Wafer grinding head with wear-resistant pressure film

Abstract

The wafer grinding head comprises a grinding head body, a rotating shaft, an air pressure plate and the pressure film, the air pressure plate is located in the grinding head body, the two ends of the air pressure plate are connected with the inner wall of the grinding head body in a sliding mode, and a guide rod is arranged on the inner wall of the grinding head body. Slide ways are formed in the inner walls of the two sides of the grinding head body, the upper end and the lower end of the guide rod are fixedly connected with the inner walls of the slide ways correspondingly, an air chamber is formed between the air pressure plate and the grinding head body, a pressure film is arranged at the bottom of the air pressure plate, and a thin metal gasket is embedded in the edge of the pressure film. The two ends of the air pressure plate are slidably connected with the guide rods through sliding blocks. According to the wafer grinding head with the wear-resistant pressure film, the pressure film is not easy to abrade, so that the problem that the pressure film is damaged due to the fact that the pressure film is not wear-resistant in the wafer grinding process is solved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of mechanical grinding, in particular to a wafer grinding head with a wear-resistant pressure film. Background Technique

[0002] A wafer is a carrier used in the production of integrated circuits, mostly referring to a single-crystal silicon wafer. The single-crystal silicon wafer is drawn and refined from ordinary silica sand, and after a series of measures such as dissolution, purification, and distillation, it is made into a single-crystal silicon rod. After the single-crystal silicon rod is polished and sliced, it becomes a wafer. A wafer is the most commonly used semiconductor material. The larger the wafer, the more ICs can be produced on the same wafer, which can reduce costs; but it requires higher material technology and production technology.

[0003] In the production process of wafers, it is necessary to grind the surface of the wafers. The thickness of the pressure film on the grinding head of the existing wafer grinding device is relatively thin, and the wear resistance of the outermost edge is relatively poor, resulting in easy breakage of the pressure film and reduced use efficiency. The pressure film sucks one side of the wafer in the inflated state, and the other side of the wafer is ground on the grinding machine. During this process, the friction at the edge of the pressure film is the greatest. The pressure film is a consumable, and the biggest problem is its short service life. Usually, the pressure film needs to be replaced after grinding about 500 - 600 wafers. The frequent replacement of the pressure film increases the production cost. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer grinding head with a wear-resistant pressure film, so that the pressure film is not easily worn and broken, thereby solving the problem of breakage of the pressure film due to non-wear resistance during the grinding of wafers and reducing the production cost.

[0005] To achieve the above purpose, the utility model provides a wafer grinding head with a wear-resistant pressure film, including a grinding head body, a rotating shaft, an air pressure plate, and a pressure film. The air pressure plate is located inside the grinding head body, and both ends of the air pressure plate are slidably connected to the inner wall of the grinding head body. Guide rods are provided on the inner wall of the grinding head body, and slideways are opened on both inner walls of the grinding head body. The upper and lower ends of the guide rods are respectively fixedly connected to the inner walls of the slideways. An air chamber is formed between the air pressure plate and the grinding head body. A pressure film is provided at the bottom of the air pressure plate. Thin metal washers are inlaid at the edge of the pressure film. Limiting components are provided at both the upper and lower ends of the guide rods. Both ends of the air pressure plate are slidably connected to the guide rods through sliders.

[0006] Preferably, the grinding head body is in an inverted concave shape.

[0007] Preferably, both ends of the air pressure plate are respectively fixedly connected to the sliders through connecting rods. The inside of the sliders is hollow and sleeved outside the guide rods.

[0008] Preferably, a plurality of evenly distributed balls are arranged along the circumferential direction on the inner wall of the slider. A ball groove corresponding to the balls is arranged on the inner wall of the slider. One side of the ball is in sliding contact with the inner wall of the ball groove, and the other side is in sliding contact with the surface of the guide rod.

[0009] Preferably, the limiting component includes a fixed block, a return spring, and a limiting ring arranged in sequence. One end of the fixed block is fixedly connected to the inner wall of the slideway. One end of the guide rod is connected to the fixed block. The return spring and the limiting ring are respectively sleeved on the outer side of the guide rod. One end of the return spring is connected to the limiting ring, and the other end is connected to the fixed block. The limiting ring is in sliding contact with the guide rod.

[0010] Preferably, an inlay groove is arranged at the edge of the pressure film. A thin metal washer is arranged in the inlay groove. The thin metal washer is concave.

[0011] Preferably, a rotating shaft is arranged above the main body of the grinding head. A plurality of gas pipes are arranged inside the rotating shaft. The gas pipes pass through the main body of the grinding head and are communicated with the air chamber.

[0012] Therefore, the present utility model adopts the above-mentioned wafer grinding head with a wear-resistant pressure film. By inlaying a thin metal washer on the pressure film, the wear-resistant performance of the pressure film is improved, the pressure film is not easily worn out, the service life of the pressure film is prolonged, thereby solving the problem of damage of the pressure film due to non-wear resistance during the process of grinding the wafer, and reducing the production cost; by arranging the limiting component, it is avoided that the air pressure plate presses the wafer too tightly, resulting in damage to the wafer; by arranging balls in the slider, the slider and the guide rod of the air pressure plate can move more smoothly and quickly in the slideway, and the speed of wafer grinding is improved.

[0013] The technical solution of the present utility model will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0014] Figure 1 is the overall structural schematic diagram of a wafer grinding head with a wear-resistant pressure film of the present utility model;

[0015] Figure 2 is Figure 1 the enlarged view at A in

[0016] Figure 3 is the top view of the pressure film in a wafer grinding head with a wear-resistant pressure film of the present utility model;

[0017] Figure 4 is the schematic diagram of the thin metal washer in a wafer grinding head with a wear-resistant pressure film of the present utility model;

[0018] Figure 5 is the schematic diagram of the ball in a wafer grinding head with a wear-resistant pressure film of the present utility model.

[0019] Reference numerals

[0020] 1. Gas pipe; 2. Polishing head body; 3. Limit assembly; 4. Guide rod; 5. Slide block; 6. Pressure film; 7. Wafer; 8. Pneumatic plate; 9. Polishing pad; 10. Slideway; 11. Air chamber; 12. Inlay groove; 13. Limit ring; 14. Return spring; 15. Fixed block; 16. Connecting rod; 17. Ball; 18. Ball groove; 19. Thin metal washer; 20. Rotating shaft. Detailed implementation manners

[0021] The technical solutions of the present utility model will be further described below with reference to the drawings and embodiments.

[0022] Unless otherwise defined, the technical terms or scientific terms used in the present utility model shall have the ordinary meanings understood by those of ordinary skill in the field to which the present utility model belongs. The "first", "second" and similar terms used in the present utility model do not denote any order, quantity or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to represent relative positional relationships, and when the absolute position of the object to be described changes, the relative positional relationship may also change accordingly.

[0023] Embodiment

[0024] As Figure 1 shown, a wafer 7 polishing head with a wear-resistant pressure film 6 includes a polishing head body 2, a rotating shaft 20, a pneumatic plate 8, and a pressure film 6. The polishing head body 2 is in an inverted concave shape. The pneumatic plate 8 is located inside the polishing head body 2, and an air chamber 11 is formed between the pneumatic plate 8 and the polishing head body 2. A rotating shaft 20 is provided above the polishing head body 2. The polishing head body 2 is fixedly connected to a polishing device (not shown in the figure) through the rotating shaft 20. The polishing device belongs to the prior art. The polishing device drives the rotating shaft 20 to rotate, thereby driving the polishing head to rotate for polishing the wafer 7. A plurality of gas pipes 1 are arranged inside the rotating shaft 20, and the gas pipes 1 pass through the polishing head body 2 and communicate with the air chamber 11. The plurality of gas pipes 1 are all connected to an external inert gas pressure pump.

[0025] The two ends of the air pressure plate 8 are slidably connected to the inner wall of the grinding head main body 2. A guide rod 4 is provided on the inner wall of the grinding head main body 2. Slideways 10 are formed on the inner walls on both sides of the grinding head main body 2. The upper and lower ends of the guide rod 4 are respectively fixedly connected to the inner walls of the slideways 10. The two ends of the air pressure plate 8 are slidably connected to the guide rod 4 through sliders 5. The two ends of the air pressure plate 8 are respectively fixedly connected to the sliders 5 through connecting rods 16. The inside of the slider 5 is hollow and sleeved outside the guide rod 4. A plurality of evenly distributed balls 17 are provided on the inner wall of the slider 5 along the circumferential direction. A ball groove 18 corresponding to the balls 17 is provided on the inner wall of the slider 5. One side of the ball 17 is in sliding contact with the inner wall of the ball groove 18, and the other side is in sliding contact with the surface of the guide rod 4. The gas pipe 1 is inflated, and the air chamber 11 is inflated. The gas in the air chamber 11 presses on the air pressure plate 8, pressing the air pressure plate 8 to move downward. The air pressure plate 8 moves downward along the guide rod 4 under the action of the slider 5. As Figure 5 shown, the balls 17 are arranged inside the slider 5, which can make the slider 5 of the air pressure plate 8 and the guide rod 4 move more smoothly and quickly in the slideway 10, and improve the grinding speed of the wafer 7.

[0026] As Figure 2 shown, limiting components 3 are provided at both the upper and lower ends of the guide rod 4. The limiting components 3 include a fixed block 15, a return spring 14, and a limiting ring 13 arranged in sequence. One end of the fixed block 15 is fixedly connected to the inner wall of the slideway 10. One end of the guide rod 4 is connected to the fixed block 15. The return spring 14 and the limiting ring 13 are respectively sleeved outside the guide rod 4. One end of the return spring 14 is connected to the limiting ring 13, and the other end is connected to the fixed block 15. The limiting ring 13 is in sliding contact with the guide rod 4. The slider 5 slides down along the guide rod 4 and contacts the limiting ring 13, pressing down the limiting ring 13, and the return spring 14 deforms, buffering the downward pressure of the air pressure plate 8. By providing the limiting components 3, it is avoided that the air pressure plate 8 presses too tightly on the wafer 7, resulting in damage to the wafer 7. The limiting components above the guide rod are, from bottom to top, the limiting ring, the return spring, and the fixed block. The fixed block is connected to the top wall of the slideway. The limiting components at the upper end of the guide rod play a buffering role when the air pressure plate moves up along the guide rod. During the upward movement of the air pressure plate, the slider is driven to move up, buffering the impact between the slider and the inner wall of the slideway.

[0027] As Figure 4 shown, a pressure film 6 is provided at the bottom of the air pressure plate 8. A thin metal washer 19 is inlaid at the edge of the pressure film 6. A mounting groove 12 is provided at the edge of the pressure film 6 (as Figure 3As shown, a thin metal washer 19 is provided in the inlay groove 12, and the thin metal washer 19 is concave. The thin metal washer 19 is provided at one side edge of the pressure film 6 that adsorbs the wafer 7. A polishing pad 9 is provided below the polishing head main body 2 and the air pressure plate 8. The wafer 7 is placed on the polishing pad 9 directly below the air pressure plate 8. The pressure film 6 sucks one side of the wafer 7 in the inflated state. The thickness of the pressure film 6 on the traditional polishing head is relatively thin, and the wear resistance of the outermost edge is poor. It is difficult for the pressure film 6 to have a long service life in application. By attaching a thin metal washer 19 layer to the edge surface of the pressure film 6, the wear resistance of the edge of the pressure film 6 can be greatly improved, and the surface of the pressure film 6 will not be damaged.

[0028] During use, the pressure film 6 with the thin metal washer 19 is arranged on the air pressure plate 8, and then the wafer 7 is placed on the polishing pad 9. The gas pipe 1 is inflated through an external inert gas pump, so that the air chamber 11 is inflated. The air pressure plate 8 moves downward along the guide rod 4 under the action of the slider 5 until the pressure film 6 adsorbs the wafer 7. A ball 17 is arranged in the slider 5, which can make the slider 5 of the air pressure plate 8 and the guide rod 4 move more smoothly and quickly in the slideway 10, improving the polishing speed of the wafer 7. By setting the limit component 3, it is avoided that the air pressure plate 8 presses the wafer 7 too tightly, resulting in damage to the wafer 7. The pressure film 6 adsorbs the wafer 7 and drives the rotating shaft 20 to rotate under the action of the polishing device, thereby driving the polishing head to rotate to polish the wafer 7. By attaching a thin metal washer 19 layer to the edge surface of the pressure film 6, the wear resistance of the edge of the pressure film 6 can be greatly improved, and the surface of the pressure film 6 will not be damaged.

[0029] Therefore, the present utility model adopts the above-mentioned wafer polishing head with a wear-resistant pressure film. By inlaying a thin metal washer on the pressure film, the wear resistance of the pressure film is improved, and the pressure film is not easily worn out, extending the service life of the pressure film, thereby solving the problem of damage to the pressure film due to non-wear resistance during the wafer polishing process and reducing the production cost; by setting the limit component, it is avoided that the air pressure plate presses the wafer too tightly, resulting in damage to the wafer; by arranging a ball in the slider, the slider of the air pressure plate and the guide rod can move more smoothly and quickly in the slideway, improving the polishing speed of the wafer.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify or equivalently replace the technical solutions of the present utility model, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present utility model.

Claims

1. A wafer grinding head with a wear-resistant pressure film, characterized in that: It includes a grinding head body, a rotating shaft, an air pressure plate, and a pressure membrane. The air pressure plate is located inside the grinding head body, and both ends of the air pressure plate are slidably connected to the inner wall of the grinding head body. A guide rod is provided on the inner wall of the grinding head body, and slideways are provided on the inner walls of the grinding head body on both sides. The upper and lower ends of the guide rod are respectively fixedly connected to the inner walls of the slideways. An air chamber is formed between the air pressure plate and the grinding head body, a pressure membrane is provided at the bottom of the air pressure plate, and a thin metal gasket is inlaid on the edge of the pressure membrane. Limiting components are provided at the upper and lower ends of the guide rod, and both ends of the air pressure plate are slidably connected to the guide rod through sliders.

2. A wafer grinding head with a wear-resistant pressure film according to claim 1, characterized in that: The grinding head body is in an inverted concave shape.

3. The wafer grinding head with a wear-resistant pressure film according to claim 1, characterized in that: The two ends of the air pressure plate are fixedly connected to the slider through connecting rods respectively. The slider is hollow inside and is sleeved on the outside of the guide rod.

4. The wafer grinding head with a wear-resistant pressure film according to claim 1, characterized in that: The inner wall of the slider is provided with a plurality of evenly distributed balls along the circumferential direction, and the inner wall of the slider is provided with ball grooves corresponding to the balls. One side of the ball is in sliding contact with the inner wall of the ball groove, and the other side is in sliding contact with the surface of the guide rod.

5. The wafer grinding head with a wear-resistant pressure film according to claim 1, characterized in that: The limiting assembly includes a fixed block, a return spring, and a limiting ring which are arranged in sequence. One end of the fixed block is fixedly connected to the inner wall of the slideway, and one end of the guide rod is connected to the fixed block. The return spring and the limiting ring are respectively sleeved on the outside of the guide rod. One end of the return spring is connected to the limiting ring, and the other end is connected to the fixed block. The limiting ring is in sliding contact with the guide rod.

6. The wafer grinding head with a wear-resistant pressure film according to claim 1, characterized in that: An inlay groove is arranged at the edge of the pressure membrane, a thin metal gasket is arranged in the inlay groove, and the thin metal gasket is concave.

7. The wafer grinding head with a wear-resistant pressure film according to claim 1, characterized in that: A rotating shaft is arranged above the grinding head body, and a plurality of gas pipes are arranged inside the rotating shaft. The gas pipes pass through the grinding head body and are communicated with the air chamber.

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