Wafer dispergation irradiation mechanism

Abstract

The utility model provides a wafer dispergation irradiation mechanism. The wafer dispergation irradiation mechanism comprises a frame body, and an irradiation assembly, a transfer assembly and a shading assembly which are arranged on the frame body, a light outlet is formed in the frame body, an irradiation station is arranged over the light outlet, and a feeding station is arranged on the side, away from the light outlet, of the frame body. The irradiation assembly comprises a light emitting assembly and a shutter assembly, the light emitting assembly is arranged under the light outlet, and the shutter assembly is movably arranged at the light outlet to open and close the light outlet; the transferring assembly is provided with an irradiation opening, and the transferring assembly is movably arranged on the frame body; the transferring assembly can be connected with the mechanical arm so that the wafer sucked by the mechanical arm can be fixed to the position above the irradiation opening, and the transferring assembly and the mechanical arm can synchronously move between the feeding station and the irradiation station. The shading assemblies are arranged at the two ends of the transferring assembly in the moving direction of the transferring assembly. According to the invention, the structure and the processing procedure of the glue-knowing irradiation mechanism are simplified, and the use convenience of the glue-knowing irradiation mechanism is improved.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor equipment, and more specifically, relates to a wafer degumming irradiation mechanism. Background Art

[0002] In the manufacturing process of semiconductor chips, before the grinding and thinning process, a protective adhesive film needs to be pasted on the front surface of the wafer (i.e., the surface with circuits) to protect the circuits and prevent the wafer from cracking, breaking, and being contaminated during grinding. After the grinding and thinning process is completed, the protective adhesive film needs to be torn off. Before tearing the adhesive film, UV degumming is performed on the protective adhesive film to make it easier to tear off from the wafer surface.

[0003] The prior art usually uses a degumming irradiation mechanism to tear the protective adhesive film, but its applicable scenarios have certain limitations. It is applicable to a single film tearing machine, and the protective adhesive film needs to be placed on the upper surface of the wafer, and the UV light irradiates from top to bottom. After the wafer is ground and thinned, the back surface of the wafer (the surface without circuits) and the support fixing ring frame also need to be bonded together through a dicing tape to facilitate subsequent transfer and processing.

[0004] However, with the continuous development of the semiconductor industry, the thickness of the wafer tends to become smaller and smaller, and the diameter tends to become larger and larger. There is a risk of fracture or damage when transporting ultra-thin wafers between a separate film tearing machine and a film pasting machine. Therefore, such wafers can only be processed on an integrated machine with both film tearing and film pasting functions. Since the front surface of the wafer faces down when pasting the dicing tape, that is, the grinding protective adhesive film is located on the lower surface of the wafer. Therefore, the structure and processing procedures of the degumming irradiation mechanism still need to be simplified to improve the convenience of using the degumming irradiation mechanism. Summary of the Utility Model

[0005] The purpose of the embodiments of this application is to provide a wafer degumming irradiation mechanism, which sets the irradiation component below the wafer, and the UV light irradiates from bottom to top. The robotic arm completes UV degumming while transporting the wafer, thereby simplifying the structure and processing procedures of the degumming irradiation mechanism and improving the convenience of using the degumming irradiation mechanism.

[0006] To achieve the above object, the technical solution adopted in the embodiments of the present application is to provide a wafer degumming irradiation mechanism, which includes: a frame body, and an irradiation component, a transfer component and a light shielding component arranged on the frame body; a light outlet is opened on the frame body, an irradiation station is arranged directly above the light outlet, and a loading station is arranged on one side away from the light outlet; the irradiation component includes a light emitting component and a shutter component, the light emitting component is arranged directly below the light outlet, and the shutter component is movably arranged at the light outlet to open and close the light outlet; the transfer component is provided with an irradiation port, and the transfer component is movably arranged on the frame body; the transfer component can be connected to a robotic arm so that the wafer sucked by the robotic arm is fixed above the irradiation port, and the transfer component and the robotic arm can move synchronously between the loading station and the irradiation station; the light shielding component is respectively arranged at both ends of the transfer component along the moving direction of the transfer component.

[0007] Optionally, the shutter component includes a first cylinder, a shutter and a first guide rail. The first cylinder and the first guide rail are arranged on the frame body. The driving end of the first cylinder is fixedly connected to the shutter and is used to drive the shutter to slide along the first guide rail to open and close the light outlet.

[0008] Optionally, the irradiation mechanism further includes a positioning member arranged on the transfer component. The positioning member is used to position the robotic arm to keep the robotic arm moving synchronously with the transfer component.

[0009] Optionally, the positioning member protrudes with a positioning pin, and the positioning pin is used for plug-in cooperation with a positioning hole on the robotic arm.

[0010] Optionally, the irradiation mechanism further includes a locking component, and the locking component is used to lock the transfer component located at the loading station.

[0011] Optionally, the locking component includes a second cylinder and a locking pin. The second cylinder is arranged on the frame body. The driving end of the second cylinder is fixedly connected to the locking pin. The transfer component is provided with a locking hole, and the second cylinder is used to drive the locking pin to be inserted and limited in the locking hole.

[0012] Optionally, the transfer component includes a scanning platform and a driving member. The irradiation port is formed on the scanning platform. The driving member is arranged on the frame body, and the driving member is used to drive the scanning platform to reciprocate between the loading station and the irradiation station.

[0013] Optionally, the driving member includes a third cylinder and a second guide rail. The driving end of the third cylinder is fixed to the scanning platform, and the driving end of the third cylinder is slidably connected to the second guide rail.

[0014] Optionally, the irradiation mechanism further includes a light meter disposed on the scanning platform. The scanning platform is provided with a measurement hole therethrough, and the measuring end of the light meter faces the measurement hole.

[0015] Optionally, the irradiation mechanism further includes a controller, which is electrically connected to the irradiation component and the light meter respectively. The controller is used to adjust the light intensity of the irradiation component to maintain constancy during the irradiation process.

[0016] The wafer de-gluing irradiation mechanism provided by the embodiment of the present application has at least the following beneficial effects:

[0017] When using this irradiation mechanism to irradiate the grinding protective film on the surface of the wafer, the robotic arm adsorbs the wafer and moves the wafer to the loading station. The transfer component positions and connects with the robotic arm so that the wafer sucked by the robotic arm is fixed above the irradiation port. At the same time, the light-emitting component is started, and the shutter component is driven to open the light outlet. Subsequently, the transfer component and the robotic arm are driven to move synchronously between the loading station and the irradiation station, so that the wafer passes through the light outlet, and the irradiation component uniformly irradiates the grinding protective film on the surface of the wafer, thereby reducing the viscosity of the adhesive layer of the protective film. Compared with the prior art, the present application simplifies the structure and processing procedures of the de-gluing irradiation mechanism and improves the convenience of using the de-gluing irradiation mechanism. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a three-dimensional view of the wafer de-gluing irradiation mechanism and the robotic arm in some embodiments of the present application;

[0020] Figure 2 It is a three-dimensional view of another perspective of the wafer de-gluing irradiation mechanism in some embodiments of the present application;

[0021] Figure 3 is Figure 1 an enlarged view of part A in

[0022] Description of the reference numerals: 1. Frame; 11. Light outlet; 12. Upper mounting plate; 13. Lower mounting plate; 2. Irradiation assembly; 21. Light-emitting assembly; 22. Shutter assembly; 221. First cylinder; 222. Shutter; 223. First guide rail; 23. Power supply; 24. Heat dissipation pipe; 3. Transfer assembly; 31. Irradiation port; 32. Locking hole; 33. Scanning platform; 34. Driving member; 341. Third cylinder; 342. Second guide rail; 4. Light-shielding assembly; 5. Positioning member; 51. Positioning pin; 6. Locking assembly; 61. Second cylinder; 62. Locking pin; 7. Photometer; 8. Controller; 9. Robot arm; 91. Positioning hole. Detailed implementation manners

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following further describes this application in detail with reference to the drawings and embodiments.

[0024] It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element.

[0026] When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0029] In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0030] Please refer to... together Figures 1 to 3, a debonding irradiation mechanism provided by an embodiment of the present application will now be described. This irradiation mechanism can be arranged in a film tearing machine and is used to irradiate the grinding protective film on the surface of the wafer, thereby reducing the viscosity of the adhesive layer of the protective film, so as to subsequently tear the protective film from the surface of the wafer.

[0031] Please refer to Figures 1 to 3 , the irradiation mechanism of the present application includes a frame body 1, and an irradiation component 2, a transfer component 3 and a light shielding component 4 arranged on the frame body 1. Among them, a light outlet 11 is formed on the frame body 1, an irradiation station is arranged directly above the light outlet 11, and a loading station is arranged on the side far from the light outlet 11. A robotic arm 9 for adsorbing and loading the wafer to the loading station is also arranged in the film tearing machine. The robotic arm 9 can move up and down in a direction perpendicular to the irradiation mechanism and can also move horizontally in a direction parallel to the irradiation mechanism.

[0032] In a specific embodiment, the irradiation component 2 includes a light emitting component 21 and a shutter component 22. The light emitting component 21 is arranged directly below the light outlet 11, and the shutter component 22 is movably arranged at the light outlet 11 to open and close the light outlet 11. The transfer component 3 is provided with an irradiation port 31, and the transfer component 3 is movably arranged on the frame body 1; the transfer component 3 can be connected to the robotic arm 9 so that the wafer sucked by the robotic arm 9 is fixed above the irradiation port 31, and the transfer component 3 and the robotic arm 9 can move synchronously between the loading station and the irradiation station. The light shielding component 4 is respectively arranged at both ends of the transfer component 3 along the moving direction of the transfer component 3 to shield the wafer during the irradiation process.

[0033] Here, when using this irradiation mechanism to irradiate the grinding protective film on the surface of the wafer, the robotic arm 9 adsorbs the wafer and moves the wafer to the loading station. The transfer component 3 positions and connects to the robotic arm 9 so that the wafer sucked by the robotic arm 9 is fixed above the irradiation port 31; at the same time, the light emitting component 21 is started, and the shutter component 22 is driven to open the light outlet 11; subsequently, the transfer component 3 and the robotic arm 9 are driven to move synchronously between the loading station and the irradiation station, so that the wafer passes through the light outlet 11, and the irradiation component 2 uniformly irradiates the grinding protective film on the surface of the wafer, thereby reducing the viscosity of the adhesive layer of the protective film. Compared with the prior art, the present application simplifies the structure and processing procedures of the debonding irradiation mechanism, improves the convenience of use of the debonding irradiation mechanism; on the other hand, by simplifying the structure and processing procedures, the maintenance cost in subsequent use can also be reduced.

[0034] In a specific embodiment, the frame body 1 includes an upper mounting plate 12 and a lower mounting plate 13 that are fixedly connected and parallel to each other. Among them, the light outlet 11 is formed through the upper mounting plate 12, the shutter component 22 and the transfer component 3 are arranged on the upper mounting plate 12, and the light emitting component 21 is arranged on the lower mounting plate 13.

[0035] In a specific embodiment, the power supply 23 of the light-emitting component 21 is disposed adjacent to it on the lower mounting plate 13, and the light-emitting component 21 is a mercury lamp box. Among them, a light source and a reflector are provided inside the mercury lamp box, and a backlight sheet for transmitting light is provided at the light-emitting port of the mercury lamp box, and the backlight sheet faces the light-emitting port 11 located on the upper mounting plate 12. Starting the power supply 23 can start the light source inside the mercury lamp box to emit ultraviolet rays. The ultraviolet rays are refracted to the backlight sheet through the reflector, and then irradiate upward through the backlight sheet and pass through the light-emitting port 11. In addition, the mercury lamp box is connected to the external environment through a heat dissipation pipe 24 to exhaust air and dissipate heat inside the mercury lamp box, improving the safety and service life of the mercury lamp box.

[0036] In a specific embodiment, the shutter assembly 22 includes a first cylinder 221, a shutter 222, and a first guide rail 223. Among them, the first cylinder 221 and the first guide rail 223 are fixedly arranged on the upper mounting plate 12. The driving direction of the first cylinder 221 is parallel to the first guide rail 223, and the driving direction of the first cylinder 221 is consistent with the moving direction of the transfer assembly 3; the driving end of the first cylinder 221 is fixedly connected to the shutter 222, and the first cylinder 221 is used to drive the shutter 222 to slide along the first guide rail 223 to open or close the light-emitting port 11.

[0037] When the irradiation mechanism works, the light-emitting component 21 is started. At this time, the shutter 222 closes the light-emitting port 11, and the transfer assembly 3 is located at the loading station; after the robot arm 9 loads the wafer, the transfer assembly 3 and the robot arm 9 are driven to move synchronously to the irradiation station. At this time, the shutter 222 opens the light-emitting port 11, and the ultraviolet rays sequentially pass through the light-emitting port 11 and the irradiation port 31 to irradiate the grinding protective film on the surface of the wafer; after the irradiation is completed, the shutter 222 closes the light-emitting port 11, and the transfer assembly 3 and the robot arm 9 are driven to move synchronously to the loading station.

[0038] Please refer to Figure 1 and Figure 2 As shown in, in a specific embodiment, the irradiation mechanism further includes a positioning member 5 disposed on the transfer assembly 3. The positioning member 5 is used to position the robot arm 9 to keep the robot arm 9 moving synchronously with the transfer assembly 3. Specifically, the positioning member 5 is located on the periphery of the irradiation port 31. The positioning member 5 protrudes with a plurality of positioning pins 51, and the robot arm 9 is provided with positioning holes 91 corresponding to the number of the positioning pins 51. The plurality of positioning pins 51 are used for plugging and matching with the positioning holes 91, so as to realize the positioning connection between the transfer assembly 3 and the robot arm 9. The positioning member 5 improves the stability of the wafer movement process. In this embodiment, two positioning pins 51 and positioning holes 91 are respectively provided. In other embodiments, one, three, or four can also be provided.

[0039] In a specific embodiment, the irradiation mechanism further includes a locking assembly 6, and the locking assembly 6 is used to lock the transfer assembly 3 at the loading station. Specifically, the locking assembly 6 includes a second cylinder 61 and a locking pin 62. The second cylinder 61 is fixedly arranged on the upper mounting plate 12, and the driving end of the second cylinder 61 is fixedly connected to the locking pin 62; the transfer assembly 3 is provided with a locking hole 32, and the locking pin 62 is inserted and limited in the locking hole 32 by driving the second cylinder 61. Herein, the transfer assembly 3 is locked at the loading station through the locking assembly 6, so as to facilitate the robot arm 9 to load materials, improve the stability of wafer loading, and thus reduce the possibility of wafer damage.

[0040] Please refer to Figure 3 , in a specific embodiment, the transfer assembly 3 includes a scanning platform 33 and a driving member 34. Among them, the irradiation port 31 is formed through the scanning platform 33, and the driving member 34 is fixedly arranged on the upper mounting plate 12, and the driving member 34 is used to drive the scanning platform 33 to reciprocate between the loading station and the irradiation station. In this regard, the positioning member 5 is arranged on the scanning platform 33 to realize the positioning connection between the scanning platform 33 and the robot arm 9; the locking hole 32 is formed on the scanning platform 33 to lock the scanning platform 33 at the loading station, facilitating the robot arm 9 to load materials; the horizontal position of the scanning platform 33 is higher than the horizontal position of the shutter 222 to prevent the scanning platform 33 from colliding with the shutter 222 during movement, causing equipment damage and affecting the work progress and safety.

[0041] In a specific embodiment, the driving member 34 includes a third cylinder 341 and a second guide rail 342. Among them, the second guide rail 342 is fixedly arranged on the upper mounting plate 12 along the moving direction of the scanning platform 33; the third cylinder 341 is a rodless cylinder, the driving end of the third cylinder 341 is fixed to the scanning platform 33, and the driving end of the third cylinder 341 is slidably connected to the second guide rail 342. Herein, the scanning platform 33 is driven by the third cylinder 341 to reciprocate between the loading station and the irradiation station along the second guide rail 342.

[0042] In a specific embodiment, the light-shielding assembly 4 is two light-shielding plates, and the two light-shielding plates are respectively fixedly arranged at both ends of the scanning platform 33 along the moving direction of the scanning platform 33 to prevent ultraviolet rays from leaking when the irradiation mechanism works, thus affecting the safety of the human body or the working environment.

[0043] In a specific embodiment, the irradiation mechanism further includes a light meter 7 disposed on the scanning platform 33, and the light meter 7 moves with the scanning platform 33. Among them, the scanning platform 33 is provided with a measurement hole therethrough, and the measuring end of the light meter 7 faces the measurement hole. When the scanning platform 33 is located at the irradiation station, the light meter 7 can detect the illuminance in real time during the ultraviolet irradiation through the measurement hole to maintain a constant light intensity, so as to uniformly irradiate the grinding protective film on the wafer surface, thereby enhancing the reduction effect of the viscosity of the adhesive layer of the protective film.

[0044] In a specific embodiment, the irradiation mechanism further includes a controller 8. Among them, the controller 8 is disposed on the upper mounting plate 12, and the controller 8 is electrically connected to the irradiation assembly 2 and the light meter 7 respectively. The controller 8 is used to adjust the light intensity of the light-emitting assembly 21 to maintain constancy during the irradiation process, so as to uniformly irradiate the grinding protective film on the wafer surface, and further enhance the reduction effect of the viscosity of the adhesive layer of the protective film.

[0045] The foregoing are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer dissolution irradiation mechanism, characterized in that: It includes: a frame, and an irradiation component, a transfer component and a light shielding component arranged on the frame; The frame is provided with a light outlet, an irradiation station is arranged directly above the light outlet, and a loading station is arranged on a side away from the light outlet; The irradiation assembly includes a light emitting assembly and a shutter assembly, wherein the light emitting assembly is arranged directly below the light emitting port, and the shutter assembly is movably arranged at the light emitting port to open and close the light emitting port; The transfer assembly is provided with an irradiation port, and the transfer assembly is movably arranged on the frame; the transfer assembly can be connected to a robot arm so that the wafer sucked by the robot arm is fixed above the irradiation port, and the transfer assembly and the robot arm can synchronously move between the loading station and the irradiation station; The shading components are respectively arranged at two ends of the transfer component along the moving direction of the transfer component.

2. A wafer debonding and irradiation mechanism as claimed in claim 1, characterized in that: The shutter assembly includes a first cylinder, a shutter and a first guide rail. The first cylinder and the first guide rail are arranged on the frame. The driving end of the first cylinder is fixedly connected to the shutter and is used to drive the shutter to slide along the first guide rail to open and close the light outlet.

3. A wafer debonding and irradiation mechanism as claimed in claim 1 or 2, characterized in that: The irradiation mechanism also includes a positioning member arranged on the transfer assembly, and the positioning member is used to position the mechanical arm to keep the mechanical arm moving synchronously with the transfer assembly.

4. A wafer debonding and irradiation mechanism as claimed in claim 3, characterized in that: The positioning piece is protrudingly provided with a positioning pin, and the positioning pin is used for plugging and matching with the positioning hole on the mechanical arm.

5. A wafer debonding and irradiation mechanism as claimed in claim 1 or 2, characterized in that: The irradiation mechanism also includes a locking component, which is used to lock the transfer component located at the loading station.

6. The wafer debonding and irradiation mechanism according to claim 5, characterized in that: The locking assembly includes a second cylinder and a locking pin. The second cylinder is arranged on the frame. The driving end of the second cylinder is fixedly connected to the locking pin. The transfer assembly is provided with a locking hole. The second cylinder is used to drive the locking pin to be inserted into the locking hole.

7. A wafer debonding and irradiation mechanism as claimed in claim 1 or 2, characterized in that: The transfer assembly includes a scanning platform and a driving component. The irradiation port is formed on the scanning platform. The driving component is arranged on the frame, and the driving component is used to drive the scanning platform to slide back and forth between the loading station and the irradiation station.

8. The wafer debonding and irradiation mechanism according to claim 7, characterized in that: The driving component includes a third cylinder and a second guide rail. The driving end of the third cylinder is fixed to the scanning platform, and the driving end of the third cylinder is slidably connected to the second guide rail.

9. The wafer debonding and irradiation mechanism according to claim 7, characterized in that: The irradiation mechanism further comprises a light meter arranged on the scanning platform. A measuring hole is formed through the scanning platform. The measuring end of the light meter faces the measuring hole.

10. The wafer debonding and irradiation mechanism according to claim 9, characterized in that: The irradiation mechanism also includes a controller, which is electrically connected to the irradiation component and the light meter respectively, and is used to adjust the light intensity of the irradiation component to keep the irradiation process constant.

Images