Combined suction cup tool for micro-jet laser machining
By designing a combined suction cup tooling, using vacuum suction cups and supporting bosses to fix the wafer, and adapting to multiple specifications by positioning the ring, the problems of unstable wafer fixation and insufficient tooling adaptability are solved, and the accuracy and quality of micro jet laser processing are improved.
Patent Information
- Application Number
- CN202422147776.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-09-02
AI Technical Summary
During the micro jet laser processing, the unfixed wafer fixation leads to a decrease in processing accuracy and quality, and the existing tooling cannot adapt to a variety of wafer specifications, which increases production costs and replacement errors.
A combined suction cup tooling is designed, including a suction cup base, a combined positioning ring, an adapter block and a rotary slide table, which fixes the wafer through a vacuum suction cup and a supporting boss, and adapts to a variety of wafer specifications through the positioning ring.
It improves the fixed stability of the wafer, avoids processing errors caused by suction changes and offsets, and adapts to a variety of wafer specifications without changing the tooling, improving processing quality and efficiency.
Smart Images
Figure CN222999892U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of micro-jet laser processing, and particularly relates to a combined chuck tooling for micro-jet laser processing. Background Art
[0002] With the rapid development of the manufacturing industry and the aviation industry, the requirements for the processing quality of scribing and chip modification of super-hard and brittle materials and semiconductor materials are getting higher and higher, thus putting forward higher requirements for processing technologies. The micro-jet laser processing technology cuts the workpiece to be processed by guiding the laser beam through a water jet. Since the refractive indices of water and air are different, when the laser beam irradiates the interface between water and air at a certain angle, if the incident angle of the laser beam is less than its total reflection critical angle, the laser beam will undergo total reflection and will not transmit through, so that the laser energy is confined in the pure water column and propagates along the direction of the pure water column. The pure water column carrying the laser beam reaches the surface of the workpiece to be processed, and the material is removed by laser burning. At the same time, the pure water column also plays a role in removing impurities on the surface of the workpiece to be processed and cooling the processing area.
[0003] Due to the advantages of small processing loss, high surface quality and high processing efficiency of the micro-jet laser processing technology, the requirements for the clamping tooling are also getting higher and higher. The wafer is a typical material processed by the micro-jet laser processing technology, with a thickness of about 500 microns and various diameter specifications. At present, the clamping of wafers is realized based on a surface adsorption structure, and a negative pressure is formed by the vacuum pressure acting on the entire surface of the wafer, so as to clamp and fix the wafer on the tooling.
[0004] However, when scribing and chip modifying the wafer, the cut part generates a notch on the surface adsorption structure, resulting in air leakage and suction change. During the micro-jet laser processing, the unstable vacuum suction force on the wafer will cause the wafer to be not firmly fixed, and the wafer will also shift under the impact of the pure water column, affecting the processing accuracy and quality, and even causing stress cracking of the wafer. In addition, due to the large number of wafer specifications, corresponding tooling needs to be set, which greatly increases the production cost of the tooling, and replacing the tooling will also bring processing errors. Therefore, a tooling that can adapt to various wafer specifications is needed to improve the fixing stability of the wafer, thereby improving the processing quality. Summary of the Utility Model
[0005] In order to solve the above problems existing in the prior art, the utility model provides a combined chuck tooling for micro-jet laser processing. The technical problems to be solved by the utility model are realized through the following technical solutions:
[0006] The utility model provides a combined suction cup tooling for micro-jet laser processing, which is arranged on the processing table of a micro-jet laser processing device and includes a suction cup base, a combined positioning ring, an adapter block and a rotary slide; wherein, the suction cup base is connected to the rotary slide through the adapter block, and the rotary slide drives the suction cup base and the adapter block to rotate; a vacuum suction cup is arranged in the middle of the suction cup base, and a plurality of supporting bosses surround the vacuum suction cup and are evenly arranged, and each supporting boss extends from bottom to top; the combined positioning ring is arranged on the suction cup base and includes a plurality of positioning rings, and the plurality of positioning rings are nested in sequence from outside to inside; each positioning ring is provided with a positioning ring surface, the diameters of the positioning ring surfaces of the plurality of positioning rings gradually decrease, and the diameter of each positioning ring surface matches the positioning dimension of a wafer to be processed with a certain specification.
[0007] In an embodiment of the utility model, a ring fixing step is arranged on the suction cup base, the ring fixing step cooperates with the outermost positioning ring, and the outermost positioning ring is fixedly connected to the suction cup base through screws.
[0008] In an embodiment of the utility model, a plurality of fastening screw holes are arranged on the suction cup base, a plurality of fastening screw through holes are arranged on the adapter block, the plurality of fastening screw holes and the plurality of fastening screw through holes are arranged in one-to-one correspondence and coaxially, and a plurality of fastening screws respectively pass through the plurality of fastening screw holes and the plurality of fastening screw through holes, and the suction cup base is fixedly connected to the adapter block through the plurality of fastening screws.
[0009] In an embodiment of the utility model, a plurality of drain ports are arranged on the suction cup base, and the plurality of drain ports surround the vacuum suction cup and are evenly arranged.
[0010] In an embodiment of the utility model, each positioning ring is provided with a mounting ring surface, and the positioning ring surface of the previous positioning ring nested with each other cooperates with the mounting ring surface of the next positioning ring.
[0011] In an embodiment of the utility model, two adjacent positioning rings are connected by screws.
[0012] In an embodiment of the utility model, a replacement groove is arranged on the outer side or the inner side of each positioning ring for easy removal and replacement.
[0013] In an embodiment of the utility model, a quick-insert joint avoidance groove is arranged in the middle of the adapter block, the quick-insert joint passes through the quick-insert joint avoidance groove, and the vacuum suction cup is connected to an external vacuum device through the quick-insert joint.
[0014] In an embodiment of the present utility model, the rotary slide table includes a slide table bottom plate and a slide table rotating part. Among them, the slide table rotating part is arranged on the slide table bottom plate and is rotationally connected. A number of fastening screw threaded holes are arranged on the slide table rotating part. A number of fastening screw holes, a number of fastening screw through holes, and a number of fastening screw threaded holes correspond to each other one by one and are coaxially arranged from top to bottom in sequence. A number of fastening screws pass through the number of fastening screw holes, the number of fastening screw through holes, and the number of fastening screw threaded holes correspondingly, and the suction cup base, the adapter block, and the slide table rotating part are connected into one body through the number of fastening screws passing through.
[0015] In an embodiment of the present utility model, the combined suction cup tooling for micro-jet laser processing further includes a bottom plate. The rotary slide table is arranged on the bottom plate, and the bottom plate is connected to the processing table of the micro-jet laser processing equipment.
[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0017] In the combined suction cup tooling for micro-jet laser processing of the present utility model, the vacuum suction cup is arranged in the middle of the suction cup base, avoiding the suction force change caused by cutting, and providing support and protection for the wafer to be processed through the support boss, improving the fixing stability of the wafer. By arranging a number of positioning rings, it can adapt to a variety of wafer specifications without replacing the tooling, avoiding the processing error caused by replacing the tooling, and thus improving the processing quality.
[0018] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features, and advantages of the present utility model more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the drawings, details are described as follows. Description of the Drawings
[0019] Figure 1 is a structural schematic diagram of a combined suction cup tooling for micro-jet laser processing provided by an embodiment of the present utility model;
[0020] Figure 2 is a structural schematic diagram of the suction cup seat provided by an embodiment of the present utility model;
[0021] Figure 3 is a structural schematic diagram of the positioning ring provided by an embodiment of the present utility model;
[0022] Figure 4 is a structural sectional view of the positioning ring provided by an embodiment of the present utility model;
[0023] Figure 5 is a structural schematic diagram of the adapter block provided by an embodiment of the present utility model;
[0024] Figure 6 This is a schematic structural diagram of the rotary slide table provided by an embodiment of the present utility model.
[0025] Icon: 1 - Suction cup base; 11 - Vacuum suction cup; 12 - Ring fixing step; 13 - Fastening screw hole; 14 - Support boss; 15 - Drainage port; 2 - Combined positioning ring; 21 - Positioning ring surface; 22 - Mounting ring surface; 23 - Replacement groove; 3 - Adapter block; 31 - Quick - connect joint avoidance groove; 32 - Fastening screw through - hole; 4 - Rotary slide table; 41 - Slide table bottom plate; 42 - Slide table rotating part; 43 - Fastening screw threaded hole; 5 - Bottom plate. Detailed implementation manners
[0026] In order to further elaborate on the technical means and effects adopted by the present utility model to achieve the predetermined utility model purpose, the following combines the attached drawings and specific implementation manners to detail a combined suction cup tooling for micro - jet laser processing proposed according to the present utility model.
[0027] Regarding the foregoing and other technical contents, features, and effects of the present utility model, they can be clearly presented in the following detailed description of the specific implementation manners in conjunction with the attached drawings. Through the description of the specific implementation manners, a more in - depth and specific understanding of the technical means and effects adopted by the present utility model to achieve the predetermined purpose can be obtained. However, the attached drawings are only for reference and illustration, and are not used to limit the technical solution of the present utility model.
[0028] Embodiment 1
[0029] As shown in Figure 1 and Figure 2 This embodiment provides a combined suction cup tooling for micro - jet laser processing, which is arranged on the processing table of the micro - jet laser processing equipment and includes: a suction cup base 1, a combined positioning ring 2, an adapter block 3, and a rotary slide table 4. The suction cup base 1 is connected to the rotary slide table 4 through the adapter block 3, and the rotary slide table 4 drives the suction cup base 1 and the adapter block 3 to rotate; a vacuum suction cup 11 is arranged in the middle of the suction cup base 1 for adsorbing and fixing the wafer to be processed; the combined positioning ring 2 is arranged on the suction cup base 1 and includes a plurality of positioning rings, and each positioning ring matches the positioning dimensions of a wafer of a certain specification to be processed.
[0030] In this embodiment, as shown in Figure 1 and Figure 2 a vacuum suction cup 11 is arranged in the middle of the suction cup base 1, and a plurality of support bosses 14 surround the vacuum suction cup 11 and are evenly arranged, and each support boss 14 extends from bottom to top.
[0031] Exemplarily, the vacuum chuck 11 includes a plurality of micro - suction holes. The diameter of the vacuum chuck 11 can be 20 mm, which can at least meet the adsorption and fixation requirements of a silicon carbide wafer with a diameter of 8 inches and a thickness of about 500 microns.
[0032] It should be noted that the vacuum chuck 11 is arranged in the middle of the chuck base 1. Since the adsorption and fixation position is a non - processing position (the wafer modification and scribing processes are generally carried out in the peripheral area), air leakage caused by processing interference at the adsorption position is avoided, and the suction force change caused by cutting during the processing is also avoided. At the same time, since micro - jet laser processing is used, the wafer surface will be subjected to the pressure of a pure water column. By setting the support boss 14 to provide support and positioning for the wafer to be processed, cracking of the wafer surface caused by the impact of the pure water column is avoided, and wafer offset can also be avoided.
[0033] In an alternative embodiment, as Figure 2 shown, a circular fixing step 12 is provided on the chuck base 1. The circular fixing step 12 cooperates with the outermost positioning ring, and the outermost positioning ring is fixedly connected to the chuck base 1 by screws.
[0034] In an alternative embodiment, as Figure 2 shown, a plurality of drain ports 15 are provided on the chuck base 1. The plurality of drain ports 15 surround the vacuum chuck 11 and are evenly arranged, used to drain the water during the micro - jet processing, avoiding the interference of water on the processing surface, so as to improve the processing quality.
[0035] In this embodiment, as Figures 1 to 4 shown, the combined positioning ring 2 is arranged on the chuck base 1, including a plurality of positioning rings. The plurality of positioning rings are nested in sequence from outside to inside; each positioning ring is provided with a positioning ring surface 21, and the diameters of the positioning ring surfaces 21 of the plurality of positioning rings gradually decrease, and the diameter of each positioning ring surface 21 matches the positioning size of a kind of wafer to be processed.
[0036] In an alternative embodiment, as Figure 3 and Figure 4 shown, each positioning ring is provided with an installation ring surface 22, and the positioning ring surface 21 of the previous positioning ring nested with each other cooperates with the installation ring surface 22 of the next positioning ring.
[0037] Exemplarily, adjacent positioning rings are connected by screws.
[0038] In an alternative embodiment, as Figure 3 and Figure 4 shown, a replacement groove 23 is provided on the outside or inside of each positioning ring for easy removal and replacement.
[0039] The principle is as follows: Taking the specifications of the wafers to be processed as 8 inches, 6 inches, and 4 inches in sequence as an example, at least three positioning rings are correspondingly provided. Among them, the outermost positioning ring is fixed to the chuck base 1 by screws. The diameter of its mounting ring surface 22 can be 10 inches, and the diameter of its positioning ring surface 21 can be 8 inches. Similarly, the diameters of the mounting ring surfaces 22 of the other two positioning rings are 8 inches and 6 inches respectively, and the diameters of the positioning ring surfaces 21 are 6 inches and 4 inches respectively, and two adjacent positioning rings are connected by screws. By disassembling the positioning rings, the limiting and positioning of wafers of different specifications are achieved. Without replacing the tooling, it can adapt to multiple wafer specifications, avoiding the processing errors caused by replacing the tooling, thereby improving the processing quality. In addition, the positioning rings can be easily taken out through the replacement slots 23, improving the replacement efficiency.
[0040] In an alternative embodiment, as Figure 2 and Figure 5 shown, a quick-connect joint avoidance groove 31 is provided in the middle of the adapter block 3 for avoiding the quick-connect joint; the quick-connect joint passes through the quick-connect joint avoidance groove 31, and the vacuum chuck 11 is connected to an external vacuum device through the quick-connect joint.
[0041] Exemplarily, a quick-connect joint threaded hole is also provided in the middle of the chuck base 1. The quick-connect joint threaded hole is located on the back side of the vacuum chuck 11, and the quick-connect joint is fixed to the chuck base 1 through the quick-connect joint threaded hole.
[0042] Exemplarily, the external vacuum device can be a vacuum pump.
[0043] It should be noted that a quick-connect joint avoidance groove 31 is provided in the middle of the adapter block 3 to reserve space for the quick-connect joint, so that the vacuum chuck 11 can be connected to an external vacuum device through the quick-connect joint.
[0044] In an alternative embodiment, as Figure 2 and Figure 5 shown, a number of fastening screw holes 13 are provided on the chuck base 1, and a number of fastening screw through holes 32 are provided on the adapter block 3. The number of fastening screw holes 13 and the number of fastening screw through holes 32 are coaxially arranged in one-to-one correspondence. A number of fastening screws pass through the number of fastening screw holes 13 and the number of fastening screw through holes 32 one by one, and the chuck base 1 is fixedly connected to the adapter block 3 through a number of fastening screws.
[0045] In an alternative embodiment, as Figure 2 、 Figure 5 and Figure 6As shown in the figure, the rotary table 4 includes a table base plate 41 and a table rotating part 42. Among them, the table rotating part 42 is arranged on the table base plate 41 and is rotatably connected. A number of fastening screw threaded holes 43 are provided on the table rotating part 42. A number of fastening screw holes 13, a number of fastening screw through holes 32 and a number of fastening screw threaded holes 43 are arranged in one-to-one correspondence and coaxially from top to bottom in sequence. A number of fastening screws respectively pass through a number of fastening screw holes 13, a number of fastening screw through holes 32 and a number of fastening screw threaded holes 43. The suction cup base 1, the adapter block 3 and the table rotating part 42 are connected into one body by a number of penetrating fastening screws.
[0046] It should be noted that the adapter block 3 is used to realize the connection between the suction cup base 1 and the rotary table 4. Among them, the adapter block 3 and the suction cup base 1 can be first connected into one body by a number of fastening screws, and then the adapter block 3 and the table rotating part 42 of the rotary table 4 are connected into one body by a number of fastening screws; it is also possible to connect the suction cup base 1, the adapter block 3 and the table rotating part 42 into one body by a number of penetrating fastening screws.
[0047] Exemplarily, the rotary table 4 is provided with a 360° rotation scale and can drive the adapter block 3 and the suction cup base 1 thereon to rotate 360°, so as to facilitate the adjustment of the direction during the wafer processing.
[0048] In an alternative embodiment, as Figure 1 shown, the combined suction cup tooling for micro-jet laser processing in this embodiment further includes a base plate 5. The rotary table 4 is arranged on the base plate 5, and the base plate 5 is connected to the processing table of the micro-jet laser processing equipment.
[0049] For the combined suction cup tooling for micro-jet laser processing of the present utility model, the vacuum suction cup is arranged in the middle of the suction cup base, which avoids the suction force change caused by cutting, and provides support and protection for the wafer to be processed through the support boss, improving the fixing stability of the wafer. By providing a number of positioning rings, it can adapt to a variety of wafer specifications without replacing the tooling, avoiding the processing error caused by replacing the tooling, thereby improving the processing quality.
[0050] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant is intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the article or device comprising the element. Similar words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The orientation or positional relationship indicated by "above", "below", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.
[0051] The above content is a further detailed description of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can be made, and all should be regarded as belonging to the protection scope of the present invention.
Claims
1. A combined suction cup tooling for micro jet laser processing, arranged on a processing table of a micro jet laser processing device, characterized in that: include: Suction cup base (1), combined positioning ring (2), adapter block (3) and rotating slide table (4); The suction cup base (1) is connected to the rotating slide (4) via the adapter block (3), and the rotating slide (4) drives the suction cup base (1) and the adapter block (3) to rotate; A vacuum suction cup (11) is arranged in the middle of the suction cup base (1), and a plurality of supporting bosses (14) surround the vacuum suction cup (11) and are evenly arranged, and each of the supporting bosses (14) extends from bottom to top; The combined positioning ring (2) is arranged on the suction cup base (1), and comprises a plurality of positioning rings, wherein the plurality of positioning rings are nested in sequence from the outside to the inside; each of the positioning rings is provided with a positioning ring surface (21), the diameters of the positioning ring surfaces (21) of the plurality of positioning rings gradually decrease, and the diameter of each positioning ring surface (21) matches the positioning size of a wafer to be processed of a certain specification.
2. The combined suction cup tooling for micro jet laser processing according to claim 1 is characterized in that: A circular ring fixing step (12) is provided on the suction cup base (1), the circular ring fixing step (12) cooperates with the positioning circular ring of the outermost circle, and the positioning circular ring of the outermost circle is fixedly connected to the suction cup base (1) by means of screws.
3. The combined suction cup tooling for micro jet laser processing according to claim 1 is characterized in that: The suction cup base (1) is provided with a plurality of fastening screw holes (13), and the adapter block (3) is provided with a plurality of fastening screw through holes (32). The plurality of fastening screw holes (13) and the plurality of fastening screw through holes (32) are coaxially arranged in a one-to-one correspondence, and a plurality of fastening screws pass through the plurality of fastening screw holes (13) and the plurality of fastening screw through holes (32) in a one-to-one correspondence. The suction cup base (1) is fixedly connected to the adapter block (3) via the plurality of fastening screws.
4. The combined suction cup tooling for micro-jet laser processing according to claim 1 is characterized in that: The suction cup base (1) is provided with a plurality of drainage openings (15), and the plurality of drainage openings (15) surround the vacuum suction cup (11) and are evenly arranged.
5. The combined suction cup tooling for micro jet laser processing according to claim 1, characterized in that: Each of the positioning circular rings is provided with a mounting ring surface (22), and the positioning ring surface (21) of the preceding positioning circular ring and the mounting ring surface (22) of the succeeding positioning circular ring, which are arranged to be nested with each other, cooperate with each other.
6. The combined suction cup tooling for micro jet laser processing according to claim 1, characterized in that: Two adjacent positioning rings are connected by screws.
7. The combined suction cup tooling for micro jet laser processing according to claim 1, characterized in that: A replacement groove (23) is provided on the outer side or the inner side of each positioning ring to facilitate removal and replacement.
8. The combined suction cup tooling for micro-jet laser processing according to claim 1, characterized in that: A quick-connect joint avoidance groove (31) is provided in the middle of the adapter block (3), the quick-connect joint passes through the quick-connect joint avoidance groove (31), and the vacuum suction cup (11) is connected to an external vacuum device via the quick-connect joint.
9. The combined suction cup tooling for micro jet laser processing according to claim 3, characterized in that: The rotary slide (4) comprises: a slide base plate (41) and a slide rotating part (42); wherein the slide rotating part (42) is arranged on the slide base plate (41) and is rotatably connected, and a plurality of threaded holes (43) for fastening screws are arranged on the slide rotating part (42); The plurality of fastening screw holes (13), the plurality of fastening screw through holes (32) and the plurality of fastening screw threaded holes (43) correspond to each other and are coaxially arranged in sequence from top to bottom; the plurality of fastening screws pass through the plurality of fastening screw holes (13), the plurality of fastening screw through holes (32) and the plurality of fastening screw threaded holes (43) in a one-to-one manner; the suction cup base (1), the adapter block (3) and the slide rotating part (42) are connected as a whole through the plurality of fastening screws passing through them.
10. The combined suction cup tooling for micro jet laser processing according to claim 1, characterized in that: Also includes: A bottom plate (5), the rotating slide (4) is arranged on the bottom plate (5), and the bottom plate (5) is connected to a processing table of the micro-jet laser processing equipment.