Flux paste cooling device
By designing a solder paste cooling device including fixed pillars, connecting brackets, cooling support plates, fence components and heat dissipation fins, the problems of insufficient cooling of traditional devices and easy deviation of welding materials are solved, and a more comprehensive cooling effect is achieved.
Patent Information
- Application Number
- CN202422176172.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-09-05
AI Technical Summary
It is difficult for traditional welding paste cooling devices to enclose welding materials according to needs, resulting in welding materials being easily deviated or dropped due to collision during cooling, affecting the cooling effect, and the cooling range is relatively limited, making it difficult to achieve comprehensive cooling.
A solder paste cooling device is designed, including a base, fixed pillar, connecting bracket, cooling support plate, fence assembly and heat sink fins. The fence assembly can provide enclosure to the cooling support plates when needed, and the adjustment assembly can adjust the position of the cooling assembly and expand the cooling range.
This device can effectively prevent welding objects from being offset or falling due to collision during cooling, ensure cooling effect, and make solder paste more comprehensive cooling through flexible cooling structure and wide cooling range.
Smart Images

Figure CN222999827U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of soldering paste, in particular to a soldering paste cooling device. Background Technique
[0002] Soldering paste is a substance used to assist in the soldering of electronic components. It is usually a mixture of metal powders (such as tin powder or lead-tin alloy powder) and a combustible organic compound (such as rosin or other resins). In the process of electronic manufacturing, soldering paste is applied to the pads or other metal surfaces on the circuit board to promote the wetting effect during the soldering process, improve the soldering quality and efficiency. Soldering paste needs to be stored refrigerated before use to prevent changes in its chemical composition. After being applied to the circuit board, it is melted by heating (usually through the reflow soldering process) to melt the metal powder, so that the metal powder forms a good connection with the surface of the circuit board and other electronic components. Selecting the appropriate soldering paste is crucial for ensuring the reliability and performance of electronic products.
[0003] After assisting in soldering, the soldering paste needs to be cooled, so a cooling device is required. Although the traditional cooling device has a certain cooling capacity, it still has some deficiencies. For example, it is difficult to enclose the soldered object according to requirements, so it is easy for the soldered object to be displaced or dropped due to collision during the cooling process, thus affecting its cooling effect. In addition, its cooling structure is relatively fixed, so its cooling range is also relatively limited, making it difficult to cool the soldering paste more comprehensively. Therefore, a soldering paste cooling device is proposed to solve the above problems. Content of the Utility Model
[0004] The purpose of the utility model is to provide a soldering paste cooling device, which can enclose the soldered object according to requirements, so it is not easy for the soldered object to be displaced or dropped due to collision during the cooling process, thus ensuring its cooling effect. In addition, its cooling structure is relatively flexible, so its cooling range is relatively wide, enabling the soldering paste to be cooled more comprehensively, so as to solve the problems raised in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] A solder paste cooling device comprises a base, wherein the four corners of the top of the base are fixedly connected with fixed pillars, the tops of the fixed pillars are fixedly connected with connecting brackets, cooling support plates are arranged between the connecting brackets, the left and right ends of the front wall and the rear wall of the cooling support plate are connected to the connecting brackets by connecting bolts, a retaining assembly is arranged above the cooling support plate, a plurality of groups of heat dissipation fins are arranged at equal intervals and fixedly connected at the bottom of the cooling support plate, a bottom plate is fixedly connected at the top center of the base, an adjustment assembly is arranged on the bottom plate, and a cooling assembly is arranged above the adjustment assembly.
[0007] Preferably, the enclosure assembly includes positioning rods fixedly connected to the four sides of the top wall of the cooling support plate and an enclosure support plate arranged above the positioning rods, and the bottom wall of the enclosure support plate is provided with positioning holes arranged at equal intervals, and the positioning holes and the positioning rods are equal in number, corresponding in position, and have matching specifications.
[0008] Preferably, the adjustment assembly includes a vertical plate fixedly connected to the rear side of the top of the base plate, a driving motor is fixedly connected to the center of the rear wall of the vertical plate, an output end of the driving motor passes through the vertical plate and a half gear is fixedly connected to this end.
[0009] Preferably, an adjustment frame with front and rear opening structures is provided on the front side of the vertical plate, and the adjustment frame is sleeved on the outside of the half gear. The inner top wall and the inner bottom wall of the adjustment frame are provided with convex teeth corresponding to the position of the half gear and matching the specifications.
[0010] Preferably, a movable groove is provided at the center of the inner cavity of the bottom plate, a movable support rod is fixedly connected at the center of the bottom wall of the adjustment frame, a movable support block is fixedly connected to the bottom end of the movable support rod, the movable support block extends into the movable groove and the adjustment frame is slidably connected to the movable groove through the movable support rod and the movable support block.
[0011] Preferably, the cooling assembly includes a cooling box, a connecting pillar is fixedly connected at the bottom center of the cooling box and the cooling box is fixedly connected to the top center of the adjustment frame through the connecting pillar, a cooling fan is provided in the inner cavity of the cooling box and dust nets are provided on the top and bottom walls of the cooling box.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] In the present utility model, the fixed struts provided can fixedly support the cooling support plate through the connecting brackets. The connecting brackets provided can be connected to the cooling support plate through connecting bolts, and the cooling support plate can be freely disassembled and assembled through the connecting bolts, thus facilitating the maintenance of the cooling support plate. The enclosure assembly provided can provide good enclosure ability for the cooling support plate when needed. Therefore, it is not easy for the welding objects placed on the cooling support plate to be displaced or dropped due to collision during the cooling process, thereby ensuring its cooling effect. The heat dissipation fins provided can quickly absorb the heat on the welding objects through the cooling support plate, so that the soldering paste can be quickly cooled. The bottom plate provided can support the adjusting assembly. The adjusting assembly provided can regularly and reciprocally adjust the position of the cooling assembly. Therefore, the cooling range of the cooling assembly can be made wider, so that the soldering paste can be cooled more comprehensively. The cooling assembly provided can cool the heat dissipation fins, that is, quickly cool the soldering paste at the same time. Description of the Drawings
[0014] Figure 1 is the front view of the present utility model;
[0015] Figure 2 is the structural schematic diagram of the present utility model;
[0016] Figure 3 is the front view of the enclosure assembly of the present utility model;
[0017] Figure 4 is the exploded structural schematic diagram of the enclosure assembly of the present utility model;
[0018] Figure 5 is the upward view of the enclosure assembly of the present utility model;
[0019] Figure 6 is the structural schematic diagram of the adjusting assembly and the cooling assembly of the present utility model;
[0020] Figure 7 is the side view of the adjusting assembly and the cooling assembly of the present utility model.
[0021] In the figure: 1, base; 2, fixed strut; 3, connecting bracket; 4, cooling support plate; 5, connecting bolt; 6, enclosure assembly; 601, positioning insertion rod; 602, enclosure support plate; 603, positioning insertion hole; 7, heat dissipation fin; 8, bottom plate; 9, adjusting assembly; 901, vertical plate; 902, driving motor; 903, half gear; 904, adjusting frame; 905, convex tooth; 906, moving groove; 907, moving support rod; 908, moving support block; 10, cooling assembly; 1001, cooling box; 1002, connecting strut; 1003, cooling fan; 1004, dust-proof net. Detailed Embodiment
[0022] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part rather than all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0023] In the description of the present utility model, it should be understood that the orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom", etc. usually indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the protection scope of the present utility model; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.
[0024] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without otherwise stating, these terms have no special meaning. Therefore, they should not be construed as limiting the protection scope of the present utility model.
[0025] Please refer to Figure 1-7 , the present utility model provides a technical solution:
[0026] A solder paste cooling device includes a base 1. Fixed columns 2 are fixedly connected to the four corners of the top of the base 1. A connecting bracket 3 is fixedly connected to the top of the fixed columns 2. A cooling support plate 4 is arranged between the connecting brackets 3. The left and right ends of the front wall and the rear wall of the cooling support plate 4 are connected to the connecting brackets 3 through connecting bolts 5. A surrounding component 6 is arranged above the cooling support plate 4. A plurality of heat dissipation fins 7 are arranged at equal intervals and fixedly connected to the bottom of the cooling support plate 4. A bottom plate 8 is fixedly connected to the center of the top of the base 1. An adjusting component 9 is arranged on the bottom plate 8. A cooling component 10 is arranged above the adjusting component 9.
[0027] The enclosure component 6 includes positioning insertion rods 601 fixedly connected to the four sides of the top wall of the cooling support plate 4, and an enclosure support plate 602 arranged above the positioning insertion rods 601. Positioning insertion holes 603 are arranged at equal intervals on the bottom wall of the enclosure support plate 602. The positioning insertion holes 603 and the positioning insertion rods 601 are set with equal numbers, corresponding positions, and matching specifications. The enclosure component 6 can provide good enclosure ability for the cooling support plate 4 when needed. Therefore, it is not easy for the welded object placed on the cooling support plate 4 to shift or fall due to collision during the cooling process, thus ensuring its cooling effect; The adjustment component 9 includes a vertical plate 901 fixedly connected to the rear side of the top of the bottom plate 8. A driving motor 902 is fixedly connected to the center of the rear wall of the vertical plate 901. The output end of the driving motor 902 penetrates the vertical plate 901 and a half gear 903 is fixedly connected to this end. An adjustment frame 904 with an open structure in the front and rear is arranged on the front side of the vertical plate 901. The adjustment frame 904 is sleeved outside the half gear 903. Convex teeth 905 corresponding to the position of the half gear 903 and matching specifications are arranged on both the inner top wall and the inner bottom wall of the adjustment frame 904. A moving groove 906 is arranged at the center of the inner cavity of the bottom plate 8. A moving support rod 907 is fixedly connected to the center of the bottom wall of the adjustment frame 904. A moving support block 908 is fixedly connected to the bottom end of the moving support rod 907. The moving support block 908 extends into the moving groove 906 and the adjustment frame 904 is slidably connected to the moving groove 906 through the moving support rod 907 and the moving support block 908. The adjustment component 9 can regularly reciprocally adjust the position of the cooling component 10. Therefore, the cooling range of the cooling component 10 can be made wider, so that the soldering paste can be cooled more comprehensively; The cooling component 10 includes a cooling box 1001. A connecting support column 1002 is fixedly connected to the center of the bottom of the cooling box 1001, and the cooling box 1001 is fixedly connected to the center of the top of the adjustment frame 904 through the connecting support column 1002. A cooling fan 1003 is arranged in the inner cavity of the cooling box 1001, and dust-proof nets 1004 are arranged on both the top wall and the bottom wall of the cooling box 1001. The cooling component 10 can cool the heat dissipation fins 7, that is, cool the soldering paste quickly at the same time.
[0028] Workflow: First, all electrical appliances are powered on. The fixed support column 2 can fixedly support the cooling support plate 4 through the connecting bracket 3. The connecting bracket 3 can be connected to the cooling support plate 4 through the connecting bolt 5 and can freely disassemble and assemble the cooling support plate 4 through the connecting bolt 5, facilitating the maintenance of the cooling support plate 4. The enclosure assembly 6 can provide good enclosure ability for the cooling support plate 4 when needed. Therefore, it is not easy for the welded objects placed on the cooling support plate 4 to shift or fall due to collision during the cooling process, ensuring its cooling effect. When enclosure is needed, just set the positioning jack 603 at the bottom of the enclosure support plate 602 on the positioning rod 601 for positioning. The disassembly is the same. The cooling support plate 4 is made of aluminum or copper. Therefore, the heat dissipation fins 7 can quickly absorb the heat on the welded objects through the material characteristics of the cooling support plate 4, enabling the soldering paste to cool quickly. The bottom plate 8 can support the adjustment assembly 9. The adjustment assembly 9 can regularly and reciprocally adjust the position of the cooling assembly 10. Therefore, the cooling range of the cooling assembly 10 can be made wider, enabling the soldering paste to be cooled more comprehensively. Start the driving motor 902. The driving motor 902 drives the semi-gear 903 to rotate through its output end. When the gear of the semi-gear 903 rotates to the upper convex tooth 905, it will push the adjustment frame 904 to move leftward through meshing. When the gear of the semi-gear 903 rotates to the lower convex tooth 905, it will push the adjustment frame 904 to move rightward through meshing, thereby driving the cooling assembly 10 to move simultaneously through the connecting support column 1002. When the adjustment frame 904 moves, it slides in the moving groove 906 through the moving rod 907 and the moving block 908. The cooling fan 1003 in the cooling assembly 10 can cool the heat dissipation fins 7, that is, cool the soldering paste quickly at the same time. The dust-proof net 1004 can block impurities in the air to prevent them from entering the cooling box 1001 and affecting the cooling fan 1003.
[0029] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art. The standard parts used in this utility model can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machines, parts, and equipment all adopt conventional models in the prior art. Coupled with the circuit connection adopting the conventional connection method in the prior art, it will not be elaborated here.
[0030] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A solder paste cooling device, comprising a base (1), characterized in that: The four corners of the top of the base (1) are fixedly connected to fixed pillars (2), the top of the fixed pillars (2) is fixedly connected to a connecting bracket (3), a cooling support plate (4) is provided between the connecting brackets (3), the left and right ends of the front wall and the rear wall of the cooling support plate (4) are connected to the connecting bracket (3) by connecting bolts (5), a retaining assembly (6) is provided above the cooling support plate (4), a plurality of groups of heat dissipation fins (7) are arranged at equal intervals and fixedly connected at the bottom of the cooling support plate (4), a bottom plate (8) is fixedly connected to the center of the top of the base (1), an adjustment assembly (9) is provided on the bottom plate (8), and a cooling assembly (10) is provided above the adjustment assembly (9).
2. A solder paste cooling device according to claim 1, characterized in that: The enclosure assembly (6) comprises positioning rods (601) fixedly connected to the four sides of the top wall of the cooling support plate (4) and an enclosure support plate (602) arranged above the positioning rods (601), and the bottom wall of the enclosure support plate (602) is provided with positioning holes (603) arranged at equal intervals, and the positioning holes (603) and the positioning rods (601) are arranged in equal number, corresponding positions and matching specifications.
3. The solder paste cooling device according to claim 1, characterized in that: The adjustment assembly (9) comprises a vertical plate (901) fixedly connected to the rear side of the top of the bottom plate (8), a driving motor (902) fixedly connected to the center of the rear wall of the vertical plate (901), an output end of the driving motor (902) passing through the vertical plate (901) and a half gear (903) fixedly connected to the output end.
4. A solder paste cooling device according to claim 3, characterized in that: The front side of the vertical plate (901) is provided with an adjustment frame (904) with front and rear opening structures, the adjustment frame (904) is sleeved on the outside of the half gear (903), and the inner top wall and inner bottom wall of the adjustment frame (904) are both provided with convex teeth (905) corresponding to the position of the half gear (903) and matching the specifications.
5. A solder paste cooling device according to claim 4, characterized in that: A movable groove (906) is provided at the center of the inner cavity of the bottom plate (8); a movable support rod (907) is fixedly connected to the center of the bottom wall of the adjustment frame (904); a movable support block (908) is fixedly connected to the bottom end of the movable support rod (907); the movable support block (908) extends into the movable groove (906); and the adjustment frame (904) is slidably connected to the movable groove (906) via the movable support rod (907) and the movable support block (908).
6. A solder paste cooling device according to claim 4, characterized in that: The cooling assembly (10) comprises a cooling box (1001), a connecting pillar (1002) is fixedly connected to the center of the bottom of the cooling box (1001), and the cooling box (1001) is fixedly connected to the center of the top of the adjustment frame (904) via the connecting pillar (1002), a cooling fan (1003) is provided in the inner cavity of the cooling box (1001), and a dustproof net (1004) is provided on the top wall and the bottom wall of the cooling box (1001).