Matte electroplating tin thin copper foil production equipment

Abstract

The utility model discloses matte electroplating tin thin copper foil production equipment which comprises a tin plating bracket and a plurality of tin plating devices arranged at the rear end of the tin plating bracket, the tin plating device comprises an upper tin plating mechanism, a lower tin plating mechanism, an electroplating liquid temporary storage tank and an electroplating liquid circulating mechanism; the upper electrotinning mechanism, the lower electrotinning mechanism and the electroplating liquid temporary storage tank are sequentially distributed from top to bottom; electroplating liquid in the upper electrotinning mechanism and the lower electrotinning mechanism flows into the electroplating liquid temporary storage tank from top to bottom; and the electroplating liquid circulating mechanism filters the electroplating liquid in the electroplating liquid temporary storage tank and then re-injects the electroplating liquid into the upper electrotinning mechanism and the lower electrotinning mechanism. The whole electroplating device is shortened by half, so that the moving distance of electroplating liquid is shortened, and driving parts such as a pump body are reduced.

Description

Technical Field

[0001] The utility model relates to the field of copper foil strip production, in particular to a production device for matte electroplated tin thin copper foil. Background Art

[0002] The copper foil strip for connector components usually has a tin coating. Tin improves corrosion protection, maintains solderability, and provides a better contact surface than bare copper metal.

[0003] The existing tin-plated copper foil strip is generally produced and processed through an assembly line. The layout of the assembly line is in a linear distribution. The copper foil strip leaves the wire pay-off device and then successively passes through pre-cleaning, tin plating, post-cleaning, and drying, and finally enters the wire take-up device for coiling.

[0004] Tin plating is carried out by electroplating. The electroplating solution used for electroplating is generally recycled. However, since the electroplating tank of the assembly line of the tin-plated copper foil strip is generally horizontally arranged along the conveying direction of the copper foil strip, the moving distance of the electroplating solution is relatively long, so more driving parts such as pumps are required to drive the electroplating solution. Summary of the Utility Model

[0005] In order to overcome the deficiencies in the prior art, the utility model provides a production device for matte electroplated tin thin copper foil, which has the advantages of shortening the moving distance of the electroplating solution and thus reducing driving parts such as pumps.

[0006] In order to achieve the above object, the utility model adopts the following technical scheme:

[0007] A production device for matte electroplated tin thin copper foil includes a tin plating support and a tin plating device arranged on the tin plating support; the tin plating device includes an upper tin plating mechanism, a lower tin plating mechanism, an electroplating solution temporary storage tank, and an electroplating solution circulation mechanism; the upper tin plating mechanism, the lower tin plating mechanism, and the electroplating solution temporary storage tank are distributed from top to bottom in sequence; the electroplating solution in the upper tin plating mechanism and the lower tin plating mechanism flows down into the electroplating solution temporary storage tank; the electroplating solution circulation mechanism filters the electroplating solution in the electroplating solution temporary storage tank and then re-injects it into the upper tin plating mechanism and the lower tin plating mechanism.

[0008] By adopting the above technical scheme, the tin plating device is divided into an upper tin plating mechanism and a lower tin plating mechanism which are distributed up and down, so that the whole electroplating device is shortened by half, thus shortening the moving distance of the electroplating solution and reducing driving parts such as pumps.

[0009] Optionally, the electroplating solution circulation mechanism includes an electroplating solution circulation pump; the liquid outlet end of the electroplating solution circulation pump is connected with an electroplating solution outlet pipe; the electroplating solution outlet pipe includes an electroplating solution outlet branch pipe connected with the upper tin plating mechanism; and an outlet valve is arranged on the electroplating solution outlet branch pipe.

[0010] By adopting the above technical solution, when the liquid outlet valve is opened, the electroplating solution circulation pump injects the filtered electroplating solution into the upper electroplating tin mechanism, so that the upper electroplating tin mechanism is normally used for electroplating; when the liquid outlet valve is closed, no new electroplating solution can enter the upper electroplating tin mechanism, and the electroplating solution in the upper electroplating tin mechanism flows downward through the lower electroplating tin mechanism and finally flows into the electroplating solution temporary storage tank, so that the electroplating solution in the upper electroplating tin mechanism is drained and electroplating will not occur; in this way, the electroplating time of the copper foil strip is increased or decreased, which is beneficial to controlling the thickness of the tin layer on the copper foil strip.

[0011] Optionally, it further includes a flipping device arranged on the tin plating bracket; the flipping device enables the copper foil strip to pass through all the lower electroplating tin mechanisms in sequence and then turn back to pass through all the upper electroplating tin mechanisms.

[0012] By adopting the above technical solution, the flipping device is at the end of the tin plating bracket, enabling the copper foil strip to turn back smoothly, so that the copper foil strip first passes through the lower electroplating tin mechanism and then through the upper electroplating tin mechanism, which is beneficial to controlling the path of the copper foil strip.

[0013] Optionally, the flipping device includes a flipping roller rotatably connected to the tin plating bracket and a flipping roller driving mechanism for driving the flipping roller.

[0014] By adopting the above technical solution, the flipping roller driving mechanism drives the flipping roller to rotate, thereby driving the copper foil strip to advance, making the advancement of the copper foil strip smoother and beneficial to the long-term transportation of the copper foil strip.

[0015] Optionally, a pair of guide roller mechanisms are arranged on the tin plating bracket; one of the guide roller mechanisms is located on the outlet side of the upper electroplating tin mechanism, and the other guide roller mechanism is located on the inlet side of the lower electroplating tin mechanism; the guide roller mechanism is used to tighten the copper foil strip.

[0016] By adopting the above technical solution, guide roller mechanisms are arranged both before and after tin plating, so that the copper foil strip can be kept in a tightened state during tin plating, making the control of the tin plating time of the copper foil strip more accurate and beneficial to controlling the tin plating thickness.

[0017] Optionally, the guide roller mechanism includes a pair of side guide rollers, an intermediate guide roller and a driving assembly; the intermediate guide roller is located between the pair of side guide rollers; the driving assembly is used to drive the pair of side guide rollers and the intermediate guide roller to rotate, and the rotation direction of the intermediate guide roller is opposite to that of the pair of side guide rollers.

[0018] By adopting the above technical solution, the copper foil strip passes through the side guide roller on one side, the intermediate guide roller and the side guide roller on the other side in sequence, and the path of the copper foil strip in the guide roller mechanism is in a W shape. In this way, it is not easy to accidentally turn over during the long-distance movement of the copper foil strip, and at the same time, it is beneficial to straighten the copper foil strip.

[0019] Optionally, a plurality of limiting ring grooves in the shape of circular ring grooves are formed on the side guide rollers and are uniformly distributed along the axial direction thereof.

[0020] By adopting the above technical solution, the copper foil strips are along the limiting ring grooves of the side guide rollers, and each copper foil strip corresponds to a limiting ring groove, so as to adapt to the simultaneous electroplating of multiple copper foil strips. At the same time, the movement path of the copper foil strips is better controlled, and accidental contact between the copper foil strips is avoided, thereby preventing wear of the tin layer.

[0021] Optionally, a plurality of tin plating devices are provided; guide roller mechanisms are provided between adjacent upper tin plating mechanisms and between adjacent lower tin plating mechanisms.

[0022] By adopting the above technical solution, guide roller mechanisms are provided between adjacent upper tin plating mechanisms and between adjacent lower tin plating mechanisms, ensuring that the copper foil strips are in a straightened state during electroplating, which is beneficial to electroplating. At the same time, it is more beneficial to the horizontal transmission of the copper foil strips and prevents accidental turning over.

[0023] Optionally, it further includes an electroplating solution supplement pipe provided on the tin plating support; one end of the electroplating solution supplement pipe is connected to an external electroplating solution supplement device, and the other end is connected to the upper tin plating mechanism.

[0024] By adopting the above technical solution, the electroplating solution supplement device and the electroplating solution supplement pipe supplement the electroplating solution, keeping the concentration of the electroplating solution in the upper tin plating mechanism at the designed level, thereby being beneficial to the electroplating of the copper foil strips.

[0025] Optionally, the upper tin plating mechanism includes a rectangular electroplating tank with an upward opening; an electroplating cover plate is installed on the electroplating tank.

[0026] By adopting the above technical solution, an electroplating cover plate is provided on the upper electroplating tank, which can prevent foreign objects from accidentally entering the electroplating tank and prevent the staff from accidentally contacting the electroplating solution, improving work safety.

[0027] In summary, the beneficial effects of the present utility model are as follows:

[0028] The tin plating device is divided into an upper tin plating mechanism and a lower tin plating mechanism which are distributed up and down, so that the entire electroplating device is shortened by half, thereby shortening the moving distance of the electroplating solution and reducing driving parts such as pumps. Description of the Drawings

[0029] Figure 1 is a schematic structural diagram of the present utility model.

[0030] Figure 2 is a schematic rear view structural diagram of the present utility model with the tin plating support omitted.

[0031] Figure 3It is a schematic structural diagram of the end of the tin-plated bracket of the present utility model.

[0032] Figure 4 It is a schematic structural diagram of the guide roller mechanism of the present utility model.

[0033] Explanation of reference numerals:

[0034] 10. Tin-plated bracket;

[0035] 20. Tin-plating device; 21. Upper electro-tin-plating mechanism; 22. Lower electro-tin-plating mechanism; 23. Electroplating solution storage tank; 24. Electroplating solution circulation pump; 25. Electroplating solution inlet pipe; 26. Electroplating solution outlet pipe; 261. Electroplating solution outlet main pipe; 262. Electroplating solution outlet branch pipe; 263. Outlet valve; 27. Circulation inlet pipe; 271. Circulation valve;

[0036] 30. Guide roller mechanism; 31. Servo drive motor; 32. Side guide roller; 320. Limit ring groove; 33. Driven gear; 34. Intermediate guide roller; 35. Intermediate gear;

[0037] 40. Flipping device; 41. Flipping servo motor; 42. Flipping roller. Specific embodiments

[0038] The following is a further detailed description of the present utility model in conjunction with the attached Figures 1-4 drawings.

[0039] Embodiment 1: Disclose a matte electro-tin-plated thin copper foil production device. Refer to Figure 1 , which includes a tin-plated bracket 10, a pair of tin-plating devices 20 arranged on the tin-plated bracket 10, and a flipping device 40 arranged on the tin-plated bracket 10. The tin-plating device 20 includes an upper electro-tin-plating mechanism 21, a lower electro-tin-plating mechanism 22, an electroplating solution storage tank 23, and an electroplating solution circulation mechanism; the upper electro-tin-plating mechanism 21, the lower electro-tin-plating mechanism 22, and the electroplating solution storage tank 23 are arranged from top to bottom in sequence; the electroplating solution in the upper electro-tin-plating mechanism 21 and the lower electro-tin-plating mechanism 22 flows downward into the electroplating solution storage tank 23; the electroplating solution circulation mechanism filters the electroplating solution in the electroplating solution storage tank 23 and then reinjects it into the upper electro-tin-plating mechanism 21 and the lower electro-tin-plating mechanism 22; during use, the copper foil strip passes through all the lower electro-tin-plating mechanisms 22 in sequence, then passes through the flipping device 40 and turns back, and then passes through all the upper electro-tin-plating mechanisms 21 in sequence.

[0040] Refer to Figure 1 and Figure 2 , both the upper electro-tin-plating mechanism 21 and the lower electro-tin-plating mechanism 22 include a cuboid-shaped electroplating tank with an open upper end. The electroplating tank is filled with electroplating solution and tin blocks are placed in it. The copper foil strip is the cathode, and the tin block is the anode.

[0041] Refer to Figure 1 andFigure 2 , baffles are fixed at both ends of the electroplating tank; several U-shaped copper foil strip passing grooves evenly distributed in the vertical direction along the conveying direction of the copper foil strip are formed on the upper end surface of the baffle; three vertically opening water drainage holes are formed on the lower side wall of the electroplating tank; two of the water drainage holes are located outside a pair of baffles, and the other water drainage hole is located in the middle of the electroplating tank; a drainage valve is fixed on the bottom surface of the electroplating tank; in the normal working state, the drainage valve is in the closed state; when it is necessary to drain all the electroplating solution in the electroplating tank, the drainage valve can be opened.

[0042] To improve production safety, an electroplating cover plate is installed on the electroplating tank; the electroplating cover plate is connected to the upper end of the electroplating tank by a hinged manner.

[0043] To prevent the concentration of the electroplating solution in the electroplating tank from being lower than the set value, an electroplating solution replenishing pipe is fixed on the tin plating bracket 10; one end of the electroplating solution replenishing pipe is connected to an external electroplating solution replenishing device (not shown), and the other end is connected to the electroplating tank of the upper tin plating mechanism 21.

[0044] Reference Figure 2 , the electroplating solution circulation mechanism includes an electroplating solution circulation pump 24 and a filter (not shown); the liquid outlet end of the electroplating solution circulation pump 24 is connected with an electroplating solution outlet pipe 26, and the liquid inlet end is connected with an electroplating solution inlet pipe 25; the liquid inlet end of the filter (not shown) is connected with a circulation inlet pipe 27; the other end of the circulation inlet pipe 27 is connected to the bottom of the electroplating solution storage tank 23; a circulation valve 271 is connected to the part of the circulation inlet pipe 27 close to the electroplating solution storage tank 23; the other end of the electroplating solution inlet pipe 25 is connected to the liquid outlet end of the filter (not shown).

[0045] Reference Figure 2 , the electroplating solution outlet pipe 26 includes an electroplating solution outlet main pipe 261 connected to the liquid outlet end of the electroplating solution circulation pump 24 and a pair of electroplating solution outlet branch pipes 262 connected to the electroplating solution outlet main pipe 261; the other ends of the pair of electroplating solution outlet branch pipes 262 are respectively connected to the upper parts of the middle of the electroplating tanks of the upper tin plating mechanism 21 and the lower tin plating mechanism 22; liquid outlet valves 263 are connected to both of the pair of electroplating solution outlet branch pipes 262.

[0046] Reference Figure 3 , the flipping device 40 includes a flipping roller 42 rotatably connected to the tin plating bracket 100 and a flipping roller driving mechanism for driving the flipping roller 42; the flipping roller driving mechanism includes a flipping servo motor 41 and a flipping transmission assembly arranged between the output shaft of the flipping servo motor 41 and the rotating shaft of the flipping roller 42; the flipping transmission assembly can be a sprocket chain transmission or a gear transmission.

[0047] Working principle of Embodiment 1: When the electroplating solution circulates, open the circulation valve 271 and a pair of liquid outlet valves 263. The electroplating solution in the electroplating solution storage tank 23 flows along the circulation inlet pipe 27 into a filter (not shown), is filtered in the filter (not shown), and then the filtered electroplating solution, under the action of the electroplating solution circulation pump 24, flows along the electroplating solution inlet pipe 25 and into the electroplating tanks of the upper electroplating tin mechanism 21 and the lower electroplating tin mechanism 22 through the electroplating solution outlet main pipe 261; at the same time, the electroplating solution in the electroplating tanks of the upper electroplating tin mechanism 21 and the lower electroplating tin mechanism 22 flows downward in sequence along the water dropping holes and thus returns to the electroplating solution storage tank 23; of course, if it is not necessary for the upper electroplating tin mechanism 21 to participate in electroplating, the corresponding liquid outlet valve 263 can be closed, and then the corresponding drain valve is opened, so that the electroplating solution in the electroplating tank of the upper electroplating tin mechanism 21 will be drained completely, and thus it does not participate in the electroplating of the copper foil while being charged.

[0048] Embodiment 2: The difference between Embodiment 2 and Embodiment 1 lies in: Refer to Figure 1 , and it further includes a pair of guide roller mechanisms 30. One guide roller mechanism 30 is located on the outlet side of the upper electroplating tin mechanism 21 far from the flipping device 40, and the other guide roller mechanism 30 is located on the inlet side of the lower electroplating tin mechanism 22 far from the flipping device 40; the guide roller mechanism 30 is used to tension the copper foil strip.

[0049] Refer to Figure 4 , the guide roller mechanism 30 includes a pair of side guide rollers 32, an intermediate guide roller 34 and a driving assembly; the pair of side guide rollers 32 and the intermediate guide roller 34 are both rotatably connected to the tin plating bracket 10 and their axes are perpendicular to the conveying direction of the copper foil strip; the intermediate guide roller 34 is located between the pair of side guide rollers 32; the driving assembly is used to drive the pair of side guide rollers 32 and the intermediate guide roller 34 to rotate and the rotation direction of the intermediate guide roller 34 is opposite to that of the pair of side guide rollers 32; the side guide roller 32 is formed with a number of annular groove-shaped limiting ring grooves 320 evenly distributed along its axis.

[0050] Refer to Figure 4 , the driving assembly includes a servo driving motor 31 fixed on the tin plating bracket 10, a driving gear coaxially fixed on the output shaft of the servo driving motor 31, a driven gear 33 coaxially fixed at the end of the side guide roller 32 and an intermediate gear 35 coaxially fixed at the end of the intermediate guide roller 34; the driving gear meshes with one of the driven gears 33; the intermediate gear 35 is located between the pair of driven gears 33 and meshes with the pair of driven gears 33 respectively.

[0051] Embodiment 3: The difference between Embodiment 3 and Embodiment 1 lies in: Refer to Figure 1 , guide roller mechanisms 30 are also provided between a pair of upper electroplating tin mechanisms 21 and between a pair of lower electroplating tin mechanisms 22.

[0052] The above are all preferred embodiments of the present utility model, and the protection scope of the present utility model is not limited thereby. Therefore, all equivalent changes made according to the structure, shape and principle of the present utility model shall be covered within the protection scope of the present utility model.

Claims

1. A matte tinned thin copper foil production device, comprising a tinning bracket (10), characterized in that: It also includes a tinning device (20) arranged on the tinning bracket (10); the tinning device (20) includes an upper tinning mechanism (21), a lower tinning mechanism (22), a temporary storage tank for electroplating liquid (23) and a circulation mechanism for electroplating liquid; the upper tinning mechanism (21), the lower tinning mechanism (22) and the temporary storage tank for electroplating liquid (23) are arranged in sequence from top to bottom; the electroplating liquid in the upper tinning mechanism (21) and the lower tinning mechanism (22) flows from top to bottom into the temporary storage tank for electroplating liquid (23); the electroplating liquid circulation mechanism filters the electroplating liquid in the temporary storage tank for electroplating liquid (23) and then re-injects it into the upper tinning mechanism (21) and the lower tinning mechanism (22).

2. The matte tin-plated thin copper foil production equipment according to claim 1, characterized in that: The electroplating liquid circulation mechanism comprises an electroplating liquid circulation pump (24); the liquid outlet end of the electroplating liquid circulation pump (24) is connected to an electroplating liquid outlet pipe (26); the electroplating liquid outlet pipe (26) comprises an electroplating liquid outlet branch pipe (262) connected to the upper electrotin plating mechanism (21); and an outlet valve (263) is provided on the electroplating liquid outlet branch pipe (262).

3. The matte tin-plated thin copper foil production equipment according to claim 1, characterized in that: It also includes a turning device (40) arranged on the tinning bracket (10); the turning device (40) allows the copper foil strip to pass through all the lower tinning mechanisms (22) in sequence and then turn back to pass through all the upper tinning mechanisms (21).

4. The matte tin-plated thin copper foil production equipment according to claim 3, characterized in that: The turning device (40) comprises a turning roller (42) rotatably connected to the tin-plating bracket (10) and a turning roller driving mechanism for driving the turning roller (42).

5. The matte tin-plated thin copper foil production equipment according to claim 1, characterized in that: A pair of guide roller mechanisms (30) are provided on the tinning bracket (10); one of the guide roller mechanisms (30) is located at the outlet side of the upper tinning mechanism (21), and the other guide roller mechanism (30) is located at the inlet side of the lower tinning mechanism (22); the guide roller mechanism (30) is used to tighten the copper foil strip.

6. The equipment for producing matte tin-plated thin copper foil according to claim 5, characterized in that: The guide roller mechanism (30) comprises a pair of side guide rollers (32), a middle guide roller (34) and a driving assembly; the middle guide roller (34) is located between the pair of side guide rollers (32); the driving assembly is used to drive the pair of side guide rollers (32) and the middle guide roller (34) to rotate, and the rotation direction of the middle guide roller (34) is opposite to the rotation direction of the pair of side guide rollers (32).

7. The matte tin-plated thin copper foil production equipment according to claim 6, characterized in that: The side guide roller (32) is formed with a plurality of annular groove-shaped limiting ring grooves (320) evenly distributed along its axial direction.

8. The matte tin-plated thin copper foil production equipment according to claim 5, characterized in that: The tinning device (20) is provided in plurality; the guide roller mechanism (30) is provided between adjacent upper tinning mechanisms (21) and between adjacent lower tinning mechanisms (22).

9. The matte tin-plated thin copper foil production equipment according to claim 1, characterized in that: It also includes a plating liquid replenishing tube arranged on the tinning bracket (10); one end of the plating liquid replenishing tube is connected to an external plating liquid replenishing device, and the other end is connected to the upper tinning mechanism (21).

10. The matte tin-plated thin copper foil production equipment according to claim 1, characterized in that: The upper tinning mechanism (21) comprises a rectangular electroplating tank with an opening facing upward; a plating cover plate is installed on the electroplating tank.

Images