the rotating plate.

[0012] As a further solution of the present utility model: an electric push rod is fixedly connected to the inner side wall of the housing; the top end of the electric push rod is fixedly connected to a rotary cylinder, and the rotary cylinder is slidably connected inside the housing.

[0013] The beneficial effects of the present utility model: The lead screw is rotated by the first motor, and the rotation of the lead screw causes the slider to slide. The sliding of the slider causes the second motor to slide. Then, the first motor and the lead screw can move the second motor above the semiconductor component. Then, the cleaning brush is rotated by the second motor, and the rotation of the cleaning brush can clean the surface of the semiconductor component. After the cleaning brush cleans the semiconductor component, it slides to the next one through the lead screw. After the semiconductor component on the positioning plate frame is cleaned, the positioning plate frame is flipped by the rotary cylinder. After the positioning plate frame is flipped, the other side of the semiconductor component is cleaned by the cleaning brush. There is no need to clean the semiconductor component multiple times, improving the cleaning efficiency of the semiconductor component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following further describes the present utility model with reference to the drawings.

[0015] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0016] Figure 2 It is a schematic diagram of the internal structure of the housing in the present utility model;

[0017] Figure 3 It is a schematic diagram of the positioning plate frame structure in the present utility model.

[0018] In the figure: 1. Housing; 2. First motor; 3. Lead screw; 4. Slide block; 5. Second motor; 6. Cleaning brush; 7. Positioning plate frame; 8. Rotary cylinder; 9. Electric push rod; 10. Water tank; 11. Ring plate; 12. Spraying head; 13. Water pump; 14. Connecting pipe; 15. Semiconductor component; 16. Positioning groove; 17. Positioning bottom plate; 18. Rotary plate. Specific implementation manner

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present utility model.

[0020] As Figures 1 - 3 shown, a semiconductor processing device includes a housing 1; a first motor 2 is fixedly connected to the inner side wall of the housing 1; a lead screw 3 is fixedly connected to the output end of the first motor 2; a slide block 4 is slidably connected to the lead screw 3; a second motor 5 is fixedly connected to the bottom end of the slide block 4; a cleaning brush 6 is fixedly connected to the output end of the second motor 5; a flipping unit is provided inside the housing 1.

[0021] By the first motor 2, the lead screw 3 is rotated. The lead screw 3 is threadedly connected to the slide block 4. The rotation of the lead screw 3 further causes the slide block 4 to slide. The sliding of the slide block 4 causes the second motor 5 to slide. Then, through the first motor 2 and the lead screw 3, the second motor 5 can be moved above the semiconductor component 15. Then, the second motor 5 is used to rotate the cleaning brush 6. The rotation of the cleaning brush 6 can clean the surface of the semiconductor component 15. After the cleaning brush 6 cleans the semiconductor component 15, it slides to the next one through the lead screw 3. After the semiconductor component 15 on the positioning plate frame 7 is cleaned, the positioning plate frame 7 is flipped by the rotary cylinder 8. After the positioning plate frame 7 is flipped, the other side of the semiconductor component 15 is cleaned by the cleaning brush 6. It is not necessary to clean the semiconductor component 15 multiple times, improving the cleaning efficiency of the semiconductor component 15.

[0022] The flipping unit includes a rotary cylinder 8; a rotary cylinder 8 is provided on the inner side wall of the housing 1; a positioning plate frame 7 is fixedly connected to the output end of the rotary cylinder 8; a plurality of positioning grooves 16 are formed inside the positioning plate frame 7; a positioning bottom plate 17 is fixedly connected to the inner side wall of the positioning groove 16; a semiconductor component 15 is installed at one end of the positioning bottom plate 17.

[0023] Before work, the staff places the semiconductor component 15 on the positioning plate rack 7. The semiconductor component 15 is placed above the positioning bottom plate 17 inside the positioning groove 16. The positioning bottom plate 17 can support the position of the semiconductor component 15. By rotating the air cylinder 8, the positioning plate rack 7 is flipped. After the positioning plate rack 7 is flipped, the other side of the semiconductor component 15 is cleaned by the cleaning brush 6. It is not necessary to clean the semiconductor component 15 multiple times, improving the cleaning efficiency of the semiconductor component 15.

[0024] The top end of the slider 4 is fixedly connected with a water tank 10; the bottom end of the water tank 10 is fixedly connected with an annular disc 11; a plurality of spray heads 12 are arranged at the bottom end of the annular disc 11, and a semiconductor component 15 is arranged on one side of the spray head 12.

[0025] The inside of the water tank 10 is filled with water. During work, the water inside the water tank 10 is conveyed into the annular disc 11, and then sprayed onto the cleaning brush 6 and the semiconductor component 15 through the spray heads 12. The spraying of the spray heads 12 and the cooperation of the cleaning brush 6 can improve the cleaning effect on the semiconductor component 15.

[0026] A storage pool is arranged inside the housing 1; a water pump 13 is installed inside the storage pool; a connecting pipe 14 is fixedly connected inside the housing 1, and one end of the connecting pipe 14 is connected with the water pump 13; the side end of the water tank 10 is connected with the connecting pipe 14.

[0027] The water sprayed by the spray heads 12 can fall downward into the storage pool. The water pump 13 can pump water and draw the water into the connecting pipe 14. The connecting pipe 14 is made of a telescopic hose material. The side end of the connecting pipe 14 is connected with the water tank 10. The sliding of the slider 4 will cause the water tank 10 to slide together, and the sliding of the water tank 10 will cause the connecting pipe 14 to expand and contract. The water inside the storage pool enters the inside of the water tank 10 through the water pump 13 and the connecting pipe 14, so that the water can be recycled.

[0028] The top end of the positioning plate rack 7 is rotatably connected with a rotating plate 18, and a semiconductor component 15 is arranged at one end of the rotating plate 18.

[0029] Before work, the staff places the semiconductor component 15 on the positioning plate rack 7. The semiconductor component 15 is placed above the positioning bottom plate 17 inside the positioning groove 16. The positioning bottom plate 17 can support the position of the semiconductor component 15. At this time, the rotating plate 18 can be rotated, and one end of the semiconductor component 15 is limited by the rotating plate 18, facilitating the cleaning work after the semiconductor component 15 is flipped. Multiple groups of rotating plates 18 can be installed according to the cleaning situation of the semiconductor component 15 to improve the position fixity of the semiconductor component 15.

[0030] The inner side wall of the housing 1 is fixedly connected with an electric push rod 9; the top end of the electric push rod 9 is fixedly connected with a rotary cylinder 8, and the rotary cylinder 8 is slidably connected inside the housing 1.

[0031] When the positioning plate frame 7 is flipped, it is necessary to move the rotary cylinder 8 downward through the electric push rod 9. The movement of the rotary cylinder 8 causes the positioning plate frame 7 to move together. At this time, the positioning plate frame 7 is flipped through the rotary cylinder 8 to avoid the collision of the cleaning brush 6 during the flipping process of the positioning plate frame 7. Then, after the positioning plate frame 7 is flipped, it is moved upward and reset through the electric push rod 9.

[0032] Working principle of the utility model: Before work, the staff places the semiconductor component 15 on the positioning plate rack 7. The semiconductor component 15 is placed above the positioning bottom plate 17 inside the positioning groove 16. The positioning bottom plate 17 can support the position of the semiconductor component 15. At this time, the rotating plate 18 can be rotated to limit one end of the semiconductor component 15, which is convenient for the cleaning work after the semiconductor component 15 is flipped. Multiple groups of rotating plates 18 can be installed according to the cleaning situation of the semiconductor component 15 to improve the position fixity of the semiconductor component 15; The first motor 2 rotates the lead screw 3. The lead screw 3 is threadedly connected to the slider 4. The rotation of the lead screw 3 causes the slider 4 to slide. The sliding of the slider 4 causes the second motor 5 to slide. Then, through the first motor 2 and the lead screw 3, the second motor 5 can be moved above the semiconductor component 15. Then, the second motor 5 rotates the cleaning brush 6. The rotation of the cleaning brush 6 can clean the surface of the semiconductor component 15. After the cleaning brush 6 cleans the semiconductor component 15, it slides to the next one through the lead screw 3. After the semiconductor component 15 on the positioning plate rack 7 is cleaned, the positioning plate rack 7 is flipped by the rotating cylinder 8. After the positioning plate rack 7 is flipped, the other side of the semiconductor component 15 is cleaned by the cleaning brush 6. It is not necessary to clean the semiconductor component 15 multiple times, which improves the cleaning efficiency of the semiconductor component 15; When the positioning plate rack 7 is flipped, the electric push rod 9 is used to move the rotating cylinder 8 downward. The movement of the rotating cylinder 8 causes the positioning plate rack 7 to move together. At this time, the positioning plate rack 7 is flipped by the rotating cylinder 8 to avoid the cleaning brush 6 from colliding during the flipping process of the positioning plate rack 7. Then, after the positioning plate rack 7 is flipped, it is moved upward and reset by the electric push rod 9; The inside of the water tank 10 is filled with water. During work, the water inside the water tank 10 is transported into the ring plate 11 and then sprayed onto the cleaning brush 6 and the semiconductor component 15 through the spray head 12. The spraying of the spray head 12 and the cooperation of the cleaning brush 6 can improve the cleaning effect on the semiconductor component 15; The water sprayed by the spray head 12 can fall downward into the storage pool. The water pump 13 can pump water and draw the water into the connecting pipe 14. The connecting pipe 14 is made of a telescopic hose material. The side end of the connecting pipe 14 is connected to the water tank 10. The sliding of the slider 4 causes the water tank 10 to slide together. The sliding of the water tank 10 causes the connecting pipe 14 to expand and contract. The water inside the storage pool enters the inside of the water tank 10 through the water pump 13 and the connecting pipe 14, so that the water can be recycled.

[0033] The above has described an embodiment of the present utility model in detail, but the described content is only the preferred embodiment of the present utility model and cannot be considered as limiting the scope of implementation of the present utility model. All equivalent changes and improvements made according to the scope of the application of the present utility model should still fall within the scope covered by the patent of the present utility model.

Claims

1. A semiconductor processing device, characterized in that: The invention comprises a housing (1); a first motor (2) is fixedly connected to the inner side wall of the housing (1); a lead screw (3) is fixedly connected to the output end of the first motor (2); a slider (4) is slidably connected to the lead screw (3); a second motor (5) is fixedly connected to the bottom end of the slider (4); a cleaning brush (6) is fixedly connected to the output end of the second motor (5); a turning unit is provided inside the housing (1); The flip unit comprises a rotating cylinder (8); the inner side wall of the housing (1) is provided with the rotating cylinder (8); the output end of the rotating cylinder (8) is fixedly connected to a positioning plate frame (7); a plurality of groups of positioning grooves (16) are provided inside the positioning plate frame (7); the inner side wall of the positioning groove (16) is fixedly connected to a positioning base plate (17); and a semiconductor component (15) is installed at one end of the positioning base plate (17).

2. A semiconductor processing device according to claim 1, characterized in that: The top end of the slider (4) is fixedly connected to a water tank (10); the bottom end of the water tank (10) is fixedly connected to a ring disk (11); a plurality of groups of spray heads (12) are provided at the bottom end of the ring disk (11), and a semiconductor component (15) is provided on one side of the spray head (12).

3. A semiconductor processing device according to claim 2, characterized in that: A storage tank is provided inside the housing (1); a water pump (13) is installed inside the storage tank; a connecting pipe (14) is fixedly connected inside the housing (1), one end of the connecting pipe (14) is connected to the water pump (13); and a side end of the water tank (10) is connected to the connecting pipe (14).

4. The semiconductor processing equipment according to claim 1, characterized in that: The top end of the positioning plate frame (7) is rotatably connected to a rotating plate (18), and one end of the rotating plate (18) is provided with a semiconductor component (15).

5. The semiconductor processing equipment according to claim 1, characterized in that: An electric push rod (9) is fixedly connected to the inner side wall of the housing (1); a rotary cylinder (8) is fixedly connected to the top end of the electric push rod (9); and the rotary cylinder (8) is slidably connected inside the housing (1).

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