Efficient nickel plating mechanism for solar cell silicon wafer

Abstract

The utility model discloses an efficient nickel plating mechanism for a solar cell silicon wafer. The efficient nickel plating mechanism comprises a reaction tank and a conveying assembly, wherein the conveying assembly is provided with a first conveying unit and a second conveying unit which are arranged on the two sides of the reaction tank; the carrying assembly is arranged on the first conveying unit and the second conveying unit, the carrying assembly can carry the silicon wafers conveyed by the first conveying unit into the reaction tank, after the reaction is completed, the silicon wafers in the reaction tank are carried to the first conveying unit again, and then the silicon wafers in the reaction tank are conveyed to the second conveying unit again. The silicon wafer conveyed by the second conveying unit is carried into the reaction tank for reaction; according to the utility model, the problem of low nickel plating efficiency due to the fact that only one conveying line is used for conveying the solar silicon wafer when chemical nickel plating is carried out on the traditional solar silicon wafer can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell silicon wafers, and particularly relates to an efficient nickel plating mechanism for solar cell silicon wafers. Background Art

[0002] Photovoltaic is short for solar photovoltaic power generation system, which is a new type of power generation system that uses the photovoltaic effect of semiconductor materials of solar cells to directly convert solar light radiation energy into electrical energy, and has two operation modes: independent operation and grid-connected operation. The photovoltaic power generation industrial chain from upstream to downstream mainly includes polysilicon, silicon wafers, solar cells and solar cell modules.

[0003] During the production process of silicon wafers, electroless nickel plating needs to be carried out on the surface of silicon wafers. Electroless nickel plating uses divalent nickel ions to undergo an oxidation-reduction reaction with a reducing agent, so that nickel is deposited on the surface of the silicon wafer to form a nickel layer. However, when traditional solar silicon wafers are subjected to electroless nickel plating, most of them are transported through a conveyor line. After a group of solar silicon wafers are plated with nickel in the reaction tank, the solar silicon wafers will continue to be transported for nickel plating operations, resulting in the problem of low nickel plating efficiency of solar silicon wafers. Summary of the Utility Model

[0004] In order to overcome the above disadvantages, the purpose of the utility model is to provide an efficient nickel plating mechanism for solar cell silicon wafers.

[0005] In order to achieve the above purpose, the technical scheme adopted by the utility model includes:

[0006] A reaction tank and a conveying assembly, the conveying assembly having a first conveying unit and a second conveying unit arranged on both sides of the reaction tank;

[0007] A handling assembly, the handling assembly is arranged on the first conveying unit and the second conveying unit, and the handling assembly can transport the silicon wafers conveyed by the first conveying unit into the reaction tank. After the reaction is completed, the silicon wafers in the reaction tank are transported back to the first conveying unit, and the silicon wafers conveyed by the second conveying unit are transported into the reaction tank for reaction.

[0008] In the preferred technical scheme of the above-mentioned efficient nickel plating mechanism for solar cell silicon wafers, it further includes a feeding assembly, and the feeding assembly is arranged at the feeding ports of the first conveying unit and the second conveying unit for transporting silicon wafers to the first conveying unit and the second conveying unit.

[0009] In the preferred technical scheme of the above-mentioned efficient nickel plating mechanism for solar cell silicon wafers, the first conveying unit or the second conveying unit at least includes a conveying frame, a conveyor belt arranged on the conveying frame through pulleys, and a servo motor for driving the pulley to rotate.

[0010] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, the handling component at least includes a vacuum chuck rotatably arranged on the first conveying unit and the second conveying unit, and a driving device for driving the vacuum chuck to flip.

[0011] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, the driving device is connected to the vacuum chuck through a turning rod, and one end of the turning rod connected to the vacuum chuck is in a cross-shaped structure.

[0012] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, the driving device is a rotary cylinder or a flipping motor.

[0013] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, the feeding component at least includes a feeding conveyor line arranged at the feeding ports of the first conveying unit and the second conveying unit.

[0014] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, the feeding component further includes a material rack and a basket installed on the material rack through a linear module. The basket is located directly above the feeding conveyor line, and a retaining rod for placing the silicon wafers is formed inside the basket along the height direction.

[0015] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, a limiting rod is arranged on the side of the vacuum chuck. When the vacuum chuck flips into the reaction tank, the limiting rod abuts against the top of the reaction tank to keep the vacuum chuck in a horizontal state.

[0016] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, a receiving space for the vacuum chuck is formed on the conveying rack. When the vacuum chuck is located inside the conveying rack, the top surface of the vacuum chuck is flush with the conveyor belt.

[0017] In the preferred technical solution of the above-mentioned high-efficiency nickel plating mechanism for solar cell silicon wafers, push plates that can move towards the receiving space are arranged on both sides of the conveying rack in the receiving space through driving cylinders.

[0018] The beneficial effects of the present utility model are as follows: Firstly, the vacuum suction cup on the first conveying unit transports the silicon wafer into the reaction tank. After one side of the silicon wafer is nickel-plated, the vacuum suction cup is used to transport the silicon wafer back to the first conveying unit for blanking. After blanking, the first conveying unit transports the silicon wafer to a predetermined position again. At the same time, the vacuum suction cup on the second conveying unit transports the silicon wafer conveyed by the second conveying unit into the reaction tank for single-sided nickel plating. After the reaction is completed, the vacuum suction cup transports the silicon wafer to the second conveying unit for blanking operation. This process is repeated to achieve continuous nickel plating of the silicon wafer, reduce the time for the conveying component to transport the silicon wafer, improve the efficiency of silicon wafer nickel plating production, and has practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is the front view of the present utility model;

[0020] Figure 2 is the top view of the present utility model;

[0021] Figure 3 is the connection relationship diagram of the conveying component and the reaction tank;

[0022] Figure 4 is the position relationship diagram of the first conveying unit and the vacuum suction cup;

[0023] Figure 5 is the first schematic diagram of the vacuum suction cup and the handling component;

[0024] Figure 6 is the second schematic diagram of the vacuum suction cup and the handling component;

[0025] Figure 7 is the structural schematic diagram of the loading component;

[0026] In the figure: reaction tank 1, first conveying unit 21, second conveying unit 22, handling component 3, vacuum suction cup 31, driving device 32, turning rod 33, accommodating space 4, limiting rod 5, driving cylinder 61, pushing plate 62, loading component 7, loading conveyor line 71, material rack 72, linear module 73, basket 74, blocking rod 75. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present utility model and are not intended to limit the protection scope of the present utility model.

[0028] It should be noted that in the description of the present utility model, the terms "upper", "lower", "left", "right", "front", "rear" and other terms indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0029] In addition, it should also be noted that in the description of the present utility model, unless otherwise clearly specified and defined, the terms "set", "connected", "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] As Figures 1 to 7 shown, the high-efficiency nickel plating mechanism for silicon wafers of the present utility model includes: a reaction tank 1 and a conveying assembly. The conveying assembly has a first conveying unit 21 and a second conveying unit 22 disposed on both sides of the reaction tank 1; a handling assembly 3, and the handling assembly 3 is disposed on the first conveying unit 21 and the second conveying unit 22. The handling assembly 3 can convey the silicon wafers conveyed by the first conveying unit 21 into the reaction tank 1. After the reaction is completed, the silicon wafers in the reaction tank 1 are conveyed back to the first conveying unit 21, and the silicon wafers conveyed by the second conveying unit 22 are conveyed into the reaction tank 1 for reaction.

[0031] See Figure 3 , a reaction solution is disposed in the reaction tank 1, and the reaction tank 1 can perform single-sided nickel plating on the silicon wafers placed therein; the conveying assembly includes a first conveying unit 21 and a second conveying unit 22 disposed on both sides of the reaction tank 1, and the first conveying unit 21 and the second conveying unit 22 have the same structure.

[0032] See Figures 3 to 6 , handling assemblies 3 are disposed on both the first conveying unit 21 and the second conveying unit 22. The handling assemblies 3 are used to convey the silicon wafers on the first conveying unit 21 and the second conveying unit 22 into the reaction tank 1. At the same time, the silicon wafers that have completed the reaction in the reaction tank 1 can be conveyed out of the reaction tank 1 and placed correspondingly on the first conveying unit 21 and the second conveying unit 22.

[0033] During operation, both the first conveying unit 21 and the second conveying unit 22 of the conveying assembly convey the silicon wafers to the handling assembly 3. The handling assembly 3 on the first conveying unit 21 first conveys the silicon wafers into the reaction tank 1. After one-sided nickel plating of the silicon wafers in the reaction tank 1 is completed, the handling assembly 3 on the first conveying unit 21 conveys the silicon wafers in the reaction tank 1 back onto the first conveying unit 21 for discharging. After discharging is completed, the first conveying unit 21 conveys the silicon wafers to a predetermined position again. At the same time, the handling assembly 3 on the second conveying unit 22 conveys the silicon wafers conveyed by the second conveying unit 22 into the reaction tank 1 for one-sided nickel plating. After the reaction is completed, the conveying assembly conveys the silicon wafers to the second conveying unit 22 for discharging operation. At the same time, the second conveying unit 22 is used to load the silicon wafers; and so on, to achieve continuous nickel plating of the silicon wafers, reduce the time for the conveying assembly to convey the silicon wafers, improve the efficiency of silicon wafer nickel plating production, and have practicality.

[0034] In one or more embodiments, at least one of the first conveying unit 21 or the second conveying unit 22 includes at least a conveying frame, a conveyor belt configured on the conveying frame through pulleys, and a servo motor for driving the pulley to rotate. See Figure 3 , Figure 4 , the servo motor drives the pulley to rotate, and then drives the conveyor belt to rotate to convey the silicon wafers placed on the conveyor belt.

[0035] In one or more embodiments, the handling assembly 3 includes at least a vacuum chuck 31 rotatably configured on the first conveying unit 21 and the second conveying unit 22, and a driving device 32 for driving the vacuum chuck 31 to flip; the driving device 32 can be a rotary cylinder or a flipping motor; a receiving space 4 for accommodating the vacuum chuck 31 is formed on the conveying frame. When the vacuum chuck 31 is located inside the conveying frame, the top surface of the vacuum chuck 31 is flush with the conveyor belt.

[0036] See Figures 3 to 6 , a concave receiving space 4 is formed on the conveying frame. The receiving space 4 is used to place the vacuum chuck 31. After the vacuum chuck 31 is located in the receiving space 4, the top surface of the vacuum chuck 31 is flush with the conveyor belt at the top of the conveying frame, so that the conveyor belt conveys the silicon wafers onto the upper surface of the vacuum chuck 31; the vacuum chuck 31 can adsorb the silicon wafers, and the driving device 32 can control the vacuum chuck 31 to flip to directly above the reaction tank 1 and make the silicon wafers adsorbed on the top surface of the vacuum chuck 31 located inside the reaction tank 1. It should be noted that when the silicon wafers are reacting inside the reaction tank 1, the vacuum chuck 31 always maintains adsorption of the silicon wafers. When the nickel plating of the silicon wafers is completed, the driving device 32 is used to control the vacuum chuck 31 to reset into the receiving space 4.

[0037] In a possible implementation, rollers are formed on the surface of the vacuum chuck 31, and the rollers are driven by a motor. With this arrangement, it can be ensured that the wafers falling onto the top surface of the vacuum chuck 31 can be effectively driven onto the conveyor belt, avoiding the problem that a large number of wafers accumulate on the top surface of the vacuum chuck 31 because the wafers cannot be transported by the conveyor belt in time.

[0038] In one or more implementations, the driving device 32 is connected to the vacuum chuck 31 through a turning rod 33, and the end of the turning rod 33 connected to the vacuum chuck 31 has a cross-shaped structure. With this arrangement, the stability of the connection between the turning rod 33 and the vacuum chuck 31 can be ensured, avoiding the problem that the vacuum chuck 31 rotates.

[0039] In one or more implementations, a limiting rod 5 is arranged on the side of the vacuum chuck 31. When the vacuum chuck 31 is turned over into the reaction tank 1, the limiting rod 5 abuts against the top end of the reaction tank 1 to keep the vacuum chuck 31 in a horizontal state. Refer to Figure 3 , with this arrangement, the position of the vacuum chuck 31 in the reaction tank 1 can be limited in time, avoiding the problem that the driving device 32 drives the vacuum chuck 31 to turn over excessively and causes the vacuum chuck 31 to collide with the reaction tank 1. At the same time, with this arrangement, the consistency of the position of the wafers in the reaction tank 1 can be ensured, improving the nickel plating effect of the wafers in this application.

[0040] In one or more implementations, on both sides of the accommodating space 4 of the conveying frame, push plates 62 that can move towards the accommodating space 4 are arranged through driving cylinders 61.

[0041] Refer to Figure 4 , when the conveyor belt transports the wafers onto the vacuum chuck 31, if the positions of the wafers are offset, it will affect the nickel plating effect of the wafers in the reaction tank 1; in this application, the driving cylinders 61 on both sides of the accommodating space 4 of the conveying frame push the push plates 62 to move towards both sides of the vacuum chuck 31, thereby pushing the positions of the wafers to change, realizing the limitation of the positions of the wafers, and ensuring the consistency of the nickel plating of the wafers in the reaction tank 1.

[0042] In one or more implementations, it further includes a loading component 7. The loading component 7 is arranged at the feeding ports of the first conveying unit 21 and the second conveying unit 22 for transporting wafers to the first conveying unit 21 and the second conveying unit 22; the loading component 7 at least includes a loading conveyor line 71 arranged at the feeding ports of the first conveying unit 21 and the second conveying unit 22.

[0043] Refer to Figure 1 、 Figure 2 、 Figure 7, there are two sets of loading conveyor lines 71, which are respectively located at the feeding ports of the first conveying unit 21 and the second conveying unit 22. By means of the two sets of loading conveyor lines 71, the loading efficiency of the first conveying unit 21 and the second conveying unit 22 can be increased, and the efficiency of nickel plating on the silicon wafers can be improved.

[0044] In one or more embodiments, the loading assembly 7 further includes a rack 72 and a basket 74 mounted on the rack 72 through a linear module 73. The basket 74 is located directly above the loading conveyor line 71, and a retaining bar 75 for placing the silicon wafers is formed inside the basket 74 along the height direction.

[0045] See Figure 1 , Figure 2 , Figure 7 , the basket 74 is mounted on the loading conveyor line 71; when the horizontally placed silicon wafers blocked by the retaining bar 75 in the basket 74 are conveyed to the loading conveyor line 71, the linear module 73 on the rack 72 can be used to control the basket 74 to move down at a predetermined height so that the silicon wafers contact the loading conveyor line 71, which has the characteristics of simple structure and convenient operation.

[0046] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it. However, the protection scope of the present invention cannot be limited by this. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A solar cell silicon wafer high efficiency nickel plating mechanism, characterized in that: include: A reaction pool and a conveying assembly, wherein the conveying assembly comprises a first conveying unit and a second conveying unit disposed on both sides of the reaction pool; A transport component is configured on the first conveying unit and the second conveying unit, and the transport component can transport the silicon wafers transported by the first conveying unit to the reaction pool. After the reaction is completed, the silicon wafers in the reaction pool are transported back to the first conveying unit, and the silicon wafers transported by the second conveying unit are transported to the reaction pool for reaction.

2. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 1, characterized in that: It also includes a loading assembly, which is arranged at the feed inlets of the first conveying unit and the second conveying unit and is used to convey silicon wafers to the first conveying unit and the second conveying unit.

3. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 1, characterized in that: The first conveying unit or the second conveying unit at least includes a conveying frame, a conveying belt arranged on the conveying frame through a pulley, and a servo motor for driving the pulley to rotate.

4. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 3, characterized in that: The transport assembly at least includes a vacuum suction cup rotatably arranged on the first conveying unit and the second conveying unit, and a driving device for driving the vacuum suction cup to flip.

5. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 4, characterized in that: The driving device is connected to the vacuum suction cup via a turning rod, and one end of the turning rod connected to the vacuum suction cup is in a cross-shaped structure.

6. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 2, characterized in that: The feeding assembly at least includes a feeding conveying line arranged at the feeding ports of the first conveying unit and the second conveying unit.

7. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 6, characterized in that: The loading assembly also includes a material rack and a lifting basket installed on the material rack through a linear module. The lifting basket is located directly above the loading conveyor line. A blocking rod for placing silicon wafers is formed on the inner side of the lifting basket along the height direction.

8. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 4, characterized in that: A limiting rod is disposed on the side of the vacuum suction cup. When the vacuum suction cup is turned over into the reaction pool, the limiting rod abuts against the top of the reaction pool to keep the vacuum suction cup in a horizontal state.

9. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 4, characterized in that: An accommodating space for accommodating the vacuum suction cup is formed on the conveying frame. When the vacuum suction cup is located in the conveying frame, the top surface of the vacuum suction cup is flush with the conveying belt.

10. The solar cell silicon wafer high-efficiency nickel plating mechanism according to claim 9, characterized in that: The conveying rack is provided with push plates on both sides of the accommodating space through a driving cylinder and can move toward the accommodating space.

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