Deposition apparatus

Abstract

A deposition apparatus includes: a mask frame; a mask disposed on the mask frame; the crucible is arranged below the mask frame; and a nozzle coupled to the crucible and disposed between the crucible and the mask frame. The nozzle includes: a body portion including a coupling opening; and an ejection portion disposed in the coupling opening and including a hole overlapping the coupling opening. And the thermal expansion coefficient of the spraying part is greater than that of the main body part.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0100351, filed on August 1, 2023, the entire content of which is incorporated herein by reference. Technical field

[0003] Embodiments relate to a deposition apparatus. Background art

[0004] Organic light - emitting diode (OLED) displays are attracting attention as next - generation flat - panel displays. They have excellent brightness characteristics and wide viewing - angle characteristics, and different from liquid - crystal displays (LCDs), do not require a separate light source. OLED displays do not require a separate light source and can thus be manufactured to have a lightweight and thin design. In addition, OLED displays have characteristics of low power consumption, high brightness, and fast response speed.

[0005] An OLED display includes organic light - emitting elements, and each organic light - emitting element includes an anode, an organic light - emitting layer, and a cathode. Holes and electrons are injected into the organic light - emitting layer from the anode and the cathode, respectively, to generate excitons, and the organic light - emitting element emits light as the excitons transition to the ground state.

[0006] In the case of manufacturing an organic light - emitting element, a mask is placed on a substrate, and an organic material for forming the organic light - emitting layer passes through an opening portion of the mask from a nozzle and is provided on the substrate. Summary of the utility model

[0007] Embodiments provide a deposition apparatus including a nozzle having a spraying part, a main body part, and a coupling member. The main body part is formed of a material different from that of the spraying part, and the coupling member is detachable and replaceable from the main body part.

[0008] However, the embodiments are not limited to those stated herein. Through reference to the following detailed description of the present disclosure, the above and other embodiments will become more apparent to those of ordinary skill in the art to which the present disclosure pertains.

[0009] In one embodiment, a deposition apparatus may include: a mask frame; a mask disposed on the mask frame; a crucible disposed below the mask frame; and a nozzle disposed between the crucible and the mask frame and coupled to the crucible, wherein the nozzle includes: a main body part including a coupling opening; and a spraying part disposed in the coupling opening and including a hole overlapping the coupling opening, and the coefficient of thermal expansion of the spraying part may be greater than that of the main body part.

[0010] The crucible and the main body portion may be made of the same material, and the ejection portion may be made of a material different from that of the crucible and the main body portion.

[0011] The main body portion may further include a main body protrusion, which is disposed in the connection opening and on the inner surface of the main body portion. The ejection portion may further include a connection protrusion, which is disposed on the outer surface of the ejection portion. The main body protrusion and the connection protrusion may be connected to each other in an engaging manner, and the main body portion and the ejection portion may be connected to each other through the main body protrusion and the connection protrusion.

[0012] The nozzle may further include a connection member, which is disposed in the connection opening and includes an ejection hole, and the main body portion and the ejection portion may be connected to each other through the connection member.

[0013] The coefficient of thermal expansion of the connection member may be less than that of the ejection portion.

[0014] The connection opening of the main body portion may include: a first connection opening, adjacent to the upper surface of the main body portion; and a second connection opening, disposed below the first connection opening and having a diameter larger than that of the first connection opening.

[0015] The connection member may include a first ejection protrusion, which is disposed on the inner surface of the connection member and in the ejection hole. The ejection portion may include a connection protrusion, which is disposed on the outer surface of the ejection portion. The connection member may be disposed in the second connection opening of the main body portion, and the connection protrusion may be connected to the first ejection protrusion in an engaging manner, so that the ejection portion and the connection member are connected to each other.

[0016] The connection member may further include a second ejection protrusion, which is disposed on the outer surface of the connection member.

[0017] The main body portion may include a main body protrusion, which is disposed on the inner surface of the main body portion and in the second connection opening, and the main body protrusion may be connected to the second ejection protrusion of the connection member in an engaging manner, so that the main body portion and the connection member are connected to each other.

[0018] The connection openings of the main body portion may include: a first connection opening adjacent to the upper surface of the main body portion; a second connection opening disposed below the first connection opening; and a third connection opening disposed below the second connection opening, the first connection opening having a diameter larger than that of the second connection opening, and the third connection opening having a diameter larger than that of the second connection opening.

[0019] The connection member may include: a first portion having a cylindrical shape; a second portion disposed on the first portion and having a cylindrical shape in a plan view, having a diameter smaller than that of the first portion; and an ejection protrusion disposed on an outer surface of the second portion, the first portion being disposed in the third connection opening of the main body portion, and the second portion being disposed in the second connection opening of the main body portion.

[0020] The ejection portion may include: a first ejection portion having a cylindrical shape; a second ejection portion disposed on the first ejection portion and having a cylindrical shape in a plan view, having a diameter smaller than that of the first ejection portion; and a connection protrusion disposed on an inner surface of the first ejection portion and disposed in the hole of the ejection portion, and the connection protrusion may be connected to the ejection protrusion of the connection member in an engaging manner within the second connection opening such that the ejection portion and the connection member are connected to each other.

[0021] The ejection portion may further include a support portion disposed between the first ejection portion and the second ejection portion and having an annular shape, and the support portion may be disposed in the first connection opening of the main body portion.

[0022] The upper surface of the ejection portion may have an annular shape in a plan view, and a plurality of fastening grooves may be formed in an outer surface of the ejection portion.

[0023] The upper surface of the ejection portion may have a polygonal shape in a plan view, and the outer surface of the ejection portion may include a plurality of flat surfaces.

[0024] In one embodiment, a deposition device may include: a mask frame; a mask disposed on the mask frame; a crucible disposed below the mask frame; and a nozzle disposed between the crucible and the mask frame, wherein the nozzle includes: a main body portion including a connection opening; an ejection portion disposed in the connection opening and including a hole overlapping the connection opening; and a connection member disposed between the main body portion and the ejection portion and including an ejection hole, and the main body portion and the ejection portion may be connected to each other through the connection member.

[0025] The injection part may include a coupling projection provided on an outer surface of the injection part. The coupling member may include a first injection projection provided on an inner surface of the coupling member and disposed in the injection hole, and the first injection projection and the coupling projection may be coupled to each other in an engaging manner.

[0026] The main body part may include a main body projection provided on an inner surface of the main body part and disposed in the coupling opening. The coupling member may further include a second injection projection provided on an outer surface of the coupling member, and the second injection projection and the main body projection may be coupled to each other in an engaging manner.

[0027] The coupling member may include: a first part having a cylindrical shape; a second part provided on the first part; and an injection projection provided on an outer surface of the second part.

[0028] The injection part may include a coupling projection provided on an inner surface of the injection part and disposed in the hole of the injection part, and the coupling projection and the injection projection may be coupled to each other in an engaging manner. Description of the Drawings

[0029] The drawings are included to provide a further understanding of the present invention, and are incorporated into and constitute a part of this disclosure. The drawings illustrate embodiments and, together with the description, are used to explain the principles of the present invention. In the drawings:

[0030] Figure 1 is a schematic perspective view of a deposition device according to an embodiment;

[0031] Figure 2 is Figure 1 a schematic exploded perspective view of the nozzle illustrated in ;

[0032] Figure 3A and Figure 3B illustrates Figure 2 a schematic view of the coupling of the injection part and the main body part illustrated in ;

[0033] Figure 4A and Figure 4B is a schematic view of a nozzle according to another embodiment;

[0034] Figure 5A and Figure 5B is a schematic view of a nozzle according to another embodiment;

[0035] Figure 6A and Figure 6B is a schematic view of a nozzle according to another embodiment;

[0036] Figure 7A and Figure 7B is a schematic diagram illustrating an ejection unit according to another embodiment;

[0037] Figure 8 For use Figure 1 is a schematic plan view of a display panel manufactured using the deposition apparatus illustrated in

[0038] Figure 9 To illustrate Figure 8 is a schematic diagram of a cross-section of a pixel illustrated in ; and

[0039] Figure 10 To illustrate a deposition process for a light-emitting element used in Figure 9 is a schematic diagram of a deposition process for a light-emitting element illustrated in Detailed Description of the Invention

[0040] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable terms that are non-limiting examples of the apparatus or method disclosed herein. However, it is apparent that the various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, the various embodiments are not necessarily exclusive and do not limit the present disclosure. For example, the specific shape, configuration, and characteristics of one embodiment may be used or implemented in another embodiment.

[0041] Unless otherwise specified, the illustrated embodiments should be understood to provide the features of the present invention. Accordingly, unless otherwise specified, the features, components, modules, layers, films, panels, regions, and / or aspects, etc. (hereinafter collectively or individually referred to as "elements") of the various embodiments may be combined, separated, interchanged, and / or rearranged in other ways without departing from the scope of the present invention.

[0042] The use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. For this reason, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, ratio, commonality between the illustrated elements, and / or any other characteristics, attributes, properties, etc., unless specified. Further, in the drawings, for clarity and / or descriptive purposes, the dimensions and relative dimensions of the elements may be exaggerated. When the embodiments may be implemented differently, the specific process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals denote the same elements.

[0043] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, no intervening elements or layers are present. For this purpose, the term "connected" can refer to physical connection, electrical connection, and / or fluid connection with or without intervening elements. Further, the axes of the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to the three axes of a rectangular coordinate system, such as the X-axis, Y-axis, and Z-axis, and can be interpreted in a broader sense. For example, the axes of the first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, "at least one of A and B" can be understood to mean only A, only B, or any combination of A and B. In addition, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be understood to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] Although terms such as "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below could be termed the second element without departing from the teachings of the present disclosure.

[0045] Spatial relative terms such as "beneath", "below", "under", "lower", "above", "on", "over", "higher", and "side" (e.g., as in "sidewall") may be used herein for descriptive purposes and, thus, to describe the relationship of one element to another as illustrated in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as "below" or "beneath" another element or feature would then be oriented "above" the other element or feature. Thus, the term "below" can encompass both an upper and a lower orientation. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and, as such, the spatial relative descriptors used herein should be interpreted accordingly.

[0046] The embodiments described herein will be illustrated with reference to plan views and cross-sectional views that are ideal schematic views of the embodiments. Accordingly, the illustrated shapes may be deformed due to manufacturing techniques and / or tolerances. Accordingly, the embodiments are not limited to the specific forms illustrated, but include variations in form resulting from manufacturing processes. Accordingly, the regions in the drawings have schematic characteristics, and the shapes of the regions in the drawings illustrate the specific forms of the regions of the elements and do not limit the category of the utility model.

[0047] Hereinafter, embodiments will be described in detail with reference to the drawings.

[0048] Figure 1 is a schematic perspective view of a deposition apparatus according to an embodiment. Figure 2 is Figure 1 a schematic exploded perspective view of the nozzle illustrated in

[0049] Referring to Figure 1 , the deposition apparatus PDA may include a mask frame MFS, a mask MM, a nozzle NZ, and a crucible CRB.

[0050] The mask frame MFS may have side surfaces extending in a first direction DR1 and side surfaces extending in a second direction DR2 that intersects the first direction DR1. The mask frame MFS may have a rectangular frame shape, but the shape of the mask frame MFS is not limited thereto.

[0051] Hereinafter, a direction passing through the plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. The third direction DR3 may be substantially orthogonal to the plane defined by the first direction DR1 and the second direction DR2. In the present disclosure, "in the plan view" may mean a state observed in the third direction DR3.

[0052] In the plan view, the mask frame MFS may have a quadrilateral shape having a long side extending in the first direction DR1 and a short side extending in the second direction DR2.

[0053] A mask opening MK-OP may be defined (or formed) in the mask frame MFS. The mask opening MK-OP may have a quadrilateral shape, but the shape of the mask opening MK-OP is not limited thereto.

[0054] The mask frame MFS may include a metallic material. For example, the mask frame MFS may include an invar alloy or stainless steel.

[0055] The mask MM may be disposed on the mask frame MFS. The sides (e.g., opposite sides) of the mask MM that are opposite to each other in the first direction DR1 may be connected to the mask frame MFS. For example, the mask MM may be connected to the mask frame MFS by laser welding.

[0056] The mask MM may extend in a first direction DR1 and be arranged along a second direction DR2. The mask MM may have a rectangular shape with a long side extending in the first direction DR1 and a short side extending in the second direction DR2. For example, two masks MM may be provided on the mask frame MFS, but the number of masks MM is not limited thereto.

[0057] The mask MM may include metal. For example, the mask MM may be defined as a fine metal mask.

[0058] The unit area CEA may be defined on the upper surface of each mask MM, although Figure 1 two unit areas CEA are shown to be defined on the upper surface of each mask MM, but the number of unit areas CEA is not limited thereto.

[0059] The unit area CEA may be arranged along a specific direction. The unit area CEA may be arranged along the first direction DR1. In a plan view, the unit area CEA may overlap with the mask opening MK-OP. In a plan view, the unit area CEA may not overlap with the mask frame MFS.

[0060] The unit area CEA may have a polygonal shape. For example, each unit area CEA may have a rectangular shape with a long side extending in the first direction DR1 and a short side extending in the second direction DR2.

[0061] The unit opening MOP may be defined (or formed) in the unit area CEA. The unit opening MOP may be arranged along the first direction DR1 or the second direction DR2. In a plan view, the unit opening MOP may overlap with the mask opening MK-OP.

[0062] For example, twenty unit openings MOP may be defined (or formed) in each unit area CEA, but the number of unit openings MOP is not limited thereto.

[0063] The substrate SUB may be provided on the unit area CEA. In the case where a deposition material is ejected from a nozzle to be described later, the deposition material may be deposited in the area of the substrate SUB that overlaps with the unit opening MOP. The deposition of the deposition material will be described in detail with reference to Figure 8 、 Figure 9 and Figure 10 in detail.

[0064] Referring to Figure 1 and Figure 2 , the crucible CRB may be provided below the mask frame MFS. The crucible CRB may have a cuboid shape. The crucible CRB may include a surface extending in the first direction DR1 and a surface extending in the second direction DR2. In a plan view, the crucible CRB may have a rectangular shape with a long side extending in the first direction DR1 and a short side extending in the second direction DR2.

[0065] The receiving groove ACG can be defined (or formed) in the crucible CRB. The receiving groove ACG can extend from the top to the bottom. In a plan view, the receiving groove ACG can have a rectangular shape.

[0066] The crucible CRB can accommodate a deposition material therein. The deposition material can be accommodated in the receiving groove ACG of the crucible CRB. For example, a heating wire capable of heating the deposition material can be included. Accordingly, in the case where the deposition material is provided to the receiving groove ACG, the deposition material can be evaporated (or vaporized) by the heating wire of the crucible CRB.

[0067] The crucible CRB can include a metal or non-metal material. For example, the crucible CRB can include any one of molybdenum (Mo), tungsten, Mo-La which is an alloy of molybdenum and lanthanum oxide (La2O3), tantalum (Ta), a carbon composite material, and titanium zirconium molybdenum (TZM), in which titanium, carbon, and zirconium are added to molybdenum. However, the embodiments are not limited thereto, and the crucible CRB can include another material having a melting point higher than the boiling point of the deposition material.

[0068] The nozzle NZ can be disposed between the crucible CRB and the mask frame MFS. The nozzle NZ can be coupled to the crucible CRB. The nozzle NZ can be disposed on the crucible CRB. The nozzle NZ can overlap with the receiving groove ACG defined (or formed) in the crucible CRB.

[0069] In a plan view, the nozzle NZ can have a rectangular shape, having a long side extending in a first direction DR1 and a short side extending in a second direction DR2.

[0070] The nozzle NZ can include a main body portion BDP and a spraying portion EXP, and the spraying portion EXP can be disposed on the main body portion BDP.

[0071] The main body portion BDP can include a first main body portion BDP1 and a second main body portion BDP2. The first main body portion BDP1 can be disposed on the upper surface of the crucible CRB. The second main body portion BDP2 can be disposed on the upper surface of the first main body portion BDP1. The second main body portion BDP2 can extend from the first main body portion BDP1 in a third direction DR3. For example, the first main body portion BDP1 and the second main body portion BDP2 can be integrally formed with each other.

[0072] The length of the first main body portion BDP1 in the first direction DR1 and the length of the second main body portion BDP2 in the first direction DR1 can be substantially equal to each other. The length (or width) of the first main body portion BDP1 in the second direction DR2 can be greater than the length (or width) of the second main body portion BDP2 in the second direction DR2. Accordingly, the first main body portion BDP1 and the second main body portion BDP2 can have a stepped portion in the second direction DR2.

[0073] The main body part BDP and the crucible CRB may include the same material. The main body part BDP may include a metallic material or a non-metallic material. For example, the main body part BDP may include any one of molybdenum (Mo), tungsten, Mo-La which is an alloy of molybdenum and lanthanum oxide (La2O3), tantalum (Ta), a carbon composite material, and titanium zirconium molybdenum (TZM), in which titanium, carbon, and zirconium are added to molybdenum. However, the embodiments are not limited thereto, and the main body part BDP may include another material having a melting point higher than the boiling point of the deposition material. Since the main body part BDP and the crucible CRB include the same material, when the deposition material is heated to vaporize (or evaporate), the thermal expansion rate of the main body part BDP and the thermal expansion rate of the crucible CRB may be the same. The thermal expansion amount of the main body part BDP and the thermal expansion amount of the crucible CRB may be the same. Accordingly, no gap may appear between the main body part BDP and the crucible CRB. Therefore, when heat is applied, the space between the main body part BDP and the crucible CRB may be sealed, and the deposition material may not leak between the main body part BDP and the crucible CRB.

[0074] The coupling opening SOP may be defined (or formed) in the upper surface of the second main body part BDP2. The coupling openings SOP may be arranged along the first direction DR1. The coupling openings SOP may be spaced apart from each other at a specific interval in the first direction DR1. In a plan view, each coupling opening SOP may have a circular shape.

[0075] The ejection part EXP may be detachably coupled to the main body part BDP. The ejection part EXP may be disposed (or inserted) in the coupling opening SOP defined (or formed) in the second main body part BDP2. This will be described in detail with reference to Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 5A , Figure 5B , Figure 6A and Figure 6B detailed description.

[0076] The ejection part EXP may include a metallic material or a non-metallic material. Under the condition that the thermal expansion coefficient of the ejection part EXP is greater than the thermal expansion coefficient of the main body part BDP, the ejection part EXP and the main body part BDP may include different materials. Accordingly, when the deposition material is heated, the ejection part EXP may expand within the coupling opening SOP. Therefore, the space between the ejection part EXP and the main body part BDP may be sealed.

[0077] For example, the ejection part EXP may have a cylindrical shape. However, the embodiments are not limited thereto, and a flat surface may be provided on the outer surface of the ejection part EXP. This will be described in detail with reference to Figure 7A and Figure 7B detailed description.

[0078] The hole HL may be defined (or formed) in the upper space of the ejection part EXP. The hole HL may extend in the third direction DR3. The hole HL may overlap with the connection opening SOP and the accommodation groove ACG. Accordingly, the deposition material provided in the accommodation groove ACG may be vaporized (or evaporated) and ejected onto the mask MM through the hole HL.

[0079] The ejection part EXP may further include a connection projection EPP. The connection projection EPP may be provided on the outer surface of the ejection part EXP. The connection projection EPP may be provided adjacent to the lower part of the ejection part EXP. The ejection part EXP may be connected to the main body part BDP through the connection projection EPP. This will be described in detail with reference to Figure 3A and Figure 3B the detailed description.

[0080] For example, the deposition apparatus PDA may further include a cooling plate and a magnetic plate on the mask frame MFS. The cooling plate may prevent thermal deformation of the display panel DP (see Figure 8 ) provided on the mask MM. The magnetic plate may prevent the mask MM and the display panel DP (see Figure 8 ) from sagging downward due to gravity.

[0081] Figure 3A and Figure 3B are schematic views for exemplifying the connection of the ejection part and the main body part illustrated in Figure 2 the illustration.

[0082] For example, Figure 3A illustrates a state in which the ejection part EXP and the main body part BDP are separated. Figure 3B illustrates a state in which the ejection part EXP and the main body part BDP are connected.

[0083] For example, Figure 3A and Figure 3B are cross-sectional views taken along the line I-I’ in Figure 2 the illustration.

[0084] For ease of explanation, the crucible CRB (see Figure 1 ), the mask frame MFS (see Figure 1 ), and the mask MM (see Figure 1 ) are omitted in Figure 3A and Figure 3B the illustration.

[0085] Figure 3A and Figure 3B The ejection part EXP and the main body part BDP in Figure 1 and Figure 2 are the same as the ejection part EXP and the main body part BDP in

[0086] and thus, for convenience of description, their description will be omitted or simplified. Figure 3A, the coupling projection EPP may be provided on the outer surface of the ejection part EXP. The hole HL may be defined (or formed) in the ejection part EXP. The hole HL may extend from the upper surface to the lower surface of the ejection part EXP in the third direction DR3.

[0087] The connection groove HAL may be defined (or formed) in the first main body part BDP1. The connection groove HAL may overlap with Figure 2 the accommodation groove ACG of the crucible CRB illustrated in

[0088] The coupling opening SOP may be defined (or formed) in the main body part BDP. The coupling opening SOP may extend from the upper surface of the second main body part BDP2 in the third direction DR3. The coupling opening SOP may be connected to the connection groove HAL.

[0089] The main body part BDP may further include a main body projection BPP. The main body projection BPP may be provided in the coupling opening SOP. The main body projection BPP may be provided on the inner surface of the second main body part BDP2 that defines the coupling opening SOP. When viewed from the first direction DR1, the main body projection BPP may be arranged along the third direction DR3. However, the embodiment is not limited thereto, and the main body projection BPP may be omitted.

[0090] Reference Figure 3A and Figure 3B , the ejection part EXP may be coupled to the main body part BDP. The ejection part EXP may be coupled to the second main body part BDP2. The ejection part EXP may be provided (or inserted) in the coupling opening SOP.

[0091] The coupling projection EPP of the ejection part EXP may have a shape corresponding to the shape of the main body projection BPP of the main body part BDP. When the ejection part EXP is provided in the coupling opening SOP, the coupling projection EPP may be engaged with the main body projection BPP. The coupling projection EPP and the main body projection BPP may be coupled to each other in an engaged manner. Accordingly, the ejection part EXP may be coupled to the main body part BDP.

[0092] The coefficient of thermal expansion of the ejection part EXP may be greater than the coefficient of thermal expansion of the main body part BDP. When the deposition material is heated, the amount of thermal expansion of the ejection part EXP may be greater than the amount of thermal expansion of the main body part BDP. Accordingly, the ejection part EXP may expand within the coupling opening SOP such that the space between the outer surface of the ejection part EXP and the inner surface of the main body part BDP may be sealed. Therefore, the evaporated deposition material may be ejected to the outside after passing through the connection groove HAL, and thus leakage of the deposition material to the space between the outer surface of the ejection part EXP and the inner surface of the main body part BDP can be prevented.

[0093] The ejection part EXP may include a metallic material or a non-metallic material. For example, the ejection part EXP may include any one of molybdenum (Mo), tungsten, Mo-La which is an alloy of molybdenum and lanthanum oxide (La2O3), tantalum (Ta), a carbon composite material, and titanium zirconium molybdenum (TZM), in which titanium, carbon, and zirconium are added to molybdenum. However, the embodiments are not limited thereto, and the ejection part EXP may include another material whose melting point is higher than the boiling point of the deposition material.

[0094] Under the condition that the coefficient of thermal expansion of the ejection part EXP is greater than that of the main body part BDP, the ejection part EXP and the main body part BDP may include different materials. For example, the ejection part EXP may include a metal, and the main body part BDP may include a non-metal. However, the embodiments are not limited thereto, and each of the ejection part EXP and the main body part BDP may include any metal as long as the coefficient of thermal expansion of the ejection part EXP is greater than that of the main body part BDP.

[0095] Figure 4A and Figure 4B is a schematic diagram illustrating a nozzle according to another embodiment.

[0096] For ease of explanation, in Figure 4A , the main body part BDPa is illustrated by a sectional view taken along line I-I’, and the ejection part EXPa and the coupling member CTPa are illustrated by a perspective view.

[0097] Figure 4A is a schematic diagram illustrating the main body part BDPa, the ejection part EXPa, and the coupling member CTPa separated from each other, and Figure 4B is a schematic diagram illustrating the main body part BDPa, the ejection part EXPa, and the coupling member CTPa coupled to each other.

[0098] Since Figure 4A and Figure 4B the coupling projection EPPa of the ejection part EXPa illustrated in Figure 3A is substantially the same as the coupling projection EPP of the ejection part EXP illustrated in

[0099] For ease of description, its description may be omitted or simplified. Figure 4A, the main body portion BDPa may include a first main body portion BDP1a and a second main body portion BDP2a. The upper surface of the second main body portion BDP2a may include a stepped portion. A first surface PL1 of the upper surface of the second main body portion BDP2a adjacent to the connection opening SOPa and a second surface PL2 of the upper surface of the second main body portion BDP2a spaced apart from the connection opening SOPa may be connected to form a stepped portion. The height of the first surface PL1 of the upper surface of the second main body portion BDP2a adjacent to the connection opening SOPa may be lower than the height of the second surface PL2 of the upper surface of the second main body portion BDP2a spaced apart from the connection opening SOPa.

[0100] The connection opening SOPa may include a first connection opening SOP1a and a second connection opening SOP2a. The first connection opening SOP1a may be adjacent to the upper surface of the second main body portion BDP2a. The second connection opening SOP2a may be defined below the first connection opening SOP1a. The second connection opening SOP2a may be adjacent to the boundary between the first main body portion BDP1a and the second main body portion BDP2.

[0101] The maximum diameter (or diameter) of the first connection opening SOP1a in the second direction DR2 may be smaller than the maximum diameter (or diameter) of the second connection opening SOP2a in the second direction DR2. Accordingly, the inner surface of the second main body portion BDP2a defining the connection opening SOPa may have a stepped shape.

[0102] For example, in Figure 4A , the first connection opening SOP1a may have a semicircular shape, but may also have a substantially circular shape. For example, in Figure 4A , the second connection opening SOP2a may have a part of a polygonal shape, but may have a substantially polygonal shape. The inner surface of the second main body portion BDP2a defining the second connection opening SOP2a may include a flat surface. The flat plane may be arranged at a specific angle.

[0103] The nozzle NZa may further include a connection member CTPa. The upper surface of the connection member CTPa may have a polygonal shape. The connection member CTPa may have a polygonal column shape. For example, in Figure 4A , the connection member CTPa may have a hexagonal column shape. This is for illustrative purposes, and the shape of the connection member CTPa may be changed to correspond to the shape of the inner surface of the second main body portion BDP2a defining the second connection opening SOP2a.

[0104] The ejection portion EXPa may further include a support portion SPPa. The support portion SPPa may be provided on the connection projection EPPa. For example, the support portion SPPa may have an annular shape. The support portion SPPa may surround the outer surface of the ejection portion EXPa.

[0105] The injection hole FSH may be defined (or formed) in the upper surface of the connection member CTPa. The injection hole FSH may extend in the third direction DR3 and pass through the connection member CTPa.

[0106] Reference Figure 4A and Figure 4B , the connection member CTPa, the injection part EXPa, and the main body part BDPa may be connected to each other. For example, the connection member CTPa may be disposed (or inserted) in the second connection opening SOP2a. The injection hole FSH may overlap with the connection groove HAL. The injection hole FSH may overlap with the connection opening SOPa. In one embodiment, the connection member CTPa may be disposed between the main body part BDPa and the injection part EXPa.

[0107] The connection member CTPa may include a first injection protrusion BSP1a. The first injection protrusion BSP1a may be disposed on the inner surface of the connection member CTPa that defines the injection hole FSH. The first injection protrusion BSP1a may be disposed to correspond to the connection protrusion EPPa of the injection part EXPa.

[0108] The injection part EXPa may be disposed (or inserted) in the connection opening SOPa of the main body part BDPa. The injection part EXPa may be disposed (or inserted) in the injection hole FSH of the connection member CTPa. The connection protrusion EPPa may be joined to the first injection protrusion BSP1a in an engaging manner. The injection part EXPa and the connection member CTPa may be connected to each other through the connection protrusion EPPa and the first injection protrusion BSP1a.

[0109] The support part SPPa of the injection part EXPa may be disposed on the upper surface of the second main body part BDP2a. The support part SPPa may be disposed on the upper surface of the second main body part BDP2a adjacent to the connection opening SOPa. Since the support part SPPa is disposed on the upper surface of the second main body part BDP2a, only a part of the injection part EXPa may be disposed (or inserted) in the connection opening SOPa.

[0110] In the case where the injection part EXPa and the main body part BDPa are directly connected, wear may occur between the outer surface of the injection part EXPa and the inner surface of the main body part BDPa. Accordingly, a gap may be formed between the outer surface of the injection part EXPa and the inner surface of the main body part BDPa, and evaporated deposited materials may leak through the gap. For example, the service life of the main body part BDPa may be shortened.

[0111] However, when the ejection part EXPa is connected to the main body part BDPa through the connection member CTPa, wear may not occur on the inner surface of the main body part BDPa. Therefore, the service life of the main body part BDPa can be extended. When the ejection part EXPa is connected to the connection member CTPa, the connection member CTPa can be detachably connected to the main body part BDPa so that when wear occurs on the inner surface of the connection member CTPa, the connection member CTPa can be easily replaced. Accordingly, the maintenance of the nozzle NZa can be easily performed.

[0112] The coefficient of thermal expansion of the ejection part EXPa can be greater than that of the connection member CTPa. When the deposition material is heated to be evaporated (or vaporized), the thermal expansion amount of the ejection part EXPa can be greater than that of the connection member CTPa. The ejection part EXPa can expand within the ejection hole FSH. Therefore, the deposition material may not leak into the space between the outer surface of the ejection part EXPa and the inner surface of the connection member CTPa, and the deposition material can be ejected to the outside through the hole HL, thereby reducing unnecessary loss of the deposition material.

[0113] Figure 5A and Figure 5B is a schematic diagram illustrating a nozzle according to another embodiment.

[0114] For ease of explanation, in Figure 5A , the main body part BDPb is illustrated by a sectional view taken along the line I-I', and the ejection part EXPb and the connection member CTPb are illustrated by a perspective view.

[0115] Figure 5A illustrates a state in which the main body part BDPb, the ejection part EXPb, and the connection member CTPb are separated from each other, and Figure 5B illustrates a state in which the main body part BDPb, the ejection part EXPb, and the connection member CTPb are connected to each other.

[0116] Since Figure 5A and Figure 5B the ejection part EXPb in Figure 3A and Figure 3B is the same as the ejection part EXP in

[0117] For the sake of description convenience, its description will be omitted or simplified. Figure 5A Referring to

[0118] The maximum diameter (or diameters) of the first coupling opening SOP1b in the second direction DR2 may be smaller than the maximum diameter (or diameters) of the second coupling opening SOP2b in the second direction DR2. Correspondingly, the inner surface of the second body portion BDP2b that defines the coupling opening SOPb may have a stepped shape.

[0119] The body portion BDPb may further include a body protrusion BPPa. The body protrusion BPPa may be disposed in the second coupling opening SOP2b.

[0120] The nozzle NZb may further include a coupling member CTPb. The coupling member CTPb may have a cylindrical shape. The injection holes FSH may be defined in the upper surface of the coupling member CTPb. The injection holes FSH may extend in a third direction DR3 and pass through the coupling member CTPb.

[0121] The coupling member CTPb may include a first injection protrusion BSP1b and a second injection protrusion BSP2b. The first injection protrusion BSP1b may be disposed on the inner surface of the coupling member CTPb that defines the injection holes FSH. The first injection protrusion BSP1b may be disposed to correspond to the coupling protrusion EPPb of the injection portion EXPb. The second injection protrusion BSP2b may be disposed on the outer surface of the coupling member CTPb. The second injection protrusion BSP2b may be disposed to correspond to the body protrusion BPPa.

[0122] Reference Figure 5A and Figure 5B , the body portion BDPb, the injection portion EXPb, and the coupling member CTPb may be coupled to each other. The coupling member CTPb may be disposed in the second coupling opening SOP2b. The second injection protrusion BSP2b of the coupling member CTPb may be joined to the body protrusion BPPa disposed in the second coupling opening SOP2b. The coupling member CTPb and the body portion BDPb may be coupled to each other through the second injection protrusion BSP2b and the body protrusion BPPa. In one embodiment, the coupling member CTPb may be disposed between the body portion BDPb and the injection portion EXPb.

[0123] The injection portion EXPb may be disposed (or inserted) in the coupling opening SOPb. The injection portion EXPb may be disposed (or inserted) in the injection holes FSH. The coupling protrusion EPPb of the injection portion EXPb may be joined to the first coupling protrusion BSP1b of the coupling member CTPb. The coupling protrusion EPPb and the first injection protrusion BSP1b may be joined to each other. Correspondingly, the injection portion EXPb and the coupling member CTPb may be coupled to each other through the coupling protrusion EPPb and the first injection protrusion BSP1b. The injection portion EXPb may be coupled to the body portion BDPb through the coupling member CTPb.

[0124] When the ejection part EXPb is connected to the main body part BDPb through a connection member CTPb, the possibility of wear occurring on the inner surface of the main body part BDPb can be reduced compared to the case where the ejection part EXPb and the main body part BDPb are directly connected to each other. Accordingly, the service life of the main body part BDPb can be extended.

[0125] For example, since the connection member CTPb is connected so as to be detachable from the main body part BDPb, the connection member CTPb can be easily replaced. Accordingly, the maintenance of the nozzle NZb can be easily performed.

[0126] The coefficient of thermal expansion of the ejection part EXPb can be greater than the coefficients of thermal expansion of the main body part BDPb and the connection member CTPb. When the deposition material is heated to be evaporated (or vaporized), the amount of thermal expansion of the ejection part EXPb can be greater than the amounts of thermal expansion of the main body part BDPb and the connection member CTPb. The ejection part EXPb can expand within the ejection hole FSH. Accordingly, the space between the outer surface of the ejection part EXPb and the inner surface of the connection member CTPb can be sealed. Therefore, the deposition material can be prevented from leaking into the space between the outer surface of the ejection part EXPb and the inner surface of the connection member CTPb, and can be ejected to the outside through the hole HL, thereby reducing unnecessary losses.

[0127] Figure 6A and Figure 6B is a schematic diagram illustrating a nozzle according to another embodiment.

[0128] For ease of explanation, in Figure 6A , the main body part BDPc is illustrated by a cross-sectional view taken along line I-I', and the ejection part EXPc and the connection member CTPc are illustrated by a perspective view.

[0129] Figure 6A illustrates a state in which the main body part BDPc, the ejection part EXPc, and the connection member CTPc are separated from each other, and Figure 6B illustrates a state in which the main body part BDPc, the ejection part EXPc, and the connection member CTPc are connected to each other.

[0130] Referring to Figure 6A , the upper surfaces PL1 and PL2 of the main body part BDPc may include a first surface PL1 and a second surface PL2. The first surface PL1 may be adjacent to the connection opening SOPc. The second surface PL2 may be spaced apart from the connection opening SOPc. The first surface PL1 and the second surface PL2 may be connected to form a stepped portion. The height of the first surface PL1 may be lower than the height of the second surface PL2.

[0131] The coupling opening SOPc may include a first coupling opening SOP1c, a second coupling opening SOP2c, and a third coupling opening SOP3c. The first coupling opening SOP1c may be defined by the second surface PL2. The second coupling opening SOP2c may be defined by the inner surface of the second main body portion BDP2c. The third coupling opening SOP3c may be defined by the first main body portion BDP1c. For example, the first coupling opening SOP1c, the second coupling opening SOP2c, and the third coupling opening SOP3c may be integral with each other.

[0132] For example, the maximum diameter (or diameter) of the first coupling opening SOP1c may be greater than the maximum diameter (or diameter) of the second coupling opening SOP2c. For example, the third coupling opening SOP3c may have a polygonal shape in a plan view. The inner surface of the first main body portion BDP1c that defines the third coupling opening SOP3c may include flat surfaces arranged at a specific angle. In one embodiment, the third coupling opening SOP3c may have a circular shape in a plan view and may have a diameter larger than the diameter of the second coupling opening SOP2c.

[0133] The coupling member CTPc may include a first part PT1, a second part PT2, and a jet protrusion BSPa. The second part PT2 may be disposed on the first part PT1. The second part PT2 may extend from the first part PT1 in the third direction DR3. For example, the first part PT1 and the second part PT2 may be integral with each other.

[0134] In a plan view, the upper surface of the first part PT1 may have a polygonal shape. The first part PT1 may have a polygonal column shape. For example, in Figure 6A it is illustrated that the first part PT1 has a hexagonal column shape. The second part PT2 may have a cylindrical shape. The maximum length of the first part PT1 in the first direction DR1 may be greater than the diameter of the second part PT2. In a plan view, the thickness of the first part PT1 in the third direction DR3 may be less than the thickness of the second part PT2 in the third direction DR3. In one embodiment, the first part PT1 may have a cylindrical shape and may have a diameter larger than the diameter of the second part PT2.

[0135] The jet protrusion BSPa may be disposed on the outer surface of the second part PT2. The jet protrusion BSPa may have a shape surrounding the second part PT2.

[0136] The jetting portion EXPc may include a first jetting portion EXP1, a second jetting portion EXP2, and a support portion SPPb. The second jetting portion EXP2 may be disposed on the first jetting portion EXP1. The support portion SPPb may be disposed between the first jetting portion EXP1 and the second jetting portion EXP2. For example, the first jetting portion EXP1, the second jetting portion EXP2, and the support portion SPPb may be integral with each other.

[0137] For example, the first ejection part EXP1 and the second ejection part EXP2 may have a cylindrical shape. The support part SPPb may have an annular shape. The diameter of the first ejection part EXP1 may be larger than the diameter of the second ejection part EXP2. The diameter of the support part SPPb may be larger than the diameter of the first ejection part EXP1.

[0138] Reference Figure 6A and Figure 6B , a hole HLa may be defined (or formed) in the ejection part EXPc. The hole HLa may extend in the third direction DR3. The hole HLa may include a first hole HL1 and a second hole HL2. The first hole HL1 may be defined (or formed in) the first ejection part EXP1. The second hole HL2 may be defined (or formed in) the second ejection part EXP2. When viewed from the first direction DR1, the diameter of the first hole HL1 in the second direction DR2 may be larger than the diameter of the second hole HL2 in the second direction DR2.

[0139] The ejection part EXPc may include a coupling projection EPPc. The coupling projection EPPc may be provided on the inner surface of the first ejection part EXP1 that defines the first hole HL1. The coupling projection EPPc may be provided to correspond to the ejection projection BSPa of the coupling member CTPc.

[0140] The ejection part EXPc, the main body part BDPc, and the coupling member CTPc may be coupled to each other. For example, the coupling member CTPc may be provided in the coupling opening SOPc of the main body part BDPc. The first part PT1 of the coupling member CTPc may be provided in the third coupling opening SOP3c. The second part PT2 may be provided in the second coupling opening SOP2c. In one embodiment, the coupling member CTPc may be provided between the main body part BDPc and the ejection part EXPc.

[0141] The ejection part EXPc may be provided (or inserted) in the coupling opening SOPc. The first ejection part EXP1 may be provided (or inserted) in the second coupling opening SOP2c. The first ejection part EXP1 may be provided on the first part PT1 of the coupling member CTPc.

[0142] The first ejection part EXP1 may be coupled to the second part PT2 of the coupling member CTPc. The coupling projection EPPc provided on the inner surface of the first ejection part EXP1 may be joined in an engaging manner to the ejection projection BSPa provided on the outer surface of the second part PT2. Accordingly, the ejection part EXPc may be coupled to the coupling member CTPc. The ejection part EXPc may be coupled to the main body part BDPc through the coupling member CTPc.

[0143] The support part SPPb can be arranged in the first connection opening SOP1c. The second ejection part EXP2 can be exposed to the outside from the main body part BDPc. The second hole HL2 can overlap with the ejection hole FSHa. The deposition material accommodated in the crucible CRB (see Figure 1 ) can be evaporated (or vaporized) and ejected to the outside from the second hole HL2 after passing through the connection groove HAL and the ejection hole FSHa.

[0144] Compared with the case where the ejection part EXPc and the main body part BDPc are directly connected to each other, in the case where the ejection part EXPc is connected to the main body part BDPc through the connection member CTPc, the possibility of wear occurring on the inner surface of the main body part BDPc can be reduced.

[0145] For example, the connection member CTPc is connected so as to be detachable from the main body part BDPc, so that the connection member CTPc can be easily replaced. Accordingly, the maintenance of the nozzle NZc can be easily performed.

[0146] The coefficient of thermal expansion of the ejection part EXPc can be greater than the coefficient of thermal expansion of the main body part BDPc and the coefficient of thermal expansion of the connection member CTPc. When the deposition material is heated to be evaporated (or vaporized), the amount of thermal expansion of the ejection part EXPc can be greater than the amount of thermal expansion of the main body part BDPc and the amount of thermal expansion of the connection member CTPc. The ejection part EXPc can expand within the connection opening SOPc. Accordingly, the space between the inner surface of the main body part BDPc and the outer surface of the ejection part EXPc can be sealed. Therefore, the deposition material can not leak into the space between the outer surface of the ejection part EXPc and the inner surface of the connection member CTPc, and can be ejected to the outside through the hole HLa, thereby reducing unnecessary losses.

[0147] Figure 7A and Figure 7B is a schematic diagram illustrating an ejection part according to another embodiment.

[0148] For example, Figure 7A and Figure 7B is illustrated in a perspective view.

[0149] Since Figure 7A and Figure 7B the connection protrusions EPP and the holes HL of Figure 3A and Figure 3B are the same as those of

[0150] For the sake of convenience of description, their descriptions will be omitted or simplified. Figure 7A, a fastening groove FLG may be defined (or formed) in the outer surface of the ejection part EXPd. As the fastening groove FLG is defined, a flat surface FLA may be provided on the outer surface of the ejection part EXPd. In one embodiment, the upper surface of the ejection part EXPd may have an annular shape in a plan view.

[0151] For example, in the case where the ejection part EXPd is coupled to the main body part BDP (see Figure 2 ), the fastening groove FLG is defined (or formed) in the outer surface of the ejection part EXPd, so that the ejection part EXPd can be easily utilized by a tool. Accordingly, in the case where the ejection part EXPd is coupled to the main body part BDP (see Figure 2 ), the coupling process can be easily performed.

[0152] Referring to Figure 7B , the ejection part EXPe may have a hexagonal column shape. In a plan view, the upper surface of the ejection part EXPe may have a hexagonal shape. However, this is illustrated as an example, and the shape of the ejection part EXPe may have different polygonal shapes.

[0153] A flat surface FLAa may be provided on the outer surface of the ejection part EXPe. For example, since the flat surface FLAa is provided on the outer surface of the ejection part EXPe, the use of a tool can be easily facilitated during coupling of the ejection part EXPe to the main body part BDP (see Figure 2 ). Accordingly, in the case where the ejection part EXPe is coupled to the main body part BDP (see Figure 2 ), the coupling process can be easily performed.

[0154] Figure 8 Schematic plan view of a display panel manufactured using the deposition apparatus illustrated in Figure 1 .

[0155] Referring to Figure 8 , the display panel DP may have a rectangular shape, having a short side extending in a first direction DR1 and a long side extending in a second direction DR2, but the shape of the display panel DP is not limited thereto. The display panel DP may include a display unit DA and a non-display unit NDA surrounding the display unit DA.

[0156] The display panel DP may be a light-emitting type display panel. The display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may contain an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may contain, for example, quantum dots and quantum rods. Hereinafter, the display panel DP will be described as an organic light-emitting display panel.

[0157] The display panel DP may include pixels PX, scan lines SL1 - SLm, data lines DL1 - DLn, emission lines EL1 - ELm, a first control line CSL1 and a second control line CSL2, a first power line P1 and a second power line P2, connection lines CNL, and pads PD. Here, m and n may be natural numbers greater than zero.

[0158] The pixels PX may be disposed in the display unit DA, and the scan driving unit SDV and the emission driving unit EDV may be disposed in the non - display unit NDA adjacent to the long side of the display panel DP. The data driving unit DDV may be disposed in the non - display unit NDA adjacent to one of the short sides of the display panel DP. In a plan view, the data driving unit DDV may be adjacent to the lower end portion of the display panel DP.

[0159] The scan lines SL1 - SLm may extend in a first direction DR1 to connect to the pixels PX and the scan driving unit SDV. The data lines DL1 - DLn may extend in a second direction DR2 to connect to the pixels PX and the data driving unit DDV. The emission lines EL1 - ELm may extend in the first direction DR1 to connect to the pixels PX and the emission driving unit EDV.

[0160] The first power line P1 may extend in the second direction DR2 and may be disposed in the non - display unit NDA. The first power line P1 may be disposed between the display unit DA and the emission driving unit EDV. However, the embodiment is not limited thereto, and the first power line P1 may be disposed between the display unit DA and the scan driving unit SDV.

[0161] The connection lines CNL may extend in the first direction DR1 and may be arranged along the second direction DR2. The connection lines CNL may be connected to the first power line P1 and the pixels PX. A first voltage may be applied to the pixels PX through the first power line P1 and the connection lines CNL connected to each other.

[0162] The second power line P2 may be disposed in the non - display unit NDA. The second power line P2 may extend along the long side of the display panel DP and one of the short sides of the display panel DP where the data driving unit DDV is not disposed. The second power line P2 may be disposed outside the scan driving unit SDV and the emission driving unit EDV.

[0163] For example, the second power line P2 may extend toward the display unit DA and may be connected to the pixels PX. A second voltage having a voltage level lower than that of the first voltage may be applied to the pixels PX through the second power line P2.

[0164] The first control line CSL1 can be connected to the scan driving unit SDV and can extend toward the lower end portion of the display panel DP in a plan view. The second control line CSL2 can be connected to the emission driving unit EDV and can extend toward the lower end portion of the display panel DP in a plan view. The data driving unit DDV can be disposed between the first control line CSL1 and the second control line CSL2.

[0165] The pad PD can be disposed on the display panel DP. The pad PD can be closer to the lower end portion of the display panel DP than the data driving unit DDV. The data driving unit DDV, the first power line P1, the second power line P2, the first control line CSL1, and the second control line CSL2 can be connected to the pad PD. The data lines DL1 - DLn can be connected to the data driving unit DDV, and the data driving unit DDV can be connected to the pad PD corresponding to the data lines DL1 - DLn.

[0166] Figure 1 The unit area CEA illustrated in can correspond to Figure 8 the display panel DP illustrated in. The display panel DP can be disposed on one unit area CEA, and the light-emitting elements of a single display panel DP can be formed through the unit opening MOP defined (or formed) in the unit area CEA.

[0167] The unit area corresponding to the display panel DP can be defined (or formed) in the above substrate SUB (see Figure 1 ). After the light-emitting elements are formed in the unit area, the unit area can be cut. Accordingly, the display panel DP as shown in Figure 8 can be manufactured.

[0168] For example, a timing controller for controlling the operations of the scan driving unit SDV, the data driving unit DDV, and the emission driving unit EDV, and a voltage generator for generating a first voltage and a second voltage can be disposed on a printed circuit board. The timing controller and the voltage generator can be connected to the corresponding pad PD through the printed circuit board.

[0169] The scan driving unit SDV can generate a scan signal, and the scan signal can be applied to the pixels PX through the scan lines SL1 - SLm. The data driving unit DDV can generate a data voltage, and the data voltage can be applied to the pixels PX through the data lines DL1 - DLn. The emission driving unit EDV can generate an emission signal, and the emission signal can be applied to the pixels PX through the emission lines EL1 - ELm.

[0170] The pixel PX can receive the data voltage in response to the scan signal. The pixel PX can display an image by emitting light having a brightness corresponding to the data voltage in response to the emission signal. The light-emitting time of the pixel PX can be controlled by the emission signal.

[0171] The display panel DP in which the light-emitting layer where pixels PX are not formed can be defined as the above-described substrate SUB.

[0172] Hereinafter, Figure 10 the cross-sectional structure of the substrate SUB in which the light-emitting layer is not formed will be described. The pad PD can be formed on the substrate SUB, and the substrate SUB can be defined (or formed) in a state where it is not connected to the printed circuit board. The pad PD can be connected to the ground terminal, and thus the pad PD and the data lines DL1 - DLn can be grounded.

[0173] Figure 9 For illustration Figure 8 a schematic diagram of the cross-section of the pixel illustrated in

[0174] Referring to Figure 8 and Figure 9 , the pixel PX can be disposed on the base substrate BS and can include a transistor TR and a light-emitting element OLED. The transistor TR and the light-emitting element OLED of the pixel PX can be connected to the data lines DL1 - DLn and the first power line P1 and the second power line P2.

[0175] The transistor TR and the light-emitting element OLED of the pixel PX can be connected to the Figure 8 pad PD of Figure 8 through the data lines DL1 - DLn (see Figure 8 ) and the first power line P1 and the second power line P2 (see Figure 8 ). The transistor TR of the pixel PX can be connected to the Figure 8 pad PD of

[0176] through the data lines DL1 - DLn (see Figure 8 ). The light-emitting element OLED can include a first electrode AE, a second electrode CE, a hole control layer HCL, an electron control layer ECL, and an emission layer EML. The first electrode AE can be an anode electrode, and the second electrode CE can be a cathode electrode.

[0177] The transistor TR and the light-emitting element OLED can be disposed on the base substrate BS. For example, a single transistor TR is illustrated, but basically the pixel PX can include a plurality of transistors and at least one capacitor for driving the light-emitting element OLED.

[0178] The display unit DA can include a light-emitting unit PA corresponding to the pixel PX and a non-light-emitting unit NPA surrounding the light-emitting unit PA. The light-emitting element OLED can be disposed in the light-emitting unit PA.

[0179] The base substrate BS can include a flexible plastic substrate. For example, the base substrate BS can contain transparent polyimide (PI). A buffer layer BFL can be disposed on the base substrate BS, and the buffer layer BFL can be an inorganic layer.

[0180] A semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, the embodiment is not limited thereto, and the semiconductor pattern may include amorphous silicon or metal oxide.

[0181] The semiconductor pattern may be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a heavily doped region and a lightly doped region. The conductivity of the heavily doped region may be greater than that of the lightly doped region, and may substantially function as the source electrode and the drain electrode of the transistor TR. The lightly doped region may substantially correspond to the active region (or channel region) of the transistor.

[0182] The source region S, the active region A, and the drain region D may be formed of the semiconductor pattern. A first insulating layer INS1 may be disposed on the semiconductor pattern. The gate electrode G of the transistor TR may be disposed on the first insulating layer INS1. A second insulating layer INS2 may be disposed on the gate electrode G. A third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0183] A connection electrode CNE may be disposed between the transistor TR and the light-emitting element OLED to connect the transistor TR and the light-emitting element OLED. The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2.

[0184] The first connection electrode CNE1 may be disposed on the third insulating layer INS3 and is connected to the drain region D through a first contact hole CH1 defined (or formed) in the first insulating layer INS1 to the third insulating layer INS3. A fourth insulating layer INS4 may be disposed on the first connection electrode CNE1. A fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0185] The second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a second contact hole CH2 defined (or formed) in the fourth insulating layer INS4 and the fifth insulating layer INS5. A sixth insulating layer INS6 may be disposed on the second connection electrode CNE2. The first insulating layer INS1 to the sixth insulating layer INS6 may be an inorganic layer or an organic layer.

[0186] A first electrode AE may be disposed on the sixth insulating layer INS6. The first electrode AE may be connected to the second connection electrode CNE2 through a third contact hole CH3 defined (or formed) in the sixth insulating layer INS6. A pixel defining film PDL exposing a specific portion of the first electrode AE may be disposed on the first electrode AE and the sixth insulating layer INS6. An opening PX_OP for exposing a specific portion of the first electrode AE may be defined (or formed) in the pixel defining film PDL.

[0187] The hole control layer HCL can be disposed on the first electrode AE and the pixel defining layer PDL. The hole control layer HCL can be disposed on both the light-emitting unit PA and the non-light-emitting unit NPA. The hole control layer HCL can include a hole transport layer and a hole injection layer.

[0188] The emission layer EML can be disposed on the hole control layer HCL. The emission layer EML can be disposed in a region corresponding to the opening PX_OP. The emission layer EML can include an organic material and / or an inorganic material. The emission layer EML can generate any one of red light, green light, and blue light.

[0189] The electron control layer ECL can be disposed on the emission layer EML and the hole control layer HCL. The electron control layer ECL can be disposed on both the light-emitting unit PA and the non-light-emitting unit NPA. The electron control layer ECL can include an electron transport layer and an electron injection layer.

[0190] The second electrode CE can be disposed on the electron control layer ECL. The second electrode CE can be disposed on the pixel PX. The layers from the buffer layer BFL to the light-emitting element OLED can be defined as the pixel layer.

[0191] The thin film encapsulation layer TFE can be disposed on the light-emitting element OLED. The thin film encapsulation layer TFE can be disposed on the second electrode CE to cover the pixel PX. The thin film encapsulation layer TFE can include at least two inorganic layers and an organic layer between the at least two inorganic layers. The inorganic layer can protect the pixel PX from moisture / oxygen. The organic layer can protect the pixel PX from foreign substances such as dust particles.

[0192] A first voltage can be applied to the first electrode AE through the transistor TR, and a second voltage having a voltage level lower than that of the first voltage can be applied to the second electrode CE. The holes and electrons injected into the emission layer EML can combine to generate excitons, and the light-emitting element OLED can emit light when the excitons transition to the ground state.

[0193] Figure 10 For illustration of Figure 9 a schematic diagram of the deposition process of the light-emitting element illustrated in

[0194] For ease of description, Figure 1 the substrate SUB and the mask MM illustrated in Figure 10 are vertically inverted in

[0195] Referring to Figure 1 and Figure 10 , the layers from the base substrate BS to the hole control layer HCL disposed on the first electrode AE can be defined as the substrate SUB. The mask MM can be disposed on the substrate SUB.

[0196] As described above, the transistor TR can be connected to the pad PD through the data lines DL1 - DLn. For example, the substrate SUB may include the data lines DL1 - DLn and the pads PD connected to the data lines DL1 - DLn.

[0197] The mask MM can be arranged to face the substrate SUB. The mask MM can be arranged to be close to the substrate SUB. The deposition material DPM can be provided (or ejected) onto the substrate SUB through the unit openings MOP defined (or formed) in the upper surface of the mask MM. The emission layer EML can be formed on the substrate SUB from the deposition material DPM.

[0198] According to an embodiment, the ejection part EXP containing a material different from that of the main body part BPD of the nozzle NZ can be separated and replaced. The main body part BPD and the crucible CRB can contain the same material. Accordingly, when the nozzle NZ is heated at a high temperature, a difference in the amount of thermal expansion may occur between the main body part BPD and the ejection part EXP. The ejection part EXP having a high coefficient of thermal expansion can expand to seal the space between the main body part BPD and the ejection part EXP.

[0199] According to an embodiment, the main body part BPD and the ejection part EXP can be coupled to each other through the coupling member CTPa, the coupling member CTPb, or the coupling member CTPc. The coupling member CTPa, the coupling member CTPb, or the coupling member CTPc can be coupled to the main body part BPD, and the ejection part EXP can be coupled to the coupling member CTPa, the coupling member CTPb, or the coupling member CTPc. Accordingly, the wear that occurs when the ejection part EXP is directly coupled to the main body part BPD may not occur in the main body part BPD, making it easy to perform maintenance and repair of the nozzle NZ.

[0200] For example, a flat surface can be provided on the outer surface of the ejection part EXP. Accordingly, when the ejection part EXP is coupled to the main body part BPD, the tightening strength between the ejection part EXP and the main body part BPD can be precisely adjusted using a tool.

[0201] In summarizing the detailed description, those skilled in the art will recognize that many variations and modifications can be made to the embodiments without substantially departing from the principles, spirit, and scope of the present disclosure. Therefore, the disclosed embodiments are used only in a general and descriptive sense and not for the purpose of limitation.

Claims

1. A deposition device, characterized in that: The deposition device comprises: Mask frame; A mask, arranged on the mask frame; a crucible disposed below the mask frame; and a nozzle disposed between the crucible and the mask frame and coupled to the crucible, wherein The nozzle comprises: a main body portion including a coupling opening; and an injection portion disposed in the coupling opening and comprising a hole overlapping the coupling opening, and The thermal expansion coefficient of the injection portion is greater than the thermal expansion coefficient of the main body portion.

2. The deposition device according to claim 1, characterized in that: The crucible and the body portion comprise the same material, The injection portion includes a material different from that of the crucible and the main body portion, The main body portion further includes a main body protrusion disposed in the coupling opening and disposed on an inner surface of the main body portion, The injection portion further includes a coupling protrusion, and the coupling protrusion is disposed on an outer surface of the injection portion. The main body protrusion and the coupling protrusion are coupled to each other in an engaging manner, and The body portion and the injection portion are coupled to each other through the body protrusion and the coupling protrusion.

3. The deposition device according to claim 1, characterized in that: The nozzle further includes a coupling member disposed in the coupling opening and including a spray hole, The main body part and the injection part are coupled to each other by the coupling member, and The coupling member has a thermal expansion coefficient smaller than the thermal expansion coefficient of the injection portion.

4. The deposition device according to claim 3, characterized in that: The coupling opening of the main body portion includes: A first coupling opening adjacent to an upper surface of the main body portion; and a second coupling opening disposed below the first coupling opening and having a diameter greater than that of the first coupling opening, The coupling member includes a first injection protrusion disposed on an inner surface of the coupling member and disposed in the injection hole, The injection portion includes a coupling protrusion disposed on an outer surface of the injection portion, the coupling member is disposed in the second coupling opening of the body portion, and The coupling protrusion is coupled to the first injection protrusion in an engaging manner so that the injection portion and the coupling member are coupled to each other.

5. The deposition device according to claim 4, characterized in that: The coupling member further includes a second injection protrusion disposed on an outer surface of the coupling member. The main body portion includes a main body protrusion, which is disposed on an inner surface of the main body portion and is disposed in the second coupling opening, and The body protrusion is coupled to the second injection protrusion of the coupling member in an engaging manner so that the body portion and the coupling member are coupled to each other.

6. The deposition device according to claim 3, characterized in that: The coupling opening of the main body portion includes: a first coupling opening adjacent to the upper surface of the main body; A second coupling opening disposed below the first coupling opening; and A third connection opening is arranged below the second connection opening, The first coupling opening has a diameter that is larger than a diameter of the second coupling opening, The third coupling opening has a diameter greater than a diameter of the second coupling opening, The connecting member comprises: The first part has a cylindrical shape; a second portion, which is disposed on the first portion and has a cylindrical shape in a plan view, having a diameter smaller than that of the first portion; and an injection protrusion, disposed on an outer surface of the second portion, The first portion is disposed in the third coupling opening of the main body, The second portion is disposed in the second coupling opening of the main body, The injection unit comprises: a first injection portion having a cylindrical shape; a second injection portion disposed on the first injection portion and having a cylindrical shape in a plan view, having a diameter smaller than that of the first injection portion; a coupling protrusion disposed on an inner surface of the first injection portion and disposed in the hole of the injection portion; and a support portion disposed between the first and second injection portions and having a ring shape, the coupling protrusion being coupled to the injection protrusion of the coupling member in an engaging manner within the second coupling opening so that the injection portion and the coupling member are coupled to each other, and The support portion is disposed in the first coupling opening of the body portion.

7. The deposition device according to claim 1, characterized in that: An upper surface of the ejection portion has a ring shape in a plan view, and a plurality of fastening grooves are formed in an outer surface of the ejection portion; or An upper surface of the injection portion has a polygonal shape in a plan view, and an outer surface of the injection portion includes a plurality of flat surfaces.

8. A deposition device, characterized in that: The deposition device comprises: Mask frame; A mask, arranged on the mask frame; a crucible disposed below the mask frame; and a nozzle disposed between the crucible and the mask frame; and The nozzle comprises: A main body portion including a coupling opening; an injection portion disposed in the coupling opening and including a hole overlapping the coupling opening; and a coupling member disposed between the main body and the injection portion and including an injection hole, and The body part and the injection part are coupled to each other by the coupling member.

9. The deposition device according to claim 8, characterized in that The injection portion includes a coupling protrusion, and the coupling protrusion is provided on an outer surface of the injection portion, The connecting member comprises: a first injection protrusion provided on an inner surface of the coupling member and disposed in the injection hole; and A second injection protrusion is provided on the outer surface of the coupling member, The first ejection protrusion and the coupling protrusion are coupled to each other in an engaging manner, The main body portion includes a main body protrusion, which is disposed on an inner surface of the main body portion and is disposed in the coupling opening, and The second ejection protrusion and the body protrusion are coupled to each other in an engaging manner.

10. The deposition device according to claim 8, characterized in that The connecting member comprises: The first part has a cylindrical shape; a second portion disposed on the first portion; and an injection protrusion, disposed on an outer surface of the second portion, The injection portion includes a coupling protrusion disposed on an inner surface of the injection portion and disposed in the hole of the injection portion, and The coupling protrusion and the ejection protrusion are coupled to each other in an engaging manner.

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