Wafer unloading machine

Abstract

The utility model discloses a wafer unloading machine which comprises a driving moving mechanism, a laser etching mechanism and an unloading mechanism, the driving moving mechanism comprises a driving frame, a camera, an adsorption frame, a moving frame and a placing table, the adsorption frame and the moving frame are installed at the lower end of the driving frame, and the camera is installed on the placing table. The camera is arranged on one side of the adsorption frame and one side of the moving frame, the placing table is arranged below the adsorption frame and the moving frame, the laser engraving mechanism comprises an engraving table, an engraving machine and an engraving supporting frame, the engraving table is installed on the upper half portion of the engraving supporting frame in a sliding mode, and the engraving machine is located above the engraving supporting frame; according to the utility model, under the operation of the driving moving mechanism, a wafer is firstly subjected to information processing in the laser etching mechanism, then the wafer is moved to the interior of the blanking mechanism, and finally, the collecting box filled with the moving frame is moved and collected, so that the processing, engraving and collecting processes of the device are integrated, and the use space of the device is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer unloading machine. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon.

[0003] The main processing methods of wafers are single-wafer processing and batch processing, that is, one or more wafers are processed simultaneously. Among them, during single-wafer processing, it is necessary to move and collect a single wafer. Since its processing, engraving, and collection processes need to run step by step, it is necessary to set up support structures for multiple processes. However, the setting of too many mechanisms makes the processing device relatively scattered, affecting the volume of the device during use.

[0004] Therefore, we provide a wafer unloading machine. Content of the Utility Model

[0005] The purpose of the utility model is to provide a wafer unloading machine for the above-mentioned existing technical problems, so as to achieve the effect of saving the actual use space of the device.

[0006] In view of this, the utility model provides a wafer unloading machine, which includes a driving and moving mechanism, a laser engraving mechanism, and a blanking mechanism.

[0007] The driving and moving mechanism includes a driving frame, a camera, an adsorption frame, a moving frame, and a placement table. Among them, the adsorption frame and the moving frame are installed at the lower end of the driving frame, the camera is arranged on one side of the adsorption frame and the moving frame, and the placement table is arranged below the adsorption frame and the moving frame.

[0008] The laser engraving mechanism includes an engraving table, an engraving machine, and an engraving support frame. Among them, the engraving support frame is arranged on one side of the driving frame, the engraving table is slidably installed on the upper half of the engraving support frame, and the engraving machine is located above the engraving support frame.

[0009] The blanking mechanism includes a collection box and a moving support frame. Among them, the collection box is arranged on the moving support frame, the collection box is used for placing wafer slices, and the moving support frame is arranged on one side of the engraving machine.

[0010] Preferably, there are at least two driving frames, and the two driving frames are located on the same side and operate separately.

[0011] Preferably, a driving motor is installed at one end of the engraving support frame, the output end of the driving motor extends into the interior of the engraving support frame, and the engraving table is installed at the output end of the driving motor.

[0012] Preferably, a support frame is slidably installed on one side of the movable support frame, a driving motor is installed at one end of the movable support frame, and the support frame is installed at the output end of the driving motor.

[0013] Preferably, a cylinder is installed at the upper end of the support frame, a clamping head is installed at the output end of the cylinder, and the cylinder is used to control the clamping movement of the clamping head.

[0014] Preferably, a conveyor belt is installed below the collection box, limiting rods are arranged on both opposite sides of the conveyor belt, and the collection box is located between the two limiting rods.

[0015] Compared with the prior art, the present utility model provides a wafer unloading machine, which has the following

[0016] Beneficial effects:

[0017] 1. In the present utility model, when the driving and moving mechanism operates, the wafer is first moved into the laser engraving mechanism for information processing, then moved into the blanking mechanism, and finally the collection box filled with the moving rack is moved for collection, making the processing, engraving, and collection processes of the device integrated, reducing its usage space, and at the same time enabling the device to have the effect of automatically processing, moving, and blanking the wafer.

[0018] 2. In the present utility model, by controlling the two driving frames to operate separately or simultaneously, two wafers can be operated simultaneously or separately, improving the high efficiency and stability of the device during wafer unloading and processing.

[0019] Parts not involved in this device are the same as or can be implemented using the prior art. The structure of the present utility model is simple and the operation is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front view structural schematic diagram of a wafer unloading machine proposed by the present utility model;

[0021] Figure 2 It is a processing method structural schematic diagram of a wafer unloading machine proposed by the present utility model;

[0022] Figure 3 It is a engraving method structural schematic diagram of a wafer unloading machine proposed by the present utility model;

[0023] Figure 4 It is a material collection method structural schematic diagram of a wafer unloading machine proposed by the present utility model.

[0024] In the figure: 1, driving frame; 2, camera; 3, adsorption frame; 4, moving frame; 5, placement table; 6, adjustment table; 7, engraving table; 8, engraving machine; 9, engraving support frame; 10, collection box; 11, clamping head; 12, driving motor; 13, moving support frame; 14, transmission belt; 15, limiting rod; 16, cylinder. Detailed implementation manner

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0026] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0027] Embodiment: A wafer unloading machine, as Figures 1-4 shown, includes a driving and moving mechanism, a laser engraving mechanism, and a blanking mechanism.

[0028] The driving and moving mechanism includes a driving frame 1, a camera 2, an adsorption frame 3, a moving frame 4, and a placement table 5. Among them, the adsorption frame 3 and the moving frame 4 are installed at the lower end of the driving frame 1, the camera 2 is arranged on one side of the adsorption frame 3 and the moving frame 4, and the placement table 5 is arranged below the adsorption frame 3 and the moving frame 4.

[0029] The laser engraving mechanism includes an engraving table 7, an engraving machine 8, and an engraving support frame 9. Among them, the engraving support frame 9 is arranged on one side of the driving frame 1, the engraving table 7 is slidably installed on the upper half of the engraving support frame 9, and the engraving machine 8 is located above the engraving support frame 9.

[0030] The blanking mechanism includes a collection box 10 and a moving support frame 13. Among them, the collection box 10 is arranged on the moving support frame 13. The collection box 10 is used for placing wafer sheets, and the moving support frame 13 is arranged on one side of the engraving machine 8.

[0031] When the device is running, by rotating the driving frame 1, and then moving the adsorption frame 3 according to the picture irradiated by the camera 2 to process the wafer raw material. Then, through the adsorption effect of the adsorption frame 3, the raw material is adjusted in angle and placed above the adjustment table 6. Then, the moving frame 4 is moved to move the raw material and place it above the engraving table 7. Then, engraving processing is carried out by the engraving machine 8. Then, the moving frame 4 is moved to move the engraved raw material into the collection box 10. Then, the collection box 10 filled with the moving frame 4 is moved for collection. Thus, under the operation of the driving and moving mechanism, the wafer is first processed for information inside the laser engraving mechanism, and then moved into the blanking mechanism, making the processing, engraving and collection process of the device integrated, reducing its use space, and at the same time enabling the device to have the effect of automatically processing, moving and blanking the wafer.

[0032] As Figures 1-4 shown, there are at least two driving frames 1, and the two driving frames 1 are located on the same side and operate separately.

[0033] By controlling the two driving frames 1 to operate separately or simultaneously, two wafers can be operated simultaneously or separately, improving the high efficiency and stability of the device during the wafer unloading and processing.

[0034] As Figures 1-4 shown, a driving motor 12 is installed at one end of the engraving support frame 9, and the output end of the driving motor 12 extends into the engraving support frame 9, and the engraving table 7 is installed at the output end of the driving motor 12.

[0035] A support frame is slidably installed on one side of the moving support frame 13, a driving motor 12 is installed at one end of the moving support frame 13, and the support frame is installed at the output end of the driving motor 12.

[0036] A cylinder 16 is installed at the upper end of the support frame, a clamping head 11 is installed at the output end of the cylinder 16, and the cylinder 16 is used to control the clamping and movement of the clamping head 11.

[0037] By starting the driving motor 12, controlling the engraving table 7 to move on the engraving support frame 9, after engraving is completed, then resetting the engraving table 7 to ensure the stability when the wafer is moved again. Then, the wafer is moved into the collection box 10. Then, start the cylinder 16 to move the height of the clamping head 11, and then start the driving motor 12 to move the horizontal position of the clamping head 11, so that the collection box 10 moves under the clamping of the clamping head 11 for collection and movement.

[0038] As Figures 1-4 shown, the blanking mechanism further includes a transmission belt 14 and a limiting rod 15. Among them, the transmission belt 14 is installed below the collection box 10, the limiting rod 15 is arranged on the opposite sides of the transmission belt 14, and the collection box 10 is located between the two limiting rods 15.

[0039] Under the operation of the conveyor belt 14 and the limitation of the limiting rods 15 on both sides, the collection box 10 is moved for collection to ensure the stability of the automatic collection of the device.

[0040] Working principle: First, rotate the driving frame 1, then move the adsorption frame 3 according to the picture irradiated by the camera 2 to process the wafer raw material. Then, through the adsorption effect of the adsorption frame 3, the raw material is adjusted in angle and placed above the adjustment table 6. Then, move the moving frame 4 to move the raw material and place it above the engraving table 7. Then, start the driving motor 12 to control the movement of the engraving table 7 on the engraving support frame 9. After engraving is completed, reset the engraving table 7, then move the wafer into the collection box 10. Then, start the cylinder 16 to move the height of the clamping head 11, and start the driving motor 12 to move the horizontal position of the clamping head 11, so that the collection box 10 moves under the clamping of the clamping head 11. Under the operation of the conveyor belt 14 and the limitation of the limiting rods 15 on both sides, the collection box 10 is moved for collection.

[0041] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

Claims

1. A wafer unloading machine, comprising a driving and moving mechanism, a laser engraving mechanism, and a material unloading mechanism, characterized in that: The driving and moving mechanism comprises a driving frame (1), a camera (2), an adsorption frame (3), a moving frame (4), and a placement table (5), wherein the adsorption frame (3) and the moving frame (4) are installed at the lower end of the driving frame (1), the camera (2) is arranged on one side of the adsorption frame (3) and the moving frame (4), and the placement table (5) is arranged below the adsorption frame (3) and the moving frame (4); The laser engraving mechanism comprises an engraving table (7), an engraving machine (8), and an engraving support frame (9), wherein the engraving support frame (9) is arranged on one side of the driving frame (1), the engraving table (7) is slidably mounted on the upper half of the engraving support frame (9), and the engraving machine (8) is located above the engraving support frame (9); The unloading mechanism comprises a collection box (10) and a movable support frame (13), wherein the collection box (10) is arranged on the movable support frame (13), the collection box (10) is used for placing wafers, and the movable support frame (13) is arranged on one side of the engraving machine (8).

2. A wafer unloading machine according to claim 1, characterized in that: There are at least two drive racks (1), and the two drive racks (1) are located on the same side, and the two drive racks (1) operate separately.

3. A wafer unloading machine according to claim 1, characterized in that: A driving motor (12) is installed at one end of the carving support frame (9), an output end of the driving motor (12) extends into the interior of the carving support frame (9), and the carving platform (7) is installed at the output end of the driving motor (12).

4. A wafer unloading machine according to claim 3, characterized in that: A support frame is slidably mounted on one side of the movable support frame (13), the drive motor (12) is mounted on one end of the movable support frame (13), and the support frame is mounted on the output end of the drive motor (12).

5. The wafer unloading machine according to claim 4, characterized in that: A cylinder (16) is installed at the upper end of the support frame, and a clamping head (11) is installed at the output end of the cylinder (16). The cylinder (16) is used to control the clamping movement of the clamping head (11).

6. The wafer unloading machine according to claim 1, characterized in that: The unloading mechanism further comprises a transmission belt (14) and a limiting rod (15), wherein the transmission belt (14) is installed below the collection box (10), the limiting rod (15) is arranged on two opposite sides of the transmission belt (14), and the collection box (10) is located between the two limiting rods (15).

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