Injection molding fixing clamp for semiconductor processing

Abstract

The utility model discloses an injection molding fixing clamp for semiconductor processing, which belongs to the technical field of semiconductor processing and is characterized by comprising a fixing seat, a first clamp fixedly connected to the top of the fixing seat, a second clamp arranged at the top of the first clamp, and two clamping mechanisms arranged on opposite sides of the first clamp and the second clamp. The top of the first clamp is provided with two semiconductor bodies, the surfaces of the semiconductor bodies are fixedly connected with a plurality of pins, and the top of the second clamp is fixedly communicated with a feeding frame; the clamping mechanism comprises a protective pad, a protective plate, a plurality of stabilizing columns and a plurality of limiting springs, and the problems that in the process that most existing injection molding fixing clamps for semiconductor processing clamp and fix semiconductors, when pins of the semiconductors are clamped, the surfaces of the pins of the semiconductors are prone to being damaged, and the pins of the semiconductors are prone to being damaged are solved. And the processing quality of the semiconductor is influenced due to the fact that the pins are broken by pressing.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an injection molding fixing fixture for semiconductor processing. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. From the perspective of both technology and economic development, the importance of semiconductors is extremely great. During the semiconductor processing, a semiconductor is clamped and fixed by using an injection molding fixing fixture for semiconductor processing, so as to facilitate the injection molding processing thereof.

[0003] Chinese Patent with the publication number CN204340103U discloses a semiconductor injection mold, in which an injection inner channel is arranged at the middle position of the tail of the mold cavity of the upper mold base, the chip is located at the middle horizontal plane position of the mold cavity, and the distance between the chip and the tail end of the mold cavity is 0.3-0.5 times the width of the chip. Adopting this structural design can enable the injection resin to flow simultaneously along the upper and lower sides of the chip after flowing into the mold cavity, thereby overcoming the technical problem that the injection resin overflows from both sides due to excessive side pressure values during the up and down flow.

[0004] During the process of clamping and fixing a semiconductor by most of the existing injection molding fixing fixtures for semiconductor processing, when clamping the pins of the semiconductor, it is easy to damage the surface of the pins of the semiconductor and may also break the pins, thus affecting the processing quality of the semiconductor. Summary of the Utility Model

[0005] The utility model provides an injection molding fixing fixture for semiconductor processing, aiming at solving the problem that during the process of clamping and fixing a semiconductor by most of the existing injection molding fixing fixtures for semiconductor processing, when clamping the pins of the semiconductor, it is easy to damage the surface of the pins of the semiconductor and may also break the pins, thus affecting the processing quality of the semiconductor.

[0006] The utility model is realized as follows: an injection molding fixing fixture for semiconductor processing includes a fixed seat, a first fixture is fixedly connected to the top of the fixed seat, a second fixture is arranged on the top of the first fixture, two clamping mechanisms are arranged on the relative sides of the first fixture and the second fixture, two semiconductor bodies are arranged on the top of the first fixture, a plurality of pins are fixedly connected to the surface of the semiconductor body, and a feeding rack is fixedly communicated with the top of the second fixture;

[0007] The clamping mechanism includes a protective pad, a protective plate, a plurality of stabilizing columns and a plurality of limiting springs. The top of the protective pad is fixedly connected to the bottom of the protective plate. The top of the protective plate is fixedly connected to the bottom of the stabilizing columns. The surface of the stabilizing columns is in contact with the inside of the limiting springs. The bottom of the limiting springs extends into the inside of the protective plate and is fixedly connected to the inside of the protective plate.

[0008] In order to achieve the effect of facilitating the placement of the semiconductor body, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, placement grooves are provided on the opposite sides of the first fixture and the second fixture. One side of the semiconductor body close to the placement groove extends into the inside of the placement groove and is in contact with the inside of the placement groove.

[0009] In order to achieve the effect of facilitating the movement of the protective plate, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, movement grooves are provided on the opposite sides of the first fixture and the second fixture. One side of the protective plate close to the movement groove is slidably connected to the inside of the movement groove.

[0010] In order to achieve the effect of limiting the pins, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, a plurality of fixing grooves are provided on the opposite sides of the two movement grooves. One side of the pins close to the fixing grooves extends into the inside of the fixing grooves and is in contact with the inside of the fixing grooves.

[0011] In order to achieve the effect of sealing the inside of the fixing grooves, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, sealing pads are fixedly connected to the opposite sides of the two fixing grooves. The opposite sides of the two sealing pads are in close contact with the top and bottom of the pins respectively.

[0012] In order to achieve the effect of limiting the protective plate, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, a plurality of limiting blocks are fixedly connected to the surface of the protective plate. One side of the limiting blocks close to the fixing grooves extends into the inside of the fixing grooves and is in contact with the inside of the fixing grooves.

[0013] In order to achieve the effect of facilitating the movement of the stabilizing columns, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, movement holes are provided at the bottom of the top movement groove. The top of the stabilizing columns extends into the inside of the movement holes and is slidably connected to the inside of the movement holes.

[0014] In order to achieve the effect of facilitating the feeding, as an optimization of the injection molding fixing fixture for semiconductor processing of the present utility model, a discharge hole is provided between the opposite sides of the two placement grooves. The top of the discharge hole is fixedly communicated with the top of the feeding rack.

[0015] In order to achieve the effect of facilitating the movement of the second fixture, as an optimal choice for the injection - fixing fixture in semiconductor processing of the present utility model, a number of first sequence columns and four second sequence columns are fixedly connected to the top of the first fixture, and the surfaces of both the first sequence columns and the second sequence columns are slidably connected to the inside of the second fixture.

[0016] In order to achieve the effect of limiting the second fixture, as an optimal choice for the injection - fixing fixture in semiconductor processing of the present utility model, a limiting plate is fixedly connected to the surface of the second sequence column, and two lifting frames are fixedly connected to the top of the second fixture.

[0017] Compared with the prior art, the beneficial effects of the present utility model are:

[0018] For the injection - fixing fixture in semiconductor processing, by moving the semiconductor body to the opposite side of the first fixture and the second fixture, it is convenient to perform injection molding processing on the semiconductor body through the feeding rack. Fix the top of the protection plate to the bottom of the stabilizing column, so that the protection plate can move inside the second fixture through the stabilizing column, thereby driving the protection pad to contact the top of the pin, so that the protection pad can protect the pin. Set the limiting spring on the opposite side of the protection plate and the second fixture, so that the limiting spring can limit the protection plate, and thus avoid the protection plate from crushing the pin through the protection pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is the overall structure diagram of the injection - fixing fixture for semiconductor processing of the present utility model;

[0020] Figure 2 It is the three - dimensional connection schematic diagram of the semiconductor body and the placement groove in the present utility model;

[0021] Figure 3 It is the three - dimensional structure diagram of the bottom of the second fixture in the present utility model;

[0022] Figure 4 It is the three - dimensional connection schematic diagram of the clamping mechanism in the present utility model;

[0023] Figure 5 For the present utility model Figure 2 The partial enlarged view at A;

[0024] Figure 6 For the present utility model Figure 3 The partial enlarged view at B.

[0025] In the figure, 1 is a fixed seat; 2 is a first fixture; 3 is a second fixture; 4 is a second sequencing column; 5 is a lifting frame; 6 is a feeding frame; 7 is a first sequencing column; 8 is a placement groove; 9 is a limiting plate; 10 is a semiconductor body; 11 is a moving hole; 12 is a pin; 13 is a clamping mechanism; 1301 is a protective pad; 1302 is a protective plate; 1303 is a stabilizing column; 1304 is a limiting spring; 14 is a limiting block; 15 is a moving groove; 16 is a sealing gasket; 17 is a discharge hole; 18 is a fixing groove. Detailed implementation manners

[0026] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0027] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, in the description of the present utility model, the meaning of "a plurality of" is two or more, unless otherwise specifically defined.

[0028] Please refer to Figures 1-6 , the present utility model provides a technical solution: an injection molding fixing fixture for semiconductor processing, including a fixed seat 1, a first fixture 2 is fixedly connected to the top of the fixed seat 1, a second fixture 3 is arranged on the top of the first fixture 2, two clamping mechanisms 13 are arranged on the relative side of the first fixture 2 and the second fixture 3, two semiconductor bodies 10 are arranged on the top of the first fixture 2, a plurality of pins 12 are fixedly connected to the surface of the semiconductor body 10, and a feeding frame 6 is fixedly communicated with the top of the second fixture 3;

[0029] The clamping mechanism 13 includes a protective pad 1301, a protective plate 1302, a plurality of stabilizing columns 1303 and a plurality of limiting springs 1304. The top of the protective pad 1301 is fixedly connected to the bottom of the protective plate 1302, the top of the protective plate 1302 is fixedly connected to the bottom of the stabilizing column 1303, the surface of the stabilizing column 1303 is in contact with the inside of the limiting spring 1304, and the bottom of the limiting spring 1304 extends into the inside of the protective plate 1302 and is fixedly connected to the inside of the protective plate 1302.

[0030] In this embodiment: By moving the semiconductor body 10 to the opposite side of the first fixture 2 and the second fixture 3, it is convenient to perform injection molding on the semiconductor body 10 through the feeding rack 6, so that the top of the protective plate 1302 is fixedly connected to the bottom of the stabilizing column 1303, and then the protective plate 1302 can move inside the second fixture 3 through the stabilizing column 1303, thereby driving the protective pad 1301 to contact the top of the pin 12, so that the protective pad 1301 can protect the pin 12. The limiting spring 1304 is arranged on the opposite side of the protective plate 1302 and the second fixture 3, so that the limiting spring 1304 can limit the protective plate 1302, and thus prevent the protective plate 1302 from crushing the pin 12 through the protective pad 1301.

[0031] As a technical optimization scheme of the present utility model, placing grooves 8 are formed on the opposite sides of the first fixture 2 and the second fixture 3, and one side of the semiconductor body 10 close to the placing groove 8 extends into the placing groove 8 and contacts the inside of the placing groove 8.

[0032] In this embodiment: By making one side of the semiconductor body 10 close to the placing groove 8 contact the inside of the placing groove 8, the placing groove 8 can limit the semiconductor body 10, achieving the effect of facilitating the placement of the semiconductor body 10.

[0033] As a technical optimization scheme of the present utility model, moving grooves 15 are formed on the opposite sides of the first fixture 2 and the second fixture 3, and one side of the protective plate 1302 close to the moving groove 15 is slidably connected to the inside of the moving groove 15.

[0034] In this embodiment: By forming moving grooves 15 on the opposite sides of the first fixture 2 and the second fixture 3, it is convenient for the protective plate 1302 to move through the moving grooves 15, achieving the effect of facilitating the movement of the protective plate 1302.

[0035] As a technical optimization scheme of the present utility model, a plurality of fixing grooves 18 are formed on the opposite sides of the two moving grooves 15, and one side of the pin 12 close to the fixing groove 18 extends into the fixing groove 18 and contacts the inside of the fixing groove 18.

[0036] In this embodiment: By making the surface of the pin 12 contact the inside of the fixing groove 18, the fixing groove 18 can limit the pin 12, achieving the effect of limiting the pin 12.

[0037] As a technical optimization scheme of the present utility model, sealing gaskets 16 are fixedly connected to the opposite sides of the two fixing grooves 18, and the opposite sides of the two sealing gaskets 16 are in close contact with the top and bottom of the pin 12 respectively.

[0038] In this embodiment: By making the opposite sides of the two gaskets 16 be in close contact with the top and bottom of the pin 12 respectively, the gasket 16 can seal the inside of the fixing groove 18 while protecting the pin 12, achieving the effect of sealing the inside of the fixing groove 18.

[0039] As a technical optimization solution of the present utility model, a plurality of limiting blocks 14 are fixedly connected to the surface of the protection plate 1302, and one side of the limiting block 14 close to the fixing groove 18 extends into the fixing groove 18 and contacts the inside of the fixing groove 18.

[0040] In this embodiment: By making one side of the limiting block 14 close to the fixing groove 18 extend into the fixing groove 18 and contact the inside of the fixing groove 18, the limiting block 14 can be used to limit the movement of the protection plate 1302 through the fixing groove 18, achieving the effect of limiting the protection plate 1302.

[0041] As a technical optimization solution of the present utility model, a moving hole 11 is opened at the bottom of the top moving groove 15, and the top of the stabilizing column 1303 extends into the moving hole 11 and is slidably connected to the inside of the moving hole 11.

[0042] In this embodiment: By making the top of the stabilizing column 1303 extend into the moving hole 11, it is convenient for the stabilizing column 1303 to move inside the moving hole 11, achieving the effect of facilitating the movement of the stabilizing column 1303.

[0043] As a technical optimization solution of the present utility model, a discharge hole 17 is opened between the opposite sides of the two placement grooves 8, and the top of the discharge hole 17 is fixedly communicated with the top of the feeding rack 6.

[0044] In this embodiment: By fixedly communicating the top of the discharge hole 17 with the top of the feeding rack 6, it is convenient for the material to move through the feeding rack 6 into the discharge hole 17, achieving the effect of facilitating feeding.

[0045] As a technical optimization solution of the present utility model, a plurality of first sequence columns 7 and four second sequence columns 4 are fixedly connected to the top of the first fixture 2, and the surfaces of the first sequence columns 7 and the second sequence columns 4 are both slidably connected to the inside of the second fixture 3.

[0046] In this embodiment: By making the surface of the second fixture 3 be slidably connected to the surfaces of the first sequence columns 7 and the second sequence columns 4 respectively, the second fixture 3 can move through the first sequence columns 7 and the second sequence columns 4, achieving the effect of facilitating the movement of the second fixture 3.

[0047] As a technical optimization solution of the present utility model, a limiting plate 9 is fixedly connected to the surface of the second sequence column 4, and two lifting frames 5 are fixedly connected to the top of the second fixture 3.

[0048] In this embodiment, by fixedly connecting the inside of the limit plate 9 to the surface of the second sequence column 4, the limit plate 9 can be limited when it moves, achieving the effect of limiting the second fixture 3.

[0049] Working principle: First, by moving the semiconductor body 10 into the inside of the placement groove 8, the pin 12 extends to the inside of the fixing groove 18 and contacts the inside of the fixing groove 18 on the side close to the fixing groove 18. The lifting frame 5 drives the second fixture 3 to move on the surface of the second sequence column 4 to the surface of the first sequence column 7, thus facilitating the limitation of the second fixture 3. Then, the second fixture 3 drives the protection plate 1302 to move, and the protection plate 1302 drives the protection pad 1301 to contact the top of the pin 12 through the limit block 14 in the fixing groove 18, fixing the sealing gasket 16 inside the fixing groove 18, so as to seal the inside of the fixing groove 18 during feeding. The limit spring 1304 limits the protection plate 1302 when the protection plate 1302 moves, so that the protection pad 1301 protects the pin 12, and it can be avoided that the protection plate 1302 crushes the pin 12 through the protection pad 1301, thus facilitating the injection molding processing of the semiconductor body 10 by the feeding frame 6 through the feeding hole, and solving the problem that in the process of clamping and fixing most existing semiconductor processing injection molding fixtures to the semiconductor, when clamping the pins 12 of the semiconductor, it is easy to damage the surface of the pins 12 of the semiconductor and may also break the pins 12, thus affecting the processing quality of the semiconductor.

[0050] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An injection molding fixture for semiconductor processing, comprising a fixing seat (1), characterized in that: The top of the fixing seat (1) is fixedly connected to a first clamp (2), the top of the first clamp (2) is provided with a second clamp (3), two clamping mechanisms (13) are provided on opposite sides of the first clamp (2) and the second clamp (3), two semiconductor bodies (10) are provided on the top of the first clamp (2), a plurality of pins (12) are fixedly connected to the surface of the semiconductor body (10), and the top of the second clamp (3) is fixedly connected to a feeding rack (6); The clamping mechanism (13) includes a protective pad (1301), a protective plate (1302), a plurality of stabilizing columns (1303) and a plurality of limiting springs (1304); the top of the protective pad (1301) is fixedly connected to the bottom of the protective plate (1302); the top of the protective plate (1302) is fixedly connected to the bottom of the stabilizing column (1303); the surface of the stabilizing column (1303) is in contact with the inside of the limiting spring (1304); and the bottom of the limiting spring (1304) extends to the inside of the protective plate (1302) and is fixedly connected to the inside of the protective plate (1302).

2. The semiconductor processing injection molding fixture according to claim 1, characterized in that: A placement groove (8) is provided on the opposite side of the first clamp (2) and the second clamp (3), and a side of the semiconductor body (10) close to the placement groove (8) extends into the interior of the placement groove (8) and contacts the interior of the placement groove (8).

3. The semiconductor processing injection molding fixture according to claim 1, characterized in that: A movable groove (15) is provided on the opposite side of the first clamp (2) and the second clamp (3), and a side of the protective plate (1302) close to the movable groove (15) is slidably connected to the inside of the movable groove (15).

4. The semiconductor processing injection molding fixture according to claim 3, characterized in that: A plurality of fixed grooves (18) are provided on opposite sides of the two movable grooves (15), and a side of the pin (12) close to the fixed groove (18) extends to the inside of the fixed groove (18) and contacts the inside of the fixed groove (18).

5. The semiconductor processing injection molding fixture according to claim 4, characterized in that: The opposite sides of the two fixing grooves (18) are fixedly connected with sealing pads (16), and the opposite sides of the two sealing pads (16) are in tight contact with the top and bottom of the pin (12) respectively.

6. The semiconductor processing injection molding fixture according to claim 1, characterized in that: A plurality of limit blocks (14) are fixedly connected to the surface of the protective plate (1302), and a side of the limit block (14) close to the fixing groove (18) extends into the interior of the fixing groove (18) and contacts the interior of the fixing groove (18).

7. The semiconductor processing injection molding fixture according to claim 3, characterized in that: A moving hole (11) is provided at the bottom of the top moving groove (15), and the top of the stabilizing column (1303) extends to the inside of the moving hole (11) and is slidably connected to the inside of the moving hole (11).

8. The semiconductor processing injection molding fixture according to claim 1, characterized in that: A discharge hole (17) is provided between opposite sides of the two placement grooves (8), and the top of the discharge hole (17) is fixedly connected to the top of the feeding rack (6).

9. The semiconductor processing injection molding fixture according to claim 1, characterized in that: A plurality of first-order columns (7) and four second-order columns (4) are fixedly connected to the top of the first clamp (2), and the surfaces of the first-order columns (7) and the surfaces of the second-order columns (4) are both slidably connected to the interior of the second clamp (3).

10. The semiconductor processing injection molding fixture according to claim 9, characterized in that: The surface of the second positioning column (4) is fixedly connected to a limiting plate (9), and the top of the second clamp (3) is fixedly connected to two lifting frames (5).

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