Coating device

Abstract

The utility model discloses a coating device. The coating device comprises a coating pot body and at least one first bearing ring. The plating pot body comprises a plurality of ring carrying holes arranged at intervals. And the plurality of ring carrying holes penetrate through the plating pot body. The at least one first bearing ring is arranged in the at least one bearing ring hole. The first bearing ring comprises a first ring and a second ring which are arranged in the bearing ring hole. The first ring is arranged around the second ring and is connected with the second ring; through the arrangement, the semiconductor structure can be arranged on the second ring with the smaller size, so that the plating pot body corresponding to the first ring with the larger size can bear the semiconductor structure matched with the second ring in size, and the plating pot body does not need to be replaced by the plating pot body corresponding to the second ring, so that the time for replacing the plating pot body is saved, and the cost is reduced. And therefore, the operation time required by film coating is shortened, and the production efficiency of film coating is improved.

Description

Technical Field

[0001] This application relates to the field of coating technology, and in particular, to a coating device. Background Art

[0002] In the process of manufacturing semiconductor chips, a metal coating device is often required. The coating device generally includes a pot body. When coating metal films on wafers of different sizes, different-sized pot bodies need to be selected according to the sizes of the wafers. This process increases the operation time and affects the production efficiency. Summary of the Utility Model

[0003] The embodiments of this application provide a coating device, which shortens the operation time required for coating and improves the production efficiency of coating, so as to at least partially solve the above technical problems.

[0004] To achieve the above object, according to the first aspect of this application, a coating device is provided, including:

[0005] A plating pot body, including a plurality of spaced-apart carrier ring holes, and the plurality of carrier ring holes penetrate through the plating pot body;

[0006] At least one first carrier ring, disposed in at least one of the carrier ring holes, the first carrier ring including a first ring and a second ring disposed in the carrier ring hole, the first ring surrounding and connected to the second ring.

[0007] Optionally, the thickness of the first ring is less than the thickness of the second ring.

[0008] Optionally, the coating device further includes: a first cover plate, the first cover plate is disposed on the second ring, and the first cover plate includes a first ventilation hole, and the first ventilation hole penetrates through the first cover plate.

[0009] Optionally, the coating device further includes: a first fixing member, one end of the first fixing member is connected to the plating pot body, and the other end of the first fixing member fixes the first cover plate.

[0010] Optionally, the coating device further includes: a second fixing member, one end of the second fixing member is connected to the first ring, and the other end of the second fixing member fixes the first cover plate.

[0011] Optionally, the coating device further includes: at least one second carrier ring, disposed in at least one of the carrier ring holes, the second carrier ring including a third ring disposed in the carrier ring hole, and the diameter of the inner ring of the third ring is greater than the diameter of the inner ring of the second ring.

[0012] Optionally, the diameter of the outer ring of the third ring is the same as the diameter of the outer ring of the first ring, and the thickness of the first ring is less than the thickness of the third ring.

[0013] Optionally, the coating device further includes a second cover plate disposed on the third ring. The second cover plate has a second ventilation hole that penetrates the second cover plate.

[0014] Optionally, the coating device further includes a third fixing member. One end of the third fixing member is connected to the plating pot body, and the other end of the third fixing member fixes the second cover plate.

[0015] Optionally, the first ring and the second ring are detachably connected, or the first ring and the second ring are integrated;

[0016] The second ring has an arc-shaped side and a straight side, and the arc-shaped side is connected to the straight side.

[0017] In the coating device according to the embodiment of the present application, the first carrier ring includes a first ring and a second ring disposed in the carrier ring hole. The first ring is disposed around the second ring and connected to the second ring. With this arrangement, a semiconductor structure with a smaller size is disposed on the second ring with a smaller size, so that the plating pot body corresponding to the first ring with a larger size can carry the semiconductor structure with a smaller size, thereby eliminating the need to replace the plating pot body with the plating pot body corresponding to the second ring, saving the time for replacing the plating pot body, and thus shortening the operation time required for coating and improving the production efficiency of coating. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] To more fully understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, where the same reference numerals represent the same parts in the following description.

[0020] Figure 1 is a schematic structural diagram of a coating device according to some embodiments provided by the present application;

[0021] Figure 2 is Figure 1 a schematic structural diagram of a first carrier ring of the coating device shown;

[0022] Figure 3 is along Figure 2Schematic cross-sectional structure diagram taken along the tangent line A-A';

[0023] Figure 4 Is Figure 1 Another schematic structural diagram of the first carrier ring of the coating device shown;

[0024] Figure 5 Is along Figure 4 Schematic cross-sectional structure diagram taken along the tangent line B-B' in;

[0025] Figure 6 Is Figure 1 Schematic structural diagram of the second carrier ring of the coating device shown;

[0026] Figure 7 Is along Figure 6 Schematic cross-sectional structure diagram taken along the tangent line C-C' in;

[0027] Figure 8 Schematic structural diagram of the coating device according to some other embodiments provided by the present application;

[0028] Figure 9 Is Figure 8 Schematic structural diagram of the first carrier ring of the coating device shown;

[0029] Figure 10 Schematic structural diagram of the semiconductor structure according to some embodiments provided by the present application;

[0030] Figure 11 Schematic structural diagram of the coating device according to some other embodiments provided by the present application.

[0031] Explanation of reference numerals:

[0032] 100, coating device; 200, semiconductor structure; 200A, first positioning edge; 200B, non-positioning edge;

[0033] 11, plating pot body; 11A, carrier ring hole;

[0034] 12, first carrier ring; 121, first ring; 122, second ring; 122A, second positioning edge; 123, first annular mounting portion; 124, first connecting portion; 125, second connecting portion; 126, second annular mounting portion; 12A, hollow part;

[0035] 13, first cover plate; 13A, first ventilation hole;

[0036] 141, first fixing member; 142, second fixing member; 143, third fixing member;

[0037] 15, second carrier ring; 151, third ring; 152, third annular mounting portion; 153, third connecting portion;

[0038] 16. Second cover plate; 16A. Second vent hole. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present application.

[0040] Please refer to Figures 1 to 7 As shown, some embodiments of the present application provide a coating device 100. The coating device 100 is used to carry a semiconductor structure to facilitate coating on the semiconductor structure. The film may include at least one of a metal film and a dielectric film. Exemplarily, the film is a metal film. The semiconductor structure may include, but is not limited to, a wafer. The wafer may be a single wafer or a stacked wafer formed by bonding multiple wafers together.

[0041] As Figures 1 to 5 shown, the coating device 100 includes a coating pot body 11 and at least one first carrier ring 12. The coating pot body 11 includes a plurality of carrier ring holes 11A arranged at intervals. The plurality of carrier ring holes 11A penetrate through the coating pot body 11. At least one first carrier ring 12 is disposed in at least one carrier ring hole 11A. The first carrier ring 12 includes a first ring 121 and a second ring 122 disposed in the carrier ring hole 11A. The first ring 121 is disposed around the second ring 122 and is connected to the second ring 122.

[0042] For the above coating device 100, by disposing the semiconductor structure on the second ring 122 with a smaller size, the coating pot body 11 corresponding to the larger first ring 121 can be used to carry the semiconductor structure adapted to the second ring 122, so that it is not necessary to replace the coating pot body 11 with the coating pot body corresponding to the second ring 122, the time for replacing the coating pot body is omitted, and thus the operation time required for coating is shortened, and the production efficiency of coating is improved.

[0043] The coating pot body 11 is in the shape of a round pot. During the evaporation coating process, the coating pot body 11 needs to rotate both self-rotation and revolution. The gaseous particles evaporated by the evaporation source (not shown in the figure) of the coating device 100 pass through the hollow part 12A of the first carrier ring 12 and are deposited on the semiconductor structure on the second ring 122.

[0044] As Figure 1As shown, a plurality of carrier ring holes 11A are circular. The plurality of carrier ring holes 11A have the same size to simplify the manufacturing process of the plating pot body 11. It can be understood that the sizes of at least two carrier ring holes 11A can also be different.

[0045] Each first carrier ring 12 is disposed within one carrier ring hole 11A. Two or more first carrier rings 12 can be disposed one-to-one in two or more carrier ring holes 11A.

[0046] As Figure 2 and Figure 4 shown, both the first ring 121 and the second ring 122 are annular. In some embodiments, the maximum diameter of the outer ring of the first ring 121 is 8 inches to 10 inches, and the maximum diameter of the outer ring of the second ring 122 is 4 inches to 6 inches.

[0047] As Figure 2 and Figure 3 shown, in some embodiments, the first ring 121 and the second ring 122 are integral. Such a setting can simplify the structure of the first carrier ring 12 and simplify the manufacturing process of the first carrier ring 12.

[0048] As Figure 4 and Figure 5 shown, in some embodiments, the first ring 121 and the second ring 122 are detachably connected. Such a setting enables, when using a plating pot body 11 corresponding to the size of the first ring 121, using only the carrier ring including the first ring 121 to carry a semiconductor structure of its corresponding size, and using the second ring 122 of the first carrier ring 12 to carry a semiconductor structure of its corresponding size, that is, one plating pot body 11 can carry two semiconductor structures of different sizes, thereby eliminating the need to replace the plating pot body 11, shortening the operation time required for coating, and improving the production efficiency of coating. Moreover, the structure including the first ring 121 and the structure including the second ring 122 can be used alone or in combination, improving the utilization rate of the structure including the first ring 121 and the structure including the second ring 122.

[0049] As Figure 2 and Figure 3 and Figure 4 and Figure 5 shown, the first carrier ring 12 may further include a first annular mounting portion 123 and a first connecting portion 124. The first connecting portion 124 connects the first annular mounting portion 123 and the first ring 121, and the first annular mounting portion 123 is disposed around the first ring 121. As Figure 1 shown, the diameter of the outer ring of the first annular mounting portion 123 is greater than the diameter of the carrier ring hole 11A, and the first annular mounting portion 123 is placed on the plating pot body 11 around the carrier ring hole 11A.

[0050] In some embodiments, as Figure 3 and Figure 5 shown, the first connecting portion 124 extends along the axial direction of the first bearing ring 12 and is annular. In other embodiments, the first connecting portion 124 may extend along the radial direction of the first bearing ring 12, and a plurality of first connecting portions 124 are connected between the first annular mounting portion 123 and the first ring 121.

[0051] As Figure 2 and Figure 3 shown, the first bearing ring 12 may further include a second connecting portion 125, and the second connecting portion 125 is connected to the second ring 122. When the first ring 121 and the second ring 122 are integrated, the second connecting portion 125 is also connected to the first ring 121. In some embodiments, the second connecting portion 125 extends along the axial direction of the first bearing ring 12 and is annular.

[0052] As Figure 4 and Figure 5 shown, the first bearing ring 12 may further include a second connecting portion 125 and a second annular mounting portion 126. The second connecting portion 125 connects the second annular mounting portion 126 and the second ring 122. The second annular mounting portion 126 is disposed around the second ring 122, the diameter of the outer ring of the second annular mounting portion 126 is greater than the diameter of the inner ring of the first ring 121, and the second annular mounting portion 126 is detachably mounted on the first ring 121. In some embodiments, the second connecting portion 125 extends along the axial direction of the first bearing ring 12 and is annular.

[0053] As Figure 3 shown, in some embodiments, the thickness d1 of the first ring 121 is less than the thickness d2 of the second ring 122. With such a setting, on the basis of adding the second ring 122 inside the first ring 121, the weight of the first ring 121 is reduced, and further the weight of the first bearing ring 12 is reduced, and the risk of the first bearing ring 12 falling due to excessive weight during the evaporation process is reduced.

[0054] It should be noted that the thickness d1 of the first ring 121 is equal to the dimension of the first ring 121 in its axial direction, and the thickness d2 of the second ring 122 is equal to the dimension of the second ring 122 in its axial direction.

[0055] In some embodiments, the first ring 121 may further include a plurality of vent holes provided along its circumferential direction, and the first ring 121 is further provided with a plurality of support portions, and the plurality of support portions are located between the vent holes. With such a setting, a semiconductor structure with a larger size can be disposed on the plurality of support portions. Therefore, the first bearing ring 12 can carry semiconductor structures with different sizes.

[0056] As Figure 1As shown, in some embodiments, the coating device 100 further includes a first cover plate 13. The first cover plate 13 is disposed on the second ring 122 such that the first cover plate 13 can cover the semiconductor structure on the second ring 122. The first cover plate 13 includes a first vent hole 13A that penetrates through the first cover plate 13. With this arrangement, the first cover plate 13 protects the semiconductor structure on the second ring 122 during the coating process. Moreover, the first vent hole 13A functions as a vent, reducing the risk that the adsorption force will lift the semiconductor structure when lifting the first cover plate 13, thereby causing damage to the semiconductor structure.

[0057] In some embodiments, the first vent hole 13A may be disposed near the top of the first cover plate 13.

[0058] As Figure 1 shown, in some embodiments, the coating device 100 further includes a first fixing member 141. One end of the first fixing member 141 is connected to the plating pot body 11, and the other end of the first fixing member 141 fixes the first cover plate 13. With this arrangement, the first fixing member 141 fixes the first cover plate 13, reducing the risk that the first cover plate 13, the semiconductor structure on the second ring 122, and the first carrier ring 12 will fall off during the rotation of the plating pot body 11.

[0059] In some embodiments, the plating pot body 11 is provided with a first connection hole, and one end of the first fixing member 141 is provided with a first fixing member connection hole. A pin passes through the first connection hole and the first fixing member connection hole. The first fixing member 141 can rotate relative to the plating pot body 11, that is, the first fixing member 141 is rotatably connected to the plating pot body 11. In some embodiments, the first fixing member 141 may include, but is not limited to, a spring piece.

[0060] As Figure 1 , Figure 6 and Figure 7 shown, in some embodiments, the coating device 100 further includes at least one second carrier ring 15, and at least one second carrier ring 15 is disposed in at least one carrier ring hole 11A. The second carrier ring 15 includes a third ring 151 disposed in the carrier ring hole 11A, and the diameter of the inner ring of the third ring 151 is greater than the diameter of the inner ring of the second ring 122. With this arrangement, the size of the semiconductor structure carried by the third ring 151 is different from the size of the semiconductor structure carried by the second ring 122, such that the plating pot body 11 can carry semiconductor structures of different sizes. Furthermore, it is possible to implement the coating process for semiconductors of different sizes without replacing the plating pot body 11, shortening the operation time required for coating and improving the production efficiency of coating.

[0061] It can be understood that two or more second carrier rings 15 can be disposed in the carrier ring holes 11A one by one.

[0062] As shown Figure 7 In some embodiments, the second carrier ring 15 may further include a third annular mounting portion 152 and a third connecting portion 153. The third connecting portion 153 connects the third annular mounting portion 152 and the third ring 151. The third annular mounting portion 152 is mounted on the surface of the plating pot body 11 around the carrier ring hole 11A. The third annular mounting portion 152 is circular.

[0063] In some embodiments, the diameter of the outer ring of the third ring 151 is the same as the diameter of the outer ring of the first ring 121. The thickness of the first ring 121 is less than the thickness of the third ring 151. The thickness of the third ring 151 is equal to the dimension of the third ring 151 along its axial direction. With such a setting, a second ring 122 can be added inside the second carrier ring 15 to obtain the first carrier ring 12, improving the utilization rate of the second carrier ring 15. Moreover, on the basis of adding the second ring 122 inside the first ring 121, the weight of the first ring 121 is reduced, and then the weight of the first carrier ring 12 is reduced, reducing the risk of the first carrier ring 12 falling during the evaporation plating process due to excessive weight.

[0064] As shown Figure 1 In some embodiments, the coating device 100 further includes a second cover plate 16. The second cover plate 16 is disposed on the third ring 151 to cover the semiconductor structure on the third ring 151. The second cover plate 16 has a second vent hole 16A, and the second vent hole 16A penetrates through the second cover plate 16. With such a setting, the second cover plate 16 plays a protective role for the semiconductor structure on the third ring 151. Moreover, the second vent hole 16A plays a venting role, reducing the risk that the adsorption force sucks up the semiconductor structure on the third ring 151 when lifting the second cover plate 16, resulting in damage to the semiconductor structure.

[0065] In some embodiments, the second vent hole 16A may be disposed near the top of the second cover plate 16.

[0066] In some embodiments, the aperture diameter of the second vent hole 16A may be the same as the aperture diameter of the first vent hole 13A. In other embodiments, the aperture diameter of the second vent hole 16A may be larger than the aperture diameter of the first vent hole 13A to further reduce the risk that the adsorption force sucks up the semiconductor structure on the third ring 151 when lifting the second cover plate 16, resulting in damage to the semiconductor structure.

[0067] As shown Figure 1As shown, in some embodiments, the coating device 100 further includes a third fixing member 143. One end of the third fixing member 143 is connected to the plating pot body 11, and the other end of the third fixing member 143 fixes the second cover plate 16. With such an arrangement, the third fixing member 143 plays a role in fixing the second cover plate 16, reducing the risk of the second cover plate 16, the semiconductor structure on the third ring 151, and the second carrier ring 15 falling off during the self-rotation process of the plating pot body 11. In some embodiments, one end of the third fixing member 143 is rotatably connected to the plating pot body 11.

[0068] Referring to Figure 8 and Figure 9 shown, Figure 8 is a schematic structural diagram of a coating device according to other embodiments provided by the present application. Figure 9 is Figure 8 a schematic structural diagram of the first carrier ring of the coating device shown. Figure 8 The coating device shown and Figure 1 the coating device shown are basically similar, except that Figure 8 the coating device 100 shown includes a second fixing member 142 and does not include a first fixing member 141. One end of the second fixing member 142 is connected to the first ring 121, and the other end of the second fixing member 142 fixes the first cover plate 13. With such an arrangement, the second fixing member 142 plays a role in fixing the first cover plate 13, reducing the risk of the first cover plate 13, the semiconductor structure on the second ring 122, and the first carrier ring 12 falling off during the self-rotation process of the plating pot body 11.

[0069] In other embodiments, the first ring 121 is provided with a ring connection hole, and one end of the second fixing member 142 is provided with a second fixing member connection hole. A pin passes through the ring connection hole and the second fixing member connection hole. Thus, one end of the second fixing member 142 can rotate relative to the first ring 121, that is, one end of the second fixing member 142 is rotatably connected to the first ring 121. When it is necessary for the second fixing member 142 to fix the first cover plate 13, rotate the second fixing member 142 and press its other end against the first cover plate 13. In some embodiments, the second fixing member 142 may include, but is not limited to, a spring piece.

[0070] Such as Figure 10As shown, in some other embodiments, the semiconductor structure 200 has a non-positioning edge 200B and a first positioning edge 200A that are interconnected, and the shape of the first positioning edge 200A is different from the shape of the non-positioning edge 200B. The second loop 122 has a second positioning edge 122A adapted to the first positioning edge 200A. With such an arrangement, the first positioning edge 200A of the semiconductor structure can be aligned with the second positioning edge 122A of the second loop 122, so as to better place the semiconductor structure 200 on the second loop 122, reduce the friction between the semiconductor structure 200 and the second loop 122, and reduce the risk of damaging the semiconductor structure 200.

[0071] In some embodiments, the non-positioning edge 200B includes an arc edge, and the first positioning edge 200A includes a straight edge. The second positioning edge 122A includes a straight edge.

[0072] As Figure 11 shown, Figure 11 is a schematic structural diagram of a coating device according to still some other embodiments provided by the present application. Figure 11 The coating device shown is Figure 1 substantially similar to the coating device shown. The differences include that the coating device further includes a second fixing member 142. One end of the second fixing member 142 is connected to the first loop 121, and the other end of the second fixing member 142 is fixed to the first cover plate 13. With such an arrangement, both the first fixing member 141 and the second fixing member 142 are used to fix the first cover plate 13 to better fix the first cover plate 13.

[0073] In still some other embodiments, the elastic modulus of the first fixing member 141 is different from the elastic modulus of the second fixing member 142, so that the first fixing member 141 and the second fixing member 142 provide different elastic forces according to different positions. Exemplarily, the elastic modulus of the first fixing member 141 is greater than the elastic modulus of the second fixing member 142 to ensure that the first fixing member 141 with a longer length can better fix the first cover plate 13.

[0074] In summary, the first carrier ring includes a first loop and a second loop disposed in the carrier ring hole. The first loop is disposed around the second loop and connected to the second loop. With such an arrangement, a semiconductor structure with a smaller size is placed on the second loop with a smaller size, so that the plating pot body corresponding to the larger first loop can carry the semiconductor structure with a smaller size, thus eliminating the need to replace the plating pot body with the plating pot body corresponding to the second loop, saving the time for replacing the plating pot body, shortening the operation time required for coating, and improving the production efficiency of coating.

[0075] In the description of the present application, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0076] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0077] The embodiments, implementation manners and related technical features of the present application can be combined and replaced with each other without conflict.

[0078] The above are only the preferred embodiments of the present application and do not impose any formal restrictions on the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A coating device, characterized in that: include: The plating pot body comprises a plurality of carrier ring holes arranged at intervals, and the plurality of carrier ring holes penetrate the plating pot body; At least one first bearing ring is arranged in at least one of the bearing ring holes, the first bearing ring includes a first ring and a second ring arranged in the bearing ring hole, the first ring is arranged around the second ring and connected to the second ring.

2. The coating device according to claim 1, characterized in that: The thickness of the first ring is smaller than the thickness of the second ring.

3. The coating device according to claim 1, characterized in that: Also includes: A first cover plate, wherein the first cover plate is disposed on the second ring, and the first cover plate comprises a first ventilation hole, and the first ventilation hole passes through the first cover plate.

4. The coating device according to claim 3, characterized in that: Also includes: A first fixing member, one end of which is connected to the plating pot body, and the other end of which fixes the first cover plate.

5. The coating device according to claim 3 or 4, characterized in that: Also includes: A second fixing member, one end of which is connected to the first ring, and the other end of which is fixed to the first cover plate.

6. The coating device according to claim 1, characterized in that: Also includes: At least one second bearing ring is arranged in at least one of the bearing ring holes, and the second bearing ring includes a third ring arranged in the bearing ring hole, and the diameter of the inner ring of the third ring is greater than the diameter of the inner ring of the second ring.

7. The coating device according to claim 6, characterized in that: The diameter of the outer ring of the third ring is the same as the diameter of the outer ring of the first ring, and the thickness of the first ring is smaller than the thickness of the third ring.

8. The coating device according to claim 6, characterized in that: Also includes: The second cover plate is disposed on the third ring, the second cover plate has a second ventilation hole, and the second ventilation hole runs through the second cover plate.

9. The coating device according to claim 8, characterized in that: Also includes: A third fixing member, one end of which is connected to the plating pot body, and the other end of which fixes the second cover plate.

10. The coating device according to claim 1, characterized in that: The first ring is detachably connected to the second ring, or the first ring is integral with the second ring; The second ring is used to carry a semiconductor structure, the semiconductor structure has a non-positioning edge and a first positioning edge connected to each other, the shape of the first positioning edge is different from the shape of the non-positioning edge, and the second ring has a second positioning edge adapted to the first positioning edge.

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