Laser cutting device for chip glass substrate

Abstract

The utility model relates to the technical field of chip glass substrate processing, in particular to a chip glass substrate laser cutting device which comprises a feeding mechanism, a laser cutting head, a dust removal mechanism, a glass fixing table, an air pump, a negative pressure pump and a glass chip, dust and harmful gas processing mechanism. A shell of the dust removal mechanism is hollow to form a shell inner cavity and a dust removal inner cavity formed by wrapping the whole shell, a plurality of air holes which are annularly and evenly distributed are formed in the lower end of the shell inner cavity, and a first sealing connector communicated with the shell inner cavity and a second sealing connector communicated with the dust removal inner cavity are formed in the upper end face of the dust removal mechanism. The first sealing connector is communicated with an air pump through a first hose, and the second sealing connector is communicated with a negative pressure pump through a second hose. And the dust removal mechanism can better remove thinner glass fragments attached to the glass substrate, and dust and harmful gas can be effectively treated.

Description

Technical Field

[0001] The utility model relates to the technical field of chip glass substrate processing, and specifically relates to a laser cutting device for chip glass substrates. Background Technique

[0002] During the laser cutting process of chip glass substrates, glass chips, dust, and harmful gases are generated. Glass chips, dust, and harmful gases not only reduce the surface quality of the glass substrate but also seriously damage the health of producers. There are many improvement solutions in the prior art for these aspects. A Chinese utility model patent with an application date of August 2, 2023, an authorization announcement date of April 9, 2024, and an authorization announcement number of CN220745709 U proposed a laser cutting device for glass production. During the glass cutting process, it absorbs and removes glass chips, dust, and harmful gases on the glass plate through a horn-shaped dust removal mechanism connected to a negative pressure pump, and finally separates the glass chips and gas through a filter screen installed in the collection box. First, the horn-shaped dust removal mechanism in this utility model patent has a poor effect on sucking thin glass chips attached to the glass substrate. In addition, this patent only solves the separation of glass chips from dust and harmful gases and does not treat dust and harmful gases. Therefore, a laser cutting device for chip glass substrates is proposed to solve the above problems. Content of the Utility Model

[0003] The purpose of the utility model is to provide a more thorough glass chip removal and glass chip, dust, and harmful gas separation and treatment device to solve the problems raised in the above background technique.

[0004] To achieve the above object, the utility model provides the following technical solutions: A laser cutting device for a chip glass substrate, including columns. There are four columns in total. A connecting frame one is fixedly connected to the top surface of the columns. A Y-axis feeding mechanism is fixedly installed on the connecting frame one. A connecting frame two is fixedly installed on the Y-axis feeding mechanism. An X-axis feeding mechanism is fixedly installed on the connecting frame two. A Z-axis feeding mechanism is fixedly installed on the side of the X-axis feeding mechanism. A laser cutting head and a dust removal mechanism are fixedly connected to the side of the Z-axis feeding mechanism opposite to the X-axis feeding mechanism. The dust removal mechanism is in the shape of a flared horn with a closed mouth. The laser emitter of the laser cutting head is located inside the dust removal mechanism. The laser cutting head is fixedly installed inside the dust removal mechanism through a connecting column. And the horizontal lowest point of the dust removal mechanism is higher than the horizontal lowest point of the laser cutting head. The glass substrate is directly below the laser cutting head. The glass substrate is fixed by a glass fixing table. The glass fixing table is horizontally fixedly installed with the columns. An air pump, a negative pressure pump, and a glass chip, dust, and harmful gas treatment device are fixedly installed in a row on the table surface of the glass fixing table extending out of the columns. The dust removal mechanism includes an upper part of the dust removal mechanism and a lower part of the dust removal mechanism. The outer shell of the dust removal mechanism is hollow to form an outer shell inner cavity and a dust removal inner cavity formed by wrapping the entire outer shell. A plurality of air holes evenly distributed in a ring shape are opened at the lower end of the outer shell inner cavity. A sealing interface one communicating with the outer shell inner cavity and a sealing interface two communicating with the dust removal inner cavity are provided on the upper end surface of the dust removal mechanism. The sealing interface one is communicated with the air pump through a hose one. The sealing interface two is communicated with the negative pressure pump through a hose two.

[0005] Preferably, the laser cutting head is located on the axial center line of the dust removal mechanism.

[0006] Preferably, the lower part of the dust removal mechanism is a bendable and shapeable snake-shaped tube.

[0007] Preferably, the glass chip, dust, and harmful gas treatment device includes a sedimentation mechanism, an absorption mechanism, and a pipeline two connecting the sedimentation mechanism and the absorption mechanism.

[0008] Preferably, the sedimentation mechanism includes a sedimentation mechanism frame body, a partition board, an air inlet one, and an air outlet one. The air inlet one and the air outlet one are respectively arranged on the opposite side surfaces of the sedimentation mechanism frame body. The air inlet one is communicated with the exhaust hole of the negative pressure pump through a pipeline three. The air outlet one is hermetically connected to the pipeline two. The sedimentation mechanism frame body forms a closed sedimentation chamber. At least two partition boards are fixedly installed on the inner side surface of the sedimentation mechanism frame body at equal intervals and adjacent two partition boards are fixedly installed on the opposite inner side surfaces. There is a gap only between the partition board and the inner side surface of the sedimentation mechanism frame body opposite to the installation surface.

[0009] Preferably, the absorption mechanism comprises an absorption mechanism frame, an activated carbon plate, an air inlet 2 and an exhaust port 2, wherein the air inlet 2 and the exhaust port 2 are respectively arranged on opposite sides of the absorption mechanism frame, the air inlet 2 is sealed and connected to the sedimentation mechanism through a pipe 2, the absorption mechanism frame constitutes a closed sedimentation chamber, at least two activated carbon plates are fixedly installed on the inner side surface of the absorption mechanism frame at equal distances and two adjacent activated carbon plates are fixedly installed on opposite inner side surfaces, and a gap is left between the activated carbon plate and the inner side surface of the absorption mechanism frame opposite to the installation surface only.

[0010] Preferably, a filter is fixedly installed at an exhaust port inside the sedimentation mechanism.

[0011] Preferably, a two-position three-way solenoid valve is installed in the middle part of pipeline two, the air outlet of the two-position three-way solenoid valve is connected to the sedimentation mechanism, the exhaust port of the two-position three-way solenoid valve is connected to the absorption mechanism, and the air inlet of the two-position three-way solenoid valve is connected to the air pump through pipeline one.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The high-speed airflow blown out from the evenly distributed annular air holes at the lower end of the inner cavity of the shell can blow the thinner glass debris attached to the glass substrate away from the surface of the glass substrate and then be sucked and removed by the low-pressure airflow in the dust removal cavity.

[0014] 2. The baffle plate arranged in the sedimentation mechanism and the sedimentation mechanism frame form a tortuous air flow channel so that the glass chips can be deposited in the sedimentation mechanism and separated from dust and harmful gases.

[0015] 3. The tortuous air flow channel formed by the activated carbon plate arranged in the absorption mechanism and the absorption mechanism frame enables dust and harmful gases to be fully absorbed by the activated carbon. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a top view of the dust removal mechanism;

[0018] Figure 3 It is a cross-sectional view of the dust removal mechanism;

[0019] Figure 4 This is a bottom view when the lower part of the dust removal mechanism is perpendicular to the horizontal plane;

[0020] Figure 5 This is a cross-sectional view of the mechanism for handling glass fragments, dust and harmful gases.

[0021] In the figure: Z-axis feeding mechanism 1, X-axis feeding mechanism 2, Y-axis feeding mechanism 3, glass substrate 4, glass fixing table 5, air pump 6, negative pressure pump 7, glass chip, dust and harmful gas treatment device 8, hose one 9, hose two 10, dust removal mechanism 11, laser cutting head 12, pipe three 13, connecting frame one 14, connecting frame two 15, column 16, sealing interface one 111, sealing interface two 112, upper part of dust removal mechanism 115, lower part of dust removal mechanism 116, air hole 117, air inlet one 80, sedimentation mechanism 801, sedimentation mechanism frame 81, partition board 82, filter screen 83, exhaust port one 803, two-position three-way solenoid valve 84, pipe one 85, pipe two 86, absorption mechanism 802, absorption mechanism frame 87, activated carbon plate 88, exhaust port two 89, exhaust port one 803, air inlet two 804. Detailed implementation manner

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts belong to the protection scope of the present invention.

[0023] Please refer to Figures 1 to 5, the present utility model provides a technical solution: a laser cutting device for a chip glass substrate, including four columns 16. A connecting frame one 14 is fixedly connected to the top surface of the columns 16. A Y-axis feeding mechanism 3 is fixedly installed on the connecting frame one 14. An X-axis feeding mechanism 2 is fixedly installed on the connecting frame two 15. A Z-axis feeding mechanism 1 is fixedly installed on the side of the X-axis feeding mechanism 2. A laser cutting head 12 and a dust removal mechanism 11 are fixedly connected to the side of the Z-axis feeding mechanism 1 opposite to the X-axis feeding mechanism 2. The dust removal mechanism 11 is shaped like a flared trumpet with a closed mouth. The laser emitter of the laser cutting head 12 is located inside the dust removal mechanism 11. The laser cutting head 12 is fixedly installed inside the dust removal mechanism 11 through a connecting column. In order to prevent the dust removal mechanism 11 from scratching the glass substrate 4 during the working process, the lowest horizontal point of the dust removal mechanism 11 is installed higher than the lowest horizontal point of the laser cutting head 12. The glass substrate 4 is located directly below the laser cutting head 12. The glass substrate 4 is fixed by a glass fixing table 5. The glass fixing table 5 is horizontally and fixedly installed on the side of the column 16. The glass fixing table 5 in this application can be selected to use a vacuum chuck. An air pump 6, a negative pressure pump 7, and a glass chip, dust, and harmful gas treatment device 8 are fixedly installed in an array on the table surface of the glass fixing table 5 extending out of the column 16. The X-axis feeding mechanism 2, Y-axis feeding mechanism 3, Z-axis feeding mechanism 1, laser cutting head 12, the laser emitter of the laser cutting head 12, and the glass fixing table 5 in this application are prior arts well-known to those of ordinary skill in the art and are also conventional structures of laser cutting equipment. For example, the feeding mechanisms in all directions can be the prior art of a servo motor controlling the movement of a screw, or the above structures in the comparative document mentioned in the background art can be adopted, which will not be elaborated here. The dust removal mechanism 11 includes an upper part 115 of the dust removal mechanism and a lower part 116 of the dust removal mechanism. The material of the upper part 115 of the dust removal mechanism is selected from the commonly used metal materials in industrial machinery, which is convenient for its fixed installation on the side of the Z-axis feeding mechanism 1. The outer shell of the dust removal mechanism 11 is hollow to form an outer shell inner cavity 113 and a dust removal inner cavity 114 formed by the entire outer shell wrapping. A plurality of air holes 117 are evenly distributed in a ring shape at the lower end of the outer shell inner cavity 113, so that during operation, the ring-shaped distributed air holes 117 always have a suitable angle and orientation to blow the thinner glass chips attached to the glass substrate 4. A sealing interface one 111 communicating with the outer shell inner cavity 113 and a sealing interface two 112 communicating with the dust removal inner cavity 114 are provided on the upper end surface of the dust removal mechanism 11. The sealing interface one 111 is connected to the air pump 6 through a hose one 9, and the sealing interface two 112 is connected to the negative pressure pump 7 through a hose two 10. That is to say, the high-speed air flow generated by the air pump 6 can enter the outer shell inner cavity 113 through the sealing interface one 111 and then be ejected through the air holes 117 to blow the thinner glass chips attached to the surface of the glass substrate 4. At this time, since the dust removal inner cavity 114 is connected to the negative pressure pump through the sealing interface two 112, the dust removal inner cavity 114 is also in a negative pressure state, and then the thinner glass chips that have been blown on the surface of the glass substrate 4 are sucked and removed.

[0024] The laser cutting head 12 is fixedly installed on the axial center line of the dust removal mechanism 11.

[0025] The lower part 116 of the dust removal mechanism is a shape - settable and bendable snake - shaped pipe, so as to facilitate adjusting the direction of the high - speed air flow blown out from the air holes 117.

[0026] The glass chips, dust and harmful gas treatment device 8 includes a sedimentation mechanism 801, an absorption mechanism 802, and a second pipeline 86 connecting the sedimentation mechanism 801 and the absorption mechanism 802.

[0027] The sedimentation mechanism 801 includes a sedimentation mechanism housing 81, partition plates 82, a first air inlet 80, and a first air outlet 803. The first air inlet 80 and the first air outlet 803 are respectively arranged on the opposite sides of the sedimentation mechanism housing 81. The first air inlet 80 is communicated with the exhaust hole of the negative pressure pump 7 through a third pipeline 13, and the first air outlet 803 is hermetically connected to the second pipeline 86. The sedimentation mechanism housing 81 forms a closed sedimentation chamber. At least two partition plates 82 are fixedly installed at equal intervals on the inner side surface of the sedimentation mechanism housing 81, and adjacent two partition plates 82 are fixedly installed on the opposite inner side surfaces. There is a gap only between the partition plate 82 and the inner side surface of the sedimentation mechanism housing 81 opposite to the installation surface. That is, one partition plate 82 is fixedly installed on the inner top surface and the other is fixedly installed on the inner bottom surface, and the partition plate 81 only has a gap with the opposite surface of the installation surface, so as to form a tortuous air flow channel in the sedimentation mechanism 801, which is convenient for the sedimentation of glass chips.

[0028] The absorption mechanism 802 includes an absorption mechanism housing 87, activated carbon plates 88, a second air inlet 804, and a second air outlet 89. The second air inlet 804 and the second air outlet 89 are respectively arranged on the opposite sides of the absorption mechanism housing 87. The second air inlet 804 is hermetically connected to the sedimentation mechanism 801 through the second pipeline 86. The absorption mechanism housing 87 forms a closed absorption chamber. At least two activated carbon plates 88 are fixedly installed at equal intervals on the inner side surface of the absorption mechanism housing 87, and adjacent two activated carbon plates 88 are fixedly installed on the opposite inner side surfaces. There is a gap only between the activated carbon plate 88 and the inner side surface of the absorption mechanism housing 87 opposite to the installation surface. That is, one activated carbon plate 88 is fixedly installed on the inner top surface and the other is fixedly installed on the inner bottom surface, and the activated carbon plate 88 only has a gap with the opposite surface of the installation surface, so as to form a tortuous air flow channel in the absorption mechanism 802, which is convenient for the activated carbon plate 88 to absorb dust and harmful gases.

[0029] A filter screen 83 is fixedly installed at the port of the first air outlet 803 inside the sedimentation mechanism 801 to filter out glass chips, so that the dust and harmful gases enter the absorption mechanism 802.

[0030] A two-position three-way solenoid valve 84 is installed in the middle of pipeline two 86. The air outlet of the two-position three-way solenoid valve 84 is communicated with the sedimentation mechanism 801, the exhaust port of the two-position three-way solenoid valve 84 is communicated with the absorption mechanism 802, and the air inlet of the two-position three-way solenoid valve 84 is communicated with the air pump 6 through pipeline one 85. The two-position three-way solenoid valve 84 described in this application is a commonly used device in automation equipment, and its specific structure will not be elaborated here. The solenoid valve of model 6014 can be selected in this application; during the production process, the two-position three-way solenoid valve 84 receives periodic electrical signals to act. Specifically, when there is no electrical signal input, the air inlet valve of the two-position three-way solenoid valve 84 is closed and the exhaust port valve is opened, so that the air flow enters the absorption mechanism 802 from the sedimentation mechanism 801. When receiving an electrical signal, the air inlet valve of the two-position three-way solenoid valve 84 is opened and the exhaust port is closed. At this time, the high-speed air flow generated by the air pump 6 is sprayed into the sedimentation mechanism 801 through exhaust port one 803 and the filter screen 83, so as to wash away the smaller glass chips blocking the holes of the filter screen 83 and ensure the smooth air flow in the glass chip, dust and harmful gas treatment device 8 during normal operation.

[0031] Generally speaking, when the utility model is working normally, adjust the angle of the lower part 116 of the dust removal mechanism, start the equipment, the air pump 6 works to generate high-speed air flow, the negative pressure pump 7 works to generate negative pressure, the laser cutting head 12 cuts the glass substrate 4, and at the same time generates glass chips, dust and harmful gases. At this time, the high-speed air flow enters the inner cavity 113 of the housing of the dust removal mechanism 11 through hose one 9 and sealing interface one 111 and then sprays out from the air hole 117 to blow up the thinner glass chips attached to the glass substrate 4. At the same time, through hose two 10 and sealing interface two 112, the dust removal inner cavity 114 of the dust removal mechanism 11 is in a negative pressure state, and then the thinner glass chips blown by the air hole 117 are inhaled. At the same time, the larger glass chips, dust and harmful gases are also inhaled into the dust removal inner cavity, and then enter the sedimentation mechanism 801 through sealing interface two 112, hose two 10, negative pressure pump 7, negative pressure pump 7 exhaust hole, pipeline three 13 and air inlet one 80. The glass chips complete sedimentation here. The dust and harmful gases after separating the glass chips enter the absorption mechanism 802 through the filter screen 83, exhaust port one 803, pipeline two 86 and air inlet two 804. At this time, the activated carbon plate 88 treats the dust and harmful gases, and finally the qualified gas is discharged from exhaust port two 89. At the same time, during the working process of the glass chip, dust and harmful gas treatment mechanism 8, the two-position three-way solenoid valve 84 will perform periodic actions to guide the high-speed air flow to wash away the glass chips blocking the holes of the filter screen 83, so as to ensure the normal operation of the glass chip, dust and harmful gas treatment mechanism 8.

Claims

1. A laser cutting device for a chip glass substrate, comprising four columns (16), wherein the top surface of each column (16) is fixedly connected to a connecting frame 1 (14), a Y-axis feeding mechanism (3) is fixedly mounted on the connecting frame 1 (14), a connecting frame 2 (15) is fixedly mounted on the Y-axis feeding mechanism (3), an X-axis feeding mechanism (2) is fixedly mounted on the connecting frame 2 (15), a Z-axis feeding mechanism (1) is fixedly mounted on the side of the X-axis feeding mechanism (2), a laser cutting head (12) and a dust removal mechanism (11) are fixedly connected to the side of the Z-axis feeding mechanism (1) opposite to the X-axis feeding mechanism (2), the dust removal mechanism (11) is in the shape of a closed trumpet, The laser emitter of the laser cutting head (12) is located inside the dust removal mechanism (11), the laser cutting head (12) is fixedly installed inside the dust removal mechanism (11) via a connecting column, and the lowest horizontal point of the dust removal mechanism (11) is higher than the lowest horizontal point of the laser cutting head (12), a glass substrate (4) is located directly below the laser cutting head (12), the glass substrate (4) is fixed via a glass fixing table (5), the glass fixing table (5) is horizontally fixedly installed with a column (16), an air pump (6), a negative pressure pump (7) and a glass scrap, dust and harmful gas treatment device (8) are arranged and fixedly installed on the table surface of the glass fixing table (5) extending from the column (16), and the characteristics are: The dust removal mechanism (11) comprises an upper part (115) of the dust removal mechanism and a lower part (116) of the dust removal mechanism; the outer shell of the dust removal mechanism (11) is hollow to form an inner shell cavity (113) and a dust removal inner cavity (114) formed by wrapping the entire outer shell; the lower end of the inner shell cavity (113) is provided with a plurality of air holes (117) evenly distributed in an annular shape; the upper end surface of the dust removal mechanism (11) is provided with a sealing interface 1 (111) connected to the inner shell cavity (113) and a sealing interface 2 (112) connected to the dust removal inner cavity (114); the sealing interface 1 (111) is connected to the air pump (6) via a hose 1 (9); and the sealing interface 2 (112) is connected to the negative pressure pump (7) via a hose 2 (10).

2. The laser cutting device for a chip glass substrate according to claim 1, characterized in that: The laser cutting head (12) is fixedly mounted on the axial center line of the dust removal mechanism (11).

3. The laser cutting device for a chip glass substrate according to claim 1, characterized in that: The lower part (116) of the dust removal mechanism is a serpentine tube that can be shaped and bent.

4. The laser cutting device for a chip glass substrate according to claim 1, characterized in that: The glass scraps, dust and harmful gas treatment device (8) comprises a sedimentation mechanism (801), an absorption mechanism (802) and a second pipeline (86) connecting the sedimentation mechanism (801) and the absorption mechanism (802).

5. The laser cutting device for a chip glass substrate according to claim 4, characterized in that: The sedimentation mechanism (801) comprises a sedimentation mechanism frame (81), a partition (82), an air inlet one (80) and an exhaust port one (803), wherein the air inlet one (80) and the exhaust port one (803) are respectively arranged on opposite sides of the sedimentation mechanism frame (81), the air inlet one (80) is connected to the exhaust hole of the negative pressure pump (7) through a pipe three (13), and the exhaust port one (803) is sealed and connected to a pipe two (86), and the sedimentation mechanism frame (81) constitutes a closed sedimentation chamber, at least two of the partitions (82) are equidistantly fixedly mounted on the inner side surface of the sedimentation mechanism frame (81) and two adjacent partitions (82) are fixedly mounted on opposite inner side surfaces, and a gap is left between the partition (82) and the inner side surface of the sedimentation mechanism frame (81) opposite to the mounting surface.

6. The laser cutting device for a chip glass substrate according to claim 4, characterized in that: The absorption mechanism (802) comprises an absorption mechanism frame (87), an activated carbon plate (88), an air inlet port 2 (804) and an air outlet port 2 (89), wherein the air inlet port 2 (804) and the air outlet port 2 (89) are respectively arranged on opposite sides of the absorption mechanism frame (87), the air inlet port 2 (804) is sealedly connected to the sedimentation mechanism (801) via a pipe 2 (86), the absorption mechanism frame (87) forms a closed sedimentation chamber, at least two activated carbon plates (88) are equidistantly fixedly mounted on the inner side surface of the absorption mechanism frame (87) and two adjacent activated carbon plates (88) are fixedly mounted on opposite inner side surfaces, and a gap is left between the activated carbon plates (88) and the inner side surface of the absorption mechanism frame (87) opposite to the mounting surface.

7. The laser cutting device for a chip glass substrate according to claim 5, characterized in that: A filter screen (83) is fixedly installed at one exhaust port (803) inside the sedimentation mechanism (801).

8. The laser cutting device for a chip glass substrate according to claim 7, characterized in that: A two-position three-way solenoid valve (84) is installed in the middle of the second pipe (86); the air outlet of the two-position three-way solenoid valve (84) is connected to the sedimentation mechanism (801); the exhaust port of the two-position three-way solenoid valve (84) is connected to the absorption mechanism (802); and the air inlet of the two-position three-way solenoid valve (84) is connected to the air pump (6) through the first pipe (85).

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