Deposition polishing device and cleaning equipment

Abstract

The utility model provides a deposition polishing device and cleaning equipment, and relates to the technical field of semiconductor equipment cleaning. The deposition polishing device comprises a shell, a cleaning table and a cleaning head, wherein the shell is provided with a containing groove; and a sewage discharge hole is formed in the accommodating groove. The cleaning table is arranged in the containing groove and fixedly connected with the shell. A flow guide hole is formed in the cleaning table and communicated with the sewage draining hole. The cleaning head is installed on the cleaning table. And the cleaning efficiency and the cleaning effect of the side wall of the reaction cavity are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment cleaning, and in particular, to a deposition and polishing device and a cleaning device. Background Technique

[0002] With the rapid development of the semiconductor industry, chemical vapor deposition is a chemical technology that mainly uses one or several gaseous compounds or simple substances containing thin film elements to generate a thin film on the surface of a substrate through a chemical reaction. In the deposition process, by-products of gas reactions will be generated in the reaction chamber. Currently, the common practice is to use a suction pump to discharge the by-products generated in the reaction chamber, so that the thin film deposited on the surface of the wafer has better uniformity and the quality of thin film deposition is improved.

[0003] However, it is difficult for the existing suction devices to discharge the gas in a timely and uniform manner. When there are too many by-products in the chamber or the air flow rate is inconsistent, by-products are likely to be deposited on the side wall of the chamber. For the deposited by-products, chemical agents and sandpaper polishing are usually used to remove them during machine maintenance. Currently, manual cleaning methods are commonly used. For deeper chamber structures, it is difficult to clean the by-products at the bottom and side walls, and there is a phenomenon of incomplete cleaning. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a deposition and polishing device and a cleaning device, which can improve the cleaning efficiency of the by-products deposited on the side wall and bottom of the chamber and clean more thoroughly.

[0005] The embodiments of the utility model are implemented as follows:

[0006] In a first aspect, the utility model provides a deposition and polishing device, including:

[0007] A housing, which is provided with a receiving groove; a sewage discharge hole is provided in the receiving groove;

[0008] A cleaning table, which is arranged in the receiving groove and fixedly connected to the housing; a diversion hole is provided on the cleaning table, and the diversion hole is communicated with the sewage discharge hole;

[0009] A cleaning head, which is installed on the cleaning table.

[0010] In an optional embodiment, the cleaning head includes a first fixed shaft and a grinding part connected to the first fixed shaft, and one end of the first fixed shaft far from the grinding part is fixedly connected to the cleaning table.

[0011] In an optional embodiment, an installation groove is provided on the cleaning table, and the first fixed shaft is in plug-in fit with the installation groove.

[0012] In an alternative embodiment, the grinding portion is provided in a hemispherical shape.

[0013] In an alternative embodiment, a second fixed shaft is provided on a side of the cleaning table away from the cleaning head, and the second fixed shaft is fixedly connected to the housing.

[0014] In an alternative embodiment, a fixing hole is provided at the bottom of the accommodating groove, and the second fixed shaft is disposed in the fixing hole.

[0015] In an alternative embodiment, the cleaning table includes a mounting plate and an annular side plate protruding from the outer periphery of the mounting plate. The mounting plate is connected to the cleaning head; the annular side plate is sleeved on the housing.

[0016] In an alternative embodiment, the mounting plate covers the accommodating groove of the housing, and a sewage cavity is formed by enclosing the mounting plate, the annular side plate and the housing. The diversion hole and the sewage hole are respectively communicated with the sewage cavity.

[0017] In an alternative embodiment, the annular side plate and the housing are hermetically connected.

[0018] In a second aspect, the present invention provides a cleaning device, including a driving member and the deposition and polishing device according to any one of the foregoing embodiments, and the driving member is in transmission connection with the housing.

[0019] The beneficial effects of the embodiments of the present invention include:

[0020] The deposition and polishing device provided by the embodiments of the present invention is provided with a cleaning head on the cleaning table, and the inner wall of the reaction chamber is polished by using the cleaning head, which can improve the cleaning efficiency and cleaning effect, and the cleaning is more thorough.

[0021] The cleaning device provided by the embodiments of the present invention includes the above-mentioned deposition and polishing device, and the driving member is used to drive the housing to rotate, so as to realize the polishing of the inner wall of the reaction chamber by the cleaning head, with high cleaning efficiency and more thorough cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a schematic diagram of the overall structure of the deposition and polishing device provided by the embodiments of the present invention;

[0024] Figure 2 Schematic exploded view of the deposition and polishing device provided by an embodiment of the present utility model;

[0025] Figure 3 Schematic view of the structure of the cleaning head of the deposition and polishing device provided by an embodiment of the present utility model;

[0026] Figure 4 Schematic view of the structure of the cleaning table of the deposition and polishing device provided by an embodiment of the present utility model from a first perspective;

[0027] Figure 5 Schematic view of the structure of the cleaning table of the deposition and polishing device provided by an embodiment of the present utility model from a second perspective;

[0028] Figure 6 Schematic view of the structure of the housing of the deposition and polishing device provided by an embodiment of the present utility model.

[0029] Reference numerals: 100 - deposition and polishing device; 110 - housing; 111 - accommodating groove; 112 - sewage discharge hole; 113 - fixing hole; 120 - cleaning table; 121 - mounting plate; 122 - annular side plate; 123 - diversion hole; 124 - mounting groove; 125 - second fixed shaft; 130 - cleaning head; 131 - first fixed shaft; 132 - grinding part. Detailed implementation manners

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Generally, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0032] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0033] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is habitually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0034] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0035] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0036] In the deposition process, by-products of gas reactions will be generated in the reaction chamber. Currently, the common practice is to use a suction pump to discharge the by-products generated in the reaction chamber, so that the film deposited on the surface of the wafer has better uniformity and improves the film deposition quality.

[0037] However, it is very difficult for the existing suction devices to discharge the gas in a timely and uniform manner. When there are too many by-products in the chamber or the gas flow rates are inconsistent, by-products are likely to be deposited on the side walls of the chamber. For the deposited by-products, chemical agents and sandpaper polishing are usually required to remove them during machine maintenance. Currently, manual cleaning methods are commonly used. For deeper chamber structures, it is difficult to clean the by-products at the bottom and side walls, and it is easy to have the phenomenon of incomplete cleaning.

[0038] In order to overcome at least one defect existing in the prior art, the present application proposes a deposition and polishing device, which is beneficial to improving the cleaning efficiency and cleaning effect of the side walls of the reaction chamber.

[0039] Please refer to Figure 1 and Figure 2, this embodiment provides a deposition and polishing device 100, which includes a housing 110, a cleaning table 120, and a cleaning head 130. The housing 110 is provided with a receiving groove 111; a sewage discharge hole 112 is provided in the receiving groove 111. The cleaning table 120 is arranged in the receiving groove 111 and is fixedly connected to the housing 110; a diversion hole 123 is provided on the cleaning table 120, and the diversion hole 123 communicates with the sewage discharge hole 112. The cleaning head 130 is installed on the cleaning table 120. The cleaning head 130 is installed on the cleaning table 120, and the inner wall of the reaction chamber is polished by using the cleaning head 130, which can improve the cleaning efficiency and cleaning effect, and the cleaning is more thorough. It is beneficial to improve the cleaning efficiency and cleaning effect of the side wall of the reaction chamber.

[0040] Combined with Figure 3 , the cleaning head 130 includes a first fixed shaft 131 and an abrasive part 132 connected to the first fixed shaft 131. One end of the first fixed shaft 131 away from the abrasive part 132 is fixedly connected to the cleaning table 120. Optionally, the abrasive part 132 is set to a hemispherical shape. The hemispherical abrasive part 132 can play a good role in polishing. While achieving cleaning, it can reduce the damage and injury to the inner wall of the cavity.

[0041] Of course, in some other embodiments, the abrasive part 132 can be set to an ellipsoidal shape, a cylindrical shape, a frustum shape or other shapes, which are not specifically limited here.

[0042] In this embodiment, there are multiple cleaning heads 130, and the multiple cleaning heads 130 are arranged at intervals. Optionally, the number of cleaning heads 130 is four. Each cleaning head 130 includes a first fixed shaft 131 and a hemispherical abrasive part 132. It is easy to understand that among the multiple cleaning heads 130, the lengths of the multiple first fixed shafts 131 can be equal or unequal, which are not specifically limited here. The number, distribution method of the cleaning heads 130 and the shape of the abrasive part 132 can be flexibly set according to actual needs.

[0043] Combined with Figures 4 to 6 , optionally, the cleaning table 120 is provided with an installation groove 124, and the first fixed shaft 131 is in plug-in fit with the installation groove 124. The number of installation grooves 124 is equal to the number of cleaning heads 130. The positions of the installation grooves 124 and the cleaning heads 130 are arranged in one-to-one correspondence. The cross-sectional shape of the installation groove 124 is the same as the cross-sectional shape of the first fixed shaft 131. The first fixed shaft 131 is fixed in the installation groove 124. It should be noted that the first fixed shaft 131 and the installation groove 124 can be in plug-in fit, or can be in snap fit, or can be in bonding, welding, screw connection, riveting or magnetic attraction fixing, etc.

[0044] Optionally, a second fixed shaft 125 is provided on a side of the cleaning table 120 away from the cleaning head 130, and the second fixed shaft 125 is fixedly connected to the housing 110. In this embodiment, the second fixed shaft 125 is fixedly connected to the middle of the cleaning table 120. The second fixed shaft 125 is used to fix the cleaning table 120 on the housing 110.

[0045] Optionally, a fixing hole 113 is provided at the bottom of the accommodation groove 111, and the second fixed shaft 125 is disposed in the fixing hole 113. The cross-sectional shape of the fixing hole 113 is the same as that of the second fixed shaft 125. The fixing hole 113 and the second fixed shaft 125 can be fixedly connected by means of snap connection, plug connection, screw connection, bonding or welding.

[0046] Optionally, the cleaning table 120 includes a mounting plate 121 and an annular side plate 122 protruding from the outer periphery of the mounting plate 121. The mounting plate 121 is connected to the cleaning head 130; the annular side plate 122 is sleeved on the housing 110. The annular side plate 122 and the mounting plate 121 can be integrally formed or separately connected. An installation groove 124 for installing the first fixed shaft 131 is provided on the mounting plate 121. A diversion hole 123 penetrating the mounting plate 121 is also provided on the mounting plate 121. Optionally, the diversion holes 123 are evenly distributed in the area of the mounting plate 121 other than the installation groove 124. The annular side plate 122 is connected to a side of the mounting plate 121 away from the cleaning head 130.

[0047] Optionally, the mounting plate 121 covers the accommodation groove 111 of the housing 110, and the annular side plate 122 is sleeved on the outer peripheral surface of the housing 110, that is, the inner peripheral surface of the annular side plate 122 is attached to the outer peripheral surface of the housing 110. The mounting plate 121, the annular side plate 122 and the housing 110 enclose a sewage cavity, and the diversion hole 123 and the sewage hole 112 are respectively communicated with the sewage cavity. The sewage hole 112 is used to connect a vacuum pipeline for sucking and discharging the dirt washed off by the grinding part 132.

[0048] It should be noted that in some embodiments, the annular side plate 122 can also be disposed in the accommodation groove 111 of the housing 110, that is, the outer peripheral surface of the annular side plate 122 is attached to the inner peripheral surface of the accommodation groove 111. This also has a similar technical effect.

[0049] Optionally, the annular side plate 122 and the housing 110 are hermetically connected. That is, the inner peripheral surface of the annular side plate 122 is closely attached to the outer peripheral surface of the housing 110. Or, the outer peripheral surface of the annular side plate 122 is closely attached to the inner peripheral surface of the accommodation groove 111. In this way, it is beneficial for the cleaning table 120 and the housing 110 to form a sealed cavity, so that the vacuum pipeline can discharge the dirt more thoroughly and efficiently.

[0050] An embodiment of the present utility model further provides a cleaning device, which includes a driving member and a deposition and polishing device 100 as described in any one of the foregoing embodiments. The driving member is in transmission connection with the housing 110. The driving member is used to drive the housing 110 to rotate or reciprocate, so as to drive the cleaning head 130 on the housing 110 to rotate or reciprocate, thereby realizing the grinding and cleaning of the inner wall of the reaction chamber. Optionally, the driving member may include, but is not limited to, a motor or an electric motor.

[0051] Optionally, the cleaning device further includes an air extraction pump and a vacuum pipeline. One end of the vacuum pipeline is connected to the air extraction pump, and the other end is communicated with the sewage discharge hole 112 of the housing 110.

[0052] The working principle of the deposition and polishing device 100 provided by the embodiment of the present utility model is as follows:

[0053] The deposition and polishing device 100 provided by the embodiment of the present utility model can be used to clean the inner wall of the cavity of the reaction chamber of a deposition device. It includes effectively cleaning the side wall and the bottom wall of the reaction chamber, reducing the by-products attached to the inner wall of the reaction chamber, thereby being beneficial to improving the film deposition quality and uniformity.

[0054] The driving member can drive the housing 110 to rotate, and the cleaning head 130 will rotate along with it, thereby realizing the grinding and polishing of the inner wall of the reaction chamber and removing the by-products deposited on the inner wall. The by-product dirt falling off after removal is sucked away through the air extraction pipeline and discharged. The cleaning efficiency is high and the cleaning is more thorough.

[0055] Of course, in some embodiments, manual removal can also be adopted, that is, manually holding the housing 110 and driving the housing 110 to rotate or move to realize the cleaning of the inner wall of the reaction chamber.

[0056] In summary, the deposition and polishing device 100 and the cleaning device provided by the embodiment of the present utility model have the following beneficial effects, including:

[0057] In the deposition and polishing device 100 provided by the embodiment of the present utility model, a cleaning head 130 is installed on the cleaning table 120, and the inner wall of the reaction chamber is ground and polished by using the cleaning head 130, which can improve the cleaning efficiency and cleaning effect, and the cleaning is more thorough.

[0058] The cleaning device provided by the embodiment of the present utility model includes the above-mentioned deposition and polishing device 100, and uses a driving member to drive the housing 110 to rotate, thereby realizing the grinding and polishing of the inner wall of the reaction chamber by the cleaning head 130. The cleaning efficiency is high and the cleaning is more thorough.

[0059] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A deposition polishing device, characterized in that: include: A shell, wherein the shell is provided with a receiving groove; a drainage hole is provided in the receiving groove; A cleaning table, the cleaning table is arranged in the containing groove and fixedly connected to the shell; a guide hole is arranged on the cleaning table, and the guide hole is connected to the sewage discharge hole; A cleaning head is mounted on the cleaning table.

2. The deposition polishing device according to claim 1, characterized in that: The cleaning head comprises a first fixed shaft and a grinding portion connected to the first fixed shaft, and one end of the first fixed shaft away from the grinding portion is fixedly connected to the cleaning table.

3. The deposition polishing device according to claim 2, characterized in that: The cleaning table is provided with a mounting groove, and the first fixed shaft is plug-fitted with the mounting groove.

4. The deposition polishing device according to claim 2, characterized in that: The grinding part is configured in a hemispherical shape.

5. The deposition polishing device according to claim 3, characterized in that: A second fixed shaft is provided on a side of the cleaning platform away from the cleaning head, and the second fixed shaft is fixedly connected to the shell.

6. The deposition polishing device according to claim 5, characterized in that: A fixing hole is provided at the bottom of the accommodating groove, and the second fixing shaft is arranged in the fixing hole.

7. The deposition polishing device according to claim 1, characterized in that: The cleaning table comprises a mounting plate and an annular side plate protruding from the outer periphery of the mounting plate, wherein the mounting plate is connected to the cleaning head; and the annular side plate is sleeved on the shell.

8. The deposition polishing device according to claim 7, characterized in that: The mounting plate cover is arranged on the accommodating groove of the shell, the mounting plate, the annular side plate and the shell are enclosed to form a sewage discharge cavity, and the guide hole and the sewage discharge hole are respectively communicated with the sewage discharge cavity.

9. The deposition polishing device according to claim 7, characterized in that: The annular side plate is sealed and connected to the housing.

10. A cleaning device, characterized in that: It comprises a driving member and the deposition polishing device as claimed in any one of claims 1 to 9, wherein the driving member is in driving connection with the housing.

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