Heat dissipation device, rectification module, inversion module and UPS
By adding a filter module to the UPS's heat dissipation device, common mode noise is directed to the ground plane, which solves the radiator radiation emission problem caused by the IGBT during power conversion and reduces the impact of electromagnetic compatibility.
Patent Information
- Application Number
- CN202422147222.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-09-03
AI Technical Summary
When performing power conversion, IGBTs widely used in high-power UPSs will generate a higher voltage change rate, causing the radiator to form a displacement current through distributed capacitance, and stimulate the radiator to generate electromagnetic radiation, affecting the EMI of electronic devices.
A filter module is added to the heat sink device, which is connected between the conductive pin of the first surface of the heat sink and the ground plane, providing a low impedance path to direct common mode noise to the ground plane.
By directing common mode noise to the ground plane, the electromagnetic noise radiates outward by the radiator as an antenna is reduced, the radiation emission is reduced, and thus the EMI impact on other electronic devices is reduced.
Smart Images
Figure CN222996426U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to the field of power electronics technology, and particularly relates to a heat dissipation device, a rectification module, an inversion module, and a UPS. Background Art
[0002] With the rapid development of information technology and electronic devices, power electronic devices are increasingly widely used in various fields. In particular, an Uninterruptible Power Supply (UPS), as a key power protection device, its stability and reliability are crucial for ensuring the normal operation of key infrastructures such as data centers, industrial automation, and medical equipment.
[0003] However, when an Insulated Gate Bipolar Transistor (IGBT) widely used in high-power UPSs performs power conversion, due to its high-speed switching characteristics, a relatively high rate of voltage change (dv / dt) will be generated in the circuit. This rapidly changing voltage forms a displacement current through the distributed capacitance between the collector (C pole) of the IGBT and the heat sink, exciting the heat sink to generate electromagnetic radiation. Due to the relatively large physical size of the heat sink, its radiation effect is particularly significant, resulting in an increase in the system radiation emission level and affecting the electromagnetic compatibility (EMI) of electronic devices.
[0004] In summary, how to reduce the radiation emission of the heat sink is an urgent problem to be solved by those skilled in the art. Summary of the Utility Model
[0005] The present utility model provides a heat dissipation device, a rectification module, an inversion module, and a UPS to solve the problem of how to reduce the radiation emission of the heat sink.
[0006] In a first aspect, the present utility model provides a heat dissipation device, including: a heat sink and a filtering module. Among them, the heat sink includes a first surface and a second surface. A conductive pin is provided on the first surface, and the conductive pin is welded to a Printed Circuit Board (PCB). The collector of an Insulated Gate Bipolar Transistor (IGBT) is attached to the second surface through an insulating layer.
[0007] The first end of the filtering module is electrically connected to the conductive pin, and the second end of the filtering module is electrically connected to the ground plane on the PCB.
[0008] Wherein, the emitter of the IGBT is electrically connected to the ground plane through a parasitic capacitance.
[0009] In a possible implementation, the conductive pin includes a first conductive pin, and the filtering module includes a first common-mode capacitor;
[0010] The first conductive pin is disposed at the midpoint of an axis on the first surface, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the radiator;
[0011] The first end of the first common-mode capacitor is electrically connected to the first conductive pin, and the second end of the first common-mode capacitor is electrically connected to the ground plane.
[0012] In a possible implementation, the conductive pin includes a second conductive pin and a third conductive pin, and the filtering module includes a second common-mode capacitor and a third common-mode capacitor;
[0013] The second conductive pin and the third conductive pin are disposed at both ends of an axis on the first surface, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the radiator;
[0014] The first end of the second common-mode capacitor is electrically connected to the second conductive pin, and the second end of the second common-mode capacitor is electrically connected to the ground plane;
[0015] The first end of the third common-mode capacitor is electrically connected to the third conductive pin, and the second end of the third common-mode capacitor is electrically connected to the ground plane.
[0016] In a possible implementation, the conductive pin includes at least three fourth conductive pins, and the filtering module includes at least three fourth common-mode capacitors, wherein the fourth conductive pins and the fourth common-mode capacitors are in one-to-one correspondence;
[0017] The at least three fourth conductive pins are equidistantly disposed on an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the radiator;
[0018] For each group of the fourth common-mode capacitors and the fourth conductive pins, the first end of the fourth common-mode capacitor is electrically connected to the fourth conductive pin, and the second ends of the fourth common-mode capacitors are all electrically connected to the ground plane.
[0019] In a possible implementation, the conductive pin includes a first conductive pin, and the filtering module includes a first resistor, wherein the resistance value of the first resistor is zero;
[0020] The first conductive pin is disposed at the midpoint of an axis on the first surface, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the radiator;
[0021] The first end of the first resistor is electrically connected to the first conductive pin, and the second end of the first resistor is electrically connected to the ground plane.
[0022] In a possible implementation, the conductive pins include a second conductive pin and a third conductive pin, and the filtering module includes a second resistor and a third resistor, wherein the resistance values of the second resistor and the third resistor are both zero;
[0023] The second conductive pin and the third conductive pin are disposed at two ends of an axis on the first surface, wherein the extending direction of the axis is the same as the arrangement direction of a plurality of IGBTs on the radiator;
[0024] The first end of the second resistor is electrically connected to the second conductive pin, and the second end of the second resistor is electrically connected to the ground plane;
[0025] The first end of the third resistor is electrically connected to the third conductive pin, and the second end of the third resistor is electrically connected to the ground plane.
[0026] In a possible implementation, the conductive pins include at least three fourth conductive pins, and the filtering module includes at least three fourth common-mode capacitors, wherein the fourth conductive pins and the fourth common-mode capacitors are in one-to-one correspondence;
[0027] The at least three fourth conductive pins are equally spaced on an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of a plurality of IGBTs on the radiator;
[0028] For each group of fourth resistors and fourth conductive pins, the first end of the fourth resistor is electrically connected to the fourth conductive pin, and the second ends of the fourth resistors are all electrically connected to the ground plane.
[0029] In a second aspect, the present invention further provides a rectification module, including a printed circuit board (PCB), a plurality of insulated gate bipolar transistors (IGBTs), and a heat dissipation device as described in any one of the first aspects;
[0030] The collectors of the plurality of IGBTs are attached to the second surface of the radiator in the heat dissipation device through an insulating layer, and each pin of the plurality of IGBTs is soldered to the PCB.
[0031] In a third aspect, the present invention further provides an inverter module, including a printed circuit board (PCB), a plurality of insulated gate bipolar transistors (IGBTs), and a heat dissipation device as described in any one of the first aspects;
[0032] The collectors of the plurality of IGBTs are attached to the second surface of the radiator in the heat dissipation device through an insulating layer, and each pin of the plurality of IGBTs is soldered to the PCB.
[0033] In a fourth aspect, the present utility model further provides a UPS, which includes the rectification module as described in the second aspect and / or the inversion module as described in the third aspect.
[0034] The beneficial effects of the present utility model are as follows:
[0035] The present utility model provides a heat dissipation device, a rectification module, an inversion module and a UPS. The heat dissipation device includes a radiator and a filtering module. Among them, the radiator includes a first surface and a second surface. The first surface is provided with conductive pins, and the conductive pins are welded to the PCB. The collector of the IGBT is attached to the second surface through an insulating layer. The first end of the filtering module is electrically connected to the conductive pins, and the second end of the filtering module is electrically connected to the ground plane on the PCB. Since a filtering module is added in the heat dissipation device, and the filtering module is connected between the conductive pins on the first surface of the radiator and the ground plane, a low-impedance path can be provided to guide the common-mode noise to the ground plane. Due to the existence of parasitic capacitance or physical capacitance between the ground plane and the emitter E of the IGBT, and between the ground plane and the iron sheet connected to the emitter E of the IGBT, the noise current flows back to the emitter E of the IGBT through the ground plane, forming a closed current path, thereby reducing the electromagnetic noise radiated outward by the radiator as an antenna and reducing the radiation emission. Description of the Drawings
[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0037] Figure 1 A schematic structural diagram of a UPS provided by the related art;
[0038] Figure 2 A schematic structural diagram of the connection between an IGBT and a radiator provided by the related art;
[0039] Figure 3 A schematic diagram of generating radiation emission provided by an embodiment of the present utility model;
[0040] Figure 4 A schematic structural diagram of a heat dissipation device provided by an embodiment of the present application;
[0041] Figure 5 Another schematic structural diagram of a heat dissipation device provided by an embodiment of the present application;
[0042] Figure 6Schematic diagram of another heat sink provided by an embodiment of the present application;
[0043] Figure 7 Schematic diagram of another heat dissipation device provided by an embodiment of the present application;
[0044] Figure 8 Schematic diagram of another heat sink provided by an embodiment of the present application;
[0045] Figure 9 Schematic diagram of another heat dissipation device provided by an embodiment of the present application;
[0046] Figure 10 Schematic diagram of another heat sink provided by an embodiment of the present application;
[0047] Figure 11 Schematic diagram of another heat dissipation device provided by an embodiment of the present application;
[0048] Figure 12 Schematic diagram of another heat dissipation device provided by an embodiment of the present application;
[0049] Figure 13 Schematic diagram of another heat dissipation device provided by an embodiment of the present application;
[0050] Figure 14 Schematic diagram of the flow direction of current in an IGBT and a heat dissipation device provided by an embodiment of the present application;
[0051] Figure 15 Schematic diagram of the radiation emission result of the heat sink without common mode capacitor connection provided by an embodiment of the present application;
[0052] Figure 16 Schematic diagram of the radiation emission result of the heat sink with common mode capacitor connection provided by an embodiment of the present application. Detailed implementation manners
[0053] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0054] Such as Figure 1As shown, it is a schematic structural diagram of a UPS provided by the related art. A UPS generally includes three branches, namely a bypass branch, a main path branch, and a battery branch. The bypass branch includes a static switch. The main path branch includes a rectification module and an inversion module. The rectification module includes a radiator and multiple IGBTs, and the inversion module also includes a radiator and multiple IGBTs.
[0055] A large amount of heat generated when the IGBT is working is dissipated through the radiator. As Figure 2 shown, it is a schematic structural diagram of the connection between an IGBT and a radiator provided by the related art. The radiator is usually tightly connected to the collector C of the IGBT through an insulating ceramic chip. Therefore, a distributed capacitance will be generated between the collector C of the IGBT and the radiator. As Figure 2 shown, one end of the distributed capacitance C is connected to the collector C of the IGBT, and the other end of the distributed capacitance C is connected to the radiator.
[0056] As Figure 3 shown, it is a schematic diagram of generating radiation emission provided by an embodiment of the present invention. When the IGBT is working, the voltage on the collector C of the IGBT will change rapidly to generate a large dv / dt. The large dv / dt generates a displacement current through the distributed capacitance between the collector C of the IGBT and the radiator and flows to the radiator. The displacement current forms an excitation source for the radiator, causing the radiator to form a common-mode emission antenna. The common-mode noise is emitted into space through the common-mode emission antenna, and the generated radiation noise is very strong, resulting in the failure of the EMI test.
[0057] To solve the problem of relatively high radiation emission of the radiator, the present invention provides a heat dissipation device, a rectification module, an inversion module, and a UPS. The heat dissipation device, the rectification module, the inversion module, and the UPS provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0058] As Figure 4 shown, it is a schematic structural diagram of a heat dissipation device provided by an embodiment of the present invention. The heat dissipation device includes: a radiator 21 and a filtering module 22. Among them, as Figure 4 shown, the radiator 21 includes a first surface 211 and a second surface 212. The first surface 211 is provided with a conductive pin 41, and the conductive pin 41 is welded to the PCB. The collector C of the IGBT 23 is attached to the second surface 212 through an insulating layer 24.
[0059] The first end of the filtering module 22 is electrically connected to the conductive pin 41 on the first surface 211, and the second end of the filtering module 22 is electrically connected to the ground plane on the PCB.
[0060] In the embodiment of the present utility model, a filtering module is added to the heat dissipation device. The filtering module is connected between the conductive pins on the first surface of the radiator and the ground plane of the PCB. Therefore, a low-impedance path can be provided between the radiator, the filtering module and the ground plane, guiding the common-mode noise generated by the radiator to the ground plane. Due to the existence of parasitic capacitance or physical capacitance between the ground plane and the emitter E of the IGBT, and between the ground plane and the iron sheet connected to the emitter E of the IGBT, the noise current flows back to the emitter E of the IGBT through the ground plane, forming a closed current path, thereby reducing the electromagnetic noise radiated outward by the radiator as an antenna and reducing the radiation emission.
[0061] The function of the insulating layer in the embodiment of the present utility model is to electrically isolate the IGBT from the radiator, prevent current from directly flowing from the IGBT to the radiator, and also help to control heat conduction.
[0062] In one embodiment, as Figure 5 and Figure 6 shown, the conductive pin 41 includes a first conductive pin 61, the filtering module 22 includes a first common-mode capacitor C1, the first conductive pin 61 is arranged at the midpoint of an axis on the first surface 211 of the radiator 21, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the radiator 21;
[0063] As Figure 5 shown, the first end of the first common-mode capacitor C1 is electrically connected to the first conductive pin 61, and the second end of the first common-mode capacitor C1 is electrically connected to the ground plane.
[0064] In a specific implementation, the pins of multiple IGBTs arranged on the radiator are soldered to the PCB. The first common-mode capacitor C1 in the embodiment of the present application can be soldered to the PCB. A conductive pin is arranged on the first surface 211 of the radiator, and the conductive pin is soldered to the PCB. The conductive pin of the radiator is connected to the first end of the first common-mode capacitor C1 through a connecting wire on the PCB, and the second end of the first common-mode capacitor C1 is electrically connected to the ground plane signal wire on the PCB.
[0065] In one embodiment, as Figure 7 and Figure 8 shown, the conductive pin 41 includes a second conductive pin 62 and a third conductive pin 63, the filtering module 22 includes a second common-mode capacitor C2 and a third common-mode capacitor C3, the second conductive pin 62 and the third conductive pin 63 are arranged at both ends of an axis on the first surface of the radiator 21, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the radiator 21;
[0066] Specifically, as Figure 7As shown, the first end of the second common-mode capacitor C2 is electrically connected to the second conductive pin 62, and the second end of the second common-mode capacitor C2 is electrically connected to the ground plane;
[0067] The first end of the third common-mode capacitor C3 is electrically connected to the third conductive pin 63, and the second end of the third common-mode capacitor C3 is electrically connected to the ground plane.
[0068] In one embodiment, as Figure 9 and Figure 10 shown, the conductive pin 41 includes at least three fourth conductive pins 64, the filtering module 22 includes at least three fourth common-mode capacitors C4, and the fourth conductive pins 64 and the fourth common-mode capacitors C4 correspond one-to-one. On an axis on the first surface of the heat sink 21, the fourth conductive pins 64 corresponding to each fourth common-mode capacitor C4 are arranged at equal intervals, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the heat sink 21;
[0069] Specifically, as Figure 9 shown, for each group of the fourth common-mode capacitors C4 and the fourth conductive pins 64, the first end of the fourth common-mode capacitor C4 is electrically connected to the fourth conductive pin 64, and the second end of the fourth common-mode capacitor C4 is electrically connected to the ground plane.
[0070] In the embodiment of the present application, by using the high-frequency low-impedance characteristic of the capacitor, the radiated emission of high-frequency common-mode noise can be effectively reduced.
[0071] In one embodiment, when the maximum distance between the IGBT and the heat sink 21 meets the safety regulations requirements, there will be no short-circuit problem between them. Therefore, the filtering module 22 can also be a resistor with a resistance value of zero.
[0072] As Figure 11 shown, it is a schematic structural diagram of a heat dissipation device provided by an embodiment of the present invention. Referring to Figure 6 and Figure 10 , the conductive pin 41 includes a first conductive pin 61, and the filtering module 22 includes a first resistor R1, wherein the resistance value of the first resistor R1 is zero;
[0073] Referring to Figure 6 , the first conductive pin 61 is arranged at the midpoint of an axis on the first surface of the heat sink 21, wherein the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the heat sink;
[0074] Specifically, as Figure 11 shown, the first end of the first resistor R1 is electrically connected to the first conductive pin 61, and the second end of the first resistor R1 is electrically connected to the ground plane.
[0075] In one embodiment, as Figure 8 and Figure 12As shown, the conductive pin 41 includes a second conductive pin 62 and a third conductive pin 63, and the filtering module 22 includes a second resistor R2 and a third resistor R3. Refer to Figure 8 , the second conductive pin 62 and the third conductive pin 63 are arranged at both ends of an axis on the first surface of the heat sink. Among them, the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the heat sink;
[0076] Specifically, as Figure 12 shown, the first end of the second resistor R2 is electrically connected to the second conductive pin 62, and the second end of the second resistor R2 is electrically connected to the ground plane;
[0077] The first end of the third resistor R3 is electrically connected to the third conductive pin 63, and the second end of the third resistor R3 is electrically connected to the ground plane.
[0078] In an embodiment, the conductive pin 41 includes at least three fourth pins 64, and the filtering module 22 includes at least three fourth resistors R4. Among them, the resistance value of the fourth resistor R4 is zero, and the fourth conductive pin 64 and the fourth resistor R4 correspond one by one; on an axis on the first surface of the heat sink 21, the fourth conductive pins 64 corresponding to each fourth resistor R4 are arranged at equal intervals. Among them, the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the heat sink 21;
[0079] For each group of the fourth resistor R4 and the fourth conductive pin, the first end of the fourth resistor R4 is electrically connected to the fourth conductive pin, and the second end of the fourth resistor R4 is electrically connected to the ground plane.
[0080] As Figure 13 shown, the filtering module includes three fourth resistors R4, and the resistance values of the three fourth resistors R4 are zero;
[0081] Refer to Figure 10 , on an axis on the first surface of the heat sink 21, three fourth conductive pins 64 are arranged at equal intervals. Among them, the extending direction of the axis is the same as the arrangement direction of multiple IGBTs on the heat sink 21;
[0082] For three groups of the fourth resistor R4 and the fourth conductive pin 64, the first end of the fourth resistor R4 is electrically connected to the fourth conductive pin 64, and the second end of the fourth resistor R4 is electrically connected to the ground plane.
[0083] In a specific embodiment, as Figure 14 shown, a first conductive pin 61 is arranged on the first surface 211, the filtering module 22 includes a first common-mode capacitor C1, the collector C of the IGBT is attached to the second surface 212 through an insulating layer, and the first common-mode capacitor C1 is connected between the first conductive pin 61 and the ground plane.
[0084] When the IGBT is working, the collector C of the IGBT generates a rapidly changing voltage, and a displacement current is generated through the distributed capacitance between the collector C of the IGBT and the radiator, generating common-mode noise. These common-mode noises flow to the ground plane through the first common-mode capacitor C1. Due to the existence of the parasitic capacitance Ca or the physical capacitance Ca between the ground plane and the emitter E of the IGBT and the iron sheet connected to the emitter E of the IGBT, the noise current flows back to the emitter E of the IGBT through the ground plane, forming a closed current path, thereby reducing the common-mode noise.
[0085] For example, when the first common-mode capacitor C1 is 1000 pF, the result of its radiation emission is reduced by more than 5 dB in its operating frequency band (30 - 200 MHz). Figure 15 It is a schematic diagram of the radiation emission result of the radiator without the first common-mode capacitor C1. Figure 16 It is a schematic diagram of the radiation emission result of the radiator with the first common-mode capacitor C1 added to the ground plane.
[0086] It should be noted that the capacitance value of the common-mode capacitor in the embodiments of the present application can be adjusted according to the actual size space of the product radiator, and it is recommended to be between 470 pF and 2200 pF.
[0087] Based on the same concept, the embodiments of the present utility model also provide a rectification module. The principle of solving the technical problems of this rectification module is similar to the principle of solving the technical problems of the above-mentioned heat dissipation device. The implementation of the rectification module can refer to the implementation of the heat dissipation device, and the repeated parts will not be elaborated.
[0088] A rectification module provided by an embodiment of the present utility model includes a PCB, a plurality of IGBTs, and any one of the above-mentioned heat dissipation devices;
[0089] The collectors of the plurality of IGBTs are attached to the second surface of the radiator 21 in the heat dissipation device through an insulating layer, and each pin of the plurality of IGBTs is soldered to the PCB.
[0090] Based on the same concept, the embodiments of the present utility model also provide an inverter module. The principle of solving the technical problems of this inverter module is similar to the principle of solving the technical problems of the above-mentioned heat dissipation device. The implementation of the inverter module can refer to the implementation of the heat dissipation device, and the repeated parts will not be elaborated.
[0091] An inverter module provided by an embodiment of the present utility model includes a PCB, a plurality of IGBTs, and any one of the above-mentioned heat dissipation devices.
[0092] The collectors of the plurality of IGBTs are attached to the second surface of the radiator 21 in the heat dissipation device through an insulating layer, and each pin of the plurality of IGBTs is soldered to the PCB.
[0093] Based on the same concept, an embodiment of the present utility model further provides a UPS. The principle of the UPS to solve technical problems is similar to that of the above-mentioned heat dissipation device. The implementation of the UPS can refer to the implementation of the heat dissipation device, and the repeated parts will not be described again.
[0094] A UPS provided by an embodiment of the present utility model includes any one of the above-mentioned rectification modules and / or any one of the above-mentioned inversion modules.
[0095] For the heat dissipation device, inversion module, rectification module and UPS provided by the embodiments of the present utility model, a filtering module is added to the heat dissipation device. The filtering module is connected between the conductive pin on the first surface of the radiator and the ground plane, which can provide a low-impedance path to guide the common-mode noise to the ground plane, reduce the electromagnetic noise radiated by the radiator as an antenna, thereby reducing the radiation emission, and further reducing the impact on other electronic devices.
[0096] Those skilled in the art can make various changes and modifications to the present utility model without departing from the spirit and scope of the present utility model. Thus, if these modifications and variations of the present utility model fall within the scope of the claims of the present utility model and their equivalent technologies, the present utility model also intends to include these changes and modifications.
Claims
1. A heat dissipation device, characterized in that: include: A heat sink and filter module, wherein the heat sink comprises a first surface and a second surface, the first surface is provided with a conductive pin, the conductive pin is soldered on a printed circuit board PCB, and the collector of an insulated gate bipolar transistor IGBT is attached to the second surface through an insulating layer; The first end of the filter module is electrically connected to the conductive pin, and the second end of the filter module is electrically connected to the ground plane on the PCB.
2. The heat dissipation device according to claim 1, characterized in that: The conductive pin includes a first conductive pin, and the filtering module includes a first common-mode capacitor; The first conductive pin is disposed at the midpoint of an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of the plurality of IGBTs on the heat sink; A first end of the first common-mode capacitor is electrically connected to the first conductive pin, and a second end of the first common-mode capacitor is electrically connected to the ground plane.
3. The heat dissipation device according to claim 1, characterized in that: The conductive pins include a second conductive pin and a third conductive pin, and the filtering module includes a second common-mode capacitor and a third common-mode capacitor; The second conductive pin and the third conductive pin are disposed at two ends of an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of the multiple IGBTs on the heat sink; A first end of the second common-mode capacitor is electrically connected to the second conductive pin, and a second end of the second common-mode capacitor is electrically connected to the ground plane; A first end of the third common-mode capacitor is electrically connected to the third conductive pin, and a second end of the third common-mode capacitor is electrically connected to the ground plane.
4. The heat dissipation device according to claim 1, characterized in that: The conductive pins include at least three fourth conductive pins, and the filtering module includes at least three fourth common-mode capacitors, wherein the fourth conductive pins and the fourth common-mode capacitors correspond to each other one by one; The at least three fourth conductive pins are arranged at equal intervals on an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of the multiple IGBTs on the heat sink; For each set of fourth common-mode capacitors and fourth conductive pins, first ends of the fourth common-mode capacitors are electrically connected to the fourth conductive pins, and second ends of the fourth common-mode capacitors are electrically connected to the ground plane.
5. The heat dissipation device according to claim 1, characterized in that: The conductive pin includes a first conductive pin, and the filtering module includes a first resistor, wherein the resistance of the first resistor is zero; The first conductive pin is disposed at the midpoint of an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of the plurality of IGBTs on the heat sink; A first end of the first resistor is electrically connected to the first conductive pin, and a second end of the first resistor is electrically connected to the ground plane.
6. The heat dissipation device according to claim 1, characterized in that: The conductive pin includes a second conductive pin and a third conductive pin, and the filtering module includes a second resistor and a third resistor, wherein the resistance values of the second resistor and the third resistor are both zero; The second conductive pin and the third conductive pin are disposed at two ends of an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of the multiple IGBTs on the heat sink; A first end of the second resistor is electrically connected to the second conductive pin, and a second end of the second resistor is electrically connected to the ground plane; A first end of the third resistor is electrically connected to the third conductive pin, and a second end of the third resistor is electrically connected to the ground plane.
7. The heat dissipation device according to claim 1, characterized in that: The conductive pins include at least three fourth conductive pins, and the filtering module includes at least three fourth common-mode capacitors, wherein the fourth conductive pins and the fourth common-mode capacitors correspond to each other one by one; The at least three fourth conductive pins are arranged at equal intervals on an axis of the first surface, wherein the extending direction of the axis is the same as the arrangement direction of the multiple IGBTs on the heat sink; For each set of fourth resistors and fourth conductive pins, the first ends of the fourth resistors are electrically connected to the fourth conductive pins, and the second ends of the fourth resistors are electrically connected to the ground plane.
8. A rectifier module, characterized in that: It comprises a printed circuit board PCB, a plurality of insulated gate bipolar transistors IGBT and a heat dissipation device as claimed in any one of claims 1 to 7; The collector electrodes of the multiple IGBTs are attached to the second surface of the heat sink in the heat dissipation device through an insulating layer, and each pin of the multiple IGBTs is welded on the PCB.
9. An inverter module, characterized in that: It comprises a printed circuit board PCB, a plurality of insulated gate bipolar transistors IGBT and a heat dissipation device as claimed in any one of claims 1 to 7; The collector electrodes of the multiple IGBTs are attached to the second surface of the heat sink in the heat dissipation device through an insulating layer, and each pin of the multiple IGBTs is welded on the PCB.
10. A UPS, characterized in that: The UPS includes the rectifier module as claimed in claim 8 and / or the inverter module as claimed in claim 9.