Multilayer capacitance coupling structure of circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a multilayer capacitance coupling structure of a circuit board, which solves the technical problem that the use performance of the circuit board is affected due to the fact that scaling powder flows on the circuit board and forms a conductive path in the design and manufacturing process of the existing multilayer capacitance coupling structure of the circuit board, and comprises a circuit board main body, the upper surface of the circuit board main body is provided with a bonding pad, the upper surface of the bonding pad is connected with a capacitor main body, and the upper surface of the bonding pad is provided with an anti-overflow ring; the anti-overflow ring is arranged on the upper surface of the bonding pad, so that the flowing range of the soldering flux can be limited, the soldering flux is concentrated in the bonding pad area, sufficient infiltration between the capacitor pins and the bonding pad is ensured, the welding quality and reliability are improved, the soldering flux can be effectively prevented from overflowing to other parts of the circuit board main body, and the service life of the circuit board main body is prolonged. The adverse effect of the soldering flux on the circuit board is reduced, the capacitor body can be positioned through the positioning assembly, and the accuracy of the welding position of the capacitor can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly relates to a multi-layer capacitance coupling structure of a circuit board. Background Technique

[0002] The multi-layer capacitance coupling structure of a circuit board is a design structure that utilizes the capacitance effect to achieve signal coupling between different circuit layers in a multi-layer printed circuit board. In a multi-layer circuit board, there are usually multiple conductive layers and insulating layers arranged alternately. The capacitance coupling structure is mainly composed of conductors distributed on different layers and the insulating medium between them, and these conductors and insulating medium together form capacitors with specific capacitance values. The working principle of this structure is to utilize the conduction characteristics of capacitors for alternating current signals to achieve the transmission and coupling of signals between different circuit layers within a specific frequency range.

[0003] However, for the existing multi-layer capacitance coupling structure of a circuit board, when welding a capacitor to the circuit board, it is necessary to add a soldering flux on the tin plating layer and use a soldering iron head to weld the capacitor to the circuit board with tin material. When not in use, the soldering flux exists in a flowing form of liquid or paste. And because the soldering flux usually has a certain conductivity, the soldering flux flowing on the circuit board will form a conductive path, which will not only reduce the insulation performance of the circuit board but also affect signal transmission. Content of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a multi-layer capacitance coupling structure of a circuit board, which can solve the problem that in the design and manufacturing process of the existing multi-layer capacitance coupling structure of a circuit board, the soldering flux will flow on the circuit board and form a conductive path, thereby affecting the use performance of the circuit board. It can prevent the soldering flux from flowing randomly on the circuit board to ensure the accuracy of the design and manufacturing of the multi-layer capacitance coupling structure. At the same time, it can also improve the accuracy of the capacitor welding position, which is beneficial to reducing the interference of the capacitor on signal transmission.

[0005] To achieve the above object, the utility model provides the following technical solution: A multi-layer capacitance coupling structure of a circuit board, including a circuit board main body, a solder pad is arranged on the upper surface of the circuit board main body, a capacitor main body is connected to the upper surface of the solder pad, an anti-overflow ring is arranged on the upper surface of the solder pad, and the capacitor main body is located inside the anti-overflow ring;

[0006] A positioning component is arranged inside the anti-overflow ring, the positioning component includes a fixed block and a positioning block, and the positioning component is used for positioning the capacitor main body.

[0007] Through the above technical solution, an anti-overflow ring is provided on the upper surface of the pad, which can limit the flow range of the solder flux, concentrate the solder flux in the pad area, ensure sufficient wetting between the capacitor pins and the pad, thereby improving the quality and reliability of soldering, and can effectively prevent the solder flux from overflowing to other parts of the circuit board body, reducing the adverse effects of the solder flux on the circuit board. And the capacitor body can be positioned through the positioning component, which is beneficial to improving the accuracy of the capacitor soldering position and ensuring that the capacitor bodies maintain a specified distance from each other, thereby being beneficial to reducing the interference of the capacitor on signal transmission.

[0008] Further, the height of the anti-overflow ring is less than the height of the capacitor body, and the anti-overflow ring is closely attached to the pad.

[0009] Through the above technical solution, since the height of the anti-overflow ring is less than the height of the capacitor body, the soldering iron head can be inserted into the pad to solder the capacitor body and the pad.

[0010] Further, the connection mode between the fixing block and the anti-overflow ring is a fixed connection, and the fixing blocks are symmetrically distributed about the longitudinal center line of the anti-overflow ring.

[0011] Through the above technical solution, the anti-overflow ring provides a supporting effect on the fixing block, and the fixing block is used to accommodate the positioning block and limit the movement of the positioning block.

[0012] Further, a chute is opened inside the fixing block, the connection mode between the positioning block and the chute is a sliding connection, the positioning block has a "U" - shaped structure, and the two ends of the positioning block are in an arc structure.

[0013] Through the above technical solution, the positioning block slides inside the chute, and under the limiting action of the fixing block, the positioning block will perform a linear motion inside the chute. And because the two ends of the positioning block are in an arc structure, the positioning block will push the capacitor body located above the pad during the movement, making the capacitor body located at the center position of the pad.

[0014] Further, a support plate is fixedly connected to the lower surface of the positioning block, a connecting column is fixedly connected to one side of the support plate, a groove is opened inside the connecting column, a limiting block is arranged inside the groove, the limiting block has a rectangular structure, the limiting block is inclined, and a positioning shaft is arranged on one side of the limiting block, and the connection mode between the positioning shaft and the limiting block is a sliding connection.

[0015] Through the above technical solution, during the process of pushing the positioning block to perform a linear motion, the positioning block drives the limiting block connected to the connecting column to move synchronously through the support plate. During the horizontal movement of the limiting block, the limiting block will limit the positioning shaft, making the positioning shaft perform a linear motion in the vertical direction.

[0016] Further, the positioning shaft is slidably connected to the fixing block. The positioning shafts are symmetrically distributed about the longitudinal center line of the fixing block. A positioning hole is formed in the lower surface of the positioning block, and the positioning shaft is snap-fitted with the positioning hole.

[0017] Through the above technical solution, after the positioning shaft moves upward, it will snap into the interior of the positioning hole. The positioning block can be positioned through the snap-fit connection between the positioning shaft and the positioning hole, so that the capacitor body is stabilized at the specified position.

[0018] Further, an adsorption layer is provided inside the anti-overflow ring, and the adsorption layer has an annular structure.

[0019] Through the above technical solution, the adsorption layer is made of materials with capillary adsorption effect. The tiny pores of these materials can adsorb the solder flux like a capillary to prevent it from overflowing. When the solder flux contacts the adsorption layer, it will be quickly sucked into the pores, thereby effectively controlling its flow to ensure that it does not spread to other parts of the circuit board.

[0020] Further, a docking block is fixedly connected to the lower surface of the anti-overflow ring, and a docking groove is formed in the upper surface of the pad. The docking blocks and the docking grooves correspond to each other one by one.

[0021] Through the above technical solution, by using the snap-fit connection between the docking block and the docking groove, the anti-overflow ring can be quickly connected or disassembled from the pad, which is convenient for optimizing the overall structure of the circuit board and avoiding interference of the anti-overflow ring on the electrical performance of the circuit board.

[0022] Compared with the prior art, the present utility model provides a multi-layer capacitor coupling structure of a circuit board, having the following beneficial effects:

[0023] In the present utility model, an anti-overflow ring is provided on the upper surface of the pad, which can limit the flow range of the solder flux, concentrate the solder flux in the pad area, ensure sufficient wetting between the capacitor pins and the pad, thereby improving the quality and reliability of welding, and can effectively prevent the solder flux from overflowing to other parts of the circuit board body, reducing the adverse effects of the solder flux on the circuit board. And the capacitor body can be positioned through the positioning component, which is beneficial to improving the accuracy of the capacitor welding position and ensuring that the capacitor bodies maintain a specified distance from each other, thereby being beneficial to reducing the interference of the capacitor on signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0025] Figure 2 is a schematic diagram of the connection structure between the pad and the anti-overflow ring of the present utility model;

[0026] Figure 3 is a schematic diagram of the connection structure between the anti-overflow ring and the fixing block of the present utility model;

[0027] Figure 4 Schematic cross-sectional structure diagram of the fixing block in the present utility model;

[0028] Figure 5 Schematic connection structure diagram of the positioning block and [object not specified] in the present utility model;

[0029] Figure 6 Schematic structure diagram of the positioning block in the present utility model;

[0030] Figure 7 Schematic structure diagram of the second embodiment in the present utility model;

[0031] Figure 8 Schematic connection structure diagram of the anti-overflow ring and the adsorption layer in the present utility model.

[0032] Wherein: 1. Circuit board main body; 2. Solder pad; 3. Capacitor main body; 4. Anti-overflow ring; 5. Fixing block; 6. Chute; 7. Positioning block; 8. Support plate; 9. Connecting column; 10. Limiting block; 11. Groove; 12. Positioning shaft; 13. Positioning hole; 14. Adsorption layer; 15. Docking block; 16. Docking groove. Specific implementation manners

[0033] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0034] Embodiment 1: Please refer to Figures 1-6 , the present utility model provides a technical solution: A multi-layer capacitor coupling structure of a circuit board, including a circuit board main body 1, a solder pad 2 is arranged on the upper surface of the circuit board main body 1, a capacitor main body 3 is connected to the upper surface of the solder pad 2, an anti-overflow ring 4 is arranged on the upper surface of the solder pad 2, the capacitor main body 3 is located inside the anti-overflow ring 4, the height of the anti-overflow ring 4 is less than the height of the capacitor main body 3, and the anti-overflow ring 4 is in close fit with the solder pad 2.

[0035] It is worth mentioning that: By arranging the anti-overflow ring 4 on the upper surface of the solder pad 2, the flow range of the soldering flux can be restricted, so that the soldering flux is concentrated in the area of the solder pad 2, ensuring sufficient wetting between the capacitor pins and the solder pad 2, thereby improving the quality and reliability of the soldering, and effectively avoiding the soldering flux from overflowing to other parts of the circuit board main body 1, reducing the adverse effects of the soldering flux on the circuit board.

[0036] Please refer to Figures 1-3, the connection mode between the fixed block 5 and the anti-overflow ring 4 is a fixed connection, and the fixed blocks 5 are symmetrically distributed about the longitudinal center line of the anti-overflow ring 4.

[0037] The function of the fixed block 5 is that the anti-overflow ring 4 provides a supporting effect on the fixed block 5, and the fixed block 5 is used to accommodate the positioning block 7 and limit the movement of the positioning block 7.

[0038] Please refer to Figures 1-6 , a positioning component is arranged inside the anti-overflow ring 4. The positioning component includes a fixed block 5 and a positioning block 7. The positioning component is used to position the capacitor body 3. A sliding groove 6 is opened inside the fixed block 5. The connection mode between the positioning block 7 and the sliding groove 6 is a sliding connection. The positioning block 7 is in a "U" shape structure. The two ends of the positioning block 7 are in an arc structure. A support plate 8 is fixedly connected to the lower surface of the positioning block 7. A connecting column 9 is fixedly connected to one side of the support plate 8. A groove 11 is opened inside the connecting column 9. A limiting block 10 is arranged inside the groove 11. The limiting block 10 is in a rectangular structure. The limiting block 10 is inclined. A positioning shaft 12 is arranged on one side of the limiting block 10. The connection mode between the positioning shaft 12 and the limiting block 10 is a sliding connection. The connection mode between the positioning shaft 12 and the fixed block 5 is a sliding connection. The positioning shafts 12 are symmetrically distributed about the longitudinal center line of the fixed block 5. A positioning hole 13 is opened on the lower surface of the positioning block 7. The connection mode between the positioning shaft 12 and the positioning hole 13 is a snap connection.

[0039] The principle of being able to position the capacitor body 3 is as follows: When welding the capacitor body 3 to the solder pad 2, first, the soldering flux can be added to the upper surface of the solder pad 2. Then, the capacitor body 3 is placed in the middle position of the solder pad 2. Immediately afterwards, the positioning block 7 is pushed towards the direction where the capacitor body 3 is located. The positioning block 7 slides inside the sliding groove 6. And under the limiting effect of the fixed block 5, the positioning block 7 will perform a linear motion inside the sliding groove 6. And because the two ends of the positioning block 7 are in an arc structure, the positioning block 7 will push the capacitor body 3 located above the solder pad 2 during the movement, so that the capacitor body 3 is located in the centered position of the solder pad 2. And during the process of pushing the positioning block 7 to perform a linear motion, the positioning block 7 drives the limiting block 10 connected to the connecting column 9 through the support plate 8 to perform synchronous motion. During the process of the limiting block 10 performing a horizontal motion, the limiting block 10 will limit the positioning shaft 12, so that the positioning shaft 12 performs a linear motion in the vertical direction. After the positioning shaft 12 moves upward, it will snap into the inside of the positioning hole 13. The positioning block 7 can be positioned through the snap connection between the positioning shaft 12 and the positioning hole 13, so that the capacitor body 3 is stabilized at the specified position. Then, the capacitor body 3 and the solder pad 2 can be welded by a soldering iron head, which is beneficial to ensuring that the capacitor bodies 3 maintain a specified distance from each other, and thus is beneficial to reducing the interference of the capacitor on signal transmission.

[0040] Embodiment 2: The difference between this embodiment and Embodiment 1 is that: Please refer toFigures 7-8 , an adsorption layer 14 is provided inside the anti-overflow ring 4, and the adsorption layer 14 is in an annular structure.

[0041] It should be noted that: the adsorption layer 14 is prepared from materials with capillary adsorption effect. The tiny pores of these materials can adsorb the solder flux like a capillary to prevent it from overflowing. When the solder flux contacts the adsorption layer 14, it will be quickly sucked into the pores, so as to effectively control its flow and ensure that it will not spread to other parts of the circuit board.

[0042] Please refer to Figures 7-8 , a docking block 15 is fixedly connected to the lower surface of the anti-overflow ring 4, and a docking groove 16 is formed on the upper surface of the pad 2. The docking blocks 15 and the docking grooves 16 correspond to each other one by one;

[0043] It is worth mentioning that: by using the snap connection between the docking block 15 and the docking groove 16, the anti-overflow ring 4 can be quickly connected or disassembled with the pad 2. After the capacitor body 3 is welded to the pad 2, pulling up the anti-overflow ring 4 can quickly separate it from the pad 2, and the anti-overflow ring 4 drives the fixing block 5 to be disassembled from the circuit board synchronously, so as to facilitate optimizing the overall structure of the circuit board and avoid interference of the anti-overflow ring 4 on the electrical performance of the circuit board.

[0044] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multilayer capacitive coupling structure of a circuit board, comprising a circuit board body (1), characterized in that: A soldering pad (2) is provided on the upper surface of the circuit board body (1), a capacitor body (3) is connected to the upper surface of the soldering pad (2), an anti-overflow ring (4) is provided on the upper surface of the soldering pad (2), and the capacitor body (3) is located inside the anti-overflow ring (4); A positioning component is arranged inside the anti-overflow ring (4), the positioning component comprising a fixing block (5) and a positioning block (7), and the positioning component is used to position the capacitor body (3).

2. The multilayer capacitive coupling structure of a circuit board according to claim 1, characterized in that: The height of the anti-overflow ring (4) is smaller than the height of the capacitor body (3), and the anti-overflow ring (4) is tightly fitted to the soldering pad (2).

3. The multilayer capacitive coupling structure of a circuit board according to claim 1, characterized in that: The fixing block (5) is connected to the anti-overflow ring (4) in a fixed connection manner, and the fixing block (5) is symmetrically distributed with respect to the longitudinal center line of the anti-overflow ring (4).

4. The multilayer capacitive coupling structure of a circuit board according to claim 1, characterized in that: A sliding groove (6) is provided inside the fixing block (5), and the positioning block (7) is connected to the sliding groove (6) in a sliding manner. The positioning block (7) is in a "U"-shaped structure, and both ends of the positioning block (7) are in an arc-shaped structure.

5. The multilayer capacitive coupling structure of a circuit board according to claim 1, characterized in that: The lower surface of the positioning block (7) is fixedly connected to a support plate (8), one side of the support plate (8) is fixedly connected to a connecting column (9), a groove (11) is provided inside the connecting column (9), a limit block (10) is arranged inside the groove (11), the limit block (10) is of a rectangular structure, the limit block (10) is inclined, a positioning shaft (12) is arranged on one side of the limit block (10), and the positioning shaft (12) and the limit block (10) are connected in a sliding manner.

6. The multilayer capacitive coupling structure of a circuit board according to claim 5, characterized in that: The connection mode between the positioning shaft (12) and the fixed block (5) is a sliding connection. The positioning shaft (12) is symmetrically distributed about the longitudinal center line of the fixed block (5). A positioning hole (13) is provided on the lower surface of the positioning block (7). The connection mode between the positioning shaft (12) and the positioning hole (13) is a snap-fit ​​connection.

7. The multilayer capacitive coupling structure of a circuit board according to claim 1, characterized in that: An adsorption layer (14) is arranged inside the anti-overflow ring (4), and the adsorption layer (14) is in an annular structure.

8. The multilayer capacitive coupling structure of a circuit board according to claim 1, characterized in that: A docking block (15) is fixedly connected to the lower surface of the anti-overflow ring (4), and a docking groove (16) is provided on the upper surface of the welding pad (2), and the docking block (15) corresponds to the docking groove (16) one by one.

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