Mobile phone

Abstract

The utility model relates to the technical field of mobile phone heat dissipation, is used for solving the technical problem that an existing mobile phone is poor in heat dissipation effect, and provides a mobile phone, the mobile phone comprises a metal support and a heat dissipation pipe, the metal support is used for assembling a circuit module and a battery module and is provided with a hollow groove, the heat dissipation pipe is embedded and assembled in the hollow groove, and the heat dissipation pipe is arranged in the hollow groove. The heat dissipation pipe is used for absorbing heat of the circuit module and dissipating heat through the metal support. According to the mobile phone provided by the invention, the heat of the circuit module is absorbed through the heat dissipation pipe and is dissipated through the metal bracket, so that the heat dissipation in the mobile phone is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phones, in particular to a mobile phone with a stable structure and good heat dissipation performance. Background Art

[0002] With the acceleration of the technological innovation of electronic products, mobile phones have become an essential communication tool for people. People's requirements for mobile phones are getting higher and higher. It is no longer just an electronic device for communication purposes, but a multimedia mobile phone integrating functions such as music, video, photography, and Internet access. With the continuous development of the mobile phone industry, the performance of mobile phones is also becoming more and more powerful, especially the resolution and size of the processor and the screen are constantly improving.

[0003] Currently, in the commonly used smart phones, during long-term use, there will be a serious overheating phenomenon. Among them, the CPU part generates the most heat, and the heat usually accumulates in the upper area of the mobile phone. Summary of the Utility Model

[0004] The utility model provides a mobile phone and its speaker module to solve the technical problem that the heat generated by the CPU in the prior art accumulates in the upper area of the mobile phone.

[0005] To solve the above technical problem, a technical solution adopted by this application is: to provide a mobile phone, the mobile phone includes a metal bracket and a heat dissipation pipe. The metal bracket is used to assemble a circuit module and a battery module and is provided with a hollow groove. The heat dissipation pipe is embedded and assembled in the hollow groove. The heat dissipation pipe is used to absorb the heat of the circuit module and dissipate the heat through the metal bracket.

[0006] Preferably, the metal bracket includes a first assembly area and a second assembly area. The first assembly area is used to assemble the circuit module, and the second assembly area is used to assemble the battery module. The first assembly area and the second assembly area are provided with the hollow groove.

[0007] Preferably, the hollow groove includes a first embedding groove provided in the first assembly area, and the heat dissipation pipe includes a first heat pipe embedded in the first embedding groove;

[0008] The hollow groove includes a second embedding groove provided in the second assembly area, and the heat dissipation pipe includes a second heat pipe embedded in the second embedding groove;

[0009] Both the first heat pipe and the second heat pipe are flat.

[0010] Preferably, the first embedding groove is an arc-shaped groove or an inclined groove, and the first heat pipe is arc-shaped.

[0011] Preferably, there is one, two or more than two second grooves. When there are two or more than two second grooves, the second grooves are straight grooves, inclined grooves or arc grooves.

[0012] Preferably, the mobile phone further includes a heat dissipation block, and the heat dissipation block thermally connects the first heat pipe and the second heat pipe.

[0013] Preferably, a third assembly area is further provided in the first assembly area, and the heat dissipation block is embedded and assembled in the third assembly area.

[0014] Preferably, the mobile phone further includes a heat-conducting copper foil, and the heat-conducting copper foil is attached to both side surfaces of the heat dissipation pipe and connected to the metal bracket for heat conduction.

[0015] Preferably, the mobile phone further includes a spacer, and the spacer is disposed on both side surfaces of the second heat pipe.

[0016] Preferably, the first heat pipe is connected to the first surface side of the heat dissipation block, and the second heat pipe is connected to the second surface side of the heat dissipation block.

[0017] To solve the above technical problems, a technical solution adopted in this application is: to provide a mobile phone, which includes a metal bracket and a heat dissipation pipe. The metal bracket includes a first assembly area and a second assembly area. The first assembly area is used for assembling a circuit module, and the second assembly area is used for assembling a battery module. The heat dissipation pipe is used for absorbing the heat of the circuit module and evenly distributing the heat to the first assembly area and the second assembly area.

[0018] The beneficial effect of the present utility model is: different from the prior art, the mobile phone provided in this application absorbs the heat of the circuit module through the heat dissipation pipe and dissipates the heat through the metal bracket, optimizing the heat dissipation inside the mobile phone. Description of the Drawings

[0019] To more clearly illustrate the technical solutions of this application, the drawings required to be used in the description of this application will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0020] Figure 1 is a three-dimensional structure diagram of the mobile phone provided by the present utility model after removing the outer shell and the circuit module;

[0021] Figure 2 is Figure 1 a schematic diagram of further removing the battery module on the basis of

[0022] Figure 3 is Figure 2Schematic diagram of further removing the heat dissipation module on the basis of

[0023] Figure 4 is Figure 2 Schematic diagram of the heat dissipation module shown in

[0024] Figure 5 is Figure 1 Exploded structure schematic diagram of

[0025] Explanation of figure labels: 100, metal bracket; 101, fixing seat; 110, first assembly area; 111, first groove; 120, second assembly area; 121, second groove; 130, third assembly area; 140, retaining wall; 200, heat dissipation block; 210, first heat pipe; 220, second heat pipe; 230, heat-conducting copper foil; 240, spacer; 310, first battery cell; 320, second battery cell; 330, third battery cell; 340, fourth battery cell;. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0027] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions such as "first" and "second" involved in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present application.

[0029] Embodiment 1

[0030] Please refer to Figures 1 to 5, an embodiment of the present application provides a mobile phone, which includes a housing (not shown in the figure), a metal bracket 100 disposed in the housing, and a heat dissipation tube. The metal bracket 100 is used to assemble a circuit module (not shown in the figure) and a battery module and is provided with a hollow groove. The heat dissipation tube is embedded and assembled in the hollow groove, and the heat dissipation tube is used to absorb the heat of the circuit module and dissipate heat through the metal bracket 100. Among them, the metal bracket 100 can be integrally die-cast from aluminum alloy. For example, the metal bracket 100 can be integrally die-cast from aluminum-titanium alloy.

[0031] Specifically, the metal bracket 100 includes a first assembly area 110 and a second assembly area 120. The first assembly area 110 is used to assemble the circuit module, and the second assembly area 120 is used to assemble the battery module. Both the first assembly area 110 and the second assembly area 120 are provided with hollow grooves. The first assembly area 110 is usually located at the upper part of the mobile phone, and the second assembly area 120 is usually located at the lower part of the mobile phone. The circuit module includes components with relatively large heat generation, such as a main control chip and a camera.

[0032] As Figure 2 and Figure 3 shown, the hollow groove includes a first embedding groove 111 disposed in the first assembly area 110, the heat dissipation tube includes a first heat pipe 210 embedded in the first embedding groove 111, the hollow groove further includes a second embedding groove 121 disposed in the second assembly area 120, and the heat dissipation tube includes a second heat pipe 220 embedded in the second embedding groove 121. Among them, both the first heat pipe 210 and the second heat pipe 220 are flat.

[0033] The first embedding groove 111 is an arc groove or an inclined groove, which can be adjusted according to the specific heat source distribution of the circuit module. In the embodiment of the present application, the first heat pipe 210 is arc-shaped.

[0034] The second embedding groove 121 is one, two or more. When the second embedding groove 121 is two or more, the second embedding groove 121 is a straight groove, an inclined groove or an arc groove. The shape of the second heat pipe 220 corresponds to the shape of the second embedding groove 121. The second heat pipe 220 can extend and conduct the heat absorbed by the first heat pipe 210. That is, the heat of the circuit module in the upper part of the mobile phone can be conducted and dissipated downward as a whole through the first heat pipe 210 and the second heat pipe 220 in sequence, avoiding excessive heat concentration at the upper end part of the mobile phone.

[0035] Furthermore, the mobile phone further includes a heat dissipation block 200, and the heat dissipation block 200 thermally connects the first heat pipe 210 and the second heat pipe 220. At the same time, the heat dissipation block 200 has good heat conduction with the metal bracket 100.

[0036] Correspondingly, a third assembly area 130 is further provided in the first assembly area 110, and the heat sink 200 is embedded and assembled in the third assembly area 130. The heat sink 200 can conduct heat to the metal bracket 100 and the second heat pipe 220 better. At the same time, the second heat pipe 220 further conducts the heat to the lower area of the metal bracket 100, that is, the second assembly area 120, so as to make more effective use of the overall area of the metal bracket 100 for heat dissipation as a whole.

[0037] The mobile phone further includes a heat-conducting copper foil 230, and the heat-conducting copper foil 230 is attached to the upper and lower surfaces of the heat pipe and connected to the metal bracket 100 for heat conduction. Among them, the first heat pipe 210 and the heat-conducting copper foil 230, the heat sink 200 can be connected by soldering, and the heat exchange efficiency is relatively high. The second heat pipe 220 and the heat-conducting copper foil 230 can be connected by soldering or heat-conducting glue.

[0038] In addition, the mobile phone further includes a spacer 240, and the spacer 240 is arranged on both side surfaces of the second heat pipe 220. The spacer 240 is used to appropriately block the heat transfer to the battery module.

[0039] In the embodiment of the present application, the first heat pipe 210 is connected to the first surface side of the heat sink 200, and the second heat pipe 220 is connected to the second surface side of the heat sink 200. The first surface side and the second surface side are two main surfaces of the heat sink 200 that are opposite to each other. The thickness of the heat sink 200 can exactly match the horizontal height difference between the first heat pipe 210 and the second heat pipe 220. The number of the first heat pipes 210 can be one, two or multiple, and the number of the second heat pipes 220 can also be one or multiple.

[0040] The embodiment of the present application further provides a mobile phone, which includes a metal bracket 100 and a heat pipe. The metal bracket 100 includes a first assembly area 110 and a second assembly area 120. The first assembly area 110 is used for assembling circuit modules, and the second assembly area 120 is used for assembling battery modules. The heat pipe is used to absorb the heat of the circuit modules and evenly distribute the heat to the first assembly area 110 and the second assembly area 120. The difference between this embodiment and the previous embodiment is that no hollow groove is provided, and the number and shape of the heat pipes are not specifically limited. After the first heat pipe 210 absorbs heat in the first assembly area 110, it can dissipate heat evenly through the first assembly area 110, and further conduct the heat to the lower end of the mobile phone through the connected second heat pipe 220 and dissipate heat evenly through the second assembly area 120.

[0041] Embodiment 2

[0042] Please refer to Figures 1 to 5 simultaneously. The embodiment of the present application further provides a mobile phone, which includes a housing (not shown in the figure), a metal bracket 100, a first battery cell 310, and a second battery cell 320 provided in the housing.

[0043] The metal bracket 100 includes a first assembly area 110 and a second assembly area 120. The first assembly area 110 is used to assemble a circuit module (not shown in the figure). The second assembly area 120 is provided with a retaining wall 140 around both sides of the surface. The retaining wall 140 can preferably be provided on all sides. The retaining wall 140 can also be provided only on one side, two sides or three sides of the second assembly area 120. The metal bracket 100 can be formed by integral die-casting of an aluminum alloy. For example, the metal bracket 100 can be formed by integral die-casting of an aluminum-titanium alloy. A plurality of connecting seats 101 are provided around the metal bracket 100, and the connecting seats 101 are used to be fixed with the outer frame bracket of the mobile phone (not shown in the figure). The first battery cell 310 is assembled on the first surface side of the second assembly area 120 and is positioned and enclosed by the retaining wall 140. The second battery cell 320 is assembled on the second surface side of the second assembly area 120 and is positioned and enclosed by the retaining wall 140. The retaining wall 140 can be enclosed on all four sides of the first battery cell 310 and the second battery cell 320. The mobile phone provided by the present application can be a high-capacity, three-proof mobile phone. Its battery is larger and heavier than that of an ordinary smart phone, and therefore has a larger inertia. By setting a retaining wall 140 in the second assembly area 120 of the integrated metal bracket 100, the first battery cell 310 and the second battery cell 320 can be better fixed, and the battery mobile phone is not easy to move in the mobile phone when it falls or collides. In the prior art, the metal bracket 100 does not include the second assembly area 120. The present application adds the second assembly area 120 and uses the two side surfaces of the second assembly area 120 to fix the battery cell, which greatly improves the structural reliability of the product.

[0044] Furthermore, the mobile phone also includes a third battery cell 330 , which is aligned and bonded to the outer surface of the first battery cell 310 .

[0045] Furthermore, the mobile phone also includes a fourth battery cell 340 , which is aligned and bonded to the outer surface of the second battery cell 320 .

[0046] The mobile phone of the present application can be dual-cell, triple-cell, quad-cell, penta-cell or hexa-cell, etc. The sizes of the cells can be the same or different. For example, in the case of three cells, one cell on one side is thicker, while the two cells on the other side are thinner.

[0047] The first battery cell 310 and the second battery cell 320 can be fixed to the second assembly area 120 of the metal bracket 100 by adhesive, and the third battery cell 330 and the fourth battery cell 340 can be fixed to the first battery cell 310 and the second battery cell 320 by adhesive, respectively, and the four batteries can be further encapsulated with adhesive as a whole to be fixed by the metal bracket 100. Of course, the number of batteries in the embodiment of the present application can be 3 and they are distributed in a stacked state on both sides of the second assembly area 120.

[0048] To utilize the entire metal bracket 100 for heat dissipation, both the first assembly area 110 and the second assembly area 120 are provided with hollow slots. The mobile phone further includes a heat dissipation pipe. The hollow slot includes a first embedding slot 111 provided in the first assembly area 110, and the heat dissipation pipe includes a first heat pipe 210 embedded in the first embedding slot 111; the hollow slot includes a second embedding slot 121 provided in the second assembly area 120, and the heat dissipation pipe includes a second heat pipe 220 embedded in the first embedding slot 111. Both the first heat pipe 210 and the second heat pipe 220 are flat.

[0049] The second embedding slot 121 is one, two or more. When the second embedding slot 121 is two or more, the second embedding slot 121 is a straight slot, an inclined slot or an arc slot.

[0050] The mobile phone further includes a heat dissipation block 200. The heat dissipation block 200 thermally connects the first heat pipe 210 and the second heat pipe 220. At the same time, the heat dissipation block 200 has good heat conduction with the metal bracket 100.

[0051] A third assembly area 130 is further provided in the first assembly area 110, and the heat dissipation block 200 is embedded and assembled in the third assembly area 130. The heat dissipation block 200 can conduct heat to the metal bracket 100 and the second heat pipe 220 better. At the same time, the second heat pipe 220 further conducts heat to the metal bracket 100, and then the overall area of the metal bracket 100 is more effectively utilized for heat dissipation. In particular, the second assembly area 120 of the metal bracket 100 is fully utilized, and thus the heat at the upper part of the mobile phone can be evenly distributed to the lower part of the mobile phone.

[0052] The mobile phone further includes a heat-conducting copper foil 230. The heat-conducting copper foil 230 is attached to both side surfaces of the heat dissipation pipe and connected to the metal bracket 100 for heat conduction. The heat dissipation block 200 can conduct heat to the metal bracket 100 and the second heat pipe 220 better. At the same time, the second heat pipe 220 further conducts heat to the metal bracket 100, and then the overall area of the metal bracket 100 is more effectively utilized for heat dissipation.

[0053] In addition, the mobile phone further includes a spacer 240. The spacer 240 is arranged on both side surfaces of the second heat pipe 220. The spacer 240 is used to appropriately block the heat transfer to the battery module.

[0054] In the embodiment of the present application, the first heat pipe 210 is connected to the first surface side of the heat dissipation block 200, and the second heat pipe 220 is connected to the second surface side of the heat dissipation block 200. The thickness of the heat dissipation block 200 can exactly match the horizontal height difference between the first heat pipe 210 and the second heat pipe 220.

[0055] In summary, it is easy for those skilled in the art to understand that the present application provides a mobile phone that absorbs the heat of the circuit module through a heat dissipation pipe and dissipates heat through the metal bracket 100, optimizing the heat dissipation inside the mobile phone. In particular, after the first heat pipe 210 absorbs the heat of the circuit module, the heat at the upper part of the mobile phone is conducted downward through the heat dissipation block 200 and the second heat pipe 220 and the overall heat dissipation is carried out through the metal bracket 100, preferably avoiding the problem of excessive heat concentration at the upper part of the mobile phone. In addition, the present application provides a mobile phone that is provided with retaining walls 140 around the two side surfaces of the second assembly area 120 of the metal bracket 100, optimizing the fixation of the first battery cell 310 and the second battery cell 320 inside the mobile phone and avoiding the technical problem of the battery being prone to catenation in the prior art.

[0056] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A mobile phone, characterized in that: The mobile phone comprises a metal bracket (100) and a heat dissipation pipe, wherein the metal bracket (100) is used to assemble a circuit module and a battery module and is provided with a hollow groove, and the heat dissipation pipe is embedded and assembled in the hollow groove, and the heat dissipation pipe is used to absorb the heat of the circuit module and dissipate the heat through the metal bracket (100).

2. The mobile phone according to claim 1, characterized in that: The metal bracket (100) comprises a first assembly area (110) and a second assembly area (120), the first assembly area (110) being used to assemble the circuit module, the second assembly area (120) being used to assemble the battery module, and the first assembly area (110) and the second assembly area (120) being provided with the hollow groove.

3. The mobile phone according to claim 2, characterized in that: The hollow groove comprises a first embedding groove (111) provided in the first assembly area (110), and the heat dissipation pipe comprises a first heat pipe (210) embedded in the first embedding groove (111); The hollow groove comprises a second embedding groove (121) provided in the second assembly area (120), and the heat dissipation pipe comprises a second heat pipe (220) embedded in the second embedding groove (121); The first heat pipe (210) and the second heat pipe (220) are both flat.

4. The mobile phone according to claim 3, characterized in that: The first embedded groove (111) is an arc-shaped groove or an inclined groove, and the first heat pipe (210) is in an arc shape.

5. The mobile phone according to claim 3, characterized in that: The second embedding groove (121) is one, two or more. When the second embedding groove (121) is two or more, the second embedding groove (121) is a straight groove, an oblique groove or an arc groove.

6. The mobile phone according to claim 3, characterized in that: The mobile phone also includes a heat dissipation block (200), wherein the heat dissipation block (200) thermally connects the first heat pipe (210) and the second heat pipe (220), wherein the first heat pipe (210) is connected to a first surface side of the heat dissipation block (200), and the second heat pipe (220) is connected to a second surface side of the heat dissipation block (200).

7. The mobile phone according to claim 6, characterized in that: A third assembly area (130) is further provided in the first assembly area (110), and the heat dissipation block (200) is embedded and assembled in the third assembly area (130).

8. The mobile phone according to claim 1, characterized in that: The mobile phone further comprises a heat-conducting copper foil (230), wherein the heat-conducting copper foil (230) is attached to the two side surfaces of the heat dissipation pipe and connected to the metal bracket (100) for heat conduction.

9. The mobile phone according to claim 3, characterized in that: The mobile phone further comprises a spacer (240), and the spacer (240) is arranged on both side surfaces of the second heat pipe (220).

10. A mobile phone, characterized in that: The mobile phone comprises a metal support (100) and a heat dissipation pipe, wherein the metal support (100) comprises a first assembly area (110) and a second assembly area (120), wherein the first assembly area (110) is used for assembling a circuit module, and the second assembly area (120) is used for assembling a battery module, and the heat dissipation pipe is used for absorbing heat from the circuit module and distributing the heat evenly to the first assembly area (110) and the second assembly area (120).

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