VPX backboard with current acquisition and temperature acquisition functions

Abstract

The utility model discloses a VPX backboard with current acquisition and temperature acquisition functions, comprising a backboard main body which is provided with a connector and a power supply connector; the power supply module is connected with the backboard main body through a power supply connector and supplies power to the backboard main body; the current acquisition chip is connected with the power supply module and is connected with the backboard main body through a connector, and the current acquisition chip acquires the current of the backboard main body; and the temperature acquisition chip is connected with the backboard main body through a connector, and the temperature acquisition chip acquires the temperature of the backboard main body. According to the utility model, the power of the VPX system can be directly and accurately measured in real time without power consumption of a power supply; the environment temperature of the VPX system can be read in real time through the VPX upper computer; extra measuring equipment is not needed, convenience and rapidness are achieved, and practicability is high; the universality is high, and all standard VPX board cards can be adapted; the method is applicable to various multi-slot VPX systems; the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of backplanes, and particularly relates to a VPX backplane with functions of current acquisition and temperature acquisition. Background Art

[0002] In the prior art, measuring the power of a VPX chassis mainly relies on external devices. The common practice is to connect a power meter to the power input end of the VPX chassis. For temperature measurement, temperature sensors are usually arranged at key positions inside the VPX chassis or an external temperature gun is used for measurement. This measurement method is not accurate enough and not convenient to use. Summary of the Invention

[0003] According to an embodiment of the utility model, there is provided a VPX backplane with functions of current acquisition and temperature acquisition, including:

[0004] A backplane main body, on which a connector and a power supply connector are provided;

[0005] A power supply module, which is connected to the backplane main body through the power supply connector to supply power to the backplane main body;

[0006] A current acquisition chip, which is connected to the power supply module and is connected to the backplane main body through the connector, and the current acquisition chip acquires the current of the backplane main body;

[0007] A temperature acquisition chip, which is connected to the backplane main body through the connector, and the temperature acquisition chip acquires the temperature of the backplane main body.

[0008] Furthermore, the power supply module includes: a power supply and a sampling resistor;

[0009] The power supply is connected to the backplane main body through the power supply connector to supply power to the backplane main body;

[0010] The power supply is connected to the sampling resistor to output a sampling power supply;

[0011] The current acquisition chip is connected to the power supply and the sampling power supply.

[0012] Furthermore, the current acquisition chip is a TPA626 chip.

[0013] Furthermore, the 8th pin and the 10th pin of the TPA626 chip are connected to the power supply, the 4th pin and the 5th pin of the TPA626 chip are connected to the connector, and the 9th pin of the TPA626 chip is connected to the sampling power supply.

[0014] Furthermore, the temperature acquisition chip is an SD5075 chip.

[0015] Furthermore, the 1st pin and the 2nd pin of the SD5075 chip are connected to the connector.

[0016] The VPX backplane with current acquisition and temperature acquisition functions according to the embodiments of the present invention can directly measure the power consumption of the power supply to accurately and real-time measure the power of the VPX system; the ambient temperature of the VPX system can be read in real time through the VPX host computer; there is no need to additionally increase measurement equipment, which is convenient, fast and highly practical; it has strong versatility and can be adapted to all standard VPX boards; it can be applied to a variety of multi-slot VPX systems; and it has low cost.

[0017] It should be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic structural diagram of a VPX backplane with current acquisition and temperature acquisition functions according to an embodiment of the present invention;

[0019] Figure 2 FIG. 2 is an enlarged schematic diagram of a current acquisition chip of a VPX backplane with current acquisition and temperature acquisition functions according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following will describe in detail the preferred embodiments of the present invention in conjunction with the accompanying drawings, and further elaborate on the present invention.

[0021] First, in conjunction with Figures 1 - 2 A VPX backplane with current acquisition and temperature acquisition functions according to an embodiment of the present invention will be described, which is used to real-time detect the total power and ambient temperature of a VPX system, and has a wide range of application scenarios.

[0022] As Figures 1 - 2 shown, the VPX backplane with current acquisition and temperature acquisition functions according to an embodiment of the present invention includes: a backplane main body 1, a power module, a current acquisition chip 3, and a temperature acquisition chip 4.

[0023] Specifically, as Figures 1 - 2As shown, in this embodiment, a connector 5 and a power supply connector 6 are provided on the backplane main body 1; the power module is connected to the backplane main body 1 through the power supply connector 6 to supply power to the backplane main body 1; the current acquisition chip 3 is connected to the power module and is also connected to the backplane main body 1 through the connector 5. The current acquisition chip 3 can collect the current information of the backplane main body 1 in real time, and can detect current abnormalities such as overload and short circuit in a timely manner, so as to give an early warning and take measures; the total power of the system is calculated through the formula (power = voltage × current), so as to collect the system power; the temperature acquisition chip 4 is connected to the backplane main body 1 through the connector 5. The temperature acquisition chip 4 can collect the temperature information of the backplane main body 1 in real time, which is of great significance for ensuring the stable operation of the system and preventing performance degradation or damage caused by overheating.

[0024] Further, as Figures 1 - 2 shown, in this embodiment, the power module includes: a power supply and a sampling resistor 22; the power supply is connected to the backplane main body 1 through the power supply connector 6 to supply power to the backplane main body 1; the power supply is connected to the sampling resistor 22 to output a sampling power supply; the current acquisition chip 3 is connected to the power supply and the sampling power supply. The introduction of the sampling resistor 22 makes the current acquisition more accurate.

[0025] Further, as Figures 1 - 2 shown, in this embodiment, the current acquisition chip 3 is a TPA626 chip. The 8th and 10th pins of the TPA626 chip are connected to the power supply, the 4th and 5th pins of the TPA626 chip are connected to the connector 5, the 9th pin of the TPA626 chip is connected to the sampling power supply, and the other end of the sampling resistor 22 is connected to the power supply to form a differential voltage. This differential voltage detection method can effectively reduce common-mode noise and interference and improve the accuracy of current acquisition. The TPA626 chip can directly monitor the differential voltage drop across the sampling resistor 22 and convert it into a digital output, so as to achieve high-precision current acquisition.

[0026] Further, as Figures 1 - 2 shown, in this embodiment, the temperature acquisition chip 4 is an SD5075 chip. The 1st and 2nd pins of the SD5075 chip are connected to the connector 5. The SD5075 temperature sensor chip has high measurement accuracy, can accurately reflect the temperature change of the backplane main body 1, has various working modes and is convenient to use.

[0027] As Figures 1 - 2As shown in the figure, the TPA626 chip is used for current acquisition on the backplane main body 1, and the SD5075 chip is used for temperature acquisition. The two chips respectively lead out IIC signals to be interconnected with the IIC signals of the B5 and C5 pins of the J0 connector 5 of the standard VPX backplane, and upload the current and temperature information to the external board; furthermore, the upper computer of the board can calculate the total power of the entire VPX system and the system ambient temperature according to the program; specifically, the VPX system introduces the power supply through the power supply connector 6, and the power supply forms a sampled power supply after passing through the sampling resistor 22; the 8th and 10th pins of the TPA626 chip are connected to the power supply, the 9th pin is connected to the sampled power supply, the 4th pin SDA signal and the 5th pin SCL signal are respectively connected to the B5 and C5 pins of the J0 connector 5 of the backplane main body 1, and are interconnected with the IIC signal of the VPX board. Finally, the VPX board can read the current of the entire VPX system under the upper computer, and then calculate the total power of the system through the formula (power = voltage X current). The 1st pin SDA signal and the 2nd pin SCL signal of the SD5075 chip are respectively connected to the B5 and C5 pins of the J0 connector 5 of the backplane main body 1, and are interconnected with the IIC signal of the VPX board. Furthermore, the VPX board can read the ambient temperature of the current VPX system on the upper computer through the IIC signal.

[0028] Above, with reference to Figures 1 - 2 The VPX backplane with current acquisition and temperature acquisition functions according to the embodiments of the present invention is described. It can directly measure the power of the VPX system accurately and in real time by removing the power consumption of the power supply; the ambient temperature of the VPX system can be read in real time through the VPX upper computer; there is no need to additionally increase measurement equipment, which is convenient and fast and has strong practicability; it has strong versatility and can be adapted to all standard VPX boards; it can be applied to a variety of multi-slot VPX systems; and it has low cost.

[0029] It should be noted that in this specification, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device including the elements.

[0030] Although the content of the present invention has been introduced in detail through the above preferred embodiments, it should be understood that the above description should not be construed as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and substitutions to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A VPX backplane with current collection and temperature collection functions, characterized in that: Include: A backplane body, on which a connector and a power supply connector are provided; A power module, the power module is connected to the backplane body through the power supply connector to supply power to the backplane body; A current collection chip, the current collection chip is connected to the power module and connected to the backplane body through a connector, and the current collection chip collects the current of the backplane body; A temperature acquisition chip is connected to the backplane body through a connector, and the temperature acquisition chip acquires the temperature of the backplane body.

2. The VPX backplane with current collection and temperature collection functions as claimed in claim 1, characterized in that: The power module comprises: a power supply and a sampling resistor; The power supply is connected to the backplane body through a power supply connector to supply power to the backplane body; The power supply is connected to the sampling resistor to output sampling power; The current acquisition chip is connected to the power supply and the sampling power supply.

3. The VPX backplane with current collection and temperature collection functions as claimed in claim 2, characterized in that: The current acquisition chip is a TPA626 chip.

4. The VPX backplane with current collection and temperature collection functions as claimed in claim 3, characterized in that: Pins 8 and 10 of the TPA626 chip are connected to the power supply, pins 4 and 5 of the TPA626 chip are connected to the connector, and pin 9 of the TPA626 chip is connected to the sampling power supply.

5. The VPX backplane with current collection and temperature collection functions as claimed in claim 1, characterized in that: The temperature acquisition chip is the SD5075 chip.

6. The VPX backplane with current collection and temperature collection functions as claimed in claim 5, characterized in that: Pin 1 and pin 2 of the SD5075 chip are connected to the connector.

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