Workbench device of wafer

Abstract

The utility model discloses a wafer workbench device which comprises an upper collet assembly and a lower collet assembly. The upper collet assembly comprises a placing circular truncated cone and a first supporting column, the upper end face of the placing circular truncated cone is used for placing a wafer disc, and the lower end face of the placing circular truncated cone is connected with the first end of the first supporting column; the lower bottom support assembly comprises a base, a second supporting column and a rotating piece. A rotating piece is fixed to the first end of the second supporting column, and the first supporting column is rotatably connected to the second supporting column through the rotating piece. The second end of the second supporting column is fixed to the base. The rotating piece is a bearing; the inner peripheral wall of the second supporting column is sleeved and fixed on the outer ring of the bearing; the inner ring of the bearing is connected to the peripheral wall of the first supporting column in a sleeving mode. According to the technical scheme, by means of the arrangement of the bearing, angle adjustment and height adjustment of the containing circular truncated cone are achieved, meanwhile, the containing circular truncated cone of the technical scheme further has a heating function, and therefore the working efficiency of operators is improved, and the labor cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and particularly relates to a workbench device for wafers. Background Art

[0002] During the fine polishing process of wafers, the wafers usually need to be pasted onto a wafer chuck first and then polished on a polishing machine. After polishing, the wafers need to be taken out of the wafer chuck; the operation of taking out the wafers needs to be carried out on a workbench device.

[0003] However, the existing workbench device cannot be rotated according to the needs of operators, resulting in low efficiency and high labor cost in the process of taking out wafers from the wafer chuck. Summary of the Utility Model

[0004] In view of this, the utility model provides a workbench device for wafers. Through the arrangement of bearings, the angle of the workbench device can be adjusted according to the needs of operators.

[0005] To achieve the above object, the utility model provides the following technical solutions:

[0006] A workbench device for wafers, comprising: an upper base component and a lower base component;

[0007] The upper base component includes: a placing frustum and a first support column. The upper end surface of the placing frustum is used for placing a wafer chuck, and the lower end surface of the placing frustum is connected to the first end of the first support column;

[0008] The lower base component includes: a base, a second support column and a rotating member;

[0009] The rotating member is fixed at the first end of the second support column, and the first support column is rotatably connected to the second support column through the rotating member; the second end of the second support column is fixed to the base;

[0010] The rotating member is a bearing; the second support column is of a hollow cylindrical structure;

[0011] The outer peripheral wall of the inner circumference of the second support column is sleeved and fixed to the outer ring of the bearing;

[0012] The inner ring of the bearing is sleeved and connected to the peripheral wall of the first support column.

[0013] In some embodiments, the lower base component further includes: a locking rod;

[0014] The second support column is provided with a first through hole extending radially and penetrating therethrough, the outer ring is provided with a second through hole extending radially and penetrating therethrough, and the outer peripheral wall of the inner ring is provided with an annular groove;

[0015] A plurality of balls are provided between the inner ring and the outer ring, and a locking channel can be formed between adjacent balls;

[0016] The locking rod can sequentially pass through the first through hole, the second through hole, and the locking channel to be clamped with the annular groove.

[0017] In some embodiments, the locking rod is an L-shaped wrench.

[0018] In some embodiments, the radius of the first through hole is the same as the radius of the second through hole;

[0019] The axis of the first through hole coincides with the axis of the second through hole.

[0020] In some embodiments, the inner ring is movably sleeved and connected to the peripheral wall of the first support column;

[0021] The second end of the first support column is located inside the second support column and can slide axially along the second support column.

[0022] In some embodiments, the inner peripheral wall of the inner ring is threadedly connected to the peripheral wall of the first support column.

[0023] In some embodiments, a limiting frustum is provided at the second end of the first support column;

[0024] The axis of the limiting frustum coincides with the axis of the first support column, and the radius of the limiting frustum is greater than the radius of the inner ring and less than or equal to the inner circle radius of the second support column.

[0025] In some embodiments, the cross section of the base is circular, and the radius of the base is greater than the radius of the placement frustum.

[0026] In some embodiments, the placement frustum is a groove-shaped structure with a downward depression on the upper end surface in the middle.

[0027] In some embodiments, it further includes: a heating resistance wire and a temperature control device;

[0028] The heating resistance wire is uniformly distributed in a concentric circle shape on the placement frustum, the temperature control device is arranged on the base, and the temperature control device and the heating resistance wire are electrically connected.

[0029] As can be seen from the above technical solutions, the workbench device for wafers provided by the present utility model, through the setting of the rotating member, the operator can rotate the placement frustum according to the required angle, and then the operator can quickly shovel the wafer on the wafer disk and place it in the placement chuck; in this way, the work efficiency of the operator is improved, the efficiency of the process of taking and placing the wafer is high, and the labor cost is saved.

[0030] In the above technical solution, the relative sliding arrangement of the first support column and the second support column enables the first support column to slide up and down relative to the second support column, so as to adjust the relative height of the placement frustum to meet the needs of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0032] Figure 1 FIG. is a schematic diagram of the overall structure of the workbench device provided by the embodiment of the present invention;

[0033] Figure 2 FIG. is a schematic diagram of the structure of the upper base support assembly provided by the embodiment of the present invention;

[0034] Figure 3 FIG. is a top view of the placement frustum of the upper base support assembly provided by the embodiment of the present invention;

[0035] Figure 4 FIG. is a top view of the bearing of the lower base support assembly provided by the embodiment of the present invention;

[0036] Figure 5 FIG. is a schematic diagram of the cooperation between the bearing and the locking rod provided by the embodiment of the present invention;

[0037] Figure 6 FIG. is a front view of the bearing of the lower base support assembly provided by the embodiment of the present invention;

[0038] Figure 7 FIG. is a schematic diagram of the structure of the lower base support assembly with the bearing hidden provided by the embodiment of the present invention.

[0039] Among them, 1 is the upper base support assembly, 11 is the placement frustum, 12 is the first support column, and 13 is the limiting frustum;

[0040] 2 is the lower base support assembly, 21 is the base, 22 is the second support column, 221 is the first through hole, 23 is the bearing, 231 is the outer ring, 232 is the inner ring, 233 is the second through hole, and 24 is the locking rod;

[0041] 3 is the heating resistance wire, and 4 is the temperature control device. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0043] The workbench device for a wafer provided in the embodiment of the present utility model, as Figures 1 - 7 shown, includes: an upper base support assembly 1 and a lower base support assembly 2;

[0044] The upper base support assembly 1 includes: a placement frustum 11 and a first support column 12. The upper end surface of the placement frustum 11 is used for placing a wafer disk, and the lower end surface of the placement frustum 11 is connected to the first end of the first support column 12;

[0045] The lower base support assembly 2 includes: a base 21, a second support column 22 and a rotating member;

[0046] A rotating member is fixed to the first end of the second support column 22, and the first support column 12 is rotatably connected to the second support column 22 through the rotating member; the second end of the second support column 22 is fixed to the base 21;

[0047] The rotating member is a bearing 23; the second support column 22 is a hollow cylindrical structure;

[0048] The inner peripheral wall of the second support column 22 is sleeved and fixed to the outer ring 231 of the bearing 23;

[0049] The inner ring 232 of the bearing 23 is sleeved and connected to the peripheral wall of the first support column 12.

[0050] In the above solution, the polished wafer disk is placed on the upper end surface of the placement frustum 11 for the wafer unloading operation. The operator shovels the wafer on the wafer disk and places it into the cassette. Then, by using the rotating member, the placement frustum 11 is rotated clockwise or counterclockwise along with the first support column 12 to the angle required by the operator. Then, the operator continues to shovel the wafer on the wafer disk and place it into the cassette; the rotation action of the placement frustum 11 is repeated until all the wafers on the wafer disk are shoveled.

[0051] Compared with the prior art, with the setting of the rotating member, the operator rotates the placement frustum according to the required angle, and then quickly shovels the wafer on the wafer disk and places it into the cassette; thus, the working efficiency of the operator is improved and the labor cost is saved.

[0052] In the above technical solution, since there are balls between the inner ring 232 and the outer ring 231 of the bearing 23 (such as Figure 4) The inner ring 232 and the outer ring 231 can rotate relative to each other. By fixing the outer ring 231 and the second support column 22, the inner ring 232 can drive the first support column 12 to rotate relative to the second support column 22, so that the operator can rotate the placing turntable 11 according to the required angle.

[0053] To further optimize the above technical solution, as Figure 1 and Figure 5 shown, the lower base support assembly 2 further includes: a locking rod 24;

[0054] The second support column 22 is provided with a first through hole 221 extending radially and penetrating therethrough, the outer ring 231 is provided with a second through hole 233 extending radially and penetrating therethrough, and an annular groove is provided on the outer peripheral wall of the inner ring 232;

[0055] A plurality of balls are provided between the inner ring 232 and the outer ring 231, and a locking channel can be formed between adjacent balls;

[0056] The locking rod 24 can sequentially pass through the first through hole 221, the second through hole 233, and the locking channel to be clamped with the annular groove.

[0057] In the above technical solution, after the operator rotates the placing turntable 11 to the required position, the locking rod 24 sequentially passes through the first through hole 221 and the second through hole 233 to be clamped with the annular groove, so as to fix the placing turntable 11; it should be noted that there is a gap between adjacent balls to form a locking channel; furthermore, the bearing 23 further includes a cage, and the cage connects the balls in sequence. However, there is also a gap between adjacent balls in the cage to form a locking channel; it should also be noted that the inner peripheral wall of the second support column 22 and the outer ring 231 are fixed by welding, which is beneficial to cost saving; in addition, in one embodiment, the locking rod 24 sequentially passes through the first through hole 221 and the second through hole 233 and abuts against the annular groove, so as to fix the placing turntable 11.

[0058] To further optimize the above technical solution, the locking rod 24 is an L-shaped wrench. The L-shaped wrench is a finished product, which saves costs; in addition, the end of the L-shaped wrench that is clamped with the annular groove is a clamping end, and the shape of the cross-section of the clamping end matches the shape of the cross-section of the annular groove.

[0059] To further optimize the above technical solution, as Figure 1 shown, the radius of the first through hole 221 is the same as the radius of the second through hole 233;

[0060] The axis of the first through hole 221 coincides with the axis of the second through hole 233.

[0061] In the above technical solution, through the above settings, the locking efficiency of the locking rod 24 is improved.

[0062] In this technical solution, the inner ring 232 is movably sleeved and connected to the peripheral wall of the first support column 12;

[0063] The second end of the first support column 12 is located inside the second support column 22 and can axially slide along the second support column 22.

[0064] In the above technical solution, the first support column 12 can slide up and down relative to the second support column 22 to adjust the relative height of the placing frustum 11, meeting the requirements of the operator.

[0065] To further optimize the above technical solution, the inner peripheral wall of the inner ring 232 is threadedly connected to the peripheral wall of the first support column 12.

[0066] In the above technical solution, according to the height required by the operator, by using the threaded connection between the inner ring 232 and the first support column 12, the height can be adjusted by rotating the first support column 12. After rotating the first support column 12 to the required height, the first support column 12 and the inner ring 232 are prevented from rotating through the threaded connection; further, along the circumferential direction of the inner ring 232, a plurality of through grooves (extending along the radial direction of the inner ring 232 and penetrating) are provided at intervals on the annular groove of the inner ring 232. The locking rod 24 is used in cooperation with the through grooves to further fix the first support column 12 and the inner ring 232.

[0067] To further optimize the above technical solution, a limiting frustum 13 is provided at the second end of the first support column 12;

[0068] The axis of the limiting frustum 13 coincides with the axis of the first support column 12, and the radius of the limiting frustum 13 is greater than the radius of the inner ring 232 and less than or equal to the inner circle radius of the second support column 22.

[0069] In the above solution, the setting of the limiting frustum 13 is used to prevent the first support column 12 from separating from the second support column 22 during rotation and height adjustment; in addition, the connection between the limiting frustum 13 and the second support column 22 is a detachable connection.

[0070] In this technical solution, as Figure 1 shown, the cross-section of the base 21 is circular, and the radius of the base 21 is greater than the radius of the placing frustum 11, which is beneficial to the stable operation of this workbench device during use and not prone to tilting.

[0071] In this technical solution, the placing frustum 11 is a groove-shaped structure with a downward depression on the upper end surface in the middle. Such a setting is beneficial to the placement of the crystal placing disc.

[0072] In this technical solution, it further includes: a heating resistance wire 3 and a temperature control device 4;

[0073] The heating resistance wire 3 is evenly distributed in a concentric circle on the placement frustum 11. The temperature control device 4 is arranged on the base 21, and the temperature control device 4 and the heating resistance wire 3 are connected by an electric circuit.

[0074] In the above technical solution, by setting the temperature control device 4 and the heating resistance wire 3, the placement frustum 11 can reach the required temperature.

[0075] The technical features mentioned above, the technical features to be mentioned below, and the technical features shown separately in the drawings can be arbitrarily combined with each other as long as the combined technical features are not mutually contradictory. All feasible feature combinations are the technical contents clearly recorded in this article. Any one of the sub-features included in the same statement can be independently applied without necessarily being applied together with other sub-features.

[0076] The following further introduces this solution in combination with specific embodiments:

[0077] A workbench device for a wafer, wherein, as Figure 1 and Figure 2 shown, the upper base component 1 includes: a placement frustum 11, a first support column 12, and a limiting frustum 13; the cross-sectional diameter of the placement frustum 11 is 330 - 450 mm, the longitudinal section height is 20 mm, and the heating resistance wire 3 is also arranged on the placement frustum 11; the connection circuit of the heating resistance wire 3 passes through the first support column 12 and the second support column 22 and is connected to the temperature control device 4 (the temperature control device 4 is arranged on the base 21, and the temperature is adjusted by the knob on the temperature control device 4); the first support column 12 is of a hollow structure, with a height of 60 - 150 mm and an outer circle diameter of 15 - 30 mm; the inner circle diameter of the limiting frustum 13 is 15 - 30 mm, and the outer circle diameter is 19 - 34 mm.

[0078] The lower base component 2 includes: a base 21, a second support column 22, a bearing 23, and a locking rod 24; wherein the base 21 of the lower base component 2 is a circular bottom plane structure, and the diameter of the circular bottom plane structure is 390 - 460 mm; the second support column 22 is of a hollow cylindrical structure with a height of 40 - 60 mm, and its inner circle diameter is 30 - 40 mm; it should also be noted that the diameter of the base 21 is larger than the diameter of the limiting frustum 13 to stabilize the center and prevent tipping.

[0079] The outer diameter of the outer ring 231 of the bearing 23 of the lower base support assembly 2 can be 30 - 40 mm, the inner diameter of the inner ring 232 of the bearing 23 is 16 - 35 mm, and the inner ring 232 can be fitted with the peripheral wall of the first support column 12; there are rolling elements (i.e., ball bearings) and a cage between the outer ring 231 and the inner ring 232; there is a second through hole 233 with a diameter of 1.5 mm at the lowermost edge of the outer ring 231 of the bearing 23, and an annular groove is provided on the inner ring 232, the cross-sectional diameter of the annular groove is 1.5 mm, and the depth is 2 mm; the locking rod 24 can pass through the first through hole 233 and be snap-fitted into the annular groove; the structure of the locking rod 24 is an L-shaped hexagonal wrench, its cross-sectional diameter is 1.5 mm, and the length of the longer end is greater than 60 mm to meet the normal use requirements.

[0080] Example 1:

[0081] Place the ceramic disk (360 mm) with a 6-inch silicon carbide wafer attached onto this workbench device for cold wafer unloading operation; among them, a total of 3 wafers are attached to each ceramic disk. Place the ceramic disk flat on the placement turntable 11, and after adjusting to a suitable height according to the operator's height, perform the wafer unloading operation. The operator wears disposable rubber gloves and simultaneously prepares the wafer unloading cassette, foam pad, and blade; the operator places the ceramic disk with the wafer steadily on the placement turntable 11, and then performs the wafer unloading operation according to the arrangement order of the wafers in the cassette; use the blade to shovel off the first wafer of the ceramic disk at an angle of 10 - 50 degrees and place it into the wafer unloading cassette with a foam pad at the bottom, then rotate the turntable counterclockwise by about 120 degrees to perform the wafer unloading operation of the second wafer, and then continue to rotate the turntable counterclockwise by about 120 degrees to perform the wafer unloading operation of the third wafer; repeat the operation in the third step to unload the subsequent wafers of the same cassette and place them into the wafer unloading cassette.

[0082] Example 2: Place the ceramic disk (360 mm) with a 4-inch silicon carbide wafer attached onto the workbench for cold wafer unloading operation. Among them, a total of 6 wafers are attached to each ceramic disk. Place the ceramic disk flat on the wafer unloading workbench, and after adjusting to a suitable height according to the operator's height, perform the wafer unloading operation. The specific operation method is the same as that in Example 1.

[0083] Example 3: Place the ceramic disk (480 mm) with an 8-inch silicon carbide wafer attached onto the workbench for hot wafer unloading operation. Among them, a total of 3 wafers are attached to each ceramic disk. Place the ceramic disk flat on the wafer unloading workbench, and after adjusting to a suitable height according to the operator's height, turn on the heating device (i.e., the temperature control device 4) to heat the placement turntable 11 of the upper base support assembly 1 to the specified temperature, and then perform the wafer unloading operation. The specific operation method is the same as that in Example 1. Additionally, a pair of heat-insulating gloves need to be worn and then rubber gloves.

[0084] The present utility model provides a novel wafer unloading workbench for use after CMP processing of 4-8 inch wafers. Its advantages are that it has the heating function of a heating table of the same category and can adjust the angle and height of the placement turntable for supporting the ceramic disc, enabling convenient wafer unloading by operators and solving the problem of difficult angle adjustment of the ceramic disc. In actual use, every time an operator unloads a wafer, the ceramic disc needs to be rotated to adjust the angle, and then the wafer is unloaded. Otherwise, the risk of wafer cracking during unloading will be greatly increased. Especially during hot wafer unloading operation, the heating temperature is 140-160 °C, and the supporting area of the heating table is generally larger than that of the ceramic disc. The operator needs to wear special heat-insulating gloves to adjust the angle of the ceramic disc for wafer unloading, and the operation is relatively complex.

[0085] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0086] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer workbench device, characterized in that: include: An upper base support assembly (1) and a lower base support assembly (2); The upper base support assembly (1) comprises: a placement truncated table (11) and a first support column (12); the upper end surface of the placement truncated table (11) is used for placing a wafer disk, and the lower end surface of the placement truncated table (11) is connected to the first end of the first support column (12); The lower support assembly (2) comprises: a base (21), a second support column (22) and a rotating member; The rotating member is fixed to the first end of the second support column (22), and the first support column (12) is rotatably connected to the second support column (22) via the rotating member; the second end of the second support column (22) is fixed to the base (21); The rotating member is a bearing (23); the second supporting column (22) is a hollow cylindrical structure; The inner peripheral wall of the second support column (22) is sleeved and fixed on the outer ring (231) of the bearing (23); The inner ring (232) of the bearing (23) is sleeved and connected to the peripheral wall of the first support column (12).

2. The workbench device according to claim 1, characterized in that: The lower support assembly (2) further comprises: a locking rod (24); The second support column (22) is provided with a first through hole (221) extending in a radial direction and penetrating therethrough, the outer ring (231) is provided with a second through hole (233) extending in a radial direction and penetrating therethrough, and the outer peripheral wall of the inner ring (232) is provided with an annular groove; A plurality of balls are arranged between the inner ring (232) and the outer ring (231), and locking channels can be formed between adjacent balls; The locking rod (24) can sequentially pass through the first through hole (221), the second through hole (233), and the locking channel to engage with the annular groove.

3. The workbench device according to claim 2, characterized in that: The locking rod (24) is an L-shaped wrench.

4. The workbench device according to claim 2, characterized in that: The radius of the first through hole (221) is the same as the radius of the second through hole (233); The axial direction of the first through hole (221) coincides with the axial direction of the second through hole (233).

5. The workbench device according to claim 1, characterized in that: The inner ring (232) is movably sleeved and connected to the peripheral wall of the first support column (12); The second end of the first support column (12) is located inside the second support column (22) and is capable of axially sliding along the second support column (22).

6. The workbench device according to claim 5, characterized in that: The inner peripheral wall of the inner ring (232) is threadedly connected to the peripheral wall of the first support column (12).

7. The workbench device according to claim 5, characterized in that: A limiting truncated platform (13) is provided at the second end of the first supporting column (12); The axial direction of the limiting truncated cone (13) coincides with the axial direction of the first support column (12), and the radius of the limiting truncated cone (13) is greater than the radius of the inner circle (232) and is less than or equal to the inner circle radius of the second support column (22).

8. The workbench device according to claim 1, characterized in that: The cross section of the base (21) is circular, and the radius of the base (21) is greater than the radius of the placing truncated table (11).

9. The workbench device according to claim 1, characterized in that: The placing truncated table (11) is a groove-shaped structure with the middle upper end surface concave downward.

10. The workbench device according to any one of claims 1 to 9, characterized in that: Also includes: A heating resistance wire (3) and a temperature control device (4); The heating resistance wires (3) are evenly distributed on the placement truncated table (11) in the shape of concentric circles, the temperature control device (4) is arranged on the base (21), and the temperature control device (4) and the heating resistance wires (3) are connected via a circuit.

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