Part machining turnover device

Abstract

The utility model discloses a turnover device for part processing, and relates to the technical field of semiconductor processing. The device comprises a mounting seat, wherein a conveying belt is embedded in the middle of the mounting seat; the supporting plate is fixedly arranged on one side of the mounting base, and a rectangular notch is formed in the position, corresponding to the conveying belt, of the bottom side of the supporting plate; the mounting plate is fixedly arranged above one side of the supporting plate, and a strip-shaped channel is formed in the middle of the mounting plate; the guide block is fixedly arranged on the side, away from the supporting plate, of the mounting plate. According to the utility model, through the combined design of the processing groove, the tipping bucket mechanism, the arc-shaped cover and the material guide hopper, the rapid overturning of the semiconductor substrate is realized, the production efficiency is improved, during use, after a part is processed or checked in the processing groove, one side of the processing groove can be tilted through the tipping bucket mechanism, and the production efficiency is improved. The semiconductor substrate enters the arc-shaped cover through the guide block under the action of the gravity of the semiconductor substrate, and flanging can be easily completed in the arc-shaped cover.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, and particularly relates to a component processing and turning device. Background Art

[0002] In the process of modern industrial production, especially in the semiconductor manufacturing industry, the processing requirements for precision components are extremely high. As the basic material for integrated circuits and other microelectronic devices, the processing quality of semiconductor substrates directly affects the performance and reliability of the final products. During the production process of semiconductor substrates, turning operations are often required to process or inspect different surfaces of the substrates. Traditional turning devices mainly use robotic arms in cooperation with negative pressure suction cups or electromagnetic suction cups to achieve this process. The negative pressure suction cup adsorbs the surface of the semiconductor substrate by generating negative pressure, while the electromagnetic suction cup uses electromagnetic force to adsorb substrates containing ferromagnetic materials.

[0003] In the prior art, whether generating negative pressure or electromagnetic force, it takes a certain amount of time to establish and release the adsorption force, which will lead to a decrease in production efficiency in large-scale production. Secondly, during the turning process, due to various reasons (such as uneven adsorption force, external impact, equipment aging, etc.), the substrate may fall off the suction cup, resulting in damage or contamination. Therefore, we propose a component processing and turning device to solve the above problems. Summary of the Utility Model

[0004] The utility model specifically adopts the following technical solutions to achieve the above purposes:

[0005] A component processing and turning device, comprising:

[0006] A mounting base, in the middle of which a conveyor belt is embedded;

[0007] A support plate, fixedly arranged on one side of the mounting base, and a rectangular notch is formed at the bottom side of the support plate corresponding to the position of the conveyor belt;

[0008] A mounting plate, fixedly arranged above one side of the support plate, and a strip-shaped channel is formed in the middle of the mounting plate;

[0009] A guiding block, fixedly arranged on the side of the mounting plate away from the support plate, an extension plate is fixedly arranged on one side of the guiding block, and a processing groove is hinged on one side of the extension plate. The processing groove is in a shovel shape and the semiconductor substrate to be processed is placed inside the processing groove;

[0010] A tipping mechanism, arranged inside the strip-shaped channel, for driving the processing groove to turn;

[0011] The arc-shaped cover is fixedly arranged at one end of the mounting plate away from the support plate, and the end of the mounting plate is located at the center of the arc-shaped cover. A material guiding hopper is obliquely arranged between the bottom side of the arc-shaped cover and the mounting seat.

[0012] Further, the tipping mechanism includes a triangular plate rotatably connected to the inner side wall of the strip-shaped channel. A connecting rod is fixedly arranged between one end points of the two triangular plates. The middle of the connecting rod is hinged with an electric push rod. The piston end of the electric push rod is hinged with the bottom of the processing groove. An articulated plate is hinged at the other end point of the triangular plate. The end of the articulated plate away from the triangular plate is hinged with the bottom of the processing groove.

[0013] Further, the guiding block is triangular.

[0014] Further, the end of the mounting plate away from the support plate is arc-shaped.

[0015] Further, a first rubber pad is arranged at the end of the mounting plate away from the support plate, and a second rubber pad is arranged in the middle of the inner wall of the arc-shaped cover.

[0016] Further, the width of the semiconductor substrate to be processed is less than the distance between the first rubber pad and the second rubber pad.

[0017] The beneficial effects of the present utility model are as follows:

[0018] Through the combined design of the processing groove, the tipping mechanism, the arc-shaped cover and the material guiding hopper, the present utility model realizes the rapid flipping of the semiconductor substrate, improves the production efficiency. When in use, after the parts are processed or inspected in the processing groove, through the tipping mechanism, one side of the processing groove can be lifted. Under the action of its own gravity, the semiconductor substrate enters the interior of the arc-shaped cover through the guiding block. After the flanging can be completed inside the arc-shaped cover, it will fall along the material guiding hopper. The device has a simple structure and is convenient to operate, and is suitable for large-scale production. Description of the Drawings

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0020] Figure 2 is a top view schematic diagram of the present utility model;

[0021] Figure 3 is the present utility model Figure 2 Cross-sectional schematic diagram in the A-A direction.

[0022] Reference numerals: 1, mounting base; 2, conveyor belt; 3, support plate; 301, rectangular notch; 4, mounting plate; 401, strip channel; 5, guiding block; 6, extension plate; 7, processing groove; 8, tipping mechanism; 801, triangular plate; 802, connecting rod; 803, electric push rod; 804, hinge plate; 9, arc-shaped cover; 10, feeding hopper; 11, first rubber pad; 12, second rubber pad. Detailed implementation manners

[0023] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

[0024] This application provides a component processing and flipping device, which is mainly used to solve the problems in the prior art that whether generating negative pressure or electromagnetic force, it takes a certain amount of time to establish and release the adsorption force, which will lead to a decrease in production efficiency in large-scale production. Secondly, during the flipping process, due to various reasons (such as uneven adsorption force, external impact, equipment aging, etc.), the substrate may fall off the suction cup, resulting in damage or contamination. The following technical solutions are provided and will be described in detail below in combination with Figures 1 - 3 make a detailed description:

[0025] A component processing and flipping device includes: a mounting base 1, in the middle of which a conveyor belt 2 is embedded;

[0026] A support plate 3 is fixedly arranged on one side of the mounting base 1, and a rectangular notch 301 is formed at the bottom side of the support plate 3 corresponding to the position of the conveyor belt 2;

[0027] A mounting plate 4 is fixedly arranged above one side of the support plate 3, and a strip channel 401 is formed in the middle of the mounting plate 4;

[0028] A guiding block 5 is fixedly arranged on the side of the mounting plate 4 away from the support plate 3. One side of the guiding block 5 is fixedly provided with an extension plate 6. One side of the extension plate 6 is hinged with a processing groove 7. The processing groove 7 is in a shovel shape and the semiconductor substrate to be processed is placed inside the processing groove 7;

[0029] A tipping mechanism 8 is arranged inside the strip channel 401 and is used to drive the processing groove 7 to flip;

[0030] An arc-shaped cover 9 is fixedly arranged at the end of the mounting plate 4 away from the support plate 3, and the end of the mounting plate 4 is located at the center of the arc-shaped cover 9. A feeding hopper 10 is obliquely arranged between the bottom side of the arc-shaped cover 9 and the mounting base 1.

[0031] The specific implementation process and principle description of this component processing and flipping device:

[0032] First step, place the semiconductor substrate to be processed inside the processing tank 7;

[0033] Second step, when the parts are processed or inspected inside the processing tank 7, activate the tipping mechanism 8;

[0034] Third step, the tipping mechanism 8 causes one side of the processing tank 7 to tilt up. Under the action of its own gravity, the semiconductor substrate enters the inside of the arc-shaped cover 9 through the guiding block 5. Inside the arc-shaped cover 9, the semiconductor substrate completes the flanging.

[0035] Fourth step, the flanged semiconductor substrate falls along the material guiding hopper 10, enters the conveyor belt 2, and enters the next process.

[0036] As Figure 3 shown, in some embodiments, the tipping mechanism 8 includes a triangular plate 801 rotatably connected to the inner side wall of the strip-shaped channel 401. A connecting rod 802 is fixedly provided between one end points of the two triangular plates 801. The middle of the connecting rod 802 is hinged with an electric push rod 803. The piston end of the electric push rod 803 is hinged to the bottom of the processing tank 7. The other end point of the triangular plate 801 is hinged with a hinge plate 804. The end of the hinge plate 804 away from the triangular plate 801 is hinged to the bottom of the processing tank 7. More specifically, in the initial state, the triangular plate 801 is stationary on the inner side wall of the strip-shaped channel 401. The connecting rod 802 is connected to the electric push rod 803 and is located in the middle position. The processing tank 7 is placed horizontally, waiting for the semiconductor substrate to be processed or inspected. When it is necessary to flip the semiconductor substrate, the electric push rod 803 is activated, and its piston end starts to push the connecting rod 802. The connecting rod 802 receives the acting force of the electric push rod 803 and transmits this acting force to the triangular plate 801, causing the triangular plate 801 to rotate around its fixed point. Since the triangular plate 801 is connected to the bottom of the processing tank 7 through the hinge plate 804, the rotation of the triangular plate 801 causes one side of the processing tank 7 to start to lift. As one side of the processing tank 7 continues to rise, the semiconductor substrate slides into the arc-shaped cover 9 along the guiding block 5 under the action of gravity, completing the flipping. After completing the flipping action, the electric push rod 803 contracts, and the triangular plate 801 rotates back to the initial position in the reverse direction, causing the processing tank 7 to be laid flat, ready to receive the next semiconductor substrate to be processed.

[0037] As Figure 3 shown, in some embodiments, the guiding block 5 is triangular. More specifically, the triangular guiding block 5 is to ensure that the semiconductor substrate can smoothly slide into the arc-shaped cover 9 after being lifted by the tipping mechanism 8.

[0038] As Figure 3As shown, in some embodiments, the end of the mounting plate 4 away from the support plate 3 is arc-shaped. More specifically, the arc-shaped structure can provide a smoother transition than an acute angle or a straight line, reducing damage to the semiconductor substrate due to collision or abrasion during movement. At the same time, the arc-shaped end can provide uniform supporting force when in contact with the semiconductor substrate, avoiding local stress concentration from causing damage to the semiconductor substrate. In addition, the arc-shaped structure acts as a slide groove in guiding the semiconductor substrate into the arc cover 9, ensuring that the substrate can smoothly enter the next step without getting stuck or deviating from the predetermined path.

[0039] like Figure 3 As shown, in some embodiments, a first rubber pad 11 is provided at one end of the mounting plate 4 away from the supporting plate 3, and a second rubber pad 12 is provided in the middle of the inner wall of the arc cover 9. More specifically, the rubber pad has good elasticity and cushioning properties. When the semiconductor substrate contacts these rubber pads during the flipping process, the impact force can be reduced to prevent the substrate from being scratched or broken due to direct contact with hard objects. Secondly, the rubber pad can provide a uniform supporting surface, so that the semiconductor substrate is evenly stressed on the entire surface, thereby avoiding damage caused by local overload.

[0040] like Figure 3 As shown, in some embodiments, the width of the semiconductor substrate to be processed is smaller than the distance between the first rubber pad 11 and the second rubber pad 12. More specifically, such design consideration is mainly to avoid material jamming and ensure that the semiconductor substrate can smoothly pass through the flipping device.

[0041] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A component processing turning device, characterized in that: include: A mounting seat (1), wherein a conveyor belt (2) is embedded in the middle of the mounting seat (1); A support plate (3) is fixedly mounted on one side of the mounting seat (1), and a rectangular notch (301) is formed on the bottom side of the support plate (3) at a position corresponding to the conveyor belt (2); A mounting plate (4) fixedly mounted above one side of the support plate (3), wherein a strip-shaped channel (401) is formed in the middle of the mounting plate (4); A guide block (5) is fixedly mounted on a side of the mounting plate (4) away from the support plate (3); an extension plate (6) is fixedly mounted on one side of the guide block (5); a processing groove (7) is hingedly connected to one side of the extension plate (6); the processing groove (7) is shovel-shaped and the semiconductor substrate to be processed is placed inside the processing groove (7); A tipping mechanism (8) is arranged inside the strip-shaped channel (401) and is used to drive the processing groove (7) to flip; The arc-shaped cover (9) is fixedly mounted on one end of the mounting plate (4) away from the support plate (3), and the end of the mounting plate (4) is located at the center of the arc-shaped cover (9). A guide hopper (10) is obliquely arranged between the bottom side of the arc-shaped cover (9) and the mounting seat (1).

2. A component processing turning device according to claim 1, characterized in that: The tipping mechanism (8) includes a triangular plate (801) rotatably connected to the inner wall of the strip channel (401), a connecting rod (802) is fixedly provided between one of the end points of the two triangular plates (801), an electric push rod (803) is hingedly connected to the middle of the connecting rod (802), a piston end of the electric push rod (803) is hingedly connected to the bottom of the processing groove (7), and a hinged plate (804) is hingedly connected to the other end point of the triangular plate (801), and an end of the hinged plate (804) away from the triangular plate (801) is hingedly connected to the bottom of the processing groove (7).

3. A component processing turning device according to claim 1, characterized in that: The guide block (5) is triangular in shape.

4. The component processing turning device according to claim 1, characterized in that: One end of the mounting plate (4) away from the supporting plate (3) is arc-shaped.

5. The component processing turning device according to claim 1, characterized in that: A first rubber pad (11) is provided at one end of the mounting plate (4) away from the support plate (3), and a second rubber pad (12) is provided in the middle of the inner wall of the arc-shaped cover (9).

6. A component processing turning device according to claim 5, characterized in that: The width of the semiconductor substrate to be processed is smaller than the distance between the first rubber pad (11) and the second rubber pad (12).

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