Semiconductor process high-precision stainless steel tube

Abstract

The utility model discloses a semiconductor technology high-precision stainless steel pipe which comprises a branch pipe body, one end of the pipe body is fixedly provided with an installation sleeve, the inner side of the installation sleeve is fixedly provided with a first clamping block, and the other end of the pipe body is fixedly provided with a fixing mechanism. According to the high-precision stainless steel pipe for the semiconductor technology, through the arrangement of the pipe body, the mounting sleeve, the first clamping block and the fixing mechanism, in the using process of the high-precision stainless steel pipe, two devices can be conveniently connected together through the arrangement of the fixing mechanism, the first clamping block penetrates through the position between the second clamping blocks, then the mounting sleeve is rotated, and the mounting sleeve and the fixing sleeve are clamped; the installation sleeve continues to be rotated, the first clamping block is aligned with the notch of the limiting disc, the limiting disc is lowered to clamp the first clamping block, the first clamping block and the limiting disc are fixed by rotating the nut, the convenient connection mode of the device can simplify the operation process of pipeline connection, and the time and labor cost needed by installation and disassembly are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of stainless steel pipes, and specifically relates to a high-precision stainless steel pipe for semiconductor processes. Background Technique

[0002] Semiconductor process is a technology for manufacturing semiconductor devices and integrated circuits. Through a series of complex processes, pure semiconductor materials are processed into chips with specific electrical characteristics. High-precision stainless steel pipes for semiconductor processes play an important role in the semiconductor manufacturing process, mainly used for transporting fluids, constructing equipment frameworks, and supporting key components, etc. High-precision stainless steel pipes for semiconductor processes are a type of stainless steel pipe with high-precision and high-cleanliness requirements, usually used in key links such as fluid transportation and equipment construction during semiconductor manufacturing and packaging processes. According to different manufacturing processes and uses, these steel pipes can be divided into two categories: seamless steel pipes and welded steel pipes, and are often mainly round steel pipes, but there are also some special-shaped steel pipes such as square and rectangular ones. Semiconductor processes have extremely high requirements for the dimensional accuracy of the inner and outer diameters, wall thickness, etc. of the steel pipes to ensure the accuracy of fluid transportation and the stability of equipment construction.

[0003] During the use of existing high-precision stainless steel pipes for semiconductor processes, it is not convenient enough to connect two stainless steel pipes together or disassemble the connected stainless steel pipes into two. The time required to adjust the pipeline system is relatively long, and the practicability is not good. Therefore, a high-precision stainless steel pipe for semiconductor processes needs to be proposed. Content of the Utility Model

[0004] The purpose of the utility model is to provide a high-precision stainless steel pipe for semiconductor processes to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A high-precision stainless steel pipe for semiconductor processes, including a pipe body. One end of the pipe body is fixed with a mounting sleeve, and a first clamping block is fixed inside the mounting sleeve. The other end of the pipe body is fixed with a fixing mechanism, and a protective mechanism is arranged on the surface of the pipe body;

[0006] The fixing mechanism includes a fixing sleeve, a second clamping block, a fixing block, a limiting disc and a nut. The fixing sleeve is fixed at the other end of the pipe body. A second clamping block is fixed at one end of the fixing sleeve. A fixing block is fixed above the second clamping block. A limiting disc is sleeved outside the fixing block, and a nut is installed above the limiting disc.

[0007] Preferably, the fixing sleeve is snap-connected with the mounting sleeve through the second clamping block, and the cross-sectional shape between the second clamping blocks conforms to the cross-sectional shape of the first clamping block.

[0008] Preferably, the fixing sleeve is snap-fitted to the first clamping block through a limiting disc, and the cross-sectional shape of the limiting disc conforms to the cross-sectional shape of the first clamping block.

[0009] Preferably, the limiting disc is threadedly connected to the first clamping block through a nut, and one side of the fixing sleeve is provided in a threaded shape.

[0010] Preferably, the protection mechanism includes a protection layer and a high-temperature resistant layer. The protection layer is arranged on the outer side of the pipe body, and the high-temperature resistant layer is arranged on the inner side of the pipe body.

[0011] Preferably, the protection layer is in close contact with the pipe body, and the protection layer is made of epoxy resin material.

[0012] Preferably, the high-temperature resistant layer is in close contact with the pipe body, and the high-temperature resistant layer is made of alumina ceramic coating.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. For this high-precision stainless steel pipe for semiconductor process, through the settings of the pipe body, installation sleeve, first clamping block and fixing mechanism, during the use of the device, through the setting of the fixing mechanism, two such devices can be conveniently connected together. Pass the first clamping block through between the second clamping blocks, then rotate the installation sleeve to engage the installation sleeve with the fixing sleeve. Continue to rotate the installation sleeve to align the first clamping block with the notch of the limiting disc, lower the limiting disc to snap-fit the first clamping block, and rotate the nut to fix the first clamping block and the limiting disc. The convenient connection method of this device can simplify the operation process of pipeline connection, reduce the time and labor costs required for installation and disassembly. During the semiconductor production process, if it is necessary to frequently replace or adjust the pipeline system, the convenient connection method of this device can ensure a quick response, reduce the downtime of the production line, and improve the practicability of this device;

[0015] 2. For this high-precision stainless steel pipe for semiconductor process, through the settings of the pipe body and the protection mechanism, during the use of the device, the protection layer made of epoxy resin material is used to protect the pipe body. Epoxy resin has good chemical corrosion resistance, high-temperature resistance and wear resistance. The protection layer can effectively prevent the stainless steel pipeline from being eroded by external corrosive substances. By using the high-temperature resistant layer made of alumina ceramic material, the alumina ceramic material can withstand high temperatures and harsh environments such as acids and alkalis, and has characteristics such as corrosion resistance, wear resistance, heat resistance and aging resistance, improving the high-temperature tolerance of this device and the practicability of this device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 It is a schematic diagram of the installation sleeve structure of the present utility model;

[0018] Figure 3 This is a schematic structural diagram of the fixing sleeve of the present utility model;

[0019] Figure 4 This is a schematic cross-sectional structural diagram of the limiting disc of the present utility model;

[0020] Figure 5 This is a schematic structural diagram of the limiting disc of the present utility model;

[0021] Figure 6 This is a schematic structural diagram of the first clamping block of the present utility model

[0022] Figure 7 This is a schematic top view cross-sectional structural diagram of the pipe body of the present utility model.

[0023] In the figure: 1. Pipe body; 2. Installation sleeve; 3. First clamping block; 4. Fixing mechanism; 401. Fixing sleeve; 402. Second clamping block; 403. Fixing block; 404. Limiting disc; 405. Nut; 5. Protection mechanism; 501. Protection layer; 502. High-temperature resistant layer. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1-6, the present utility model provides a technical solution: a high-precision stainless steel pipe for semiconductor processes, including a pipe body 1. One end of the pipe body 1 is fixed with a mounting sleeve 2, and a first clamping block 3 is fixed inside the mounting sleeve 2. The other end of the pipe body 1 is fixed with a fixing mechanism 4. The fixing mechanism 4 includes a fixing sleeve 401, a second clamping block 402, a fixing block 403, a limiting disc 404, and a nut 405. The fixing sleeve 401 is fixed at the other end of the pipe body 1. One end of the fixing sleeve 401 is fixed with a second clamping block 402. The fixing sleeve 401 is snap-connected to the mounting sleeve 2 through the second clamping block 402. The cross-sectional shape between the second clamping blocks 402 conforms to the cross-sectional shape of the first clamping block 3. Pass the first clamping block 3 through between the second clamping blocks 402, and then rotate the mounting sleeve 2 to snap the mounting sleeve 2 and the fixing sleeve 401 together. Above the second clamping block 402 is fixed with a fixing block 403. The outside of the fixing block 403 is sleeved with a limiting disc 404. The fixing sleeve 401 is snap-connected to the first clamping block 3 through the limiting disc 404. The cross-sectional shape of the limiting disc 404 conforms to the cross-sectional shape of the first clamping block 3. Rotate the mounting sleeve 2 to align the first clamping block 3 with the notch of the limiting disc 404, lower the limiting disc 404 to clamp the first clamping block 3, preventing the first clamping block 3 from being misaligned. Above the limiting disc 404 is installed a nut 405. The limiting disc 404 is threadedly connected to the first clamping block 3 through the nut 405. One side of the fixing sleeve 401 is provided with a thread. Rotating the nut 405 can fix the first clamping block 3 and the limiting disc 404. Through the setting of the fixing mechanism 4, two such devices can be conveniently connected together. The convenient connection method of this device can simplify the operation process of pipeline connection, reduce the time and labor costs required for installation and disassembly. During the semiconductor production process, if the pipeline system needs to be frequently replaced or adjusted, the convenient connection method of this device can ensure a quick response, reduce the downtime of the production line, and improve the practicability of this device.

[0026] Please refer to Figure 1 and Figure 7 , a protective mechanism 5 is provided on the surface of the pipe body 1. The protective mechanism 5 includes a protective layer 501 and a high-temperature resistant layer 502. The protective layer 501 is provided on the outside of the pipe body 1, and the high-temperature resistant layer 502 is provided inside the pipe body 1. The protective layer 501 is in close contact with the pipe body 1. The protective layer 501 is made of epoxy resin material. By using the protective layer 501 made of epoxy resin material to protect the pipe body 1, epoxy resin has the characteristics of good chemical corrosion resistance, good high-temperature resistance, and good wear resistance. The protective layer 501 can effectively prevent the stainless steel pipe from being eroded by external corrosive substances. The high-temperature resistant layer 502 is in close contact with the pipe body 1. The high-temperature resistant layer 502 is made of alumina ceramic coating. Through the setting of the pipe body 1 and the protective mechanism 5, by using the high-temperature resistant layer 502 made of alumina ceramic material, the alumina ceramic material can withstand high temperatures and harsh environments such as acids and alkalis, and has the characteristics of corrosion resistance, wear resistance, heat resistance, and aging resistance, improving the high-temperature tolerance of this device and the practicability of this device.

[0027] Working principle: When using this high-precision stainless steel tube for semiconductor process, first, when docking two such devices, pass the first block 3 through between the second blocks 402, then rotate the mounting sleeve 2 to engage the mounting sleeve 2 with the fixed sleeve 401. Continue to rotate the mounting sleeve 2 to align the first block 3 with the notch of the limit disc 404. Lower the limit disc 404 to engage the first block 3, and rotate the nut 405 to fix the first block 3 and the limit disc 404, thus conveniently connecting the two such devices. In this way, the use process of this high-precision stainless steel tube for semiconductor process is completed.

[0028] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor process high-precision stainless steel tube, comprising a tube body (1), characterized in that: A mounting sleeve (2) is fixed to one end of the tube body (1), a first clamping block (3) is fixed to the inner side of the mounting sleeve (2), a fixing mechanism (4) is fixed to the other end of the tube body (1), and a protective mechanism (5) is provided on the surface of the tube body (1); The fixing mechanism (4) comprises a fixing sleeve (401), a second clamping block (402), a fixing block (403), a limiting plate (404) and a nut (405); the fixing sleeve (401) is fixed to the other end of the tube body (1); the second clamping block (402) is fixed to one end of the fixing sleeve (401); the fixing block (403) is fixed above the second clamping block (402); the limiting plate (404) is sleeved on the outer side of the fixing block (403); and the nut (405) is installed above the limiting plate (404).

2. The semiconductor process high-precision stainless steel tube according to claim 1, characterized in that: The fixing sleeve (401) is snap-connected with the installation sleeve (2) via a second clamping block (402), and the cross-sectional shape between the second clamping blocks (402) is consistent with the cross-sectional shape of the first clamping block (3).

3. The semiconductor process high-precision stainless steel tube according to claim 1, characterized in that: The fixing sleeve (401) is engaged and connected with the first clamping block (3) via a limiting plate (404); the cross-sectional shape of the limiting plate (404) is consistent with the cross-sectional shape of the first clamping block (3).

4. The semiconductor process high-precision stainless steel tube according to claim 1, characterized in that: The limiting plate (404) is threadedly connected to the first clamping block (3) via a nut (405), and one side of the fixing sleeve (401) is threadedly arranged.

5. The semiconductor process high-precision stainless steel tube according to claim 1, characterized in that: The protective mechanism (5) comprises a protective layer (501) and a high temperature resistant layer (502); the protective layer (501) is arranged on the outside of the tube body (1); and the high temperature resistant layer (502) is arranged on the inside of the tube body (1).

6. The semiconductor process high-precision stainless steel tube according to claim 5, characterized in that: The protective layer (501) is in close contact with the tube body (1), and the protective layer (501) is made of epoxy resin material.

7. The semiconductor process high-precision stainless steel tube according to claim 5, characterized in that: The high temperature resistant layer (502) is in close contact with the pipe body (1), and the high temperature resistant layer (502) is made of an alumina ceramic coating.

Images