Communication module and intelligent device

Abstract

The utility model discloses a communication module and intelligent equipment, the communication module is applied to the intelligent equipment, the communication module comprises a circuit substrate, a chip, an antenna and an interface pin, and the chip is attached to the front side of the circuit substrate; the antenna is located on the circuit substrate, the antenna is electrically connected with the chip through the circuit substrate, and the chip communicates with external communication equipment through the antenna; the plurality of interface pins are respectively positioned on the left side, the right side, the lower side and the back side of the circuit substrate, the interface pins are electrically connected with the chip through the circuit substrate, and the chip is connected with an external device through the interface pins. Through the arrangement, the applicability of the communication module and the intelligent equipment is improved.

Description

Technical Field

[0001] This application relates to the field of Internet of Things technology, and in particular to a communication module and an intelligent device. Background Art

[0002] An intelligent device (such as a smart home) usually has a communication module. The intelligent device is connected to external devices (such as a lamp or a speaker, etc.) through the communication module, and thus the intelligent device can control the external devices.

[0003] With the rapid development of the Internet of Things, users' demands for functions such as driving the screen and touch are increasing day by day. The number of pins of the communication module in the prior art is small, resulting in the communication module in the prior art being unable to meet the usage requirements in diverse application scenarios. Summary of the Utility Model

[0004] In order to solve the deficiencies of the prior art, the purpose of this application is to provide a communication module and an intelligent device with high applicability.

[0005] To achieve the above purpose, the following technical solutions are adopted in this application:

[0006] A communication module is applied to an intelligent device. The communication module includes a circuit board, a chip, an antenna, and interface pins. The chip is attached to the front side of the circuit board; the antenna is located on the circuit board, and the antenna is electrically connected to the chip through the circuit board. The chip communicates with an external communication device through the antenna; a plurality of interface pins are respectively located on the left side, right side, lower side, and back side of the circuit board. The interface pins are electrically connected to the chip through the circuit board, and the chip is connected to external devices through the interface pins.

[0007] Further, the antenna includes a radiation part and a connection part connected to the radiation part. The connection part is electrically connected to the chip, and the radiation part extends in the left-right direction.

[0008] Further, the circuit board includes an antenna area and a chip area adjacent to the antenna area. The antenna area is located above the chip area, the radiation part is located in the antenna area, and the chip is located in the chip area;

[0009] The radiation part includes a first radiation part and a second radiation part. The radiation field strength of the first radiation part is greater than that of the second radiation part. The minimum distance between the first radiation part and the chip area is defined as a first length, and the length of the circuit board in the up-down direction is defined as a second length. The ratio between the first length and the second length is greater than or equal to 0.1 and less than or equal to 0.3.

[0010] Further, the interface pins include first pins. The first pins are located on the left side, right side, and lower side of the circuit board, and the minimum distance between adjacent first pins is greater than or equal to 0.32 mm and less than or equal to 0.42 mm.

[0011] Further, the length of the first pin along its extending direction is greater than or equal to 0.8 mm and less than or equal to 1 mm.

[0012] Further, the interface pins include second pins. The second pins are located on the back side of the circuit board, and the minimum distance between adjacent second pins is greater than or equal to 0.8 mm and less than or equal to 1 mm.

[0013] Further, the length of the second pin along its extending direction is greater than or equal to 0.8 mm and less than or equal to 1 mm.

[0014] Further, the first pins include data transmission pins and power supply pins, and the second pins include screen driving pins.

[0015] Further, the communication module further includes a shielding cover. The shielding cover is disposed on the chip, and the chip is shielded from the external magnetic field through the shielding cover.

[0016] The present application also provides an intelligent device, which includes the communication module of any one of the above.

[0017] By providing interface pins on the back side of the circuit board, the above communication module enables the chip to connect more external devices through the interface pins located on the back side, so that the communication module can meet the usage requirements in diverse application scenarios, thereby improving the applicability of the communication module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the front view of the communication module in the embodiment of the present application;

[0019] Figure 2 is the cross-sectional view of the communication module in the embodiment of the present application;

[0020] Figure 3 is the rear view of the communication module in the embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the specific embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

[0022] As Figure 1 and Figure 2As shown in the figure, the present application provides a communication module 100, which is applied to intelligent devices, mainly to smart home appliances such as smart refrigerators and smart door locks. The communication module 100 includes a circuit board 11, a chip 12, an antenna 13, and interface pins 14. The circuit board 11 is in a flat shape, and there are several metal traces for connecting components inside the circuit board 11. The chip 12 is attached to the front side of the circuit board 11 and connected to the circuit board 11 by welding, so that the chip 12 is connected to the metal traces inside the circuit board 11. The antenna 13 is located on the circuit board 11, and the antenna 13 is connected to the chip 12 through the metal traces inside the circuit board 11. Thus, the chip 12 can communicate with an external communication device (such as the user's portable device) through the antenna 13, and then the user can control the communication module 100 through the external communication device. Among them, the antenna 13 can be attached to the circuit board 11 and fixedly connected to the circuit board 11. The antenna 13 can also be integrally formed with the circuit board 11 during the manufacturing process of the circuit board 11. The interface pins 14 are arranged on the left side, right side, lower side, and back side of the circuit board 11. The interface pins 14 are fixedly connected to the circuit board 11, and the interface pins 14 can be connected to the chip 12 through the metal traces inside the circuit board 11. Thus, the chip 12 can be connected to external devices (such as a screen or a speaker, etc.) through the interface pins 14, and then the control of the external devices can be realized. In order to clearly illustrate the technical solution of the application, the up, down, left, right, front, and back directions as shown in Figure 1 and Figure 2 are also defined. It should be noted that in the present application, the front side of the circuit board 11 is the side observed from the front to the back of the circuit board 11, the back side of the circuit board 11 is the side observed from the back to the front of the circuit board 11, the left side of the circuit board 11 is the side observed from the left to the right of the circuit board 11, the right side of the circuit board 11 is the side observed from the right to the left of the circuit board 11, and the lower side of the circuit board 11 is the side observed from the lower to the upper of the circuit board 11.

[0023] It should be noted that in the prior art, the interface pins 14 are only arranged on the left side, right side, and lower side of the circuit board 11. In the embodiment of the present application, the interface pins 14 are arranged on the back side of the circuit board 11, and metal traces passing through the entire circuit board 11 are provided, so that the chip 12 can connect more external devices through the interface pins 14 located on the back side, thereby enabling the communication module 100 to meet the usage requirements in diverse application scenarios, and thus improving the applicability of the communication module 100.

[0024] In the embodiment of the present application, the chip 12 is an ARMv8-M Star (M33F) processor, and the antenna 13 supports the latest WiFi6 communication standard. As a result, the communication module 100 provided by the present application has higher network speed and transmission efficiency compared to the communication module 100 in the prior art, while reducing network congestion.

[0025] As Figure 1 shown, as an implementation, the antenna 13 includes a radiation portion 131 and a connection portion 132, and the radiation portion 131 is connected to the connection portion 132. The radiation portion 131 is used to communicate with an external communication device, and the connection portion 132 is electrically connected to the chip 12 to transmit the communication information received by the radiation portion 131 to the chip 12. The radiation portion 131 extends substantially in the left-right direction, thereby avoiding interference between the signals of the radiation portion 131 caused by bending of the radiation portion 131 and affecting the performance of the antenna 13.

[0026] Specifically, the circuit board 11 includes an antenna area 111 and a chip area 112. The antenna area 111 is connected to the chip area 112, and the antenna area 111 is located above the chip area 112. The radiation portion 131 and the connection portion 132 are both located in the antenna area 111, and the chip 12 is located in the chip area 112. The radiation portion 131 includes a first radiation portion 1311 and a second radiation portion 1312. The first radiation portion 1311 extends in the left-right direction, and the second radiation portion 1312 is connected to the first radiation portion 1311 and extends in the up-down direction. The first radiation portion 1311 is the main radiation antenna 13, that is, the radiation field strength of the first radiation portion 1311 is greater than the radiation field strength of the second radiation portion 1312, and the communication module 100 communicates with an external communication device mainly through the first radiation portion 1311.

[0027] As an implementation, the minimum distance between the first radiation portion 1311 and the chip area 112 is defined as the first length L1, the length of the circuit board 11 in the up and down direction is defined as the second length L2, and the ratio between the first length L1 and the second length L2 is greater than or equal to 0.1 and less than or equal to 0.3. Further, the ratio between the first length L1 and the second length L2 is greater than or equal to 0.15 and less than or equal to 0.25. More preferably, the ratio between the first length L1 and the second length L2 is equal to 0.2. If the ratio between the first length L1 and the second length L2 is too large, the distance between the first radiation portion 1311 and the chip area 112 is too far, that is, the space occupied by the antenna area 111 is larger, and thus the space occupied by the chip area 112 is smaller. Since the interface pins 14 are all located on the back side of the chip area 112, if the space occupied by the chip area 112 is smaller, the number of interface pins 14 is less, and thus the number of external devices connected to the communication module 100 is less. If the ratio between the first length L1 and the second length L2 is too small, the distance between the first radiation portion 1311 and the chip area 112 is too small. Since the chip area 112 is usually provided with a grounding layer, if the distance between the first radiation portion 1311 and the chip area 112 is too small, it will affect the performance of the antenna 13. Through the above settings, while improving the performance of the antenna 13, it is also convenient for the communication module 100 to connect more external devices.

[0028] As Figure 2 shown, as an implementation, the communication module 100 further includes a shielding cover 15 made of a metal material (such as copper alloy), and a buckle for clamping the shielding cover 15 is further provided on the front side of the circuit board 11. The shielding cover 15 is disposed on the front side of the circuit board 11 and is clamped with the buckle, and the shielding cover 15 covers the chip 12, and the chip 12 is shielded from the external magnetic field through the shielding cover 15. Through the above settings, the electromagnetic interference of the external magnetic field on the chip 12 can be avoided, thereby improving the stability of the chip 12 during operation.

[0029] As Figure 3As shown, as an implementation, interface pin 14 includes a first pin 141. The first pins 141 are located on the left side, right side, and lower side of the circuit board 11. The intervals between the first pins 141 on the left side are all equal, the intervals between the first pins 141 on the right side are all equal, and the intervals between the first pins 141 on the lower side are all equal. The minimum distance L3 between adjacent first pins 141 is greater than or equal to 0.32 mm and less than or equal to 0.42 mm. Further, the minimum distance L3 between adjacent first pins 141 is greater than or equal to 0.35 mm and less than or equal to 0.39 mm. More preferably, the minimum distance L3 between adjacent first pins 141 is equal to 0.37 mm. If the minimum distance L3 between adjacent first pins 141 is too large, the number of first pins 141 on the circuit board 11 is small, which in turn causes the communication module 100 to be unable to connect more external devices, and thus the applicability of the communication module 100 is poor. Since the first pins 141 are connected to the chip 12 through the metal traces inside the circuit board 11, if the minimum distance L3 between adjacent first pins 141 is too small, the metal traces inside the circuit board 11 are prone to interference, which is not conducive to the layout of the metal traces. Through the above settings, while improving the applicability of the communication module 100, it is also convenient for the layout of the metal traces inside the circuit board 11.

[0030] Further, the interface pin 14 further includes a second pin 142. A plurality of second pins 142 are located on the back side of the circuit board 11. The second pins 142 are connected to the chip 12 through the metal traces passing through the circuit board 11. The second pins 142 are evenly arranged on the circuit board 11, and the second pins 142 can be evenly arranged in a square matrix on the back side of the circuit board 11. As an implementation, the minimum distance L4 between adjacent second pins 142 is greater than or equal to 0.8 mm and less than or equal to 1 mm. Further, the minimum distance L4 between adjacent second pins 142 is greater than or equal to 0.85 mm and less than or equal to 0.95 mm. More preferably, the minimum distance L4 between adjacent second pins 142 is equal to 0.9 mm. If the minimum distance L4 between adjacent second pins 142 is too large, the number of second pins 142 on the circuit board 11 is small, which in turn causes the communication module 100 to be unable to connect more external devices, and thus the applicability of the communication module 100 is poor. Since the second pins 142 are connected to the chip 12 through the metal traces inside the circuit board 11, if the minimum distance L3 between adjacent second pins 142 is too small, the metal traces inside the circuit board 11 are prone to interference, which is not conducive to the layout of the metal traces. Through the above settings, while improving the applicability of the communication mode, it is also convenient for the layout of the metal traces inside the circuit board 11.

[0031] As an implementation, the first pin 141 includes a data transmission pin and a power pin. The data transmission pin includes a network interface, an input / output interface, a PWM (Pulse Width Modulation) interface, a print log interface, and a power interface, etc. The network interface is used to connect to an external network, the input / output interface is used to interact with external devices for data, the PWM interface is used to output a PWM waveform to control external devices. For example, when the PWM interface is connected to a lamp in a smart refrigerator, increasing the duty cycle of the output PWM waveform can increase the brightness of the lamp. The print log interface is used to output the working log of the chip 12 to an external device. The power pin includes a power supply pin and a ground pin. The power supply pin is used to connect to an external power supply to supply power to devices such as the chip 12 and the antenna 13 on the communication module 100, and the ground pin is used to ground. The second pin 142 includes a screen driving pin, and the screen driving pin is used to connect to an external screen, so that the communication module 100 can control the external screen to perform corresponding displays. It should be noted that smart devices such as smart refrigerators or smart door locks usually have many external devices and display screens, etc. Therefore, through the above settings, the communication module 100 can be set on smart home appliances such as smart refrigerators or smart door locks, thereby improving the applicability of the communication module 100.

[0032] This application also provides a smart device, which includes the above-mentioned communication module 100.

[0033] Exemplarily, the smart device is a smart refrigerator. The first pin 141 of the communication module 100 is respectively connected to the temperature regulator and the temperature detector of the smart refrigerator, and the second pin 142 of the communication module 100 is connected to the display screen of the smart refrigerator. A user can communicate with the chip 12 through the antenna 13 of the communication module 100 by using a portable device, and then adjust the temperature of the smart refrigerator. In addition, the current temperature of the smart refrigerator can be obtained through the communication module 100 and displayed on the display screen of the smart refrigerator. Through the above settings, the communication module 100 can implement more functions, and thus the communication module 100 can meet the usage requirements in different scenarios, thereby improving the applicability of the communication module 100.

[0034] It should be understood that for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this application.

Claims

1. A communication module, applied to a smart device, characterized in that: The communication module comprises: Circuit substrate; A chip, wherein the chip is attached to the front side of the circuit substrate; An antenna, the antenna is located on the circuit substrate, the antenna is electrically connected to the chip through the circuit substrate, and the chip communicates with an external communication device through the antenna; Interface pins, a plurality of the interface pins are respectively located on the left side, right side, bottom side and back side of the circuit substrate, the interface pins are electrically connected to the chip through the circuit substrate, and the chip is connected to external devices through the interface pins.

2. The communication module according to claim 1, characterized in that: The antenna includes a radiation portion and a connection portion connected to the radiation portion, the connection portion is electrically connected to the chip, and the radiation portion extends in a left-right direction.

3. The communication module according to claim 2, characterized in that: The circuit substrate comprises an antenna area and a chip area connected to the antenna area, the antenna area is located above the chip area, the radiation portion is located in the antenna area, and the chip is located in the chip area; The radiation part includes a first radiation part and a second radiation part, the radiation field strength of the first radiation part is greater than the radiation field strength of the second radiation part, the minimum distance between the first radiation part and the chip area is defined as a first length, the length of the circuit substrate in the up and down directions is defined as a second length, and the ratio between the first length and the second length is greater than or equal to 0.1 and less than or equal to 0.

3.

4. The communication module according to claim 1, characterized in that: The interface pins include first pins, which are located on the left side, the right side and the bottom side of the circuit substrate, and the minimum distance between adjacent first pins is greater than or equal to 0.32 mm and less than or equal to 0.42 mm.

5. The communication module according to claim 4, characterized in that: The length of the first pin along its extension direction is greater than or equal to 0.8 mm and less than or equal to 1 mm.

6. The communication module according to claim 4, characterized in that: The interface pins include second pins, the second pins are located on the back side of the circuit substrate, and the minimum distance between adjacent second pins is greater than or equal to 0.8 mm and less than or equal to 1 mm.

7. The communication module according to claim 6, characterized in that: The length of the second pin along its extension direction is greater than or equal to 0.8 mm and less than or equal to 1 mm.

8. The communication module according to claim 6, characterized in that: The first pin includes a data transmission pin and a power supply pin, and the second pin includes a screen driving pin.

9. The communication module according to claim 1, characterized in that: The communication module further comprises a shielding cover, wherein the shielding cover is disposed on the chip, and the chip is shielded from external magnetic fields by the shielding cover.

10. A smart device, characterized in that: The smart device includes the communication module described in any one of claims 1-9.

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