Communication transmission information board card system

Abstract

The utility model relates to the technical field of communication, and discloses a communication transmission information board card system, which comprises a first board card, a second board card and a third board card, the first board card is connected with the second board card and the third board card through a PCIE protocol, and the second board card is connected with the third board card through an SGMI protocol; the third board card comprises a central processing unit, a telecommunication module, a telephone communication chip, an E1 chip, a memory chip, a clock chip, a reset circuit, an Ethernet interface, an optical fiber transmission interface and an interface switching unit; the telecommunication module, the telephone communication chip and the E1 chip are connected with corresponding pins of the central processing unit, and the telecommunication module, the telephone communication chip and the E1 chip are connected with external equipment through a connector. The board card system has the effect of improving the integration degree of the board card system.

Description

Technical Field

[0001] This application relates to the field of communication technologies, and particularly to a communication transmission information board card system. Background Art

[0002] A signal processing board card is a circuit board widely used in fields such as medical treatment, military, and electrical engineering, mainly for signal processing.

[0003] In the related art, in the field of board card development technology, the developer needs to customize and develop a board card that meets the user's requirements according to different requirements and technical indicators proposed by the user. However, the user's requirements and technical indicators are different and have little mutual correlation, and the integration of the board card system is not high, so there is room for improvement. Summary of the Invention

[0004] In order to improve the integration degree of the board card system, this application provides a communication transmission information board card system.

[0005] This application provides a communication transmission information board card system, adopting the following technical solution:

[0006] A communication transmission information board card system includes a first board card, a second board card, and a third board card;

[0007] The first board card is connected to the second board card and the third board card through the PCIE protocol, and the second board card is connected to the third board card through the SGMI protocol;

[0008] The third board card includes a central processor, a telecommunications module, a telephone communication chip, an E1 chip, a memory chip, a clock chip, a reset circuit, an Ethernet interface, an optical fiber transmission interface, and an interface switching unit;

[0009] The telecommunications module, the telephone communication chip, and the E1 chip are connected to corresponding pins of the central processor, and the telecommunications module, the telephone communication chip, and the E1 chip are connected to external devices through a connector.

[0010] By adopting the above technical solution, the first board card is connected to the second board card and the third board card through the PCIE protocol, improving the data transmission rate and reliability between the board cards. Moreover, the third board card integrates the duplex transmission ability, can realize the duplex transmission of the Ethernet interface and the Z interface signal of the telephone communication chip, has the optical fiber transmission ability, can realize the optical / electrical and electrical / optical signal conversion and transmission of the Ethernet signal and the Z interface signal of the telephone communication chip, and can realize the automatic control switching of service transmission, improving the integration degree of the board card system.

[0011] Optionally, the central processor is connected to the telecommunications module through TDM, and the telecommunications module is connected to the connector through SDSL;

[0012] The memory chip is connected to the central processing unit through DDR and is used to provide operating memory for the third board

[0013] The clock chip is connected to the central processing unit through the IIC bus, and the connector is connected to the E1 chip and the telephone communication chip through PCM.

[0014] By adopting the above technical solution, the stability and efficiency of the connection between the telecommunications module, the telephone communication chip, the E1 chip and the central processing unit and the connector are improved.

[0015] Optionally, the connector includes a aviation plug interface, an E1 interface and a Z interface. The telecommunications module is connected to the aviation plug interface, the E1 chip is connected to the E1 interface, and the telephone communication chip is connected to the Z interface.

[0016] Optionally, the interface switching unit includes a channel switching switch button;

[0017] The channel switching switch button is signal-connected to the central processing unit and switches the on / off of the optical fiber transmission interface, the Ethernet interface and the Z interface channels based on the instructions issued by the central processing unit.

[0018] By adopting the above technical solution, the channel switching function of the optical fiber and the sheathed wire board is realized.

[0019] Optionally, a debugging serial port for debugging tests and an mSATA interface for connecting external devices are provided on the first board, and the second board is used to supply power to the first board and the third board.

[0020] Optionally, line and service status indicator lights are provided on the third board to indicate the working status of the E1 interface, the Ethernet interface, the Z interface, the optical fiber interface and the aviation plug interface.

[0021] By adopting the above technical solution, based on the setting of the line and service status indicator lights, it is convenient for users to understand the working status of each interface in real time.

[0022] Optionally, the first board, the second board and the third board are all arranged in the chassis, and radiators are provided on the first board, the second board and the third board, and the radiators are arranged in a fitting manner with the upper cover plate of the chassis.

[0023] By adopting the above technical solution, since the first board, the second board and the third board will affect the performance after the internal power devices generate heat during long-term use, the first board, the second board and the third board are cooled by setting radiators, which improves the service life and performance of the first board, the second board and the third board.

[0024] Optionally, heat dissipation fins are provided on the upper cover plate of the chassis.

[0025] By adopting the above technical solution, the heat dissipation fins exchange heat between the heat of the first board, the second board, and the third board and the external environment, further improving the heat dissipation effect of the first board, the second board, and the third board.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. The first board is connected to the second board and the third board using the PCIE protocol, improving the data transmission rate and reliability between the boards. Moreover, the third board integrates the ability to transmit with a covered wire, enabling the covered wire transmission of Ethernet interface and telephone communication chip Z interface signals, and has the ability to transmit optical signals, enabling the optical / electrical and electrical / optical signal conversion and transmission of Ethernet signals and telephone communication chip Z interface signals, and can achieve automatic control switching of service transmission, improving the integration level of the board system;

[0028] 2. By providing radiators on the first board, the second board, and the third board, and opening heat dissipation fins on the upper cover plate of the chassis, it helps to exchange heat between the heat generated during the long-term use of the first board, the second board, and the third board and the external environment, greatly improving the heat dissipation efficiency of the first board, the second board, and the third board. Description of the Drawings

[0029] Figure 1 is a block diagram mainly showing the communication transmission information board system of this embodiment.

[0030] Figure 2 is a schematic diagram mainly showing the board heat dissipation structure of this embodiment.

[0031] Figure 3 is a schematic diagram mainly showing the board heat dissipation structure of this embodiment.

[0032] Figure 4 is Figure 2 a cross-sectional schematic diagram along the A-A direction.

[0033] Reference numerals: 1, chassis; 2, radiator; 3, upper cover plate; 4, heat dissipation fin. Detailed Embodiments

[0034] The following details the embodiments of the present application, and examples of the embodiments are shown in the appendices Figures 1 - 4 shown.

[0035] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0036] An embodiment of this application discloses a communication transmission information board card system. Refer to Figure 1 , which includes a first board card, a second board card, and a third board card. The first board card is connected to the second board card and the third board card through the PCIE protocol, and the second board card is connected to the third board card through the SGMI protocol.

[0037] Among them, a debugging serial port for debugging tests and an mSATA interface for connecting external devices are provided on the first board card. In actual use, a debugging device can be connected to the debugging serial port for debugging operations. A power module is provided inside the second board card. The power module is connected to a power supply aviation plug and is used to supply power to the first board card and the third board card.

[0038] Refer to Figure 1 , in order to improve the integration degree of the board card system, the third board card includes a central processor, a telecommunications module, a telephone communication chip, an E1 chip, a memory chip, a clock chip, a reset circuit, an Ethernet interface, an optical fiber transmission interface, and an interface switching unit. In the embodiment of this application, the models of each chip IC are not limited and can be adjusted according to the actual situation on the premise of meeting the requirements of users.

[0039] The corresponding pins of the telecommunications module, the telephone communication chip, and the E1 chip are connected to the central processor. The central processor is connected to the telecommunications module through TDM, and the telecommunications module is connected to the connector through SDSL. The memory chip is connected to the central processor through DDR and is used to provide operating memory. The clock chip is connected to the central processor through the IIC bus. The connector is connected to the E1 chip and the telephone communication chip through PCM. The telecommunications module, the telephone communication chip, and the E1 chip are connected to external devices through the connector.

[0040] In order to further improve the integration degree of the board card system, the connector is also integrated in the embodiment of this application. The connector includes an aviation plug interface, an E1 interface, and a Z interface. The telecommunications module is connected to the aviation plug interface, the E1 chip is connected to the E1 interface, and the telephone communication chip is connected to the Z interface.

[0041] The interface switching unit includes a channel switching switch button, which is connected to the central processor signal and switches the fiber transmission interface, Ethernet interface and Z interface channels based on the instructions issued by the central processor. The third board integrates the multiplexing transmission capability, which can realize the multiplexing transmission of Ethernet interface and telephone communication chip Z interface signals, has the fiber transmission capability, can realize the optical / electrical and electrical / optical signal conversion and transmission of Ethernet signals and telephone communication chip Z interface signals, and can realize the automatic control switching of business transmission, which improves the integration degree of the board system.

[0042] In order to facilitate users to understand the working status of each interface in real time, the third board is provided with line and service status indicators. Specifically, the line and service status indicators can indicate the working status of the E1 interface, Ethernet interface, Z interface, optical fiber interface, and aviation plug interface by lighting up or off and showing different colors.

[0043] Reference Figure 2 and Figure 3 The first board, the second board and the third board are all arranged in the chassis 1. Since the first board, the second board and the third board are in long-term use, the internal power devices will generate heat and affect the performance. In order to dissipate the heat of the first board, the second board and the third board, a radiator 2 is arranged on the first board, the second board and the third board. The radiator 2 is fitted with the upper cover 3 of the chassis 1, and the heat is transferred to the upper cover of the chassis 1 through the radiator 2. The radiator 2 can be fixed to the board through the fixing holes to ensure the stability of the board's heat dissipation. In order to further ensure that the board can work stably for a long time, the board is also treated with three protections to increase the stability of the board's work and increase the service life of the board.

[0044] Reference Figure 4 The upper cover plate 3 of the chassis 1 is provided with heat dissipation fins 4, which exchange the heat of the first board, the second board and the third board with the external environment, further improving the heat dissipation effect of the first board, the second board and the third board.

[0045] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A communication transmission information board system, characterized in that: Including the first board, the second board and the third board: The first board is connected to the second board and the third board via the PCIE protocol, and the second board is connected to the third board via the SGMI protocol; The third board includes a central processing unit, a telecommunication module, a telephone communication chip, an E1 chip, a memory chip, a clock chip, a reset circuit, an Ethernet interface, an optical fiber transmission interface, and an interface switching unit; The telecommunication module, telephone communication chip and E1 chip are connected to corresponding pins of the central processing unit, and the telecommunication module, telephone communication chip and E1 chip are connected to external devices through connectors.

2. The communication transmission information board system according to claim 1, characterized in that: The central processor is connected to the telecommunication module via TDM, and the telecommunication module is connected to the connector via SDSL; The memory chip is connected to the central processing unit via DDR to provide operating memory; The clock chip is connected to the central processor via an IIC bus, and the connector is connected to the E1 chip and the telephone communication chip via PCM.

3. The communication transmission information board system according to claim 1, characterized in that: The connector includes an aviation plug interface, an E1 interface and a Z interface. The telecommunication module is connected to the aviation plug interface, the E1 chip is connected to the E1 interface, and the telephone communication chip is connected to the Z interface.

4. The communication transmission information board system according to claim 3, characterized in that: The interface switching unit includes a channel switching switch button; The channel switching switch button is connected to the central processing unit signal, and switches the fiber optic transmission interface, Ethernet interface and Z interface channels on and off based on the instructions issued by the central processing unit.

5. The communication transmission information board system according to claim 1, characterized in that: The first board is provided with a debugging serial port for debugging and testing and an mSATA interface for connecting an external device, and the second board is used to supply power to the first board and the third board.

6. The communication transmission information board system according to claim 3, characterized in that: The third board is provided with line and service status indicator lights for indicating the working status of the E1 interface, Ethernet interface, Z interface, optical fiber interface, and aviation plug interface.

7. The communication transmission information board system according to claim 1, characterized in that: The first board, the second board and the third board are all arranged in a chassis (1); a heat sink (2) is arranged on the first board, the second board and the third board; the heat sink (2) is arranged to fit the upper cover (3) of the chassis (1).

8. The communication transmission information board system according to claim 7, characterized in that: The upper cover plate (3) of the chassis (1) is provided with heat dissipation fins (4).

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