Thermal management system and vehicle

Abstract

The utility model is suitable for the technical field of thermal management, and provides a thermal management system and a vehicle, the vehicle comprises the thermal management system, the thermal management system comprises a thermal management structure, a first water pump, a second water pump, a first cooler and a condenser, and the first water pump, the second water pump, the first cooler and the condenser are all installed on the thermal management structure; a first flow channel and a second flow channel are arranged in the heat management structure, and the heat management structure is provided with a first connecting part, a second connecting part, a third connecting part and a fourth connecting part; the first water pump, the first cooler, the first connecting part and the second connecting part all communicate with the first flow channel, and the second water pump, the condenser, the third connecting part and the fourth connecting part all communicate with the second flow channel; a first connecting pipe is connected between an outlet of the condenser and an inlet of the first cooler, the inlet of the condenser is connected with a first connector, and an outlet of the first cooler is connected with a second connector. In this way, the layout reasonability and compactness of the thermal management system can be improved, and the size of the thermal management system is reduced.

Description

Technical Field

[0001] This application belongs to the technical field of thermal management. More specifically, it relates to a thermal management system and a vehicle. Background Art

[0002] In related technologies, a thermal management system usually includes devices such as a cooler, a condenser, and a water pump. There are many devices, which makes it difficult to reasonably arrange multiple devices of the thermal management system. As a result, the volume of the thermal management system is relatively large, occupying a large space, leading to a low space utilization rate of the vehicle. Summary of the Utility Model

[0003] In view of the above problems, embodiments of this application provide a thermal management system and a vehicle, which can improve the layout rationality of the thermal management system.

[0004] In a first aspect, embodiments of this application provide a thermal management system, including a thermal management structure, a first water pump, a second water pump, a first cooler, and a condenser. The first water pump, the second water pump, the first cooler, and the condenser are all installed on the thermal management structure. The thermal management structure is provided with a first flow channel and a second flow channel, and the thermal management structure is provided with a first connection part, a second connection part, a third connection part, and a fourth connection part. The first water pump, the first cooler, the first connection part, and the second connection part are all communicated with the first flow channel, and the second water pump, the condenser, the third connection part, and the fourth connection part are all communicated with the second flow channel. A first connection pipe is connected between the outlet of the condenser and the inlet of the first cooler, and a first interface is connected to the inlet of the condenser, and a second interface is connected to the outlet of the first cooler.

[0005] In the thermal management system provided by the embodiments of this application, the first water pump, the second water pump, the first cooler, and the condenser are all installed on the thermal management structure, and the first flow channel and the second flow channel are arranged in the thermal management structure. The first water pump and the first cooler are both communicated with the first flow channel in the thermal management structure, so that a first coolant circuit can be formed. The second water pump and the condenser are both communicated with the second flow channel in the thermal management structure, so that a second coolant circuit can also be formed. A first connection pipe is connected between the outlet of the condenser and the inlet of the first cooler, so that a refrigerant circuit can be formed. With such an arrangement, the first water pump, the second water pump, the first cooler, and the condenser are integrated on the thermal management structure, improving the layout rationality and compactness of the first water pump, the second water pump, the first cooler, and the condenser, and saving the design of the pipelines for forming multiple coolant circuits, thereby helping to reduce the volume and occupied space of the thermal management system to improve the space utilization rate of the vehicle.

[0006] In some embodiments, the thermal management system further includes a liquid storage dryer installed on the thermal management structure. The inlet of the liquid storage dryer is communicated with the outlet of the condenser, and a first connection pipe is connected between the outlet of the liquid storage dryer and the inlet of the first cooler.

[0007] It is installed on the thermal management structure through a liquid receiver dryer, and a first connecting pipe is connected between the outlet of the liquid receiver dryer and the inlet of the first cooler, so that the liquid receiver dryer can be integrated into the thermal management structure, which helps to improve the layout compactness of the thermal management system and reduce the volume of the thermal management system.

[0008] In some embodiments, along the distribution direction of the condenser and the first cooler, at least part of the liquid receiver dryer is arranged between the condenser and the first cooler.

[0009] By arranging at least part of the liquid receiver dryer between the condenser and the first cooler, the condenser, the liquid receiver dryer and the first cooler can be distributed approximately along the refrigerant flow direction, so that the layout of the condenser, the liquid receiver dryer and the first cooler on the thermal management structure is very reasonable, which is beneficial to improving the layout compactness of the condenser, the liquid receiver dryer and the first cooler, and thus helps to reduce the volume of the thermal management system.

[0010] In some embodiments, the inlet of the liquid receiver dryer is installed on the outlet of the condenser to achieve connection.

[0011] With such an arrangement, the design of the refrigerant flow channel plate and pipeline for connecting the liquid receiver dryer and the condenser can be omitted, so that the compactness of the liquid receiver dryer and the condenser can be improved, which helps to reduce the volume of the thermal management system.

[0012] In some embodiments, the thermal management system further includes a valve island structure, which includes a first valve island part and a second valve island part. Both the first valve island part and the second valve island part are installed on the first cooler; the first valve island part is connected to the inlet of the first cooler, and is connected to the outlet of the condenser through a first connecting pipe; the second valve island part is connected to the outlet of the first cooler, and a second interface is arranged on the second valve island part.

[0013] Through the arrangement of the valve island structure, the first connecting pipe is connected between the first valve island part and the outlet of the condenser, and the second interface is arranged on the second valve island part, which is convenient for connecting each device in the refrigerant circuit and can save the pipeline design to simplify the structure of the thermal management system.

[0014] In some embodiments, the thermal management system further includes a first valve body, which is installed on the first valve island part and is connected between the first connecting pipe and the inlet of the first cooler.

[0015] By installing the first valve island part on the first cooler and the first valve body on the first valve island part, the first valve body does not occupy the space between the condenser and the first cooler, which helps to improve the layout compactness of multiple devices in the refrigerant circuit and thus helps to reduce the volume of the thermal management system.

[0016] In some embodiments, the thermal management system further includes a second connecting pipe;

[0017] The second connecting pipe is installed on the first valve island part and communicates with the first valve body through the first valve island part; alternatively, the second connecting pipe communicates between the outlet of the condenser and the first connecting pipe; or the second connecting pipe is connected to the first interface.

[0018] By providing the second connecting pipe, the refrigerant can be injected into the refrigerant circuit through the second connecting pipe without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system.

[0019] In some embodiments, a third interface is provided on the first valve island part; the thermal management system further includes a second valve body, which is installed on the first valve island part and communicates between the first connecting pipe and the third interface through the first valve island part; a fourth interface is provided on the second valve island part, and the fourth interface communicates with the second interface through the second valve island part.

[0020] By installing the first valve island part on the first cooler and the second valve body on the first valve island part, the second valve body does not occupy the space between the condenser and the first cooler, which helps to improve the layout compactness of multiple devices in the refrigerant circuit, thereby helping to reduce the volume of the thermal management system.

[0021] In some embodiments, the first valve body and / or the second valve body includes an expansion valve.

[0022] With such a setting, the first valve body can throttle and depressurize the refrigerant coming out of the first connecting pipe, so as to facilitate the refrigerant to cool the coolant in the first cooler. And / or, the second valve body can throttle and depressurize the refrigerant coming out of the first connecting pipe, so as to facilitate the refrigerant to perform a refrigeration function in the evaporator.

[0023] In some embodiments, the thermal management system further includes a third connecting pipe, which is installed on the first valve body island and communicates with the third interface through the first valve island part.

[0024] By providing the third connecting pipe, the refrigerant can be injected into the refrigerant circuit through the third connecting pipe without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system.

[0025] In some embodiments, the thermal management structure includes:

[0026] A thermal management component, which is internally provided with a first flow channel and a second flow channel, and is provided with a first connecting part, a second connecting part, a third connecting part and a fourth connecting part; both the first water pump and the second water pump are installed on the thermal management component;

[0027] The mounting bracket is installed on the thermal management component, and both the first cooler and the condenser are installed on the mounting bracket.

[0028] The thermal management structure is configured to include a thermal management component and a mounting bracket, so that the refrigerant side part can be installed on the mounting bracket, which facilitates the integration of multiple devices in the thermal management system, improves the layout rationality of the thermal management system, and reduces the volume of the thermal management system.

[0029] In some embodiments, at least part of the mounting bracket is installed on one side of the thermal management component, and both the first water pump and the second water pump are installed on the other side of the thermal management component.

[0030] With such an arrangement, the layout of each device in the thermal management system is more reasonable and compact, which helps to reduce the volume of the thermal management system.

[0031] In some embodiments, the mounting bracket is provided with a bracket for mounting on an external device.

[0032] With such an arrangement, it is convenient to install the thermal management system on an external device.

[0033] In some embodiments, the thermal management system further includes a water tank, which is detachably installed on the mounting bracket, and the water tank is connected to the first flow channel and the second flow channel.

[0034] By detachably connecting the water tank to the mounting bracket, the position arrangement of the water tank can be very flexible, which is convenient for the layout of the thermal management system in the vehicle.

[0035] In some embodiments, a fifth interface is provided on the thermal management structure, the fifth interface is connected to the first flow channel and the second flow channel, and the fifth interface is used to connect the water tank.

[0036] By connecting the fifth interface to the first flow channel and the second flow channel, and the fifth interface is used to connect the water tank, the coolant in the water tank can be directly or indirectly injected into the first flow channel and the second flow channel through the fifth interface, so that there is no need to set multiple water tanks for multiple flow channels, and thus there is no need to perform multiple liquid injection operations in sequence, which is convenient for injecting the coolant into the first flow channel and the second flow channel.

[0037] In some embodiments, the thermal management system further includes a water tank, the water tank is connected to the first flow channel and the second flow channel, and the water tank is provided with a plurality of exhaust ports distributed at intervals.

[0038] By providing a plurality of exhaust ports, the exhaust efficiency of the thermal management system can be improved.

[0039] In some embodiments, a fifth connection part and a sixth connection part are further provided on the thermal management structure, both the fifth connection part and the sixth connection part are connected to the first flow channel, and are used to connect the heating device respectively.

[0040] By adopting the above technical solution, the thermal management system can perform thermal management operations such as heating up and cooling down.

[0041] In some embodiments, a third flow channel is further provided inside the thermal management structure, and the thermal management structure is further provided with a seventh connection part and an eighth connection part; the thermal management system further includes a third water pump, the third water pump is installed on the thermal management structure, and the third water pump, the seventh connection part and the eighth connection part are all connected to the third flow channel;

[0042] The third flow channel is connected to the first cooler; alternatively, the third flow channel is connected to the condenser, and the thermal management structure is further provided with a ninth connection part and a tenth connection part, and the ninth connection part and the tenth connection part are used to connect the second cooler respectively.

[0043] By adopting the above technical solution, the thermal management system can form a third coolant loop, so that at least three coolant loops can be formed in the thermal management system to perform thermal management on different devices that require thermal management.

[0044] In some embodiments, a sixth interface and a seventh interface are provided on the thermal management structure, and both the sixth interface and the seventh interface are connected to the second flow channel; the condenser is connected to the sixth interface and the seventh interface to be connected to the second flow channel; a first installation part connecting the second flow channel and the third flow channel is provided on the thermal management structure, a third valve body is installed on the first installation part, the third flow channel is connected to the seventh interface through the third valve body, and the third flow channel is also connected to the sixth interface;

[0045] And / or, a second installation part connecting the first flow channel and the third flow channel is provided on the thermal management structure, and a fourth valve body is installed on the second installation part.

[0046] By adopting the above technical solution, the coolant can flow between the second flow channel and the third flow channel, and / or between the first flow channel and the third flow channel, which is convenient for the coolant in the water tank to enter the first flow channel, the second flow channel and the third flow channel, so that the coolant in the three coolant loops can circulate smoothly, thereby performing corresponding thermal management work.

[0047] In some embodiments, a third installation part connecting the first flow channel and the third flow channel is further provided on the thermal management structure, a fifth valve body is installed on the third installation part, and the first cooler is connected between the fourth valve body and the fifth valve body.

[0048] With such a setting, it is convenient to control the flow of the coolant in the first flow channel and the third flow channel, thereby facilitating the realization of various thermal management modes of the thermal management system.

[0049] In a second aspect, an embodiment of the present application provides a vehicle including a thermal management system.

[0050] The vehicle provided by the embodiment of the present application can improve the layout rationality and compactness of the thermal management system by adopting the thermal management systems involved in the above embodiments, which helps to reduce the volume and occupied space of the thermal management system, so as to improve the space utilization rate of the vehicle.

[0051] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specifically gives the specific implementation manners of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0053] Figure 1 Schematic diagram of the vehicle provided by some embodiments of the present application;

[0054] Figure 2 Schematic diagram of the principle of the thermal management system provided by some embodiments of the present application;

[0055] Figure 3 Partial schematic diagram of the thermal management system provided by some embodiments of the present application;

[0056] Figure 4 Partial three-dimensional structure diagram of the thermal management system provided by some embodiments of the present application;

[0057] Figure 5 For Figure 4 Enlarged view of part A in

[0058] Figure 6 Three-dimensional structure of the thermal management component of the thermal management system provided by some embodiments of the present application Figure 1 ;

[0059] Figure 7 Three-dimensional structure of the thermal management component of the thermal management system provided by some embodiments of the present application Figure 2 ;

[0060] Figure 8 Three-dimensional structure diagram of the mounting bracket of the thermal management system provided by some embodiments of the present application;

[0061] Figure 9 Three-dimensional structure diagram of the water tank of the thermal management system provided by some embodiments of the present application.

[0062] Among them, the reference numerals in the figures are as follows:

[0063] 1000 - Vehicle; 100 - Battery; 200 - Controller; 300 - Motor; 400 - Thermal management system; 10 - Coolant side part; 101 - First flow channel; 102 - Second flow channel; 103 - Third flow channel; 11 - Thermal management structure; 111 - Thermal management component; 1111 - First connection part; 1112 - Second connection part; 1113 - Third connection part; 1114 - Fourth connection part; 1115 - Fifth connection part; 1116 - Sixth connection part; 1117 - Seventh connection part; 1118 - Eighth connection part; 1119 - Ninth connection part; 1120 - Tenth connection part; 1121 - Fifth interface; 1122 - Sixth interface; 1123 - Seventh interface; 1124 - First mounting part; 1125 - Second mounting part; 1126 - Third mounting part; 1127 - Ninth interface; 1128 - Tenth interface; 1129 - Fourth mounting part; 1130 - Fifth mounting part; 1131 - Sixth mounting part; 112 - Mounting frame; 11021 - Frame body; 11022 - Bracket; 12 - Water pump assembly; 121 - First water pump; 122 - Second water pump; 123 - Third water pump; 13 - Water tank; 1301 - Eighth interface; 1302 - Exhaust port; 14 - Second cooler; 15 - Valve assembly; 151 - Third valve body; 152 - Fourth valve body; 153 - Fifth valve body; 16 - Heating device; 20 - Refrigerant side part; 21 - First cooler; 22 - Condenser; 23 - Pipeline assembly; 231 - Second connecting pipe; 232 - Third connecting pipe; 24 - First interface; 25 - Liquid storage dryer; 26 - Valve island structure; 261 - First valve island part; 2611 - Third interface; 262 - Second valve island part; 2621 - Second interface; 2622 - Fourth interface; 27 - First valve body; 28 - Second valve body; 29 - Compressor; 30 - Warm air core; 40 - Evaporator. Detailed implementation manners

[0064] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application and should not be construed as a limitation of the present application.

[0065] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0066] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0067] In the description of this application, the meaning of "a plurality" is more than two. Unless otherwise specifically defined, "more than two" includes two. Correspondingly, the meaning of "multiple groups" is more than two groups, including two groups.

[0068] In the description of this application, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "joined", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In the description of this application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: the existence of A, the simultaneous existence of A and B, and the existence of B. In addition, in this application, the character " / " generally represents an "or" relationship between the front and rear associated objects.

[0070] In the description of the embodiments of this application, unless otherwise clearly specified and limited, the technical terms "proximate" and "adjacent" refer to being close in position. For example, for the three components A1, A2, and B, if the distance between A1 and B is greater than the distance between A2 and B, then compared with A1, A2 is closer to B, that is, A2 is proximate to B, or it can also be said that B is proximate to A2. In other words, A2 is adjacent to B. Another example is that when there are multiple C components, the multiple C components are C1, C2... CN respectively. When one of the C components, such as C2, is closer to the B component than other C components, then B is proximate to C2, or it can also be said that C2 is proximate to B. In other words, C2 is adjacent to B.

[0071] Although the present application has been described with reference to preferred embodiments, various improvements can be made thereto and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any manner. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0072] In the related art, a thermal management system generally may include devices such as a cooler, a condenser, a water pump, etc. There are many devices, which makes it difficult to reasonably layout the multiple devices of the thermal management system, so that the volume of the thermal management system is relatively large, occupying a large space, resulting in a low space utilization rate of the vehicle.

[0073] In some cases, the multiple devices of the thermal management system are usually dispersedly arranged, which makes the integration degree of the thermal management system relatively low, resulting in a relatively large volume of the thermal management system. Moreover, when the multiple devices are dispersedly arranged, the multiple devices are usually connected through pipelines. And multiple coolant circuits usually need to be formed in the thermal management system, so that there are many and messy pipelines on the thermal management system, which need to occupy a large space, thus resulting in a relatively large volume of the thermal management system.

[0074] Based on the above considerations, the embodiments of the present application provide a thermal management system and a vehicle. By installing a first water pump, a second water pump, a first cooler and a condenser on a thermal management structure, and a first flow channel and a second flow channel are arranged in the thermal management structure. The first water pump and the first cooler are both communicated with the first flow channel in the thermal management structure, so that a first coolant circuit can be formed. The second water pump and the condenser are both communicated with the second flow channel in the thermal management structure, so that a second coolant circuit can also be formed. A first connecting pipe is connected between the outlet of the condenser and the inlet of the first cooler, so that a refrigerant circuit can be formed. With such a setting, the first water pump, the second water pump, the first cooler and the condenser are integrated on the thermal management structure, improving the rationality and compactness of the layout of the first water pump, the second water pump, the first cooler and the condenser, and saving the design of the pipelines for forming multiple coolant circuits, thus helping to reduce the volume and occupied space of the thermal management system to improve the space utilization rate of the vehicle.

[0075] The thermal management system provided by the embodiments of the present application can be applied to a vehicle for thermal management of at least one device or space such as a battery, a motor, a passenger compartment of the vehicle, etc.

[0076] Among them, classified by power source, the vehicle can be a fuel vehicle, a gas vehicle or a new energy vehicle. The new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. Classified by driving mode, the vehicle can be a front-wheel drive vehicle, a rear-wheel drive vehicle or a four-wheel drive vehicle.

[0077] The thermal management system provided by the embodiments of the present application can also be applied to other devices besides vehicles to perform thermal management on the devices or spaces to be thermally managed in these other devices.

[0078] In some embodiments, please refer to Figure 1 , Figure 1 which is a schematic diagram of vehicle 1000 provided by some embodiments of the present application. Inside vehicle 1000, a battery 100 is provided. The battery 100 can be arranged at the bottom, head or tail of the vehicle 1000. The battery 100 can be used to supply power to the vehicle 1000. For example, the battery 100 can serve as the operating power source of the vehicle 1000.

[0079] In some embodiments, please refer to Figure 1 , vehicle 1000 may further include a controller 200 and a motor 300. The controller 200 is used to control the battery 100 to supply power to the motor 300, for example, to meet the working power requirements during the start, navigation and driving of the vehicle 1000.

[0080] In some embodiments, the battery 100 can not only serve as the operating power source of the vehicle 1000, but also serve as the driving power source of the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.

[0081] The battery 100 can be a single physical module including one or more battery cells to provide higher voltage and capacity. When there are multiple battery cells, the multiple battery cells are connected in series, parallel or in a hybrid connection through a busbar component. A hybrid connection means that there are both series and parallel connections among the multiple battery cells.

[0082] In some embodiments, the battery 100 can be a battery module. When there are multiple battery cells, the multiple battery cells are arranged and fixed to form a battery module.

[0083] In some embodiments, the battery 100 can be a battery pack. The battery pack can include a box body and battery cells. As an example, the battery cells can be directly accommodated in the box body. As an example, the battery cells can also first form a battery module and then be accommodated in the box body.

[0084] As an example, multiple battery cells can be fixed to form a battery module through cable ties or the like.

[0085] As an example, multiple battery cells can also be fixed to form a battery module through end plates, side plates or the like.

[0086] A battery cell refers to the smallest unit for storing and outputting electric energy. Among them, the battery cell can be a secondary battery or a primary battery. The battery cell can be, but is not limited to, a metal battery, a lithium-sulfur battery, a sodium-ion battery, or a magnesium-ion battery. The battery cell can be in the shape of a cylinder, a flat body, a cuboid, or other shapes, etc.

[0087] Please refer to Figures 2 to 7 together with other attached drawings. Among them, Figure 2 is a schematic diagram of the thermal management system 400 provided by some embodiments of the present application, Figure 3 is a partial schematic diagram of the thermal management system 400 provided by some embodiments of the present application, Figure 4 is a partial three-dimensional structure diagram of the thermal management system 400 provided by some embodiments of the present application, Figure 5 is Figure 4 an enlarged view of part A in Figure 6 is a three-dimensional structure of the thermal management component 111 of the thermal management system 400 provided by some embodiments of the present application Figure 1 , Figure 7 is a three-dimensional structure of the thermal management component 111 of the thermal management system 400 provided by some embodiments of the present application Figure 2 . The thermal management system 400 provided by the embodiments of the present application includes a thermal management structure 11, a first water pump 121, a second water pump 122, a first cooler 21, and a condenser 22. The first water pump 121, the second water pump 122, the first cooler 21, and the condenser 22 are all installed on the thermal management structure 11. The thermal management structure 11 is internally provided with a first flow channel 101 and a second flow channel 102, and the thermal management structure 11 is provided with a first connection part 1111, a second connection part 1112, a third connection part 1113, and a fourth connection part 1114. The first water pump 121, the first cooler 21, the first connection part 1111, and the second connection part 1112 are all communicated with the first flow channel 101, and the second water pump 122, the condenser 22, the third connection part 1113, and the fourth connection part 1114 are all communicated with the second flow channel 102. A first connection pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, and a first interface 24 is connected to the inlet of the condenser 22, and a second interface 2621 is connected to the outlet of the first cooler 21.

[0088] It should be noted first that the thermal management system 400 can include a coolant side part 10 and a refrigerant side part 20. Among them, the coolant side part 10 can include the above-mentioned thermal management structure 11, the first water pump 121, and the second water pump 122, and the refrigerant side part 20 can include the above-mentioned first cooler 21 and the condenser 22.

[0089] The thermal management structure 11 refers to a structure with internal flow channels. Among them, the flow channels inside the thermal management structure 11 can be divided into a first flow channel 101 and a second flow channel 102. Both the first flow channel 101 and the second flow channel 102 are channels inside the thermal management structure 11. Specifically, both the first flow channel 101 and the second flow channel 102 are used to pass coolant.

[0090] The first connection part 1111, the second connection part 1112, the third connection part 1113, and the fourth connection part 1114 are all connection parts on the thermal management structure 11, which are used to connect the devices that need thermal management, and can be but are not limited to the battery 100, the motor 300, the heater core 30, etc.

[0091] The first water pump 121 and the second water pump 122 are both water pumps, which refer to machines used to transport liquids. Specifically, both the first water pump 121 and the second water pump 122 are used to transport coolant. Among them, the first water pump 121 is connected to the first flow channel 101, which means that both the inlet and the outlet of the first water pump 121 are connected to the first flow channel 101. The second water pump 122 is connected to the second flow channel 102, which means that both the inlet and the outlet of the second water pump 122 are connected to the second flow channel 102.

[0092] The first cooler 21 belongs to one type of heat exchanger and is used to cool liquids. Specifically, the first cooler 21 is used to cool coolant. Among them, the first cooler 21 can be a shell-and-tube cooler, a plate cooler, etc.

[0093] It should be noted that the first cooler 21 is internally provided with a fourth flow channel and a fifth flow channel that are isolated from each other. The first cooler 21 is connected to the first flow channel 101, which means that both the inlet and the outlet of the fourth flow channel are connected to the first flow channel 101.

[0094] The condenser 22 belongs to one type of heat exchanger and can turn gas or vapor into liquid during operation. Specifically, the condenser 22 releases heat during the working process, so as to heat up the coolant. Among them, the condenser 22 can be a shell-and-tube condenser 22, a plate condenser 22, etc.

[0095] It should be noted that the condenser 22 is internally provided with a sixth flow channel and a seventh flow channel that are isolated from each other. The condenser 22 is connected to the second flow channel 102, which means that both the inlet and the outlet of the sixth flow channel are connected to the second flow channel 102.

[0096] A first connecting pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, which means that a first connecting pipe is connected between the outlet of the seventh flow channel and the inlet of the fifth flow channel. That is, the opposite ends of the first connecting pipe can be respectively connected to the outlet of the seventh flow channel and the inlet of the fifth flow channel. In this way, the outlet of the seventh flow channel and the inlet of the fifth flow channel can be connected through the first connecting pipe. Among them, the first connecting pipe is a pipe structure.

[0097] The inlet of the condenser 22 is connected with a first interface 24, which means that the first interface 24 is connected to the inlet of the seventh flow channel, so that the first interface 24 can be connected to the seventh flow channel through the inlet of the seventh flow channel.

[0098] The outlet of the first cooler 21 is connected with a second interface 2621, which means that the second interface 2621 is connected to the outlet of the fifth flow channel, so that the second interface 2621 can be connected to the fifth flow channel through the outlet of the fifth flow channel.

[0099] It can be understood that in each embodiment of the present application, unless otherwise specified, the inlet of the condenser 22 is the inlet of the seventh flow channel of the condenser 22, the outlet of the condenser 22 is the outlet of the seventh flow channel of the condenser 22, the inlet of the first cooler 21 is the inlet of the fifth flow channel of the first cooler 21, and the outlet of the first cooler 21 is the outlet of the fifth flow channel of the first cooler 21.

[0100] The first interface 24 and the second interface 2621 can be but are not limited to being connected to the compressor 29. As an example, as Figure 2 shown, and in combination with other drawings, the first interface 24 is connected to the outlet of the compressor 29, and the second interface 2621 is connected to the inlet of the compressor 29.

[0101] Based on this, both the first water pump 121 and the first cooler 21 are connected to the first flow channel 101 in the thermal management structure 11, so that a first coolant circuit can be formed. As an example, as Figure 2 shown, and in combination with other drawings, the first connecting portion 1111 is connected to the inlet of the battery 100, and the second connecting portion 1112 is connected to the outlet of the battery 100, so that the first water pump 121, the first cooler 21 and the battery 100 can form a first coolant circuit. Among them, the first flow channel 101 is the flow channel in the first coolant circuit. In this way, under the pumping action of the first water pump 121, the coolant in the fourth flow channel of the first cooler 21 can flow from the outlet of the fourth flow channel into the battery 100, and then return to the fourth flow channel through the inlet of the fourth flow channel to realize the circulation of the coolant, and the coolant can perform thermal management operations such as cooling and heating on the battery 100 during the circulation process.

[0102] The second water pump 122 and the condenser 22 are both connected to the second flow channel 102 within the thermal management structure 11, thereby forming a second coolant circuit. As an example, as Figure 2 shown, and in combination with other drawings, the third connection portion 1113 is connected to the inlet of the heater core 30, and the fourth connection portion 1114 is connected to the outlet of the heater core 30, such that the second water pump 122, the condenser 22, and the heater core 30 can form a second coolant circuit. Among them, the second flow channel 102 is the flow channel in the second coolant circuit. In this way, under the pumping action of the second water pump 122, the coolant in the sixth flow channel of the condenser 22 can flow from the outlet of the sixth flow channel into the heater core 30, and then return to the sixth flow channel through the inlet circuit of the sixth flow channel to achieve the circulation of the coolant, and the coolant can perform thermal management on the heater core 30 during the circulation process.

[0103] A first connecting pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, such that the outlet of the condenser 22 and the inlet of the first cooler 21 are connected through the first connecting pipe, thereby forming a refrigerant circuit. As an example, as Figure 2 shown, and in combination with other drawings, the first interface 24 is connected to the outlet of the compressor 29, and the second interface 2621 is connected to the inlet of the compressor 29, such that the condenser 22, the first connecting pipe, the first cooler 21, and the compressor 29 can form a refrigerant circuit. In this way, the refrigerant can first be compressed by the compressor 29, and then flow through the first interface 24 and the inlet of the condenser 22 into the seventh flow channel of the condenser 22 in sequence, and then flow through the outlet of the condenser 22, the first connecting pipe, and the inlet of the first cooler 21 into the fifth flow channel of the first cooler 21 in sequence, and finally return to the compressor 29 from the outlet of the first cooler 21 and the second interface 2621 in sequence to achieve the circulation of the refrigerant.

[0104] Moreover, when the refrigerant flows into the seventh flow channel of the condenser 22, it can condense and release heat within the condenser 22. The coolant in the sixth flow channel can exchange heat with the refrigerant in the seventh flow channel to absorb heat and increase the temperature of the coolant in the sixth flow channel. The coolant with increased temperature after absorbing heat can flow to the heater core 30 under the pumping action of the second water pump 122, thereby providing a temperature increase effect to the heater core 30 so that the heater core 30 can provide warm air. That is, the coolant in the second coolant circuit can exchange heat with the refrigerant in the condenser 22, thereby providing a heating and temperature increase effect to the heater core 30. As an example, the heater core 30 is used to provide warm air to the passenger compartment of the vehicle 1000.

[0105] When the refrigerant flows into the fifth flow channel of the first cooler 21, the refrigerant can absorb heat and vaporize in the first cooler 21. The coolant in the fourth flow channel can exchange heat with the refrigerant in the fifth flow channel, so that the coolant in the fourth flow channel is cooled down. The cooled coolant can flow to the battery 100 under the pumping action of the first water pump 121, thereby performing thermal management on the battery 100, for example, cooling down the battery 100. That is, the coolant in the first coolant loop can exchange heat with the refrigerant in the first cooler 21, thereby performing thermal management on the battery 100. For example, the coolant in the first coolant loop can cool down the battery 100.

[0106] Among them, the coolant can be a medium for heat exchange, such as water, oil, etc.

[0107] In the thermal management system 400 provided by the embodiment of the present application, the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22 are all installed on the thermal management structure 11, and a first flow channel 101 and a second flow channel 102 are arranged in the thermal management structure 11. The first water pump 121 and the first cooler 21 are both connected to the first flow channel 101 in the thermal management structure 11, so as to form a first coolant loop. The second water pump 122 and the condenser 22 are both connected to the second flow channel 102 in the thermal management structure 11, so as to form a second coolant loop. A first connecting pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, so that the outlet of the condenser 22 and the inlet of the first cooler 21 can be connected through the first connecting pipe, thereby forming a refrigerant loop. With such a setting, the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22 are all integrated on the thermal management structure 11, improving the layout rationality and compactness of the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22, and also saving the design of the pipelines in multiple coolant loops, thereby helping to reduce the volume and occupied space of the thermal management system 400, so as to help improve the space utilization rate of the vehicle 1000.

[0108] Moreover, multiple coolant loops are usually arranged in the thermal management system 400. For example, it may include but is not limited to the first coolant loop and the second coolant loop involved above. Using the pipeline connection method to realize the connection of the devices in multiple coolant loops will result in a large number of pipelines and a complex layout, so there is inevitably a risk of coolant leakage, resulting in serious heat loss. In the embodiment of the present application, through the design of the first flow channel 101 and the second flow channel 102 inside the thermal management structure 11, the pipeline design in multiple coolant loops is saved, the risk of coolant leakage can be reduced, the heat loss can be reduced, and the assembly process of the thermal management system 400 can also be simplified.

[0109] In addition, a first connecting pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, eliminating the design of the refrigerant flow channel plate for connecting the condenser 22, the first cooler 21 and other devices in the refrigerant circuit, thus facilitating the connection between the condenser 22 and the first cooler 21, and helping to improve the layout compactness and rationality of the condenser 22 and the first cooler 21, reducing the volume and occupied space of the thermal management system 400, and thereby improving the space utilization rate of the vehicle 1000. In addition, with the design of the first connecting pipe, the problem of large weight caused by the design of the refrigerant flow channel plate can also be reduced.

[0110] In some embodiments, the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22 can be installed on the thermal management structure 11 by means of bolt fixing, rivet fixing, snap fixing, etc.

[0111] In some embodiments, please refer to Figures 2 to 4 together with other drawings. The thermal management system 400 may further include the above-mentioned battery 100, the heater core 30 and the compressor 29.

[0112] Among them, the inlet of the battery 100 communicates with the first connecting portion 1111, and the outlet of the battery 100 communicates with the second connecting portion 1112. The inlet of the heater core 30 communicates with the third connecting portion 1113, and the outlet of the heater core 30 communicates with the fourth connecting portion 1114. The inlet of the compressor 29 is connected to the second interface 2621, and the outlet of the compressor 29 is connected to the first interface 24.

[0113] In some embodiments, please refer to Figures 2 to 4 together with other drawings. The thermal management system 400 further includes a liquid receiver dryer 25, and the liquid receiver dryer 25 is installed on the thermal management structure 11. The inlet of the liquid receiver dryer 25 communicates with the outlet of the condenser 22, and a first connecting pipe is connected between the outlet of the liquid receiver dryer 25 and the inlet of the first cooler 21.

[0114] The liquid receiver dryer 25 refers to a dryer for storing liquid. Specifically, the liquid receiver dryer 25 is connected between the inlet of the first cooler 21 and the outlet of the condenser 22, and is used to store the excess refrigerant liquid coming out of the condenser 22.

[0115] A first connecting pipe is connected between the outlet of the liquid receiver dryer 25 and the inlet of the first cooler 21, which means that the opposite ends of the first connecting pipe are respectively connected to the outlet of the liquid receiver dryer 25 and the inlet of the first cooler 21, so that the outlet of the liquid receiver dryer 25 and the inlet of the first cooler 21 can be connected through the first connecting pipe.

[0116] With such an arrangement, the condenser 22, the liquid receiver dryer 25, the first connecting pipe, the first cooler 21 and the compressor 29 can form a refrigerant circuit, so that the refrigerant can sequentially pass through the compressor 29, the condenser 22, the liquid receiver dryer 25, the first connecting pipe and the first cooler 21, and then flow back to the compressor 29.

[0117] By mounting the liquid receiver dryer 25 on the thermal management structure 11 and connecting a first connecting pipe between the outlet of the liquid receiver dryer 25 and the inlet of the first cooler 21, the liquid receiver dryer 25 can be integrated on the thermal management structure 11, which helps to improve the layout compactness of the thermal management system 400 and reduce the volume of the thermal management system 400.

[0118] In some embodiments, please refer to Figure 4 , and in combination with other drawings. Along the distribution direction of the condenser 22 and the first cooler 21, at least a part of the liquid receiver dryer 25 is arranged between the condenser 22 and the first cooler 21.

[0119] By connecting the inlet of the liquid receiver dryer 25 to the outlet of the condenser 22 and connecting the outlet of the liquid receiver dryer 25 to the inlet of the first cooler 21 through the first connecting pipe, the refrigerant can sequentially pass through the condenser 22, the liquid receiver dryer 25 and the first cooler 21. Moreover, at least a part of the liquid receiver dryer 25 is arranged between the condenser 22 and the first cooler 21, so that the condenser 22, the liquid receiver dryer 25 and the first cooler 21 can be distributed generally along the refrigerant flow direction, thereby making the layout of the condenser 22, the liquid receiver dryer 25 and the first cooler 21 on the thermal management structure 11 very reasonable, which is beneficial to improving the layout compactness of the condenser 22, the liquid receiver dryer 25 and the first cooler 21, and thus helps to reduce the volume of the thermal management system 400.

[0120] In some embodiments, the inlet of the liquid receiver dryer 25 is mounted on the outlet of the condenser 22 to achieve connection.

[0121] With such an arrangement, the design of the refrigerant flow channel plate and pipeline for connecting the liquid receiver dryer 25 and the condenser 22 can be omitted, thereby improving the compactness of the liquid receiver dryer 25 and the condenser 22 and helping to reduce the volume of the thermal management system 400.

[0122] In some embodiments, please refer to Figures 2 to 5, and in combination with other drawings. The thermal management system 400 further includes a valve island structure 26, which includes a first valve island part 261 and a second valve island part 262. Both the first valve island part 261 and the second valve island part 262 are mounted on the first cooler 21. The first valve island part 261 is connected to the inlet of the first cooler 21, and the first valve island part 261 and the outlet of the condenser 22 are connected through a first connecting pipe. The second valve island part 262 is connected to the outlet of the first cooler 21, and a second interface 2621 is provided on the second valve island part 262.

[0123] The valve island structure 26 refers to a control component composed of multiple electronically controlled valves for controlling the refrigerant. Among them, the first valve island part 261 and the second valve island part 262 are two parts of the valve island structure 26.

[0124] Among them, the refrigerant in the seventh flow channel of the condenser 22 can flow through the first connecting pipe to the first valve island part 261, enter the fifth flow channel of the first cooler 21, and then flow out from the second interface 2621.

[0125] Through the setting of the valve island structure 26, the first connecting pipe is connected between the first valve island part 261 and the outlet of the condenser 22, and the second interface 2621 is provided on the second valve island part 262, which facilitates the connection of each device in the refrigerant circuit and can save the pipeline design to simplify the structure of the thermal management system 400.

[0126] Specifically, the opposite ends of the first connecting pipe are respectively connected to the first valve island part 261 and the outlet of the liquid receiver dryer 25.

[0127] In some embodiments, please refer to Figure 4 and Figure 5 , and in combination with other drawings. The thermal management system 400 further includes a first valve body 27, which is mounted on the first valve island part 261 and is connected between the first connecting pipe and the inlet of the first cooler 21.

[0128] The first valve body 27 is a valve for controlling the opening and closing between the first connecting pipe and the inlet of the first cooler 21.

[0129] Specifically, when the first valve body 27 is opened, the refrigerant in the condenser 22 can flow through the first connecting pipe to the first valve island part 261, and then flow through the first valve body 27 into the first cooler 21. When the first valve body 27 is opened, it is difficult for the refrigerant flowing out of the first condenser 22 to flow into the first cooler 21.

[0130] The first valve body 27 can be but is not limited to a pressure valve, a solenoid valve, an expansion valve, etc.

[0131] It is installed on the first cooler 21 through the first valve island part 261, and the first valve body 27 is installed on the first valve island part 261, so that the first valve body 27 does not occupy the space between the condenser 22 and the first cooler 21, which helps to improve the layout compactness of multiple devices in the refrigerant circuit, thereby helping to reduce the volume of the thermal management system 400.

[0132] In some embodiments, please refer to Figure 4 and Figure 5 , and in combination with other drawings. The thermal management system 400 further includes a second connecting pipe 231.

[0133] The second connecting pipe 231 is a pipe structure for injecting refrigerant into the refrigerant circuit.

[0134] In some embodiments, please refer to Figure 4 and Figure 5 , and in combination with other drawings. The second connecting pipe 231 is installed on the first valve island part 261 and is connected to the first valve body 27 through the first valve island part 261.

[0135] In this way, the refrigerant can enter the first valve island part 261 through the second connecting pipe 231 and then enter the first valve body 27. When the first valve body 27 is opened, the refrigerant can enter the first cooler 21 through the first valve body 27.

[0136] In some other embodiments, the second connecting pipe 231 is connected between the outlet of the condenser 22 and the first connecting pipe.

[0137] In this way, the refrigerant can enter the first connecting pipe through the second connecting pipe 231, and then enter the first valve island part 261 through the first connecting pipe to enter the first cooler 21.

[0138] In still some other embodiments, the second connecting pipe 231 is connected to the first interface 24.

[0139] In this way, the refrigerant can enter the first interface 24 through the second connecting pipe 231 to enter the condenser 22, then enter the first valve island part 261 through the first connecting pipe, and then enter the first cooler 21 through the first valve body 27.

[0140] Through the setting of the second connecting pipe 231, the refrigerant can be injected into the refrigerant circuit through the second connecting pipe 231 without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system 400.

[0141] In some embodiments, please refer to Figure 4 and Figure 5, and in combination with other attached drawings. A third interface 2611 is provided on the first valve island portion 261. The thermal management system 400 further includes a second valve body 28, which is installed on the first valve island portion 261 and is connected between the first connecting pipe and the third interface 2611 through the first valve island portion 261. A fourth interface 2622 is provided on the second valve island portion 262, and the fourth interface 2622 is connected to the second interface 2621 through the second valve island portion 262.

[0142] The second valve body 28 is a valve for controlling the opening and closing between the first connecting pipe and the third interface 2611.

[0143] The refrigerant in the condenser 22 can flow through the first connecting pipe into the first valve island portion 261 and then flow to the second valve body 28. When the second valve body 28 is opened, the refrigerant can flow through the second valve body 28 to the third interface 2611.

[0144] As an example, such as Figure 2 、 Figure 4 and Figure 5 shown, the third interface 2611 is used to connect to the inlet of the evaporator 40, and the fourth interface 2622 is used to connect to the outlet of the evaporator 40.

[0145] With such a setting, the refrigerant can be vaporized under the action of the evaporator 40 and flow from the outlet of the evaporator 40 through the fourth interface 2622 into the second valve island portion 262 and then flow through the second valve island portion 262 to the second interface 2621 to enter the compressor 29 from the inlet of the compressor 29. Then, the refrigerant enters the condenser 22 from the first interface 24 and then enters the first valve island portion 261 from the outlet of the condenser 22 through the first connecting pipe.

[0146] When the first valve body 27 is opened and the second valve body 28 is closed, the refrigerant in the first valve island portion 261 enters the first cooler 21 through the first valve body 27 and then enters the compressor 29 through the second interface 2621. When the second valve body 28 is opened and the first valve body 27 is closed, the refrigerant in the first valve island portion 261 flows through the second valve body 28 to the third interface 2611, so as to flow back to the evaporator 40 from the inlet of the evaporator 40.

[0147] Among them, the second valve body 28 can be but is not limited to a pressure valve, a solenoid valve, an expansion valve, etc.

[0148] With such a setting, by controlling the first valve body 27 and the second valve body 28, the usage mode of the refrigerant reflux can be controlled. Specifically, when the first valve body 27 is opened and the second valve body 28 is closed, the refrigerant coming out of the condenser 22 enters the first cooler 21, thereby cooling the coolant in the second coolant circuit. When the second valve body 28 is opened and the first valve body 27 is closed, the refrigerant coming out of the condenser 22 enters the evaporator 40, thereby evaporating and absorbing heat, so that the evaporator 40 is used to provide cold air. Therefore, the thermal management system 400 provided by the embodiment of the present application can not only perform thermal management on the battery 100, but also cooperate with the heater core 30 and the evaporator 40 to provide warm air or cold air.

[0149] The first valve island part 261 is installed on the first cooler 21, and the second valve body 28 is installed on the first valve island part 261, so that the second valve body 28 does not occupy the space between the condenser 22 and the first cooler 21, which helps to improve the layout compactness of multiple devices in the refrigerant circuit, thereby helping to reduce the volume of the thermal management system 400.

[0150] In some embodiments, please refer to Figure 4 and Figure 5 in combination with other drawings. The first valve body 27 is an expansion valve.

[0151] With such a setting, the first valve body 27 can throttle and depressurize the refrigerant coming out of the first connecting pipe, so as to facilitate the refrigerant to cool the coolant in the first cooler 21.

[0152] In some embodiments, please refer to Figure 4 and Figure 5 in combination with other drawings. The second valve body 28 includes an expansion valve.

[0153] With such a setting, the second valve body 28 can throttle and depressurize the refrigerant coming out of the first connecting pipe, so as to facilitate the refrigerant to perform refrigeration in the evaporator 40.

[0154] In some embodiments, please refer to Figure 4 and Figure 5 in combination with other drawings. The thermal management system 400 further includes a third connecting pipe 232. The third connecting pipe 232 is installed on the first valve body 27 island and is communicated with the third interface 2611 through the first valve island part 261.

[0155] The third connecting pipe 232 is a pipe structure for injecting refrigerant into the refrigerant circuit.

[0156] In this way, the refrigerant can enter the first valve island part 261 through the third connecting pipe 232, and then flow to the third interface 2611 to flow to the evaporator 40.

[0157] With the provision of the third connecting pipe 232, refrigerant can be injected into the refrigerant circuit through the third connecting pipe 232 without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system 400.

[0158] It should be supplemented here that the second connecting pipe 231 is used to inject high-pressure refrigerant into the refrigerant circuit so that the refrigerant can enter the first cooler 21 through the first valve body 27. The third connecting pipe 232 is used to inject low-pressure refrigerant into the refrigerant circuit so that the refrigerant can enter the evaporator 40.

[0159] In some embodiments, please refer to Figures 2 to 4 and in combination with other drawings. The thermal management structure 11 includes a thermal management component 111 and a mounting bracket 112. The thermal management component 111 is internally provided with the above-mentioned first flow channel 101 and the above-mentioned second flow channel 102, and the thermal management component 111 is provided with the above-mentioned first connecting portion 1111, second connecting portion 1112, third connecting portion 1113 and fourth connecting portion 1114. The first water pump 121 and the second water pump 122 are both mounted on the thermal management component 111. The mounting bracket 112 is mounted on the thermal management component 111, and the first cooler 21 and the condenser 22 are both mounted on the mounting bracket 112.

[0160] The thermal management component 111 can be but is not limited to a flow channel plate.

[0161] By setting the thermal management structure 11 to include the thermal management component 111 and the mounting bracket 112, the refrigerant side part 20 can be mounted on the mounting bracket 112, which facilitates the integration of multiple devices in the thermal management system 400, so as to improve the layout rationality of the thermal management system 400 and reduce the volume of the thermal management system 400.

[0162] In some embodiments, as Figure 3 and Figure 4 shown, the liquid storage dryer 25 is mounted on the mounting bracket 112.

[0163] In some embodiments, please refer to Figure 3 and Figure 4 and in combination with other drawings. At least part of the mounting bracket 112 is mounted on one side of the thermal management component 111, and the first water pump 121 and the second water pump 122 are both mounted on the other side of the thermal management component 111.

[0164] By mounting at least part of the mounting bracket 112 on one side of the thermal management component 111, and mounting the first cooler 21 and the condenser 22 on the mounting bracket 112, the first cooler 21 and the condenser 22 are located on one side of the thermal management component 111, while the first water pump 121 and the second water pump 122 are arranged on the other side of the thermal management component 111.

[0165] Such a setting makes the layout of each device in the thermal management system 400 more reasonable and compact, which helps to reduce the volume of the thermal management system 400.

[0166] Among them, the first cooler 21, the condenser 22 and the liquid storage dryer 25 are arranged on the same side of the thermal management component 111.

[0167] In some embodiments, please refer to Figure 3 、 Figure 4 and Figure 8 together with other drawings. Among them, Figure 8 is a three-dimensional structure diagram of the mounting bracket 112 of the thermal management system 400 provided by some embodiments of the present application. The mounting bracket 112 is provided with a bracket 11022 for mounting on an external device.

[0168] It can be understood that the mounting bracket 112 includes a frame body 11021 and a bracket 11022 provided on the frame body 11021. The frame body 11021 is mounted on the thermal management component 111, and the bracket 11022 is used for mounting on an external device. Among them, the bracket 11022 can be, but is not limited to, mounted on the whole vehicle.

[0169] Among them, the bracket 11022 can be set to one or more.

[0170] Such a setting facilitates the installation of the thermal management system 400 on an external device.

[0171] In some embodiments, please refer to Figure 3 、 Figure 4 and Figure 9 together with other drawings. Among them, Figure 9 is a three-dimensional structure diagram of the water tank 13 of the thermal management system 400 provided by some embodiments of the present application. The thermal management system 400 further includes a water tank 13, and the water tank 13 is communicated with the first flow channel 101 and the second flow channel 102.

[0172] The water tank 13 refers to a containing structure for storing coolant.

[0173] Among them, the water tank 13 is connected to the first flow channel 101 and the second flow channel 102. Specifically, the water tank 13 can be directly or indirectly connected to the first flow channel 101, and the water tank 13 can also be directly or indirectly connected to the second flow channel 102. For example, the water tank 13 can be directly connected to the first flow channel 101, and the first flow channel 101 and the second flow channel 102 are connected through a multi-way valve, so that after the coolant in the water tank 13 flows to the first flow channel 101, it can flow to the second flow channel 102 through the multi-way valve between the first flow channel 101 and the second flow channel 102, so as to indirectly connect the water tank 13 and the second flow channel 102. That is, the connection of the water tank 13 to the first flow channel 101 means that the coolant in the water tank 13 can flow into the first flow channel 101. Correspondingly, the connection of the water tank 13 to the second flow channel 102 means that the coolant in the water tank 13 can flow into the second flow channel 102. That is, the coolant in the water tank 13 can flow into the first flow channel 101 and the second flow channel 102, so that the water tank 13 is connected to the first flow channel 101 and the second flow channel 102.

[0174] Specifically, the water tank 13 is provided with an eighth interface 1301, and the eighth interface 1301 communicates with the internal space of the water tank 13. The water tank 13 is connected to the first flow channel 101 and the second flow channel 102 through the eighth interface 1301.

[0175] In some embodiments, please also refer to Figure 3 、 Figure 4 and Figure 9 , and in combination with other drawings. The water tank 13 is detachably mounted on the mounting frame 112.

[0176] Among them, the water tank 13 and the mounting frame 112 can be fixed by means of bolt fixation, rivet fixation, etc.

[0177] By detachably connecting the water tank 13 to the mounting frame 112, the position arrangement of the water tank 13 can be very flexible, which is convenient for the layout of the thermal management system 400 in the vehicle 1000.

[0178] In some embodiments, please refer to Figure 7 , and in combination with other drawings. The thermal management structure 11 is provided with a fifth interface 1121, and the fifth interface 1121 communicates with the first flow channel 101 and the second flow channel 102, and the fifth interface 1121 is used to connect the water tank 13.

[0179] The fifth interface 1121 communicates with the first flow channel 101 and the second flow channel 102. Specifically, the fifth interface 1121 can be directly or indirectly connected to the first flow channel 101, and the fifth interface 1121 can also be directly or indirectly connected to the second flow channel 102.

[0180] Specifically, the water tank 13 is connected to the fifth interface 1121 through the eighth interface 1301.

[0181] It is connected to the first flow channel 101 and the second flow channel 102 through the fifth interface 1121, and the fifth interface 1121 is used to connect to the water tank 13, so that the coolant in the water tank 13 can be directly or indirectly injected into the first flow channel 101 and the second flow channel 102. In this way, there is no need to set multiple water tanks 13 for multiple flow channels, so there is no need to perform multiple liquid injection operations in sequence, which is convenient for injecting coolant into the first flow channel 101 and the second flow channel 102.

[0182] In some embodiments, please refer to Figure 3 、 Figure 4 and Figure 9 as well, and in combination with other drawings. The thermal management system 400 further includes a water tank 13, the water tank 13 is connected to the first flow channel 101 and the second flow channel 102, and the water tank 13 is provided with a plurality of exhaust ports 1302 distributed at intervals.

[0183] The exhaust port 1302 refers to an opening for discharging gas.

[0184] By providing a plurality of exhaust ports 1302, the exhaust efficiency of the thermal management system 400 can be improved.

[0185] As an example, the water tank 13 is provided with two exhaust ports 1302 distributed at intervals.

[0186] In some embodiments, please refer to Figure 4 and Figure 6 as well, and in combination with other drawings. The thermal management structure 11 is further provided with a fifth connection part 1115 and a sixth connection part 1116. Both the fifth connection part 1115 and the sixth connection part 1116 are connected to the first flow channel 101 and are used to connect to the heating device 16 respectively.

[0187] Both the fifth connection part 1115 and the sixth connection part 1116 are connection parts on the thermal management structure 11.

[0188] The heating device 16 refers to a device for heating, specifically for heating the coolant. Among them, the heating device 16 can be but is not limited to a PCT (Positive Temperature Coefficient) heater.

[0189] Specifically, the fifth connection part 1115 is connected to the inlet of the heating device 16, and the sixth connection part 1116 is connected to the outlet of the heating device 16. In this way, the battery 100, the first water pump 121, the heating device 16 and the first cooler 21 can form a first coolant loop. The coolant can be cooled under the action of the first cooler 21, heated and raised in temperature under the action of the heating device 16, and then perform thermal management on the battery 100.

[0190] By adopting the above technical solution, the thermal management system 400 can perform thermal management operations of heating up and cooling down.

[0191] In some embodiments, please refer to Figures 2 to 7 together with other drawings. A third flow channel 103 is further provided inside the thermal management structure 11, and the thermal management structure 11 is further provided with a seventh connection part 1117 and an eighth connection part 1118. The thermal management system 400 further includes a third water pump 123, and the third water pump 123 is installed on the thermal management structure 11, and the third water pump 123, the seventh connection part 1117 and the eighth connection part 1118 are all communicated with the third flow channel 103.

[0192] The third flow channel 103 is a flow channel inside the thermal management structure 11. Specifically, the third flow channel 103 is provided in the thermal management component 111.

[0193] The seventh connection part 1117 and the eighth connection part 1118 are connection parts on the thermal management structure 11, and are used to connect the devices that need thermal management, which can be but are not limited to the battery 100, the motor 300, the heater core 30, etc. As an example, the seventh connection part 1117 is connected to the inlet of the motor 300, the eighth connection part 1118 is connected to the outlet of the motor 300, the first connection part 1111 is connected to the inlet of the battery 100, and the second connection part 1112 is connected to the outlet of the battery 100.

[0194] The third water pump 123 is a water pump, which refers to a machine used to transport liquids. The third water pump 123 being communicated with the third flow channel 103 means that the inlet of the third water pump 123 is communicated with the third flow channel 103, and the outlet of the third water pump 123 is communicated with the third flow channel 103.

[0195] In some embodiments, please refer to Figures 2 to 7 together with other drawings. The third flow channel 103 is communicated with the condenser 22, and the thermal management structure 11 is further provided with a ninth connection part 1119 and a tenth connection part 1120, and the ninth connection part 1119 and the tenth connection part 1120 are used to connect the second cooler 14 respectively.

[0196] The ninth connection part 1119 and the tenth connection part 1120 are connection parts on the thermal management structure 11. The ninth connection part 1119 is used to connect the inlet of the second cooler 14, and the tenth connection part 1120 is used to connect the outlet of the second cooler 14.

[0197] The third flow channel 103 is communicated with the condenser 22. Specifically, the opposite ends of the sixth flow channel of the condenser 22 are respectively communicated with the third flow channel 103.

[0198] In this way, the condenser 22, the third water pump 123, the second cooler 14, and the motor 300 can form a third coolant circuit. Under the pumping action of the third water pump 123, the coolant in the condenser 22 can flow to the second cooler 14 to be cooled down under the cooling action of the second cooler 14, and then flow to the motor 300 to cool the motor 300, and then return to the condenser 22.

[0199] In some other embodiments, the third flow channel 103 communicates with the first cooler 21.

[0200] Specifically, the inlet and the outlet of the fourth flow channel of the first cooler 21 communicate with the third flow channel 103 respectively.

[0201] In this way, the first cooler 21, the third water pump 123, and the motor 300 can form a third coolant circuit. Under the action of the third water pump 123, the coolant in the first cooler 21 can flow to the motor 300 after being cooled down to cool the motor 300, and then return to the first cooler 21.

[0202] By adopting the above technical solution, the heat management system 400 can form a third coolant circuit, so that at least three coolant circuits can be formed in the heat management system 400 to perform heat management on different devices that require heat management.

[0203] It should be supplemented here that the water tank 13 can be directly or indirectly communicated with the third flow channel 103 so that the coolant in the water tank 13 can be injected into the third coolant circuit.

[0204] In some embodiments, please refer to Figures 2 to 7 , and in combination with other drawings. The heat management structure 11 is provided with a sixth interface 1122 and a seventh interface 1123, and both the sixth interface 1122 and the seventh interface 1123 communicate with the second flow channel 102. The condenser 22 communicates with the sixth interface 1122 and the seventh interface 1123 to communicate with the second flow channel 102. The heat management structure 11 is provided with a first mounting portion 1124 that communicates with the second flow channel 102 and the third flow channel 103. A third valve body 151 is installed on the first mounting portion 1124. The third flow channel 103 communicates with the seventh interface 1123 through the third valve body 151, and the third flow channel 103 also communicates with the sixth interface 1122.

[0205] The inlet of the sixth flow channel of the condenser 22 communicates with the sixth interface 1122, and the outlet of the sixth flow channel communicates with the seventh interface 1123, so that the condenser 22 communicates with the second flow channel 102 through the sixth interface 1122 and the seventh interface 1123.

[0206] The third valve body 151 is a valve for controlling the flow of coolant in the second flow channel 102 or the third flow channel 103.

[0207] The first installation part 1124 refers to the installation part for installing the third valve body 151. The first installation part 1124 communicates with the second flow channel 102 and the third flow channel 103, and the third valve body 151 is installed on the first installation part 1124 so that the third valve body 151 can communicate with the second flow channel 102 and the third flow channel 103.

[0208] The third valve body 151 is provided between the third flow channel 103 and the seventh interface 1123 and communicates with the sixth interface 1122.

[0209] In this way, the coolant in the condenser 22 can flow to the seventh interface 1123. By adjusting the third valve body 151, the coolant at the seventh interface 1123 can flow through the third valve body 151 to the second flow channel 102, and then flow to the heater core 30 under the pumping action of the second water pump 122, and then return to the condenser 22 through the sixth interface 1122. By adjusting the third valve body 151, the coolant at the seventh interface 1123 can flow through the third valve body 151 to the third flow channel 103, and then flow to the motor 300 under the pumping action of the third water pump 123, and then return to the condenser 22 through the sixth interface 1122.

[0210] With such a setting, the second flow channel 102 and the third flow channel 103 can be connected, so that the coolant can be injected from the second flow channel 102 into the third flow channel 103 or from the third flow channel 103 into the second flow channel 102.

[0211] In some embodiments, please refer to Figures 2 to 7 , and in combination with other drawings. The thermal management structure 11 is provided with a second installation part 1125. The second installation part 1125 communicates with the first flow channel 101 and the third flow channel 103, and a fourth valve body 152 is installed on the second installation part 1125.

[0212] The second installation part 1125 is an installation part for installing the fourth valve body 152. The second installation part 1125 and the first installation part 1124 are spaced apart. The second installation part 1125 communicates with the first flow channel 101 and the third flow channel 103, and the fourth valve body 152 is installed on the second installation part 1125 so that the fourth valve body 152 communicates with the first flow channel 101 and the third flow channel 103.

[0213] In this way, under the action of the first water pump 121, the coolant in the third flow channel 103 can flow through the fourth valve body 152 into the first flow channel 101, so as to circulate in the first coolant loop. Under the action of the third water pump 123, the coolant in the first flow channel 101 can also flow through the fourth valve body 152 into the third flow channel 103, so as to circulate in the third coolant loop.

[0214] By adopting the above technical solution, the coolant can flow between the second flow channel 102 and the third flow channel 103, and / or between the first flow channel 101 and the third flow channel 103. In this way, it is convenient for the coolant in the water tank 13 to enter the first flow channel 101, the second flow channel 102 and the third flow channel 103, so that the coolant in the three coolant loops can circulate smoothly, thereby performing corresponding thermal management work.

[0215] Moreover, by providing the first mounting portion 1124 on the thermal management structure 11 and mounting the third valve body 151 on the first mounting portion 1124, the third valve body 151 can be made to connect the second flow channel 102 and the third flow channel 103, thus facilitating the compact layout of the third valve body 151 in the thermal management system 400 and helping to reduce the volume of the thermal management system 400.

[0216] By providing the second mounting portion 1125 on the thermal management structure 11 and mounting the fourth valve body 152 on the second mounting portion 1125, the fourth valve body 152 can be made to connect the first flow channel 101 and the third flow channel 103, thus facilitating the compact layout of the fourth valve body 152 in the thermal management system 400 and helping to reduce the volume of the thermal management system 400.

[0217] In some embodiments, please refer to Figures 2 to 7 and other attached drawings in combination. The thermal management structure 11 is further provided with a third mounting portion 1126. The third mounting portion 1126 is connected to the first flow channel 101 and the third flow channel 103. A fifth valve body 153 is mounted on the third mounting portion 1126. The first cooler 21 is connected between the fourth valve body 152 and the fifth valve body 153.

[0218] The third mounting portion 1126 is a mounting portion for mounting the fifth valve body 153. The second mounting portion 1125, the first mounting portion 1124 and the third mounting portion 1126 are spaced apart. The third mounting portion 1126 is connected to the first flow channel 101 and the third flow channel 103, and the fifth valve body 153 is mounted on the third mounting portion 1126, so that the fifth valve body 153 is connected to the first flow channel 101 and the third flow channel 103.

[0219] The first cooler 21 is connected between the fourth valve body 152 and the fifth valve body 153. That is, the inlet of the fourth flow channel of the first cooler 21 is connected to the fifth valve body 153, and the outlet of the fourth flow channel is connected to the fourth valve body 152.

[0220] With such an arrangement, it is convenient to control the flow of the coolant in the first flow channel 101 and the third flow channel 103, thereby facilitating the realization of various thermal management modes of the thermal management system 400.

[0221] Among them, the third valve body 151 can be but is not limited to a three-way valve, the fourth valve body 152 can be but is not limited to a five-way valve, and the fifth valve body 153 can be but is not limited to a six-way valve.

[0222] In some embodiments, please refer to Figure 2 and Figure 7 together, and in combination with other drawings. The thermal management component 111 is further provided with a fourth mounting portion 1129. The fourth mounting portion 1129 is connected to the first flow channel 101, and the first water pump 121 is mounted on the fourth mounting portion 1129. In this way, the first water pump 121 can be connected to the first flow channel 101 through the fourth mounting portion 1129.

[0223] In some embodiments, please refer to Figure 2 and Figure 7 together, and in combination with other drawings. The thermal management component 111 is further provided with a fifth mounting portion 1130. The fifth mounting portion 1130 is connected to the second flow channel 102, and the second water pump 122 is mounted on the fifth mounting portion 1130. In this way, the second water pump 122 can be connected to the second flow channel 102 through the fifth mounting portion 1130.

[0224] In some embodiments, please refer to Figure 2 and Figure 7 together, and in combination with other drawings. The thermal management component 111 is further provided with a sixth mounting portion 1131. The sixth mounting portion 1131 is connected to the third flow channel 103, and the third water pump 123 is mounted on the sixth mounting portion 1131. In this way, the third water pump 123 can be connected to the third flow channel 103 through the sixth mounting portion 1131.

[0225] By mounting the first water pump 121, the second water pump 122, and the third water pump 123 on the corresponding mounting portions of the thermal management component 111, they can be connected to the corresponding flow channels. In this way, it is convenient to improve the integration degree in the thermal management system 400 and helps to reduce the volume of the thermal management system 400.

[0226] It should be noted here that the first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, the fourth connecting portion 1114, the fifth connecting portion 1115, the sixth connecting portion 1116, the seventh connecting portion 1117, the eighth connecting portion 1118, the ninth connecting portion 1119, the tenth connecting portion 1120, the first mounting portion 1124, the second mounting portion 1125, the third mounting portion 1126, the fourth mounting portion 1129, the fifth mounting portion 1130 and the sixth mounting portion 1131 are distributed at intervals on the heat management component 111. Specifically, the first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, the fourth connecting portion 1114, the fifth connecting portion 1115, the sixth connecting portion 1116, the seventh connecting portion 1117, the eighth connecting portion 1118, the ninth connecting portion 1119, the tenth connecting portion 1120, the first mounting portion 1124, the second mounting portion 1125, the third mounting portion 1126, the fourth mounting portion 1129, the fifth mounting portion 1130 and the sixth mounting portion 1131 are partial structures of the heat management component 111.

[0227] Moreover, the first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, the fourth connecting portion 1114, the fifth connecting portion 1115, the sixth connecting portion 1116, the seventh connecting portion 1117 and the eighth connecting portion 1118 are provided on one side of the heat management component 111, and the condenser 22, the first cooler 21 and the liquid storage dryer 25 are also installed on this side of the heat management component 111.

[0228] The ninth connecting portion 1119, the tenth connecting portion 1120, the first mounting portion 1124, the second mounting portion 1125, the third mounting portion 1126, the fourth mounting portion 1129, the fifth mounting portion 1130 and the sixth mounting portion 1131 are provided on the other side of the heat management component 111.

[0229] In some embodiments, please refer to Figure 4 and Figure 6 and in combination with other drawings. The heat management component 111 is also provided with a ninth interface 1127 and a tenth interface 1128, and both the ninth interface 1127 and the tenth interface 1128 communicate with the first flow channel 101. The ninth interface 1127 is connected to the inlet of the fourth flow channel of the first cooler 21, and the tenth interface 1128 is connected to the outlet of the fourth flow channel of the first cooler 21. With such a setting, the integration degree of the first cooler 21 and the heat management structure 11 can be improved.

[0230] It should be supplemented and explained here that the third valve body 151, the fourth valve body 152 and the fifth valve body 153 can form a valve assembly 15, the first water pump 121, the second water pump 122 and the third water pump 123 can form a water pump assembly 12, and the second connecting pipe 231 and the third connecting pipe 232 can form a pipeline assembly 23.

[0231] Please refer to Figure 1 and Figure 2 also in combination with other attached drawings. The vehicle 1000 provided by the embodiment of the present application includes a thermal management system 400. Among them, the thermal management system 400 in this embodiment is the same as the thermal management system 400 in the previous embodiment. For specific details, please refer to the relevant description of the thermal management system 400 in the previous embodiment, which will not be elaborated here.

[0232] The vehicle 1000 provided by the embodiment of the present application, by adopting the above-mentioned thermal management system 400, can improve the layout rationality and compactness of the thermal management system 400, contribute to reducing the volume and occupied space of the thermal management system 400, so as to improve the space utilization rate of the vehicle 1000.

[0233] As one of the embodiments of the present application, as Figures 2 to 8 shown, the thermal management system 400 includes a thermal management structure 11, a first water pump 121, a second water pump 122, a third water pump 123, a water tank 13, a first cooler 21, a condenser 22, a liquid receiver dryer 25, a first valve body 27, a second valve body 28, a third valve body 151, a fourth valve body 152, and a fifth valve body 153. The thermal management structure 11 includes a thermal management component 111 and a mounting bracket 112 mounted on one side of the thermal management component 111. The water tank 13 is detachably mounted on the mounting bracket 112. The first cooler 21, the condenser 22, and the liquid receiver dryer 25 are all mounted on the mounting bracket 112. The thermal management component 111 is provided with a first flow channel 101, a second flow channel 102, and a third flow channel 103. And one side of the thermal management component 111 is provided with a first connection portion 1111, a second connection portion 1112, a third connection portion 1113, a fourth connection portion 1114, a fifth connection portion 1115, a sixth connection portion 1116, a seventh connection portion 1117, an eighth connection portion 1118, a sixth interface 1122, a seventh interface 1123, a ninth interface 1127, and a tenth interface 1128. On the other side of the thermal management component 111, there are spaced apart a first mounting portion 1124, a second mounting portion 1125, a third mounting portion 1126, a fourth mounting portion 1129, a fifth mounting portion 1130, a sixth mounting portion 1131, a ninth connection portion 1119, a tenth connection portion 1120, and a fifth interface 1121.

[0234] The first connection part 1111, the second connection part 1112, the fifth connection part 1115, the sixth connection part 1116, the fourth installation part 1129, the ninth interface 1127 and the tenth interface 1128 are all connected to the first flow channel 101. The first connection part 1111 and the second connection part 1112 are used to connect the battery 100 respectively. The fifth connection part 1115 and the sixth connection part 1116 are used to connect the heating device 16 respectively. The first water pump 121 is installed on the fourth installation part 1129, and the first cooler 21 is provided with a fourth flow channel and a fifth flow channel which are distributed at intervals. The fourth flow channel of the first cooler 21 is connected to the ninth interface 1127 and the tenth interface 1128 respectively, so that the first cooler 21, the heating device 16, the first water pump 121 and the battery 100 form a first coolant loop.

[0235] The third connection part 1113, the fourth connection part 1114, the sixth interface 1122, the seventh interface 1123, the fifth installation part 1130 are all connected to the second flow channel 102. The third connection part 1113 and the fourth connection part 1114 are connected to the heater core 30 respectively. The second water pump 122 is installed on the fifth installation part 1130, and the condenser 22 is provided with a sixth flow channel and a seventh flow channel which are distributed at intervals. The sixth flow channel of the condenser 22 is connected to the sixth interface 1122 and the seventh interface 1123 respectively, so that the condenser 22, the second water pump 122 and the heater core 30 form a second coolant loop.

[0236] The seventh connection part 1117, the eighth connection part 1118, the ninth connection part 1119, the tenth connection part 1120 and the sixth installation part 1131 are all connected to the third flow channel 103. And the sixth interface 1122 and the seventh interface 1123 are connected to the third flow channel 103. The seventh connection part 1117 and the eighth connection part 1118 are connected to the motor 300 respectively. The ninth connection part 1119 and the tenth connection part 1120 are connected to the second cooler 14 respectively. The third water pump 123 is installed on the sixth installation part 1131, so that the condenser 22, the third water pump 123, the second cooler 14 and the motor 300 form a third coolant loop.

[0237] The first mounting portion 1124 communicates with the second flow channel 102 and the third flow channel 103, and the third valve body 151 is mounted on the first mounting portion 1124. The third valve body 151 is disposed between the seventh interface 1123 and the third flow channel 103, and the third flow channel 103 communicates with the sixth interface 1122. Both the second mounting portion 1125 and the third mounting portion 1126 communicate with the first flow channel 101 and the third flow channel 103, and both the ninth interface 1127 and the tenth interface 1128 communicate between the second mounting portion 1125 and the third mounting portion 1126. The fourth valve body 152 is mounted on the second mounting portion 1125, and the fifth valve body 153 is mounted on the third mounting portion 1126. The third valve body 151 is a three-way valve, the fourth valve body 152 is a five-way valve, and the fifth valve body 153 is a six-way valve.

[0238] At least a part of the liquid storage dryer 25 is disposed between the first cooler 21 and the condenser 22. The inlet of the condenser 22 is provided with a first interface 24, and the inlet of the liquid storage dryer 25 is connected to the outlet of the condenser 22. A valve island structure 26 is provided on the first cooler 21. The valve island structure 26 includes a first valve island portion 261 and a second valve island portion 262. The first valve island portion 261 communicates with the outlet of the liquid storage dryer 25 through a first connecting pipe. The first valve island portion 261 communicates with the inlet of the first cooler 21. The first valve body 27 is mounted on the first valve island portion 261 and communicates between the inlet of the first cooler 21 and the first connecting pipe. A second connecting pipe 231 communicating with the first valve body 27 is further mounted on the first valve island portion 261. A second valve body 28 is further mounted on the first valve island portion 261. A third interface 2611 is provided on the first valve island portion 261, and the second valve body 28 communicates between the first connecting pipe and the third interface 2611. The second valve island portion 262 communicates with the outlet of the first cooler 21 and is provided with a second interface 2621 and a fourth interface 2622. The fourth interface 2622 communicates with the second interface 2621 through the second valve island portion 262. The first interface 24 and the second interface 2621 are respectively connected to the compressor 29, and the third interface 2611 and the fourth interface 2622 are respectively connected to the evaporator 40. A third connecting pipe 232 is further mounted on the first valve island portion 261. The third connecting pipe 232 communicates with the third interface 2611 through the first valve island portion 261.

[0239] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thermal management system, characterized in that: The invention comprises a thermal management structure, a first water pump, a second water pump, a first cooler and a condenser, wherein the first water pump, the second water pump, the first cooler and the condenser are all installed on the thermal management structure; a first flow channel and a second flow channel are arranged inside the thermal management structure, and the thermal management structure is provided with a first connecting part, a second connecting part, a third connecting part and a fourth connecting part; the first water pump, the first cooler, the first connecting part and the second connecting part are all connected to the first flow channel, and the second water pump, the third connecting part and the fourth connecting part of the condenser are all connected to the second flow channel; a first connecting pipe is connected between the outlet of the condenser and the inlet of the first cooler, and the inlet of the condenser is connected to a first interface, and the outlet of the first cooler is connected to a second interface.

2. The thermal management system according to claim 1, characterized in that: The thermal management system further includes a liquid storage drier installed on the thermal management structure, the inlet of the liquid storage drier is connected to the outlet of the condenser, and the first connecting pipe is connected between the outlet of the liquid storage drier and the inlet of the first cooler.

3. The thermal management system according to claim 2, characterized in that: Along the distribution direction of the condenser and the first cooler, at least a portion of the liquid storage drier is disposed between the condenser and the first cooler.

4. The thermal management system according to claim 2, characterized in that: The inlet of the liquid storage drier is installed on the outlet of the condenser to achieve communication.

5. The thermal management system according to any one of claims 1 to 4, characterized in that: The thermal management system also includes a valve island structure, which includes a first valve island portion and a second valve island portion, and the first valve island portion and the second valve island portion are both installed on the first cooler; the first valve island portion is connected to the inlet of the first cooler, and the first valve island portion and the outlet of the condenser are connected through the first connecting pipe; the second valve island portion is connected to the outlet of the first cooler, and the second interface is arranged on the second valve island portion.

6. The thermal management system according to claim 5, characterized in that: The thermal management system further includes a first valve body, which is mounted on the first valve island portion and communicated between the first connecting pipe and an inlet of the first cooler.

7. The thermal management system according to claim 6, characterized in that: The thermal management system further includes a second connecting pipe; The second connecting pipe is installed on the first valve island portion and is connected to the first valve body through the first valve island portion; or, the second connecting pipe is connected between the outlet of the condenser and the first connecting pipe; or, the second connecting pipe is connected to the first interface.

8. The thermal management system according to claim 6, characterized in that: A third interface is provided on the first valve island portion; the thermal management system also includes a second valve body, which is installed on the first valve island portion and is connected between the first connecting pipe and the third interface through the first valve island portion; a fourth interface is provided on the second valve island portion, and the fourth interface is connected to the second interface through the second valve island portion.

9. The thermal management system according to claim 8, characterized in that: The first valve body and / or the second valve body comprises an expansion valve.

10. The thermal management system according to claim 8 or 9, characterized in that: The thermal management system further includes a third connecting pipe, which is installed on the first valve body island and communicated with the third port through the first valve island.

11. The thermal management system according to any one of claims 1 to 4, characterized in that: The thermal management structure comprises: a thermal management component, in which the first flow channel and the second flow channel are provided, and the first connection portion, the second connection portion, the third connection portion and the fourth connection portion are provided; the first water pump and the second water pump are both installed on the thermal management component; A mounting frame is mounted on the thermal management component, and the first cooler and the condenser are both mounted on the mounting frame.

12. The thermal management system according to claim 11, characterized in that: At least a portion of the mounting frame is mounted on one side of the thermal management component, and the first water pump and the second water pump are both mounted on the other side of the thermal management component.

13. The thermal management system according to claim 11, characterized in that: The mounting bracket is provided with a bracket for mounting on an external device.

14. The thermal management system according to claim 11, characterized in that: The thermal management system further includes a water tank, which is detachably mounted on the mounting frame and is connected to the first flow channel and the second flow channel.

15. The thermal management system according to any one of claims 1 to 4, characterized in that: The thermal management structure is provided with a fifth interface, the fifth interface is connected to the first flow channel and the second flow channel, and the fifth interface is used to connect to a water tank.

16. The thermal management system according to any one of claims 1 to 4, characterized in that: The thermal management system further includes a water tank, the water tank is connected to the first flow channel and the second flow channel, and the water tank is provided with a plurality of exhaust ports distributed at intervals.

17. The thermal management system according to any one of claims 1 to 4, characterized in that: The thermal management structure is further provided with a fifth connection portion and a sixth connection portion, and the fifth connection portion and the sixth connection portion are both connected to the first flow channel and are used to be connected to the heating device respectively.

18. The thermal management system according to any one of claims 1 to 4, characterized in that: A third flow channel is further provided inside the thermal management structure, and a seventh connection portion and an eighth connection portion are further provided in the thermal management structure; the thermal management system further comprises a third water pump, the third water pump is installed on the thermal management structure, and the third water pump, the seventh connection portion and the eighth connection portion are all connected to the third flow channel; The third flow channel is connected to the first cooler; or, the third flow channel is connected to the condenser, and the thermal management structure is further provided with a ninth connection portion and a tenth connection portion, and the ninth connection portion and the tenth connection portion are used to connect to the second cooler respectively.

19. The thermal management system according to claim 18, characterized in that: The thermal management structure is provided with a sixth interface and a seventh interface, and the sixth interface and the seventh interface are both connected to the second flow channel; the condenser is connected to the sixth interface and the seventh interface to be connected to the second flow channel; the thermal management structure is provided with a first mounting portion connected to the second flow channel and the third flow channel, and a third valve body is installed on the first mounting portion, and the third flow channel is connected to the seventh interface through the third valve body, and the third flow channel is also connected to the sixth interface; And / or, a second mounting portion communicating with the first flow channel and the third flow channel is disposed on the thermal management structure, and a fourth valve body is mounted on the second mounting portion.

20. The thermal management system according to claim 19, characterized in that: The thermal management structure is further provided with a third mounting portion connected to the first flow channel and the third flow channel, a fifth valve body is mounted on the third mounting portion, and the first cooler is connected between the fourth valve body and the fifth valve body.

21. A vehicle, characterized in that: Comprising a thermal management system according to any one of claims 1-20.

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