Annular getter structure of ceramic tube shell

By setting an annular getter sheet and electrode block in the encapsulation cavity of the ceramic tube shell, the existing getter size limitation is solved, the vacuum requirement of highly integrated and miniaturized micro products is achieved, and the gas adsorption capacity of getters is enhanced.

CN222996976UActive Publication Date: 2025-06-17JIANGSU PROSPER SEMICON INC
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Patent Information

Application Number
CN202421783346.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-26
Publication Date
2025-06-17
Estimated Expiration
2034-07-26

AI Technical Summary

Technical Problem

The size limitations of existing getters make their effects unable to meet the needs of highly integrated and miniaturized micro products.

Method used

Using an annular getter structure of a ceramic tube shell, an annular getter sheet and an electrode block are arranged in the encapsulation cavity of the ceramic tube shell. The annular getter sheet surrounds the chip and is welded to the electrode block to increase the surface area of ​​the getter.

Benefits of technology

It achieves the maximum satisfaction of the vacuum requirement within the device in the miniaturized ceramic shell and tube packaging, and enhances the gas adsorption capacity of the getter.

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Abstract

The utility model relates to an annular getter structure of a ceramic tube shell, which comprises the ceramic tube shell, the ceramic tube shell is provided with a packaging cavity, a metal cover plate is arranged on the packaging cavity of the ceramic tube shell, a light window is arranged on the metal cover plate, and the light window is welded on the metal cover plate through a light window solder. An annular getter piece and electrode blocks are arranged in the packaging cavity, the annular getter piece surrounds the periphery of the chip, the annular getter piece is welded to at least three electrode blocks which are arranged at intervals, the surface area of the getter is increased through the annular getter structure, and the surface area of the getter is increased. According to the annular getter structure, the requirement for the vacuum degree in a device can be met to the maximum degree after use, gold production can be further integrated and miniaturized, meanwhile, the annular getter structure is provided with four adsorption areas, the adjacent adsorption areas are connected through electric activation areas, and each adsorption area can serve as an independent adsorption unit.
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Description

Technical Field

[0001] This application relates to the field of infrared semiconductor packaging, and particularly to an annular getter structure for a ceramic package shell. Background Art

[0002] Currently, the packaging forms of infrared detectors mainly include metal packaging, ceramic packaging, wafer-level packaging, and pixel-level packaging. Compared with the other three packaging forms, ceramic packaging enables infrared detectors to have the advantages of high performance, low cost, small volume, and light weight, and is currently the mainstream form of infrared detector packaging. With the breakthrough of domestic getter preparation technology, thin-film getters can already be integrated on the infrared window of ceramic packaging, which provides an opportunity for the development of infrared detectors towards low cost and miniaturization.

[0003] However, the current forms of getters mainly include columnar getters, sheet getters, and thin-film getters. However, due to size reasons, the effect of the getter cannot reach the expected value, thus failing to meet the requirements of highly integrated and miniaturized micro-products. Therefore, there is an urgent need to provide a new type of getter structure to solve the existing problems. Summary of the Utility Model

[0004] Based on this, in order to meet the vacuum degree inside the vacuum packaging device and achieve the requirement of product miniaturization, this embodiment provides an annular getter structure for a ceramic package shell, including a ceramic package shell, the ceramic package shell is provided with a packaging cavity, a metal cover plate is installed on the packaging cavity of the ceramic package shell, a light window is provided on the metal cover plate, the light window is welded on the metal cover plate through a light window solder, an annular getter sheet and an electrode block are arranged in the packaging cavity, the annular getter sheet surrounds the chip, and the annular getter sheet is welded on not less than 3 electrode blocks arranged at intervals.

[0005] Preferably, the annular getter sheet is square, and power-on activation areas are respectively arranged at the four corners of the annular getter sheet.

[0006] Preferably, the power-on activation area is an aluminum sheet, and the power-on activation area is welded on the electrode block.

[0007] Preferably, an insulating area is arranged in the power-on activation area, and the insulating area divides the power-on activation area into two non-conducting areas.

[0008] Preferably, the insulating area is a plastic part or a rubber part, and the aluminum sheet is installed on the plastic part or the rubber part.

[0009] Preferably, the number of the electrode blocks is 4.

[0010] Preferably, the number of the energized activation areas is 8, and each of the energized activation areas is welded to the electrode block.

[0011] Preferably, the annular getter sheet is circular, and at least 3 energized activation areas are arranged on the circular getter sheet.

[0012] Compared with the prior art, the advantages of this application are as follows:

[0013] By providing an annular getter structure, this application increases the surface area of the getter, and can maximally meet the vacuum degree problem inside the device after use. At the same time, the annular getter structure of this application is provided with 4 adsorption areas, and adjacent adsorption areas are connected by electric activation areas. In order to ensure the activation quality, insulation areas are arranged between the electric activation areas, so that each electric activation area and the adsorption area can be used as an independent getter structure. If any one of them cannot be activated, it will not affect the use of others. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following further describes this application in conjunction with the drawings and embodiments:

[0015] Figure 1 is an exploded view of an annular getter structure of a ceramic package of this application;

[0016] Figure 2 is a schematic diagram of a square getter structure of a ceramic package of this application;

[0017] Figure 3 is a schematic diagram of a circular getter structure of a ceramic package of this application.

[0018] Among them, 1. Ceramic package, 101. Encapsulation cavity, 2. Chip, 3. Metal cover plate, 4. Optical window solder, 5. Optical window, 6. Electrode block, 7. Getter sheet, 71. Adsorption area, 72. Energized activation area, 73. Insulation area. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] To make the purpose, technical solutions and advantages of this application clearer, the following will further describe the embodiments of this application in detail with reference to the drawings. Obviously, the described embodiments are only one embodiment of this application, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0020] As used herein, an "embodiment" refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present application. In the description of the embodiments of the present application, it should be understood that terms such as "first", "second", and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" etc. may explicitly or implicitly include one or more of such features. Moreover, terms such as "first", "second", and "third" etc. are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data may be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "comprising" and "being" and any variations thereof are intended to cover non-exclusive inclusion.

[0021] As Figure 1 As shown, this embodiment provides an annular getter structure for a ceramic package, including a ceramic package 1. The ceramic package 1 is provided with a packaging cavity 101. According to different product standards, the packaging cavity 101 is generally square or circular. In this embodiment, the square packaging cavity 101 is taken as an example. The packaging cavities of other shapes are similar to this embodiment and will not be elaborated one by one here. A chip 2 is arranged inside the packaging cavity 101. The four sides of the chip 2 are welded to the pins by gold wires. A metal cover plate 3 is installed on the ceramic package 1. The metal cover plate 3 is square to match the ceramic package 1. In this embodiment, one end face of the metal cover plate 3 and the end face of the opening of the ceramic package 1 are sealed by welding. An installation groove 31 is arranged at one end of the metal cover plate 3 away from the ceramic package 1. A light window 5 is welded to the installation groove 31 by a light window solder 4. Thus, the chip 2 inside the packaging cavity 101 is encapsulated in a sealed space formed by the packaging cavity 101, the metal cover plate 3, and the light window 5.

[0022] In an embodiment of the present application, when encapsulating the chip 2, it is necessary to ensure that a vacuum environment is maintained inside the encapsulation cavity 101. Usually, during the encapsulation process, a pair of electrode blocks 6 are arranged inside the encapsulation cavity 101, and a getter sheet 7 is welded on the pair of electrode blocks 6. After the pair of electrode blocks 6 are energized, the getter sheet 7 is activated to adsorb the gas inside the encapsulation cavity 101. Usually, the getter sheet 7 is a strip-shaped structure. In the case of a large requirement for vacuum degree, an ordinary getter sheet 7 cannot meet the requirement, and in the conventional technology, a getter sheet 7 with a large size cannot be arranged inside the limited encapsulation cavity 101. In this embodiment, the shape of the getter sheet 7 is set to be annular, and the edge close to the inner side of the encapsulation cavity 101 is circumferentially arranged, surrounding the chip 2 therein. In this embodiment, the inside of the encapsulation cavity 101 is a square structure. Therefore, a circle of getter sheet 7 is arranged around the encapsulation cavity 101, thereby increasing the surface area of the getter sheet 7 and enhancing the ability to adsorb gas.

[0023] As Figure 2 shown, in this embodiment, the annular getter sheet 7 includes an adsorption area 71, an energization activation area 72, and an insulation area 73. The energization activation areas 72 are respectively arranged at both ends of the adsorption area 71. After the energization activation area 72 is energized, the adsorption area 71 can be activated. The material of the energization activation area 72 is an aluminum sheet. Since each adsorption area needs to be activated, and it is not easy to activate the entire annular getter sheet, in this embodiment, 1 electrode block 6 is arranged at each of the four corners inside the encapsulation cavity 10, and the 4 energization activation areas 72 are respectively welded on the electrode blocks 6. In this way, the annular getter sheet 7 is divided into 4 adsorption areas 71, and each adsorption area 71 can be activated through two electrode blocks 6. To ensure the activation effect, an insulation area 73 is also arranged between the energization activation areas 72. The insulation area 73 is supported by an insulating material, including plastics, rubbers, etc. Both ends of the insulation area 73 are respectively connected to the energization activation area 72 made of aluminum sheet. In this embodiment, the insulation area 73 is arranged between the 4 energization activation areas 72, and the 4 insulation areas 73 divide the getter sheet 7 into 4 groups of getter sheets that can work independently. When any one of the getter sheets cannot work properly, the other 3 can be ensured to be normally activated.

[0024] As Figure 3As shown, in other embodiments of the present application, the shape of the encapsulation cavity 101 is circular. To adapt to the circular encapsulation cavity 101, the getter sheet 7 is also set to be circular accordingly. Three power-on activation areas 72 are provided on the circular getter sheet 7, and each power-on activation area 72 is welded to an electrode block 6 correspondingly provided on the encapsulation cavity 101. The three power-on activation areas 72 divide the circular getter sheet 7 into three adsorption areas 71, further ensuring the vacuum degree inside the encapsulation cavity 101 after the product encapsulation is completed.

[0025] The above embodiments are only used to illustrate the technical concept and features of the present application. The purpose is to enable those who are familiar with this technology to understand the content of the present application and implement it accordingly, and it cannot be used to limit the protection scope of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present application is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

Claims

1. A ring-shaped getter structure of a ceramic tube shell, comprising a ceramic tube shell, wherein the ceramic tube shell is provided with a packaging cavity, a metal cover is installed on the packaging cavity, a light window is provided on the metal cover, and the light window is welded on the metal cover by a light window solder, characterized in that: An annular getter sheet and an electrode block are arranged in the packaging cavity. The annular getter sheet surrounds the chip and is welded to no less than three electrode blocks arranged at intervals.

2. The ring-shaped getter structure of a ceramic tube shell according to claim 1, characterized in that: The annular getter sheet is square, and four corners of the square annular getter sheet are respectively provided with energized activation areas.

3. The ring-shaped getter structure of a ceramic tube shell according to claim 2, characterized in that: The energized activation area is an aluminum sheet, and the energized activation area is welded on the electrode block.

4. The ring-shaped getter structure of a ceramic tube shell according to claim 3, characterized in that: An insulating region is provided in the energized activation region, and the insulating region divides the energized activation region into two regions that are not conductive to each other.

5. The ring-shaped getter structure of a ceramic tube shell according to claim 4, characterized in that: The insulating area is a plastic part or a rubber part, and the aluminum sheet is installed on the plastic part or the rubber part.

6. A ring-shaped getter structure for a ceramic tube shell according to any one of claims 2 to 5, characterized in that: The number of the electrode blocks is 4.

7. The ring-shaped getter structure of a ceramic tube shell according to claim 6, characterized in that: The number of the energized activation zones is 8, and each of the energized activation zones is welded to the electrode block.

8. The ring-shaped getter structure of a ceramic tube shell according to claim 1, characterized in that: The annular getter sheet is circular, and at least three energized activation areas are arranged on the circular getter sheet.