Silicon wafer carrying device
By designing a silicon wafer handling device including a chip-top machine, side-by-side conveying device, a translational electric cylinder, a lifting electric cylinder and a clamping assembly, the problem of the silicon wafer flower basket manual flip and moving in the prior art is solved, and automated and efficient handling is achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202421583971.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-07-05
AI Technical Summary
During the existing silicon wafer production process, the flower basket of the silicon wafer needs to be manually flipped and moved, resulting in inefficiency and time-consuming and labor-consuming.
A silicon wafer handling device is designed, including a chip-mounted machine, a conveyor device arranged side by side, a translational electric cylinder, a lifting electric cylinder and a clamping assembly. Through structural coordination, the automatic flip, grab and transport of the flower basket is realized instead of manual operation.
It realizes automatic and efficient handling of flower baskets, improves production efficiency, and reduces the time and energy of manual operation.
Smart Images

Figure CN222995365U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of silicon wafer production, and particularly to a silicon wafer handling device. Background Art
[0002] In the existing silicon wafer production process, after the wafer cassette with wafers is conveyed, it is necessary for workers to manually flip the cassette and move it to the loader for loading. After the loading is completed, the empty cassette is then moved to the designated position, which is time-consuming and laborious and has low efficiency. Utility Model Content
[0003] The purpose of the present utility model is to provide a silicon wafer handling device to overcome the deficiencies in the prior art.
[0004] To achieve the above purpose, the present utility model provides the following technical solutions:
[0005] This application embodiment discloses a silicon wafer handling device, which is characterized in that: it includes a loader, a pair of conveying devices, a translation electric cylinder, a lifting electric cylinder and a clamping component. The pair of conveying devices are arranged side by side. The loader is arranged on one side of the pair of conveying devices. The translation electric cylinder is arranged above the pair of conveying devices and the loader. The lifting electric cylinder is slidably connected with the translation electric cylinder in cooperation. The clamping component is slidably connected with the lifting electric cylinder in cooperation. The conveying device includes a driving shaft, a driven shaft and a motor. A pair of first synchronous pulleys are symmetrically sleeved on the driving shaft. A pair of second synchronous pulleys are symmetrically sleeved on the driven shaft. The motor drives the driving shaft to rotate. A synchronous belt is wound between the first synchronous pulley and the second synchronous pulley on the same side. A pair of fixing plates are arranged on both sides of the conveying device. A rotating shaft parallel to the driving shaft is rotatably connected between the pair of fixing plates. A turning plate is fixed on the rotating shaft. The turning plate is in an "L" shape. One end of the rotating shaft penetrates through the fixing plate and is fixedly sleeved with a swing arm. A telescopic cylinder is hinged on the fixing plate. The output end of the telescopic cylinder is hinged with the swing arm.
[0006] Preferably, in the above-mentioned silicon wafer handling device, the turning plate is arranged between the two synchronous belts.
[0007] Preferably, in the above-mentioned silicon wafer handling device, the clamping component includes a moving frame, a double-acting cylinder and a pressing block. The moving frame is slidably connected with the lifting electric cylinder in cooperation. The double-acting cylinder is fixed inside the moving frame. A wafer cassette clamp is fixed at each of the two output ends of the double-acting cylinder. The pressing block is arranged below the moving frame. The pressing block is connected with the moving frame through a plurality of telescopic rods. A spring is sleeved on the telescopic rod. The two ends of the spring are respectively fixedly connected with the pressing block and the moving frame.
[0008] Preferably, in the above-mentioned silicon wafer handling device, the translation electric cylinder is fixedly connected with the first frame, and the fixing plate is fixedly connected with the second frame.
[0009] Preferably, in the above-mentioned silicon wafer handling device, there are a pair of lifting electric cylinders, and a clamping assembly is slidably connected to each lifting electric cylinder.
[0010] Preferably, in the above-mentioned silicon wafer handling device, the conveying directions of the pair of conveying devices are opposite.
[0011] Compared with the prior art, the advantages of the present utility model are as follows:
[0012] Through the structural cooperation, the automatic flipping, grasping and handling of the flower basket are realized, and the empty flower basket is processed in time, replacing manual labor, with high automation, improved efficiency and labor saving. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.
[0014] Figure 1 The figure shows a side view structural diagram of the silicon wafer handling device in a specific embodiment of the present utility model;
[0015] Figure 2 The figure shows a front view structural diagram of the silicon wafer handling device in a specific embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] The following will combine the drawings in the embodiments of the present utility model to describe the technical solutions in the embodiments of the present utility model in detail. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the protection scope of the present utility model.
[0017] Refer Figures 1 - 2As shown in the figure, the wafer handling device in this embodiment includes a wafer loader 1, a pair of conveying devices 2, a translation cylinder 3, a lifting cylinder 4, and a clamping assembly 5. The pair of conveying devices 2 are arranged side by side. The wafer loader 1 is arranged on one side of the pair of conveying devices 2. The translation cylinder 3 is arranged above the pair of conveying devices 2 and the wafer loader 1. The lifting cylinder 4 is slidably connected to the translation cylinder 3 in cooperation. The clamping assembly 5 is slidably connected to the lifting cylinder 4 in cooperation. The conveying device 2 includes a driving shaft 201, a driven shaft 202, and a motor 203. A pair of first synchronous pulleys 204 are symmetrically sleeved on the driving shaft 201. A pair of second synchronous pulleys 205 are symmetrically sleeved on the driven shaft 202. The motor 203 drives the driving shaft 201 to rotate. A synchronous belt 206 is wound between the first synchronous pulley 204 and the second synchronous pulley 205 on the same side. A pair of fixing plates 6 are arranged on both sides of the conveying device 2. A rotating shaft 7 parallel to the driving shaft 201 is rotatably connected between the pair of fixing plates 6. A turning plate 8 is fixed on the rotating shaft 7. The turning plate 8 is in an "L" shape. One end of the rotating shaft 7 penetrates through the fixing plate 6 and is fixedly sleeved with a swing arm 9. A telescopic cylinder 10 is hinged on the fixing plate 6. The output end of the telescopic cylinder 10 is hinged to the swing arm 9.
[0018] Further, the turning plate 8 is arranged between the two synchronous belts 206.
[0019] Further, the clamping assembly 5 includes a moving frame 501, a double-acting cylinder 502, and a pressing block 503. The moving frame 501 is slidably connected to the lifting cylinder 4 in cooperation. The double-acting cylinder 502 is fixed inside the moving frame 501. Flower basket clamps 504 are fixed to both output ends of the double-acting cylinder 502. The pressing block 503 is arranged below the moving frame 501. The pressing block 503 is connected to the moving frame 501 through a plurality of telescopic rods 505. Springs 506 are sleeved on the telescopic rods 505. Both ends of the springs 506 are fixedly connected to the pressing block 503 and the moving frame 501 respectively.
[0020] Further, the translation cylinder 3 is fixedly connected to the first frame 11, and the fixing plate 6 is fixedly connected to the second frame 12.
[0021] Further, there are a pair of lifting cylinders 4, and a clamping assembly 5 is slidably connected to each lifting cylinder 4.
[0022] Further, the conveying directions of the pair of conveying devices 2 are opposite.
[0023] In this technical solution, one of the conveying devices conveys a wafer cassette. After the wafer cassette moves into the L-shaped plate, the telescopic cylinder drives the swing arm and the rotating shaft to rotate, and then drives the L-shaped plate to rotate to turn the wafer cassette. At the same time, one of the clamping assemblies is clamped through the cooperation of the lifting electric cylinder and the translation electric cylinder, and the wafer cassette is moved into the wafer loader for wafer loading; after the wafer loading is completed, another fixture is driven by the lifting electric cylinder and the translation electric cylinder to clamp the empty cassette and move it to another conveying device for recycling. A pair of fixtures can repeat the actions simultaneously, thus replacing manual labor and carrying out automated and efficient handling of the wafer cassette and the empty cassette, improving efficiency.
[0024] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.
[0025] The above are only specific embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present application.
Claims
1. A silicon wafer handling device, characterized in that: The present invention relates to a method for axially activating a lifting mechanism, wherein the lifting mechanism is an electric cylinder that is movable between the movable and movable parts and the movable parts. The lifting mechanism is an electric cylinder that is movable between the movable and movable parts. The lifting mechanism is an electric cylinder that is movable between the movable and movable parts.
2. A silicon wafer handling device according to claim 1, characterized in that: The turnover plate is arranged between two synchronous belts.
3. The silicon wafer handling device according to claim 1, characterized in that: The clamping assembly includes a moving frame, a two-way cylinder and a pressure block. The moving frame is slidably connected with the lifting electric cylinder. The two-way cylinder is fixed in the moving frame. Both output ends of the two-way cylinder are fixed with flower basket clamps. The pressure block is arranged under the moving frame. The pressure block is connected to the moving frame through a plurality of telescopic rods. A spring is sleeved on the telescopic rod. Both ends of the spring are fixedly connected to the pressure block and the moving frame respectively.
4. The silicon wafer handling device according to claim 1, characterized in that: The translation electric cylinder is fixedly connected to the first frame, and the fixing plate is fixedly connected to the second frame.
5. The silicon wafer handling device according to claim 1, characterized in that: A pair of lifting electric cylinders are provided, and each lifting electric cylinder is slidably connected with a clamping assembly.
6. The silicon wafer handling device according to claim 1, characterized in that: The conveying directions of the pair of conveying devices are opposite.