Solar cell electroplating device and electroplating equipment

Abstract

The utility model relates to the technical field of solar photovoltaic, in particular to a solar cell electroplating device and electroplating equipment, the device comprises an electroplating assembly, a liquid collecting tank and a conveying roller, the electroplating assembly comprises a liquid filling box, a containing cavity is formed in the liquid filling box, and a flow guide hole communicated with the containing cavity is formed in the bottom end face of the liquid filling box; the flexible uniform flow plate and the cathode current-conducting plate are sequentially stacked on the bottom end surface of the liquid filling box; the flexible flow uniformizing plate is used for uniformizing the electroplating liquid medicine flowing out of the flow guide holes; the cathode current-conducting plate is used for electroplating the surface of a battery piece, in the electroplating process, electroplating liquid medicine sequentially flows through the flexible flow uniformizing plate and the cathode current-conducting plate from the liquid filling box, the flow uniformizing effect on the electroplating liquid medicine is achieved through the arrangement of the flexible flow uniformizing plate, staggered contacts are arranged through the cathode current-conducting plate, and the electroplating liquid medicine is evenly drained to the surface of the battery piece to be electroplated through the contacts. And the uniformity of liquid medicine on the surface of the to-be-plated battery piece and the uniformity of a power line between an anode and a cathode are improved, so that the production yield of the battery piece is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar photovoltaics, and in particular to a plating device and plating equipment for solar cell wafers. Background Art

[0002] At present, as a new method for preparing electrodes of solar cell wafers, electroplating technology has been studied more and more widely. As a relatively promising method for preparing electrodes, electroplating can not only greatly reduce the cost in the production process of solar cell wafers, but also the electrodes prepared by electroplating technology have a higher aspect ratio and better conductivity compared with the electrodes prepared by traditional screen printing. The internal resistance of the battery is lower, and the shading loss can be reduced, thereby effectively improving the photoelectric conversion efficiency of solar cell wafers.

[0003] In the electroplating equipment of the prior art, in order to adjust the electromagnetic field from the anode to the workpiece to make the thickness distribution of the electroplated film deposited by electrolysis uniform, the commonly used technology is to provide a plurality of solution injection ports on the anode to supply the electrolytic solution to spray out from the solution injection ports, so as to adjust the uniformity of the electroplating solution sprayed onto the surface of the workpiece.

[0004] However, in the actual continuous electroplating production process, the uneven phenomenon of the power lines between the anode and the cathode still exists in the supporting facilities of the existing electroplating equipment, resulting in the "edge effect" of the electroplated layer deposited on the surface of the workpiece, that is, when the electroplating equipment sprays the electroplating solution onto the surface of the workpiece, the electroplating solution accumulates on the surface of the workpiece when the electroplating clamp contacts the workpiece, resulting in the result that the closer to the edge part around the workpiece, the higher the thickness of the electroplated layer, so that it is more difficult to electroplate the central part of the workpiece than the surrounding edge parts, resulting in uneven electroplated layers on the surface of the workpiece. Summary of the Utility Model

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a plating device and plating equipment for solar cell wafers.

[0006] In a first aspect, the present application provides a plating device for solar cell wafers, comprising:

[0007] A plating assembly, the plating assembly comprising:

[0008] A liquid filling box, an accommodation cavity is arranged in the liquid filling box, and a diversion hole communicated with the accommodation cavity is opened on the bottom end surface of the liquid filling box;

[0009] A flexible flow equalizing plate and a cathode conductive plate, the flexible flow equalizing plate and the cathode conductive plate are sequentially stacked on the bottom end surface of the liquid filling box;

[0010] The flexible flow equalizing plate is configured to equalize the flow of the electroplating liquid flowing out from the diversion hole;

[0011] The cathode conductive plate is configured for electroplating on the surface of the cell.

[0012] In a possible implementation, the liquid filling box includes:

[0013] A top plate;

[0014] A bottom plate, spaced from the top plate, and enclosing the accommodation cavity together with the top plate and the side enclosure;

[0015] A limiting through hole, vertically penetrating from the end face of the top plate to the end face of the bottom plate,

[0016] A first wiring terminal, disposed on the surface of the top plate, configured for connecting a positive or anode wire.

[0017] In a possible implementation, the liquid filling box further includes:

[0018] A delivery hose, one end of which is communicated with the accommodation cavity, configured for inputting electroplating liquid medicine into the accommodation cavity.

[0019] In a possible implementation, a plurality of the diversion holes are evenly opened on the surface of the bottom plate.

[0020] In a possible implementation, the cathode conductive plate includes:

[0021] A conductive plate body, on the surface of which uniform circulation holes are opened;

[0022] A second wiring terminal, disposed at the edge of the top surface of the conductive plate body;

[0023] A contact, disposed on the bottom surface of the conductive plate body.

[0024] In a possible implementation, a plurality of the contacts are spaced on the bottom surface of the conductive plate body, and each contact is misaligned with each circulation hole.

[0025] In a possible implementation, the second wiring terminal coaxially penetrates through the limiting through hole.

[0026] In a possible implementation, it is characterized in that it further includes:

[0027] A liquid collecting tank, used in cooperation with the electroplating assembly, the liquid collecting tank is based on a cavity with an upward opening, and is disposed directly below the electroplating assembly, and the liquid collecting tank is configured to collect and / or store electroplating liquid medicine.

[0028] In a possible implementation, it further includes:

[0029] The transfer rollers are spaced apart and arranged at the opening of the top surface of the liquid collecting tank, and the transfer rollers are configured to convey the solar cell wafers to be electroplated and after electroplating.

[0030] Compared with the prior art, the technical solution provided in the first aspect of the present application at least includes the following beneficial effects or advantages:

[0031] 1) A solar cell electroplating device provided by the present application. Through the setting of the electroplating assembly, the electroplating assembly includes a liquid filling box, a flexible flow equalizing plate, and a cathode conductive plate stacked from top to bottom. The lower bottom plate of the charging box is electrically connected to the anode / positive electrode wire. At the same time, an accommodation cavity is provided inside for storing electroplating liquid medicine, and the electroplating liquid medicine can flow out from the diversion holes opened on the lower bottom plate. The flexible flow equalizing plate is a porous and multi-gap material. The cathode conductive plate is electrically connected to the cathode / negative electrode wire. At the same time, a plurality of circulation holes are opened on the surface of the cathode conductive plate, and a plurality of contacts staggered from the circulation holes are uniformly arranged on the bottom surface. During the electroplating process, the electroplating liquid medicine flows through the flexible flow equalizing plate and the cathode conductive plate in sequence from the liquid filling box. Through the setting of the flexible flow equalizing plate, the flow equalizing effect of the electroplating liquid medicine is realized. Through the staggered contacts provided on the cathode conductive plate, the electroplating liquid medicine is evenly drained to the surface of the wafer to be plated through the contacts, improving the uniformity of the liquid medicine on the surface of the wafer to be plated and the uniformity of the power lines between the anode and the cathode, thereby improving the production yield of the wafers.

[0032] 2) Through the setting of the liquid collecting tank and the transfer rollers, the electroplating liquid medicine can be contained in the liquid collecting tank and transported to the liquid filling box through a pump body to continuously provide the electroplating liquid medicine. At the same time, the electroplating liquid medicine flowing through the wafers during electroplating is collected through the liquid collecting tank. The setting of the transfer rollers realizes the transmission of the wafers, facilitating the automatic electroplating of the wafers and industrial production.

[0033] In the second aspect, the present application provides a solar cell electroplating equipment, and the electroplating equipment includes the solar cell electroplating device as described in any item of the first aspect above, and

[0034] A PLC intelligent control system, which operates in cooperation with the electroplating device, is configured to collect the potential difference between the anode plate and the wafer, and perform real-time monitoring and real-time automatic adjustment of the rectification voltage on the electrolytic power supply.

[0035] Compared with the prior art, the technical solution provided in the second aspect of the present application at least includes the following beneficial effects or advantages:

[0036] 3) By using in conjunction with the electroplating device through the PLC intelligent control system, the PLC intelligent control system controls the flow rate of the variable-frequency pump connected in the solution tank to control the size of the outflow, monitors and feedbacks the input and output of the DC current & voltage of the electroplating electrolysis power supply, monitors information such as the temperature and concentration of the electroplating bath solution, realizes the positive feedback and negative feedback of the automatic control of the electroplating process. At the same time, it monitors the potential difference between the anode plate and the workpiece in real time.

[0037] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. Brief Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0039] Figure 1 is a schematic structural diagram of the electroplating device according to an embodiment of the present utility model;

[0040] Figure 2 is another schematic structural diagram of the electroplating device according to an embodiment of the present utility model;

[0041] Figure 3 is a schematic structural diagram of the electroplating assembly according to an embodiment of the present utility model;

[0042] Figure 4 is a schematic structural diagram of the liquid filling box from the first perspective according to an embodiment of the present utility model;

[0043] Figure 5 is a schematic structural diagram of the liquid filling box from the second perspective according to an embodiment of the present utility model;

[0044] Figure 6 is a cross-sectional view of the liquid filling box according to an embodiment of the present utility model;

[0045] Figure 7 is a schematic structural diagram of the flexible flow equalizing plate and the cathode conductive plate according to an embodiment of the present utility model;

[0046] Figure 8 is a schematic structural diagram of the cathode conductive plate from the first perspective according to an embodiment of the present utility model;

[0047] Figure 9 is a schematic structural diagram of the cathode conductive plate from the second perspective according to an embodiment of the present utility model;

[0048] Figure 10 It is a flow chart of an electroplating device according to an embodiment of the present utility model.

[0049] Reference numerals:

[0050] 100, liquid collecting tank;

[0051] 200, conveying roller;

[0052] 300, electroplating assembly;

[0053] 310, liquid filling box; 311, top plate; 312, bottom plate; 3121, diversion hole; 313, accommodating cavity; 314, limiting through hole; 315, first wiring terminal; 316, conveying hose;

[0054] 320, flexible flow equalizing plate;

[0055] 330, cathode conductive plate; 331, conductive plate body; 3311, circulation hole; 332, second wiring terminal; 333, contact;

[0056] 400, solar cell. Detailed implementation manners

[0057] The embodiments of the present utility model will be described in detail below. The embodiments described with reference to the drawings are exemplary. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0058] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0060] Please refer to Figures 1 to 2 , Figures 1 to 2 which shows the electroplating device for solar cell 400 provided in this embodiment. The electroplating device includes a liquid collecting tank 100, a conveying roller 200 and an electroplating assembly 300. Among them, the liquid collecting tank 100 is used in cooperation with the electroplating assembly 300. The liquid collecting tank 100 is based on a cavity with an upward opening (not marked in the figure) and is arranged directly below the electroplating assembly 300. The conveying roller 200 is arranged at intervals at the opening of the top surface of the liquid collecting tank 100.

[0061] It should be noted that in the electroplating production process of the battery cell 400, the setting of the conveyor roller 200 realizes the automatic conveying of the battery cell 400, enabling the battery cell 400 to automatically enter the electroplating process from the previous process. After the electroplating process of the battery cell 400 is completed, it automatically enters the next process. The conveyor roller 200 can be powered by a motor, and the motor is controlled by a control system. At the same time, the distance between two adjacent conveyor rollers 200 arranged at intervals is less than the width of the battery cell 400. In the figure, only a structure of the conveyor roller 200 is schematically shown for illustration. The structure of the conveyor roller 200 and the working principle and power control of the conveyor roller 200 are prior arts, and its structure and how to achieve automatic control will not be elaborated here.

[0062] Of course, the conveying of the battery cell 400 does not necessarily have to be achieved only through the conveyor roller 200. For example, it can also be through a conveyor belt to convey the battery cell 400, or through multiple rollers arranged at intervals. When it meets the requirement of being able to convey the battery cell 400 from one end to the other end, it can be specifically selected according to actual needs, and no limitation is made here.

[0063] It also should be noted that for the electroplating assembly 300, it can be fixed at a to-be-determined position above the liquid collecting tank 100 through an additional support assembly. For example, the electroplating assembly 300 can be fixed at a to-be-determined position above the liquid collecting tank 100 through a bracket, or the electroplating assembly 300 can be fixed through an additional manipulator. Its fixing method is a prior art and can be specifically selected according to actual needs, and no limitation is made here.

[0064] As Figure 2 shown, as non-limiting, the length of the liquid collecting tank 100 can be set according to actual needs. At the same time, multiple electroplating assemblies 300 can be arranged above the cavity of the liquid collecting tank 100. The multiple electroplating assemblies 300 can be arranged at equal or unequal intervals. The multiple electroplating assemblies 300 can electroplate different battery cells 400 simultaneously, or by controlling the anode and cathode potential differences of different electroplating assemblies 300, perform segmented electroplating on the same battery cell to meet the requirements for electroplating the battery cell 400 in different situations.

[0065] Please refer to Figures 3 to 9, in this embodiment, the structure and working principle of the electroplating assembly 300 will be further described. The electroplating assembly 300 includes a liquid filling box 310, a flexible flow equalizing plate 320, and a cathode conductive plate 330. The liquid filling box 310, the flexible flow equalizing plate 320, and the cathode conductive plate 330 are stacked in sequence from top to bottom. The liquid filling box 310 is electrically connected to a positive or anode wire. At the same time, a cavity is provided in the liquid filling box 310 to store electroplating solution. The flexible flow equalizing plate 320 is sandwiched between the liquid filling box 310 and the cathode conductive plate 330. The cathode conductive plate 330 is electrically connected to a negative or cathode. During the electroplating process, the battery cell 400 is transferred to directly below the electroplating assembly 300 and coincides with the cathode conductive plate 330 in the vertical direction. The bottom structure part of the cathode conductive plate 330 contacts the surface of the battery cell 400, and then the electroplating solution flowing out of the liquid filling box 310 is drained to the surface of the battery cell to achieve uniform electroplating of the battery cell 400.

[0066] In one example, as Figures 4 to 6 shown, the liquid filling box 310 includes a top plate 311 and a bottom plate 312 arranged parallel to and spaced from the top plate 311. Side enclosing plates (not marked in the figure) are provided around the bottom plate 312 and the top plate 311. The bottom plate 312, the top plate 311, and the side enclosing plates enclose a containing cavity 313. A plurality of diversion holes 3121 are formed on the surface of the bottom plate 312, and the plurality of diversion holes 3121 communicate with the containing cavity 313. At the same time, a conveying hose 316 is hermetically connected to the side enclosing plate. The arrangement of the conveying hose 316 is used to input the electroplating solution into the containing cavity 313.

[0067] It should be noted that the plurality of diversion holes 3121 formed on the surface of the bottom plate 312 can be arranged at uniform intervals or non-uniformly. For example, in order to further reduce the edge effect occurring during electroplating, diversion holes 3121 with a higher density can be formed in the middle area of the bottom plate 312. In this way, a better electroplating effect can be achieved. Therefore, for the arrangement of the plurality of diversion holes 3121 formed, it can be specifically selected according to actual needs and is not limited herein.

[0068] It should also be noted that the other end of the conveying hose 316 can be connected to a pump body, and the other end of the pump body can be connected to a liquid collecting tank 100. The pump body is used to provide the power for liquid transportation. The electroplating solution stored in the liquid collecting tank 100 is transported to the electroplating assembly 300 again through the pump body to achieve the recycling of the electroplating solution. Of course, the other end of the pump body can also be connected to other containers filled with electroplating solution, which can be specifically selected according to actual needs and is not limited herein.

[0069] As a non - restrictive example, a limiting through - hole 314 and a first terminal 314 are penetrated through the bottom plate 312 and the top plate 311 near the edge of the liquid - filled box 310. It can be understood that the first terminal 314 can be a through - hole connecting the bottom plate, or other structures. In the case of realizing electrical connection with a wire, its specific shape can be selected according to actual needs. At the same time, the number of the limiting through - hole 314 and the first terminal 314 can be one, two, or other numbers. Preferably, one is provided at each of the four corners of the liquid - filled box 310. The limiting through - hole 314 and the first terminal 314 are arranged separately from the accommodating cavity 313. Generally speaking, the liquid medicine filled in the accommodating cavity 313 cannot flow out from the limiting through - hole 314 and the first terminal 314.

[0070] As Figure 7 shown, the flexible flow - equalizing plate 320 is arranged on the top surface of the cathode conductive plate 330. Preferably, the maximum surface area of the flexible flow - equalizing plate 320 is smaller than the maximum surface area of the cathode conductive plate 330. Of course, the flexible flow - equalizing plate 320 needs to completely cover the through - holes opened in the liquid - filled box 310. At the same time, it should be noted that the structure of the flexible flow - equalizing plate 320 is similar to that of a sponge, and its interior is filled with irregular gaps or small holes. Optionally, the flexible flow - equalizing plate 320 can be made of PTU material. The flexible flow - equalizing plate 320 is mainly used for buffering and equalizing the electroplating liquid flowing down from the liquid - filled box 310 to achieve a better electroplating effect on the battery chip.

[0071] As Figures 8 to 9 shown, the cathode conductive plate 330 includes a conductive plate body 331. Uniform flow - through holes 3311 are opened on the surface of the conductive plate body 331. The second terminal 332 is arranged on the top surface of the conductive plate body 331 near the edge, and the contact 333 is arranged on the bottom surface of the conductive plate body 331. Specifically, a plurality of contacts 333 are arranged at intervals on the bottom surface of the conductive plate body 331, and each contact 333 is arranged in a dislocation manner with each flow - through hole 3311.

[0072] As a non - restrictive example, when the liquid - filled box 310, the flexible flow - equalizing plate 320, and the cathode conductive plate 330 are stacked in sequence from top to bottom, the second terminal 332 is coaxially penetrated through the limiting through - hole 314. That is to say, after assembly, the second terminal 332 and the limiting through - hole 314 are coaxially arranged in the vertical direction. The structure of the second terminal 332 can be selected according to actual needs as long as it can realize connection with a wire. The cross - sectional area of the second terminal 332 is smaller than the cross - sectional area of the limiting through - hole 314. Of course, the second terminal 332 and the limiting through - hole 314 can also be set to an interference fit, so as to realize the fixing function between the liquid - filled box 310 and the cathode conductive plate 330.

[0073] It can be understood that for the setting of the contact 333 and the flow-through hole 3311, their density can be set uniformly or non-uniformly. For example, in one case, in order to avoid the edge effect during the electroplating process, contacts 333 and flow-through holes 3311 with a greater density can be set in the middle area of the bottom surface of the cathode conductive plate 330. Of course, specific selection needs to be made according to actual requirements and is not limited here.

[0074] In the electroplating device of the above embodiment, through the setting of the electroplating assembly 300, the electroplating assembly includes a liquid filling box 310, a flexible flow equalizing plate 320, and a cathode conductive plate 330 stacked from top to bottom. The lower bottom plate 312 of the charging box is electrically connected to the anode / positive wire. At the same time, an accommodation cavity 313 is provided inside to store the electroplating solution, and the electroplating solution can flow out from the diversion hole 3121 opened on the lower bottom plate. The flexible flow equalizing plate 320 is a porous and multi-gap material. The cathode conductive plate 330 is electrically connected to the cathode / negative wire. At the same time, a plurality of flow-through holes 3311 are opened on the surface of the cathode conductive plate 330, and a plurality of contacts 333 staggered from the flow-through holes 3311 are uniformly arranged on the bottom surface. During the electroplating process, the electroplating solution flows through the flexible flow equalizing plate 320 and the cathode conductive plate 330 in sequence from the liquid filling box 310. Through the setting of the flexible flow equalizing plate 320, the flow equalizing effect on the electroplating solution is realized. Through the staggered contacts 333 provided on the cathode conductive plate 330, the electroplating solution is evenly drained to the surface of the battery slice to be plated through the contacts 333, improving the uniformity of the solution on the surface of the battery slice to be plated and the uniformity of the power lines between the anode and the cathode, thereby improving the production yield of the battery slice.

[0075] Moreover, through the setting of the liquid collection tank 100 and the conveyor roller 200, the electroplating solution can be contained in the liquid collection tank 100 and transported to the liquid filling box 310 through a pump body to continuously provide the electroplating solution. At the same time, the electroplating solution flowing through the battery slice during electroplating is collected through the liquid collection tank 100. The setting of the conveyor roller 200 realizes the transmission of the battery slice, facilitating the automatic electroplating of the battery slice and industrial production.

[0076] Please refer to Figure 10 , this embodiment provides a solar cell electroplating device. The electroplating device includes the solar cell electroplating device described in any one of the above embodiments, and a PLC intelligent control system, which operates in cooperation with the electroplating device to collect the potential difference between the anode plate and the battery slice, and perform real-time monitoring and real-time automatic adjustment of the rectification voltage on the electrolysis power supply.

[0077] It should be noted that the PLC intelligent control system is a prior art, and its structure and the principle of realizing the control function will not be elaborated here. In one example, the parameters of the PLC intelligent control system can be obtained based on experimental experience, and the parameters can include the potential difference required for electroplating wafers of different specifications and types, as well as electroplating time and other parameters. The PLC intelligent control system realizes control connection with the electroplating tank system module through the PLC control module. The electroplating tank system module includes a rectifier control module and sensors for monitoring and recording current and voltage data. The PLC intelligent control system can perform variable frequency control on the rectifier, conduct reliability analysis by combining theory with experimental data based on the monitored data, and then realize the positive feedback and negative feedback control of the PLC intelligent control system through experimental parameter changes, automatic analysis, and automatic parameter adjustment.

[0078] Specifically, by using the PLC intelligent control system in cooperation with the electroplating device, the PLC intelligent control system realizes the positive feedback and negative feedback of the automatic control of the electroplating process by controlling the flow rate of the variable frequency pump connected in the solution tank, monitoring and feedback of the input and output of the DC current and voltage of the electroplating electrolysis power supply, and monitoring information such as the temperature and concentration of the electroplating bath solution. At the same time, it monitors the potential difference between the anode plate and the workpiece in real time. When the potential difference between the anode plate and the workpiece exceeds the predetermined range, it gives a prompt record and automatically adjusts the rectification voltage in real time to maintain a uniform distribution of the electrolytic deposition film thickness, monitors abnormalities before the anode plate is damaged, and provides production experiment values with an extreme value alarm.

[0079] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0080] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0081] Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of them. The mention of "embodiment" herein means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The appearance of this phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art can explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0082] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A solar cell electroplating device, characterized in that: include: An electroplating assembly (300), the electroplating assembly (300) comprising: A liquid filling box (310), wherein a receiving chamber (313) is provided in the liquid filling box (310), and a guide hole (3121) communicating with the receiving chamber (313) is formed on a bottom end surface of the liquid filling box (310); A flexible flow-distributing plate (320) and a cathode conductive plate (330), wherein the flexible flow-distributing plate (320) and the cathode conductive plate (330) are sequentially stacked on the bottom end surface of the liquid-filling box (310); The flexible flow-distributing plate (320) is configured to distribute the flow of the electroplating solution flowing out of the flow-guiding hole (3121); The cathode conductive plate (330) is configured to be used for electroplating the surface of the battery cell.

2. A solar cell electroplating device according to claim 1, characterized in that: The liquid filling box (310) comprises: Top plate (311); A bottom plate (312) is spaced apart from the top plate (311), and is arranged together with the top plate (311) and the side panels to form the accommodating cavity (313); A limiting through hole (314), wherein the limiting through hole (314) is vertically penetrated from the end surface of the top plate (311) to the end surface of the bottom plate (312), A first terminal, which is arranged on the surface of the top plate (311) and is configured to be used for positive electrode or anode wire connection.

3. A solar cell electroplating device according to claim 2, characterized in that: The liquid-filling box (310) further includes: A delivery hose (316), one end of which is in communication with the accommodating chamber (313), and is configured to be used for inputting electroplating liquid into the accommodating chamber (313).

4. A solar cell electroplating device according to claim 2, characterized in that: A plurality of guide holes (3121) are evenly arranged on the surface of the bottom plate (312).

5. A solar cell electroplating device according to claim 4, characterized in that: The cathode conductive plate (330) comprises: A conductive plate body (331), wherein the surface of the conductive plate body (331) is provided with uniform flow holes (3311); A second wiring terminal (332) is arranged on an edge of the top surface of the conductive plate body (331); The contact (333) is arranged on the bottom surface of the conductive plate body (331).

6. A solar cell electroplating device according to claim 5, characterized in that: A plurality of the contacts (333) are arranged at intervals on the bottom surface of the conductive plate body (331), and each of the contacts (333) is arranged in a staggered manner with respect to each of the flow holes (3311).

7. A solar cell electroplating device according to claim 5, characterized in that: The second wiring terminal (332) is coaxially inserted into the limiting through hole (314).

8. A solar cell electroplating device according to any one of claims 1 to 7, characterized in that: Also includes: A liquid collecting trough (100) is used in conjunction with the electroplating component (300); the liquid collecting trough (100) is based on a cavity opening upward and is arranged directly below the electroplating component (300); the liquid collecting trough (100) is configured to collect and / or store electroplating liquid.

9. A solar cell electroplating device according to claim 8, characterized in that: Also includes: The conveying rollers (200) are arranged at intervals at the opening of the top surface of the liquid collecting tank (100), and the conveying rollers (200) are configured to convey solar cells to be electroplated and after electroplating.

10. A solar cell electroplating device, characterized in that: The electroplating equipment comprises the solar cell electroplating device according to any one of claims 1 to 9, and The PLC intelligent control system cooperates with the electroplating device and is configured to collect the potential difference between the anode plate and the battery cell, monitor the electrolytic power supply in real time, and automatically adjust the rectifier voltage in real time.

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