Laser processing head

Abstract

The utility model discloses a laser processing head, the disclosed laser processing head comprises a laser emission part, a gas ejection part and a foreign matter intrusion prevention structure, the laser emission part is provided with a laser emission channel, the gas ejection part is connected with the laser emission part, the gas ejection part is provided with a gas ejection channel, and the foreign matter intrusion prevention structure is connected with the gas ejection part. The gas injection channel is used for injecting protective gas, the foreign matter invasion prevention structure is arranged in the laser emission channel, and the gas injection channel and the laser emission channel are at least partially separated. According to the scheme, the problems of high process cost, inconvenience in user operation and the like due to the fact that more protective gas is consumed in the process of laser processing equipment related to the related technology can be solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser processing equipment, and particularly relates to a laser processing head. Background Art

[0002] Laser processing equipment is a relatively common processing equipment. In recent years, with the continuous development of laser technology, laser processes such as laser welding, laser engraving, and laser cutting have developed by leaps and bounds, and the performance of corresponding laser processing equipment has been increasingly optimized. Since laser processing equipment adopts laser technology, it has the advantages of being light in weight, convenient to operate, and having relatively high processing efficiency, and is deeply favored by users. At the same time, with the improvement of user requirements, users have higher and higher requirements for the performance of laser processing equipment in all aspects.

[0003] In the related art, when laser processing equipment performs a process on a workpiece to be processed, it is relatively easy to generate high temperature in the processed area. During the process of completing the process, the processed area is relatively easy to undergo an oxidation reaction with air under high temperature conditions, which is not conducive to high-quality processing of the processed area. To avoid this situation, the laser processing equipment in the related art is equipped with a protective gas container. During the processing process, the protective gas container is used to transport a protective gas (generally an inert gas) to the processed area, so as to form a protective gas atmosphere in the processed area to isolate air.

[0004] During the processing process, in order to prevent foreign matters (such as slag formed during the processing process) in the processed area from invading the laser processing equipment along the laser emission channel and damaging vulnerable components (such as protective lenses) in the laser processing equipment, the related art connects the protective gas container to the laser emission channel, so that the protective gas transported by the protective gas container can be sprayed along the laser emission channel to the processed area, and the protective gas sprayed from the laser emission channel can blow the foreign matters out of the laser emission channel to a certain extent, thereby alleviating the invasion of foreign matters into the laser processing equipment along the laser emission channel.

[0005] As described above, the protective gas not only plays the role of isolating air, but also plays the role of alleviating the invasion of foreign matters along the laser emission channel. Therefore, a large amount of protective gas will be consumed in the specific processing process. The consumption of a large amount of protective gas will cause a significant increase in processing costs. At the same time, due to the need to consume a large amount of protective gas, users need to carry a large-volume protective gas container when operating the laser processing equipment to perform laser processes. This not only makes it inconvenient for users to operate, but also carrying a large-volume protective gas container and a large amount of protective gas brings a heavy burden to users. Obviously, various problems caused by the need to consume a large amount of protective gas in the laser processing equipment related to the related art will seriously affect the further popularization of the laser processing equipment. Summary of the Utility Model

[0006] The present utility model discloses a laser processing head to solve the problems in the related art that the laser processing equipment consumes a large amount of protective gas during the process, resulting in high process costs and inconvenient operation for users.

[0007] To solve the above technical problems, the present utility model provides the following technical solutions:

[0008] A laser processing head includes a laser emission part, a gas ejection part, and an anti-foreign object intrusion structure, wherein:

[0009] The laser emission part has a laser emission channel, the gas ejection part is connected to the laser emission part, the gas ejection part has a gas ejection channel for ejecting protective gas, the anti-foreign object intrusion structure is arranged in the laser emission channel, and the gas ejection channel is at least partially separated from the laser emission channel.

[0010] The technical solutions adopted by the present utility model can achieve the following technical effects:

[0011] The laser processing head disclosed in the embodiment of the present utility model improves the related technology and adopts two main means to achieve the purpose of preventing foreign objects from intruding. One is to design the gas ejection channel and the laser emission channel into two channels that are at least partially separated, so that the protective gas will not be ejected along the laser emission channel, and thus the reverse sputtering of foreign objects caused by the impact of the protective gas will not occur, so that the amount of foreign objects invading the laser emission channel can be greatly reduced, and the effect of alleviating foreign object intrusion can be exerted to a certain extent. The second is to add an anti-foreign object intrusion structure in the laser emission channel, so that foreign objects are blocked after invading the laser emission channel, thus avoiding further intrusion of foreign objects. In other words, the laser processing head disclosed in the embodiment of the present utility model solves the problem of foreign object intrusion from the above two main means and can achieve the purpose of preventing foreign objects from intruding. In this case, the gas ejection channel only needs to eject to form a protective atmosphere for isolating air, and there is no need for excessive ejection. That is to say, the laser processing head disclosed in the embodiment of the present utility model avoids preventing foreign objects from intruding by excessive ejection of protective gas, so that the consumption of protective gas can be reduced, which not only can reduce the process cost, but also can avoid users carrying a large amount of protective gas during the process, and can also avoid users carrying a large-volume protective gas container during the process, which is beneficial to making the laser processing head more portable and convenient for users to use. Description of the Drawings

[0012] Figure 1 is a partial structural schematic diagram of a laser processing head disclosed in an embodiment of the present utility model;

[0013] Figure 2 isFigure 1 Cross-sectional view of a partial structure;

[0014] Figure 3 is Figure 1 Cross-sectional view of an embodiment of a partial structure;

[0015] Figure 4 is Figure 1 Cross-sectional view of another embodiment of a partial structure;

[0016] Figure 5 is a schematic structural diagram of another laser processing head disclosed in an embodiment of the present invention;

[0017] Figure 6 is a schematic structural diagram of a first blocking member disclosed in an embodiment of the present invention;

[0018] Figure 7 is another schematic structural diagram of a first blocking member disclosed in an embodiment of the present invention;

[0019] Figure 8 is a schematic structural diagram of the first blocking member when forming a light avoidance hole, Figure 3 and Figure 4 The black arrow in indicates the emission direction of the laser beam, and the dashed arrow indicates the injection direction of the protective gas.

[0020] Explanation of reference numerals:

[0021] 100 - Laser emission part, 110 - Laser emission channel, 101 - Laser emission nozzle, 102 - Laser emission main body, 120 - First foreign object collection space, 130 - First foreign object dumping hole,

[0022] 200 - Gas ejection part, 210 - Gas injection channel, 220 - Second foreign object collection space, 230 - Second foreign object dumping hole,

[0023] 300 - Anti-foreign object intrusion structure, 310 - Magnetic component, 320 - Adhesive, 330 - First blocking member, 331 - Part to be burned through, 332 - Small hole to be expanded in diameter, 333 - Light avoidance hole, 340 - Second blocking member,

[0024] 400 - Protective gas container, 500 - Gas pipeline. Detailed implementation manners

[0025] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with specific embodiments of the present utility model and the corresponding drawings. Apparently, the described embodiments are only a part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts belong to the scope of protection of the present utility model.

[0026] The technical solutions disclosed in each embodiment of the present utility model will be described in detail below in conjunction with the drawings.

[0027] In order to overcome the problems existing in the related art, the inventors of the present invention found through analyzing the actual processing scenario that during the process of the laser processing head in the related art, the protective gas would flow out along the laser emission channel. While the protective gas was ejected at a high speed to form a protective atmosphere for isolating air, it would also blow up foreign matters in the processing area. Some of the foreign matters would be ejected backward after being impacted, resulting in a reverse sputtering phenomenon. Specifically, when the protective gas was ejected onto the processing area, it would impact the foreign matters existing in the processing area (such as slag generated during the processing), which would cause these foreign matters to be ejected backward when being impacted, and instead, it was relatively easy for these foreign matters to invade along the laser emission channel. This was a relatively hidden deep-level problem that had not been discovered and disclosed. In order to avoid the reverse sputtering of foreign matters, the inventors of the present invention further increased the ejection flow rate of the protective gas to prevent the reverse-sputtered foreign matters from entering the laser emission channel. That is to say, more gas was needed to prevent the reverse-sputtered foreign matters from reverse sputtering when they invaded backward. As a result, a large amount of protective gas was consumed during the laser process in the related art, and it also required users to wear a relatively large-sized protective gas container and a large amount of protective gas during the laser process in the related art.

[0028] In view of the discovered problem, an embodiment of the present utility model discloses a laser processing head. Please refer to Figures 1 to 8 The disclosed laser processing head includes a laser emission part 100, a gas ejection part 200, and an anti-foreign matter intrusion structure 300.

[0029] The laser emission part 100 is at least used for emitting a laser beam. Specifically, the laser beam generated by the laser processing head will be emitted from the laser emission part 100 during the transmission process. In the embodiment of the present utility model, the laser emission part 100 has a laser emission channel 110. During the specific process, the laser beam will be emitted from the laser emission channel 110 to reach the processing area of the object to be processed.

[0030] The gas ejection part 200 is connected to the laser emission part 100. The gas ejection part 200 has a gas ejection channel 210, and the gas ejection channel 210 is used for ejecting a protective gas. As described above, the protective gas can be an inert gas, such as nitrogen. The embodiments of the present invention do not limit the specific type of the protective gas. In a specific process, the protective gas is ejected from the gas ejection channel 210 and then reaches the processed area of the object to be processed, so as to form a protective atmosphere in the processed area and avoid adverse reactions such as oxidation of the processed area caused by the high temperature of the laser beam.

[0031] The gas ejection channel 210 is at least partially separated from the laser emission channel 110, that is to say, at least part of the gas ejection channel 210 and the laser emission channel 110 are not shared. In other words, the protective gas will no longer be ejected along the laser emission channel 110, so as to avoid the phenomenon of reverse sputtering of foreign objects in the processed area caused by the protective gas being ejected from the laser emission channel 110, thereby being able to alleviate the phenomenon of foreign objects invading the laser emission channel 110. It should be noted that reverse sputtering of foreign objects refers to the movement of foreign objects in the opposite direction to the ejection direction of the protective gas when the foreign objects are impacted by the protective gas. After the protective gas is ejected to the processed area, it will cause the foreign objects to sputter in multiple directions. Among them, the reverse-sputtered foreign objects are more likely to invade along the flow path of the protective gas. The fact that at least part of the gas ejection channel 210 and the laser emission channel 110 are not shared can at least make the gas ejection channel 210 and the laser emission channel 110 not the same channel, and their positions or extension directions are inconsistent. Finally, when the reverse-sputtered foreign objects invade reversely along the gas ejection channel 210, they are not easy to invade along the laser emission channel 110, thereby being able to prevent the problem that foreign objects invade along the laser emission channel 110 and easily damage vulnerable components.

[0032] The foreign object intrusion prevention structure 300 is used to prevent foreign objects from intruding. Specifically, the foreign object intrusion prevention structure 300 is arranged in the laser emission channel 110, so that a small amount of foreign objects that invade the laser emission channel 110 are difficult to further invade the laser processing head. There are various means for the foreign object intrusion prevention structure 300 to prevent foreign objects from intruding. The embodiments of the present invention do not limit the specific structure and principle of the foreign object intrusion prevention structure 300. As long as the structure can block the foreign objects after the foreign objects invade the laser emission channel 110, so as to prevent or reduce the further intrusion of foreign objects, it can be applied to the laser processing head involved in the present invention.

[0033] The laser processing head disclosed in the embodiment of the present utility model improves the related art and adopts two main means to achieve the purpose of preventing foreign objects from entering. One is to design the gas injection channel 210 and the laser emission channel 110 as two at least partially separated channels, so that the protective gas will not be emitted from the laser emission channel 110, and thus the reverse sputtering of foreign objects caused by the impact of the protective gas (i.e., the direction opposite to the laser output direction of the laser emission channel 110) will not occur, so that the amount of foreign objects invading the laser emission channel 110 can be greatly reduced, and to a certain extent, the effect of alleviating the invasion of foreign objects is exerted. The other is to add a foreign object intrusion prevention structure 300 in the laser emission channel 110, so that the foreign objects are blocked after invading the laser emission channel 110, thus avoiding further invasion of foreign objects. In other words, the laser processing head disclosed in the embodiment of the present utility model solves the problem of foreign object invasion from the above two main means and can achieve the purpose of preventing foreign objects from entering. In this case, the gas injection channel 210 only needs to inject to form a protective atmosphere for isolating air, and there is no need for excessive injection. That is to say, the laser processing head disclosed in the embodiment of the present utility model avoids preventing foreign objects from entering by excessive injection of protective gas, so that the consumption of protective gas can be reduced, which can not only reduce the process cost, but also avoid the user carrying a large amount of protective gas during the process, and can also avoid the user carrying a large-volume protective gas container during the process, which is beneficial to making the laser processing head more portable and convenient for the user to use.

[0034] As described above, in the embodiment of the present utility model, the gas injection channel 210 and the laser emission channel 110 are at least partially separated, and such a structure can make the ejection direction of the protective gas not completely follow the laser emission channel 110, or even not follow the laser emission channel 110 at all, which will reduce the amount of foreign objects invading along the laser emission channel 110 during reverse sputtering. Foreign objects sputtered in other directions may enter the laser emission channel 110, but due to the direction, they are more likely to hit the wall and be blocked. As Figure 3 shown, in one embodiment, the gas injection channel 210 and the laser emission channel 110 are completely separated. In this case, the gas injection channel 210 and the laser emission channel 110 do not share at all, which can better prevent foreign objects sputtered in the reverse direction from invading the laser emission channel 110.

[0035] As Figure 4As shown, in another embodiment, the gas injection channel 210 shares the ejection port with the laser emission channel 110. In this case, the gas injection channel 210 and the laser emission channel 110 partially share and are separated in another part. Since they only share the ejection port, the direction opposite to the direction of the protective gas ejected from the gas injection channel 210 intersects with the laser emission channel 110, making it difficult for foreign objects to invade along the laser emission channel 110. In this article, the reverse direction is essentially the direction parallel to the extension direction of the gas injection channel 210 and opposite to the ejection direction of the protective gas.

[0036] As described above, during the specific process, the laser emission channel 110 and the gas injection channel 210 are independent of each other and spray towards the processing area. To better achieve spraying the protective gas to the laser beam projection location, in one embodiment, the laser emission channel 110 extends along the first axis, and the gas injection channel 210 extends along the second axis. The first axis intersects the second axis. This structure can make the ejection direction of the laser beam and the ejection direction of the protective gas different and easily converge at the processing area. At the same time, foreign objects are subjected to a lateral impact force, better avoiding the reverse sputtering of foreign objects towards the laser emission channel 110.

[0037] In a specific embodiment, the angle between the first axis and the second axis can be 15° to 30°. That is to say, the angle between the gas injection channel 210 and the laser emission channel 110 can be 15° to 30°. Specifically, the angle between the gas injection channel 210 and the laser emission channel 110 can be 25°, or 15°, or 30°. Of course, the embodiments of the present utility model do not limit the specific angle between the gas injection channel 210 and the laser emission channel 110.

[0038] In the laser processing head disclosed in the embodiments of the present utility model, the laser emission part 100 can be a single structural member, that is, the laser emission part 100 can be an integral structure or a split structure, and the embodiments of the present utility model do not make any restrictions.

[0039] As Figure 2As shown, in an alternative solution, the laser emitting unit 100 may include a laser emitting nozzle 101 and a laser emitting body 102, and the laser emitting nozzle 101 and the laser emitting body 102 may be connected in a detachable manner. In this case, the laser emitting channel 110 may penetrate from the laser emitting body 102 to the laser emitting nozzle 101. In other words, both the laser emitting body 102 and the laser emitting nozzle 101 are provided with a channel for the laser beam to pass through, and the two spliced together can form the laser emitting channel 110. Since the laser emitting nozzle 101 is closer to the processing area and the environment it is in is relatively harsh, the laser emitting nozzle 101 is more likely to be damaged. This detachable assembly method can facilitate the user to replace or repair the laser emitting nozzle 101 separately, thus helping to reduce the maintenance cost of the laser processing head. The laser emitting nozzle 101 and the laser emitting body 102 can be detachably connected by means of threaded fitting, snap connection, plug-in connection, etc. The embodiments of the present utility model do not limit the specific detachable connection method between the laser emitting nozzle 101 and the laser emitting body 102. In other embodiments, the laser emitting unit 100 may also be of an integral structure, and the embodiments of the present utility model do not limit the specific structure of the laser emitting unit 100.

[0040] In the embodiments of the present utility model, the structure of the gas ejection unit 200 can be various. For example, the gas ejection unit 200 can be a protective gas nozzle or an ordinary ejection pipe. The embodiments of the present utility model do not make any limitations. The gas ejection unit 200 can be installed on the laser emitting unit 100 or other components of the laser processing head. The gas ejection unit 200 can be detachably installed or non-detachably installed. The embodiments of the present utility model do not make any limitations. As long as the installation structure can ensure that the gas ejection channel 210 and the laser emitting channel 110 are independent of each other so that the protective gas does not eject from the laser emitting channel 110, it can be applied in the embodiments of the present utility model to realize the installation of the gas ejection unit 200.

[0041] In a further embodiment, the gas ejection unit 200 and the laser emitting nozzle 101 can be of a split structure. In other embodiments, the gas ejection unit 200 and the laser emitting nozzle 101 can be of an integral structure, as Figure 3 shown. In this case, when the laser emitting nozzle 101 is connected to the laser emitting body 102, the installation of the gas ejection unit 200 can be achieved at the same time. On the contrary, when the laser emitting nozzle 101 is disassembled from the laser emitting body 102, the disassembly of the gas ejection unit 200 can be achieved. Thus, it can be seen that this integral structure integrating the gas ejection unit 200 and the laser emitting nozzle 101 can undoubtedly simplify the disassembly and assembly operations of the user for them.

[0042] During the process, the protective gas will be consumed. In the laser processing head disclosed in the embodiments of the present invention, the gas ejection part 200 needs to be connected to the protective gas source, so that the protective gas in the protective gas source can be transported into the gas ejection part 200 and ejected. As Figure 4 shown, in one embodiment, the protective gas source can be a protective gas container 400. Based on this, the laser processing head disclosed in the embodiments of the present invention can further include a protective gas container 400, and the protective gas container 400 is connected to the gas ejection part 200, so as to supply gas to the gas ejection part 200 during the process.

[0043] In order to replace it when the protective gas is exhausted, the protective gas container 400 can be detachably installed. Specifically, the protective gas container 400 can be detachably installed by means of threaded fit, clamping, plugging, etc. In one embodiment, the protective gas container 400 can be detachably installed on the laser emitting part 100. Of course, the protective gas container 400 can also be detachably installed on other components of the laser processing head, and the embodiments of the present invention do not limit this. For the convenience of connection, the protective gas container 400 can be detachably installed on the laser emitting part 100 through a quick interface or directly detachably installed on the laser emitting part 100.

[0044] The laser processing head disclosed in the embodiments of the present invention can be a handheld laser processing head or an automated laser processing head, that is, during the laser process, it is held by a machine (such as a manipulator) to perform the laser process. Whether it is a handheld laser processing head or an automated laser processing head, the laser processing head includes a part for a user's hand to hold or a machine to hold, and the protective gas container 400 can be detachably installed on the part of the laser processing head for a user's hand to hold or a machine to hold. Of course, the protective gas container 400 can also be installed on other parts of the laser processing head, and the embodiments of the present invention do not limit the specific installation position of the protective gas container 400.

[0045] In the embodiments of the present invention, the protective gas container 400 can be directly connected to the gas ejection part 200 or indirectly connected to the gas ejection part 200, and the embodiments of the present invention do not limit this. In one embodiment, as Figure 4 shown, the laser processing head disclosed in the embodiments of the present invention can further include an air delivery pipe 500. The air delivery pipe 500 can connect the protective gas container 400 and the gas ejection part 200. The air delivery pipe 500 is detachably connected to the protective gas container 400, and the air delivery pipe 500 can be detachably connected to the gas ejection part 200. In a more specific embodiment, both ends of the air delivery pipe 500 can be respectively detachably connected to the protective gas container 400 and the gas ejection part 200 through quick connectors.

[0046] As described above, the structure of the foreign object intrusion prevention structure 300 in the laser processing head disclosed in the embodiments of the present invention can be various, and the embodiments of the present invention do not limit it. For example, the foreign object intrusion prevention structure 300 can be at least one of the magnetic attraction component 310, the adhesive 320, and the blocking structure, such as Figure 2 as shown. Of course, there can be other types of foreign object intrusion prevention mechanisms. In short, the embodiments of the present invention do not limit the specific types of the foreign object intrusion prevention structure 300.

[0047] In an embodiment where the foreign object intrusion prevention structure 300 includes the magnetic attraction component 310, the magnetic attraction component 310 adsorbs foreign objects by magnetic attraction, thereby alleviating the continuous intrusion of foreign objects in the laser emission channel 110. In this embodiment, the magnetic attraction component 310 mainly targets foreign objects that can be magnetically adsorbed, such as iron slag. Specifically, the magnetic attraction component 310 can be one or multiple. To improve the adsorption effect, in one embodiment, the magnetic attraction component 310 is multiple and can be spaced or closely distributed along the through direction of the laser emission channel 110.

[0048] In other embodiments, the magnetic attraction component 310 can be buried in the laser emission part 100 or arranged outside the laser emission part 100. Such a structure can also produce a magnetic adsorption effect on the foreign objects invading the laser emission channel 110. The embodiments of the present invention do not limit the specific setting position of the magnetic attraction component 310, as long as the magnetic attraction component 310 can magnetically adsorb the foreign objects invading the laser emission channel 110.

[0049] There can be various types of the magnetic attraction component 310. For example, the magnetic attraction component 310 can be a permanent magnet or an electromagnetic coil. The embodiments of the present invention do not limit the specific types of the magnetic attraction component 310.

[0050] The magnetic attraction component 310 can be arranged at a position close to the outlet on the laser emission part 100 or at a position far from the outlet on the laser emission part 100. The embodiments of the present invention do not limit the specific setting position of the magnetic attraction component 310.

[0051] In an embodiment where the foreign object intrusion prevention structure 300 includes the adhesive 320, the adhesive 320 has adhesiveness and can stick foreign objects through adhesiveness, thereby alleviating the continuous intrusion of foreign objects in the laser emission channel 110. In the embodiments of the present invention, the structure of the adhesive 320 can be various. In one embodiment, the adhesive 320 can be an adhesive sheet, and the adhesive sheet can be attached to the inner wall of the laser emission channel 110. The surface of the adhesive sheet facing away from the inner wall of the laser emission channel 110 has an adhesive layer. The adhesive layer can be a glue layer. Of course, in other embodiments, a glue layer can also be directly provided on the inner wall of the laser emission channel 110.

[0052] Similarly, the bonding member 320 can be one or multiple. In the embodiment with multiple bonding members 320, the multiple bonding members 320 can be spaced apart along the through direction of the laser emission channel 110. Similarly, the bonding member 320 can be disposed at a position close to the outlet on the laser emission portion 100, or at a position far from the outlet on the laser emission portion 100. The embodiment of the present invention does not limit the specific setting position of the bonding member 320.

[0053] In the embodiment where the foreign object intrusion prevention structure 300 includes a blocking structure, the blocking structure can be various structures capable of blocking foreign objects, such as a baffle or a stopper. The embodiment of the present invention does not limit the specific type and structure of the blocking structure.

[0054] As Figure 2 shown, in one embodiment, the blocking structure can include at least one of a first blocking member 330 and a second blocking member 340. Both the first blocking member 330 and the second blocking member 340 can perform the function of blocking foreign objects. In the embodiment of the present invention, the structures of the first blocking member 330 and the second blocking member 340 can be various, and the embodiment of the present invention does not limit the specific structures of the first blocking member 330 and the second blocking member 340. The structures of the first blocking member 330 and the second blocking member 340 can be the same or different, and the embodiment of the present invention does not make any restrictions.

[0055] In one embodiment, the first blocking member 330 can include a portion to be burned through 331 (as Figure 5 shown) or a small hole with a diameter to be expanded 332 (as Figure 6 shown). The portion to be burned through 331 is used to be broken by the laser beam emitted from the laser emission channel 110 to form a light avoidance hole 333, as Figure 7 shown. The small hole with a diameter to be expanded 332 is used for the laser beam to expand the edge to form a light avoidance hole 333. During the laser process, the portion to be burned through 331 is projected and broken by the laser beam to form a light avoidance hole 333. The small hole with a diameter to be expanded 332 is used for the laser beam to expand the edge to form a light avoidance hole 333.

[0056] When the first blocking member 330 includes the portion to be burned through 331, the first blocking member 330 is a structure without an opening and can block the laser emission channel 110. Since the first blocking member 330 can block the laser emission channel 110, such a laser processing head will play a better blocking role before use (such as during storage, sale, etc.), thereby being able to prevent foreign objects from invading the laser emission portion 100 through the laser emission channel 110, and it is not easy to damage the laser processing head.

[0057] When the first blocking member 330 includes a small hole 332 to be enlarged in diameter, the first blocking member 330 is a structural member with an opening. In this case, after the first blocking member 330 is installed in the laser emission channel 110, it can only block a part of the laser emission channel 110. During the laser process, the laser beam can be projected onto the first blocking member 330. Among them, part of the laser in the laser beam will pass through the small hole 332 to be enlarged in diameter, and the other part of the laser will be projected onto the position at the edge of the small hole 332 in the first blocking member 330 and punch through this part, thereby completing the enlargement of the small hole 332 to be enlarged in diameter. Eventually, the small hole 332 to be enlarged in diameter is enlarged into a light avoidance hole 333. Since this structure has the small hole 332 to be enlarged in diameter, there is no need for the laser beam to penetrate a large area, so it can reduce energy consumption and also reduce the heat generated during the punching process.

[0058] During the laser process, the laser beam can be projected onto the portion 331 to be burned through to punch a hole in the portion 331 to be burned through to form a light avoidance hole 333. Or, the laser beam can be projected onto the small hole 332 to be enlarged in diameter to burn the edge of the small hole 332 to be enlarged in diameter, thereby forming a light avoidance hole 333 with a larger aperture. The laser beam has good collimation. During the process of punching through the portion 331 to be burned through or enlarging the small hole 332 to be enlarged in diameter, a light avoidance hole 333 that exactly matches the size of the laser beam can be formed. The light avoidance hole 333 formed by burning with the laser beam will not be much larger than the laser beam, so that while ensuring the projection of the laser beam, it can also alleviate the situation of weak blocking performance caused by the overly large light avoidance hole 333.

[0059] It should be added that in the embodiment of the present invention, other parts of the first blocking member 330 except the light avoidance hole 333 play a blocking role. In the specific process, foreign objects will invade the laser emission channel 110, but the first blocking member 330 can play a blocking role, thereby alleviating the invasion of foreign objects. At the same time, the light avoidance hole 333 formed by the first blocking member 330 can avoid the laser beam, so that the laser beam can normally emit from the laser emission channel 110 and participate in the process.

[0060] In one embodiment, the second blocking member 340 can also play a blocking role. At the same time, the second blocking member 340 can also reduce the flow rate of foreign objects invading the laser emission channel 110, thereby facilitating the deposition of foreign objects and preventing foreign objects from invading deeper. In the embodiment of the present invention, the second blocking member 340 includes a conical cylinder structure, and the smaller port of the conical cylinder structure faces the outlet of the laser emission channel 110, and the larger port of the conical cylinder structure faces away from the outlet of the laser emission channel 110.

[0061] In a specific laser process, foreign objects invade the laser emission channel 110 and pass through the second blocking member 340. During the process of passing through the second blocking member 340, the outer conical surface of the conical tube structure will form a blockage, thereby alleviating the invasion of foreign objects towards deeper parts. The embodiment of the present utility model does not limit the specific shape of the conical tube structure. The conical tube structure can be a conical cylinder structure or a multi-pyramid tube structure.

[0062] Similarly, in the embodiment of the present utility model, the second blocking member 340 can include one conical tube structure or multiple conical tube structures. The embodiment of the present utility model does not limit the specific number of conical tube structures. When the second blocking member 340 includes multiple conical tube structures, the multiple conical tube structures can be arranged at intervals or adjacent to each other. The taper of the multiple conical tube structures can be the same or different, and the embodiment of the present utility model does not make any restrictions.

[0063] Further, as Figure 2 shown, the second blocking member 340 can further include a mounting portion. The mounting portion can protrude from the outer conical surface of the conical tube structure. The mounting portion can extend between two adjacent magnetic components 310 and thus be clamped and fixed, thereby realizing the clamping and fixing of the second blocking member 340. Of course, the second blocking member 340 can also be installed by means such as bonding, snap connection, connection by a connecting member, etc. The embodiment of the present utility model does not limit the specific installation method of the second blocking member 340. Similarly, the embodiment of the present utility model does not limit the specific installation methods of the magnetic component 310, the bonding member 320, the first blocking member 330, and the second blocking member 340.

[0064] When the foreign object intrusion prevention structure 300 includes at least two of the magnetic component 310, the bonding member 320, the first blocking member 330, the second blocking member 340, and other blocking structures, the embodiment of the present utility model does not limit their arrangement order on the laser emission part 100.

[0065] It should be noted that the foreign object intrusion prevention structure 300 involved in the embodiment of the present utility model can block foreign objects from invading deeper along the laser emission channel 110. At the same time, the foreign object intrusion prevention structure 300 should not block the normal emission of the laser beam during the process.

[0066] The laser processing head disclosed in the embodiments of the present application can preferably reduce the intrusion of foreign objects. During the specific laser processing, the foreign object intrusion prevention structure 300 can block foreign objects, and the foreign objects will fall into the laser emission channel 110. To reduce the possible accumulation of foreign objects after falling, which may affect the passage of the laser beam, in an alternative solution, the laser emission part 100 can be provided with a first foreign object collection space 120 and a first foreign object dumping hole 130. The first foreign object collection space 120 can communicate with the laser emission channel 110 and is used for collecting foreign objects. The first foreign object dumping hole 130 communicates with the first foreign object collection space 120 and is used for dumping the foreign objects collected by the first foreign object collection space 120. Specifically, the first foreign object dumping hole 130 communicates with the external environment of the laser processing head, which is conducive to discharging foreign objects.

[0067] Further, the first foreign object collection space 120 can be provided on the side of the foreign object intrusion prevention structure 300 facing the outlet of the laser emission channel 110, so that the foreign objects blocked on this side by the foreign object intrusion prevention structure 300 can be collected in time to prevent the foreign objects from blocking in the laser emission channel 110.

[0068] Certainly, in the embodiments where the foreign object intrusion prevention structure 300 includes at least one of the magnetic attraction component 310, the bonding component 320, the first blocking component 330, and the second blocking component 340, the first foreign object collection space 120 and the first foreign object dumping hole 130 can be opened on the side of at least one of the magnetic attraction component 310, the bonding component 320, the first blocking component 330, and the second blocking component 340 facing the outlet of the laser emission channel 110.

[0069] In the laser processing equipment disclosed in the embodiments of the present utility model, the gas injection channel 210 is at least partially separated from the laser emission channel 110. Substantially, it can be considered that there is a certain offset between the axes of the gas injection channel 210 and the laser emission channel 110 or a certain included angle is formed between the axes. Therefore, it can alleviate the reverse sputtering caused by the high-speed and high-pressure impact of the shielding gas, and further reduce the amount of foreign objects invading along the laser emission channel 110. However, the shielding gas ejected from the gas injection channel 210 impacts the foreign objects, which will cause reverse sputtering towards the gas injection channel 210. That is to say, there is also foreign object intrusion or an increase in foreign object intrusion in the gas injection channel 210. However, the foreign objects invading through the gas injection channel 210 will not cause damage to the vulnerable components in the laser processing head.

[0070] Of course, in order to achieve the collection of foreign objects and avoid residue in the gas injection channel 210, in other embodiments, the gas ejection part 200 may be provided with a second foreign object collection space 220 and a second foreign object dumping hole 230. The second foreign object collection space 220 is communicated with the gas injection channel 210 and is used for collecting invading foreign objects. The second foreign object dumping hole 230 is communicated with the second foreign object collection space 220 and is used for dumping the foreign objects collected by the second foreign object collection space 220. It should be noted that the second foreign object dumping hole 230 is communicated with the external environment of the laser processing equipment, so as to realize the timely discharge of foreign objects.

[0071] The laser processing head disclosed in the embodiments of the present invention may be a laser welding processing head, a laser cutting processing head, a laser engraving processing head, a laser polishing processing head, etc. The embodiments of the present invention do not limit the specific types of the laser processing head. As described above, the laser processing head disclosed in the embodiments of the present invention may be a handheld device or a non-handheld device, and the embodiments of the present invention do not make any restrictions.

[0072] In the above embodiments of the present invention, the differences between the various embodiments are mainly described. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. Considering the simplicity of the text, it will not be elaborated here.

[0073] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present invention, those of ordinary skill in the art can also make many forms without departing from the purpose of the present invention and the scope protected by the claims, and all of them belong to the protection scope of the present invention.

Claims

1. A laser processing head, characterized in that: The invention comprises a laser emitting part (100), a gas ejecting part (200) and a foreign matter intrusion prevention structure (300), wherein: The laser emitting portion (100) has a laser emitting channel (110), the gas ejecting portion (200) is connected to the laser emitting portion (100), the gas ejecting portion (200) has a gas injection channel (210), the gas injection channel (210) is used to inject protective gas, the foreign matter intrusion prevention structure (300) is arranged in the laser emitting channel (110), and the gas injection channel (210) is at least partially separated from the laser emitting channel (110).

2. The laser processing head according to claim 1, characterized in that: The laser emission channel (110) extends along a first axis, the gas injection channel (210) extends along a second axis, and the first axis intersects with the second axis.

3. The laser processing head according to claim 1, characterized in that: The gas injection channel (210) is completely separated from the laser emission channel (110), or the gas injection channel (210) and the laser emission channel (110) share an emission port.

4. The laser processing head according to claim 1, characterized in that: The laser emission portion (100) comprises a laser emission nozzle (101) and a laser emission body (102); the laser emission nozzle (101) and the laser emission body (102) are detachably connected; the laser emission channel (110) runs from the laser emission body (102) to the laser emission nozzle (101); and the gas ejection portion (200) and the laser emission nozzle (101) are an integral structure.

5. The laser processing head according to claim 1, characterized in that: The laser processing head further comprises a gas delivery pipe (500) and a protective gas container (400); the gas delivery pipe (500) connects the protective gas container (400) and the gas ejection portion (200); the gas delivery pipe (500) is detachably connected to the protective gas container (400); the gas delivery pipe (500) is detachably connected to the gas ejection portion (200); the protective gas container (400) is detachably mounted on the laser ejection portion (100) via a quick interface or is directly detachably mounted on the laser ejection portion (100).

6. The laser processing head according to any one of claims 1 to 5, characterized in that: The foreign matter intrusion prevention structure (300) comprises at least one of a magnetic attraction component (310), an adhesive component (320), a first blocking component (330) and a second blocking component (340).

7. The laser processing head according to claim 6, characterized in that: The first blocking member (330) comprises a portion to be burned through (331) or a small hole to be expanded (332), the portion to be burned through (331) is used to be broken by the laser beam emitted from the laser emission channel (110) to form a light avoidance hole (333), the small hole to be expanded (332) is used for the laser beam to expand the edge to form the light avoidance hole (333) and / or the second blocking member (340) comprises a cone structure, the smaller port of the cone structure faces the outlet of the laser emission channel (110), and the larger port of the cone structure faces away from the outlet of the laser emission channel (110).

8. The laser processing head according to claim 6, characterized in that: The adhesive component (320) is an adhesive sheet attached to the inner wall of the laser emission channel (110), and the surface of the adhesive sheet facing away from the inner wall of the laser emission channel (110) has an adhesive layer.

9. The laser processing head according to claim 6, characterized in that: The number of the magnetic attraction components (310) is plural and they are distributed at intervals along the through direction of the laser emission channel (110).

10. The laser processing head according to claim 1, characterized in that: The laser emitting portion (100) is provided with a first foreign matter collecting space (120) and a first foreign matter dumping hole (130), the first foreign matter collecting space (120) being in communication with the laser emitting channel (110) and being used for collecting foreign matter, the first foreign matter dumping hole (130) being in communication with the first foreign matter collecting space (120) and being used for dumping out the foreign matter collected in the first foreign matter collecting space (120); and / or, The gas ejection portion (200) is provided with a second foreign matter collecting space (220) and a second foreign matter dumping hole (230); the second foreign matter collecting space (220) is connected to the gas ejection channel (210) and is used to collect foreign matter; the second foreign matter dumping hole (230) is connected to the second foreign matter collecting space (220) and is used to dump out the foreign matter collected in the second foreign matter collecting space (220).

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