Novel SMD (Surface Mount Device) inductor shell structure

Abstract

The utility model discloses a novel SMD chip inductor shell structure, which relates to the technical field of electronic components and comprises an inductor body and a shell, a loading cavity is formed in the shell, the inductor body is loaded by the loading cavity, and at least four pin terminals extend out of the inductor body; at least four pin parts are arranged on the shell, the pin terminals are electrically connected with the pin parts, the inductor is welded to a preset position of a circuit board through the pin parts during mounting, so that the inductor body is electrically connected with the circuit board, and the inductor is stably mounted on the circuit board by the aid of the shell and the pin parts. During welding, the solder paste and the conductive wire are welded and fixed, so that the inductor body is electrically connected with the circuit board, manual welding is facilitated through the conductive wire, the inductor is prevented from inclining and deviating in the welding process, the welding and mounting efficiency is improved, the stability of the inductor during reflow soldering can be improved, and the inductor is prevented from generating the position and deviating from the preset position in the moving process. And the occurrence of mounting errors is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a novel SMD patch inductor housing structure. Background Art

[0002] The patch inductor, also known as the surface mount inductor, is an inductor component designed specifically for surface mount technology (SMT). Compared with traditional through-hole inductors, the patch inductor has a smaller volume, a higher assembly density, better high-frequency characteristics, and mechanical stability, making it very suitable for the miniaturization, lightweight, and high-performance requirements of modern electronic products.

[0003] Existing patch inductors directly lead out pins. When performing patch assembly, the pins of the inductor need to be aligned with the assembly positions on the circuit board, and then solder wire is used for manual soldering at the contact points. It is also possible to use equipment for the reflow soldering process. However, due to the relatively weak structure of the directly led-out pins of the inductor, most of which are iron sheets, the inductor is not placed stably on the circuit board, resulting in unstable positions after manual soldering. During soldering, the inductor moves, making soldering difficult, and there is a problem of low soldering and assembly efficiency, or the position of the inductor shifts during the process of the equipment driving the circuit board for the reflow soldering process.

[0004] In view of this, it is necessary to propose a new technical solution to solve the above problems. Summary of the Utility Model

[0005] The utility model aims to provide a technical solution that can solve the problems of slow and insecure soldering of inductor pins to overcome the above situations.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A novel SMD patch inductor housing structure, including an inductor body and a housing. The housing forms a loading cavity, and the inductor body is loaded in the loading cavity. The inductor body extends at least four pin terminals, and at least four pin parts are provided on the housing. An electrical connection is formed between the pin terminals and the pin parts. During patch mounting, the inductor is soldered to a preset position on the circuit board through the pin parts, so that an electrical connection is formed between the inductor body and the circuit board.

[0007] As a further solution of the utility model: A conducting wire is provided on the pin part, and the pin terminal is connected to the conducting wire. During patch soldering, an electrical connection is formed between the conducting wire and the soldering point on the circuit board, so that an electrical connection is formed between the inductor body and the circuit board through the conducting wire.

[0008] As a further solution of the utility model: After the pin terminal is placed in the pin part, the conducting wire is wound around the pin part, and the pin terminal is wound and fixed by the conducting wire.

[0009] As a further solution of the utility model: a gully groove is formed on the outer side surface of the pin part, and the size of the gully groove allows the pin terminal to enter.

[0010] As a further solution of the utility model: two baffles are fixedly arranged on the outer side surface of the pin part, the two baffles are distributed on both sides of the gully groove, and the edges of the two baffles protrude around the side surface of the pin part to form a reserved groove with the shell.

[0011] As a further solution of the utility model: sunken grooves are formed around the upper side surface of the shell, so that the pin terminal can pass through the sunken groove and be placed on the pin part.

[0012] As a further solution of the utility model: the conducting wire is a metallic wire body with conductivity.

[0013] As a further solution of the utility model: the shell is of a frame structure and is provided with upper and lower openings, a top piece is fixedly arranged on the upper side surface of the shell, notches are formed at both ends of the top piece, and the loading cavity communicates with the outside through the notches.

[0014] Compared with the prior art, the beneficial effects of the technical solution are as follows: during mounting, the shell loaded with the inductor body is placed on the circuit board, and the pin parts at four places are placed at the preset soldering points. At this time, the conducting wires on the pin parts are in contact with the solder paste at the soldering points. The stable placement of the inductor on the circuit board is realized by the arrangement of the shell and the pin parts. Manual soldering is facilitated through the conducting wires, the inclination and offset of the inductor during the soldering process are avoided, the soldering and mounting efficiency are improved, and the stability of the inductor during reflow soldering can also be ensured. The position of the inductor is prevented from shifting from the preset position during the movement process, and the occurrence of mounting errors is reduced.

[0015] During the manual soldering process, the use of the shell and the pin parts can improve the stability of the overall position, avoid the displacement and inclination of the position of the existing chip inductor during the soldering process, and compared with the existing pins, the pin parts and the conducting wires increase the contact area with the soldering points, which is beneficial to the progress of soldering and improves the soldering efficiency and mounting efficiency.

[0016] When reflow soldering is carried out by equipment, when the equipment drives the circuit board to move, there will be situations of from static - moving - stopping. During startup and braking, the inductor on the circuit board may be displaced due to inertia. At this time, the use of the shell and the pin parts can improve the stability of the inductor, avoid the position of the inductor from moving, and thus reduce the occurrence of mounting errors.

[0017] The additional aspects and advantages of the utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the utility model. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 is a three-dimensional view of the overall structure of the present invention;

[0020] Figure 2 is a three-dimensional view of the bottom structure after the present invention is turned over up and down;

[0021] Figure 3 is a three-dimensional view of the housing structure of the present invention;

[0022] The corresponding reference numerals in the drawings are described as follows:

[0023] 1. Inductor body; 2. Housing; 3. Pin part; 4. Conductive wire; 5. Baffle; 6. Sinking groove;

[0024] 101. Pin terminal;

[0025] 201. Loading cavity; 202. Top sheet;

[0026] 301. Gully groove. Detailed implementation manners

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0028] Please refer to Figures 1-3 , a novel SMD patch inductor housing structure, including an inductor body 1, a housing 2. The housing 2 forms a loading cavity 201, and the inductor body 1 is loaded by using the loading cavity 201. The inductor body 1 extends at least four pin terminals 101.

[0029] Preferably, a top sheet 202 is fixedly provided on the upper side of the housing 2. Both ends of the top sheet 202 are formed with notches. The housing 2 is an overall frame structure, with openings at the top and bottom. The loading cavity 201 communicates with the outside through the notches (as shown in Figure 3 ), and the two ends of the top sheet 202 without notches are fixedly connected to the frame of the housing 2. The middle area of the top sheet 202 is used to install the inductor body 1 (as shown in Figure 1 ).

[0030] The top sheet 202 can be used to mark the model number of the inductor and the values of various aspects of the inductor, and at the same time can protect the internal inductor body 1.

[0031] The notches formed at both ends of the top sheet 202 facilitate the communication between the loading cavity 201 and the outside, which is conducive to the heat dissipation of the inductor body 1.

[0032] Preferably, at least four pin portions 3 are provided on the outer shell 2. An electrical connection is formed between the pin terminals 101 and the pin portions 3. When mounting, the inductor is welded to a preset position on the circuit board through the pin portions 3, so that an electrical connection is formed between the inductor body 1 and the circuit board. A conducting wire 4 is provided on the pin portion 3, and the pin terminal 101 is connected to the conducting wire 4.

[0033] Specifically, when mounting, the outer shell 2 loaded with the inductor body 1 is placed on the circuit board, and the four pin portions 3 are located at the preset welding points. At this time, the conducting wire 4 on the pin portion 3 contacts the solder paste at the welding point. When welding, the solder paste melts and then solidifies to fix the conducting wire 4 and the welding point. Since the pin terminal 101 extending from the inductor body 1 is connected to the conducting wire 4, the inductor body 1 can be electrically connected to the circuit board. During the manual welding process, the use of the outer shell 2 and the pin portions 3 can improve the stability of the overall position, avoiding the displacement and tilt of the existing surface mount inductors during the welding process. And compared with the existing pins, the pin portions 3 and the conducting wire 4 increase the contact area with the welding point, which is beneficial to the welding, improving the welding efficiency and the mounting efficiency.

[0034] Or when performing reflow soldering through equipment, when the equipment drives the circuit board to move, there will be a situation of starting from rest - moving - stopping. During startup and braking, the inductors on the circuit board may move due to inertia. At this time, the use of the outer shell 2 and the pin portions 3 can improve the stability of the inductors, avoiding the movement of the positions of the inductors, thereby reducing the occurrence of mounting errors.

[0035] Among them, when the outer shell 2 and the inductor body 1 are placed on the circuit board, the inductor body 1 inside the loading cavity 201 does not contact the circuit board, thus avoiding the inductor body 1 from interfering with the signals of the circuit board and improving the signal stability.

[0036] More specifically, after the pin terminal 101 is placed in the pin portion 3, the conducting wire 4 is wound around the pin portion 3, and the conducting wire 4 winds and fixes the pin terminal 101.

[0037] The connection between the pin terminal 101 and the conductive wire 4 can be achieved by first placing the pin terminal 101 on the pin part 3, then using the conductive wire 4 to wind the pin terminal 101 around the pin part 3. Subsequently, the connection between the pin terminal 101 and the conductive wire 4 can be fixed by soldering with solder wire to prevent the separation of the pin terminal 101 from the conductive wire 4.

[0038] More specifically, a groove 301 is provided on the outer side surface of the pin part 3, and the size of the groove 301 allows the pin terminal 101 to enter.

[0039] Before winding the conductive wire 4 around the pin terminal 101, the pin terminal 101 can be bent, and the bent part can be placed into the groove 301. By using the right angle formed after bending to abut against the edge of the pin part 3, it can prevent the pin terminal 101 from retracting into the housing 2 during the winding process.

[0040] More specifically, two baffles 5 are fixedly provided on the outer side surface of the pin part 3, and the two baffles 5 are distributed on both sides of the groove 301. When winding the conductive wire 4, the edges of the baffles 5 protrude from the side surface of the pin part 3, presenting a shape where the edges of the baffles 5 expand outwards in all directions, thereby forming a reserved groove between the baffles 5 and the housing 2 for winding the conductive wire 4. This not only prevents the wound conductive wire 4 from detaching from the pin part 3 but also facilitates the winding of the conductive wire 4.

[0041] Among them, after the conductive wire 4 is wound around the pin part 3, when the housing 2 is placed flat on the circuit board, the bottom of the housing 2 and the baffles 5 are flush, and the position of the pin part 3 between the outer side of the housing 2 and the baffles 5 will be above the solder paste at the welding point. The pin part 3 will not contact the solder paste, but the bottom of the conductive wire 4 wound around the pin part 3 will contact the solder paste, so that the solder paste can be melted and solidified with the conductive wire 4.

[0042] More specifically, sunken grooves 6 are provided around the upper side surface of the housing 2, enabling the pin terminal 101 to pass through the sunken grooves 6 and be placed on the pin part 3.

[0043] The sunken grooves 6 are provided on the frame of the housing 2, and the bottom of the sunken grooves 6 is flush with the surface height of the pin part 3. The sunken grooves 6 can provide an extraction space for the pin terminal 101.

[0044] Preferably, the conductive wire 4 is a metallic wire body with conductivity. The conductive wire 4 can be a wire body made of copper, silver, or gold. These metals have good conductivity and welding performance, ensuring a reliable connection between the inductor body 1 and the circuit board.

[0045] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A new type of SMD chip inductor shell structure, characterized in that: The inductor comprises an inductor body (1) and a housing (2), wherein the housing (2) is formed with a loading cavity (201), and the loading cavity (201) is used to load the inductor body (1), and the inductor body (1) has at least four pin terminals (101) extending therefrom; At least four pin portions (3) are provided on the housing (2), an electrical connection is formed between the pin terminals (101) and the pin portions (3), and during mounting, the inductor is soldered to a preset position on a circuit board via the pin portions (3), so that an electrical connection is formed between the inductor body (1) and the circuit board.

2. The novel SMD chip inductor housing structure according to claim 1 is characterized in that: The pin portion (3) is provided with a conductive wire (4), the pin terminal (101) is connected to the conductive wire (4), and during mounting and welding, the conductive wire forms an electrical connection with a welding point of the circuit board, thereby forming an electrical connection between the inductor body (1) and the circuit board through the conductive wire (4).

3. The novel SMD chip inductor housing structure according to claim 2 is characterized in that: After the pin terminal (101) is placed on the pin portion (3), the conductive wire (4) is wound around the pin portion (3), and the conductive wire (4) winds and fixes the pin terminal (101).

4. The novel SMD chip inductor housing structure according to claim 3 is characterized in that: A groove (301) is provided on the outer side surface of the pin portion (3), and the size of the groove (301) allows the pin terminal (101) to enter.

5. The novel SMD chip inductor housing structure according to claim 4 is characterized in that: Two baffles (5) are fixedly provided on the outer side of the pin portion (3), and the two baffles (5) are distributed on both sides of the groove (301). The edges of the two baffles (5) protrude in all directions from the side of the pin portion (3) and the housing (2) to form a reserved groove.

6. The novel SMD chip inductor housing structure according to claim 3 is characterized in that: The upper side surface of the housing (2) is provided with sunken grooves (6) all around, so that the pin terminal (101) can pass through the sunken groove (6) and be placed on the pin portion (3).

7. The novel SMD chip inductor housing structure according to claim 3 is characterized in that: The conductive wire (4) is a conductive metal wire.

8. The novel SMD chip inductor housing structure according to claim 1 is characterized in that: The outer shell (2) is a frame structure and is provided with upper and lower openings. A top sheet (202) is fixedly provided on the upper side of the outer shell (2). Notches are formed at both ends of the top sheet (202). The loading cavity (201) communicates with the outside through the notches.

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