Circuit board heat dissipation system

Abstract

The utility model relates to the technical field of circuit board heat dissipation, in particular to a circuit board heat dissipation system, which comprises a fireplace, a heat dissipation device and a heat dissipation device, the heat dissipation assembly comprises a turning plate arranged on the fireplace, a conductive part arranged on the inner wall of the bottom of the placement groove and a lifting part arranged on the side wall of the placement groove; wherein the conductive piece comprises a conductive sheet, a copper sheet electrically connected with the conductive sheet in a normal state, and a steel sheet arranged on one side, far away from the conductive sheet, of the copper sheet; the lifting piece comprises a limiting disc abutting against the steel sheet during operation, a sliding rod arranged on the limiting disc and a fixing lantern ring connected with the sliding rod in a sliding and sleeving mode. The beneficial effects of the utility model are that through arranging the copper sheet and the steel sheet, deformation of the circuit board caused by thermal expansion due to high temperature is avoided, elements and connection points on the circuit board are prevented from generating stress, and the electrical performance and reliability of the circuit board are prevented from being influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board heat dissipation, in particular to a circuit board heat dissipation system. Background Art

[0002] The circuit board of a fireplace is the core component for controlling the heating of the fireplace. The circuit board records the operating parameters of the fireplace, such as temperature, time period, and operating mode, and these parameters are crucial for monitoring the efficiency and performance of the wall-mounted boiler.

[0003] However, when the circuit board is heated by the fireplace and exceeds a certain temperature tolerance value, it will deform due to thermal expansion, which will in turn cause stress on the components and connection points on the circuit board, affecting its electrical performance and reliability. Especially when the CTE of the substrate does not match the CTE of the components soldered on the PCB, this difference in thermal expansion will cause the solder joints on the circuit board to break. Summary of the Utility Model

[0004] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and title of the specification of this application, to avoid obscuring the purpose of this part, the abstract, and the title of the utility model. However, such simplifications or omissions shall not be used to limit the scope of the utility model.

[0005] In view of the problems existing in the above or prior art, the present utility model is proposed.

[0006] Therefore, the purpose of the present utility model is to provide a circuit board heat dissipation system.

[0007] To solve the above technical problems, the present utility model provides the following technical solution: A circuit board heat dissipation system includes

[0008] A fireplace, wherein an installation groove is opened at the top of the fireplace; a heat dissipation assembly, including a flap provided on the fireplace, a conductive member provided on the inner wall of the bottom of the installation groove, and a lifting member provided on the side wall of the installation groove; wherein, the conductive member includes a conductive sheet, a copper sheet electrically connected to the conductive sheet under normal conditions, and a steel sheet provided on the side of the copper sheet away from the conductive sheet; wherein, the lifting member includes a limiting disk that contacts the steel sheet during operation, a sliding rod provided on the limiting disk, and a fixed collar slidably sleeved on the sliding rod.

[0009] As a preferred solution of the circuit board heat dissipation system of the present utility model, wherein: the end of the flap is bent and contacts the side wall of the fireplace under normal conditions, a circuit board is provided on the conductive sheet, and the ends of the copper sheet and the steel sheet are both provided with the same heat conducting plate.

[0010] As a preferred solution of the circuit board heat dissipation system of the utility model, the vertical projection areas of the copper sheet and the steel sheet can cover the vertical projection area of ​​the circuit board, and a plurality of anti-slip grooves are provided on the side of the steel sheet away from the copper sheet.

[0011] As a preferred solution of the circuit board heat dissipation system of the utility model, wherein: the lifting member is close to the raised ends of the copper sheet and the steel sheet, and the fixing ring is provided with a connecting rod fixedly connected to the side wall of the placement groove.

[0012] As a preferred solution of the circuit board heat dissipation system of the utility model, the top end and the bottom end of the sliding rod are fixedly connected to the limiting plate, and the side of the limiting plate away from the sliding rod is arc-shaped.

[0013] As a preferred solution of the circuit board heat dissipation system of the utility model, there is a gap between the outer wall of the sliding rod and the inner wall of the fixing ring.

[0014] The circuit board heat dissipation system of the utility model has the following beneficial effects: by arranging the copper sheet and the steel sheet, the circuit board is prevented from being deformed due to thermal expansion caused by high temperature, and stress is prevented from being generated in the components and connection points on the circuit board, thereby avoiding affecting its electrical performance and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 This is a schematic diagram of the enlarged structure of the circuit board heat dissipation system with the flap closed.

[0017] Figure 2 Flip open the panel to enlarge the schematic diagram of the circuit board cooling system.

[0018] Figure 3 It is a three-dimensional enlarged structural diagram of the heat dissipation component.

[0019] Figure 4 It is a schematic diagram of the three-dimensional enlarged structure of the conductive part.

[0020] Figure 5 It is a three-dimensional enlarged structural diagram of the lifting parts.

[0021] 100, Fireplace; 200, Heat dissipation component; 201, Flap; 202, Conductive part; 202a, Circuit board; 202b, Copper sheet; 202c, Steel sheet; 202d, Heat conducting plate; 202e, Conductive sheet; 203, Lifting part; 203a, Limit disk; 203b, Slide bar; 203c, Fixed collar; 203d, Connecting rod. Detailed implementation mode

[0022] To make the above objects, features and advantages of the present utility model more obvious and understandable, the following will give a detailed description of the specific implementation mode of the present utility model in conjunction with the accompanying drawings of the specification.

[0023] In the following description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0024] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure or characteristic that can be included in at least one implementation mode of the present utility model. The "in one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selectively exclusive embodiment from other embodiments.

[0025] Embodiment 1

[0026] Referring to Figures 1-5 , this is the first embodiment of the present utility model. This embodiment provides a circuit board heat dissipation system. By setting the heat dissipation component 200, it is possible to prevent the circuit board 202a from thermally expanding and deforming due to high temperature, and prevent stress from being generated on the components and connection points on the circuit board 202a, thereby avoiding affecting its electrical performance and reliability.

[0027] Specifically, there is a fireplace 100, and an installation groove is opened at the top of the fireplace 100; a heat dissipation component 200, which includes a flap 201 arranged on the fireplace 100, a conductive part 202 arranged on the inner wall of the bottom of the installation groove, and a lifting part 203 arranged on the side wall of the installation groove; among them, the conductive part 202 includes a conductive sheet 202e, a copper sheet 202b that is electrically connected to the conductive sheet 202e under normal conditions, and a steel sheet 202c arranged on the side of the copper sheet 202b away from the conductive sheet 202e; among them, the lifting part 203 includes a limit disk 203a that contacts the steel sheet 202c during operation, a slide bar 203b arranged on the limit disk 203a, and a fixed collar 203c that is slidably sleeved on the slide bar 203b.

[0028] Among them, since the heat of the circuit board 202a is conducted to the air, the air is heated and rises. An installation groove is provided at the top of the fireplace 100 to facilitate the hot air flowing out from the top.

[0029] The flap 201 can close the installation groove under normal conditions to prevent dust from falling into the installation groove and polluting the circuit board 202a. Since the thermal expansion coefficient of the copper sheet 202b is larger than that of the steel sheet 202c, the copper sheet 202b will expand more than the steel sheet 202c due to temperature rise. Therefore, after the copper sheet 202b and the steel sheet 202c are heated together, they bend towards the side of the steel sheet 202c.

[0030] The limiting disc 203a limits the sliding rod 203b and does not contact the steel sheet 202c under normal conditions.

[0031] In summary, by setting the heat dissipation component 200, when the temperature after the fireplace 100 is heated reaches a certain level, the heat conduction plate 202d in the installation groove is heated and conducts the heat to the copper sheet 202b and the steel sheet 202c, so that the copper sheet 202b and the steel sheet 202c bend towards the direction of the steel sheet 202c after thermal expansion. The copper sheet 202b disconnects the electrical connection with the conductive sheet 202e, causing the circuit board 202a to stop controlling the fireplace 100 from heating. The bent copper sheet 202b and steel sheet 202c push open the limiting disc 203a and the sliding rod 203b, opening the flap 201 for heat dissipation, avoiding the thermal expansion and deformation of the circuit board 202a due to high temperature, preventing stress from being generated on the components and connection points on the circuit board 202a, and avoiding affecting its electrical performance and reliability.

[0032] Embodiment 2

[0033] Refer to Figures 1-5 , which is the second embodiment of the present utility model. Different from the previous embodiment, by setting the copper sheet 202b and the steel sheet 202c, the thermal expansion and deformation of the circuit board 202a due to high temperature are avoided, preventing stress from being generated on the components and connection points on the circuit board 202a, and avoiding affecting its electrical performance and reliability.

[0034] Specifically, the end of the flap 201 is bent and contacts the side wall of the fireplace 100 under normal conditions. The circuit board 202a is arranged on the conductive sheet 202e, and the ends of the copper sheet 202b and the steel sheet 202c are both provided with the same heat conduction plate 202d.

[0035] The vertical projection area of the copper sheet 202b and the steel sheet 202c can cover the vertical projection area of the circuit board 202a, and a plurality of anti-slip grooves are provided on the side of the steel sheet 202c away from the copper sheet 202b.

[0036] The lifting member 203 is close to the upturned ends of the copper sheet 202b and the steel sheet 202c, and a connecting rod 203d fixedly connected to the side wall of the installation groove is arranged on the fixed sleeve 203c.

[0037] The top and bottom ends of the slide bar 203b are both fixedly connected to the limiting plate 203a, and the side of the limiting plate 203a away from the slide bar 203b is arc-shaped.

[0038] Among them, the end of the flap 201 is bent and contacts the side wall of the fireplace 100 under normal conditions. After the flap 201 is resisted and pushed up by the lifting member 203, the vertical projection area of ​​the straight part of the flap 201 can no longer completely cover the vertical projection area of ​​the mounting groove after rotation. In order to prevent dust from falling into the mounting groove and contaminating the circuit board 202a, the vertical projection area of ​​the bent part of the flap 201 will supplement the vertical projection area of ​​the straight part of the flap 201, so that the entire vertical projection area of ​​the flap 201 can still completely cover the vertical projection area of ​​the mounting groove.

[0039] The vertical projection area of ​​the copper sheet 202b and the steel sheet 202c can cover the vertical projection area of ​​the circuit board 202a. When the copper sheet 202b is electrically connected to the conductive sheet 202e, the circuit board 202a can still be blocked to prevent the circuit board 202a from being contaminated by dust.

[0040] A plurality of anti-slip grooves are provided on the side of the steel sheet 202c away from the copper sheet 202b. When the copper sheet 202b and the steel sheet 202c are tilted to push the limit plate 203a and the slide rod 203b to rise, the friction force is increased at the part where the steel sheet 202c and the limit plate 203a are in contact, thereby improving the sliding efficiency of the limit plate 203a and the slide rod 203b.

[0041] A connecting rod 203d fixedly connected to the side wall of the placement groove is provided on the fixing ring 203c, and heat insulation materials are provided at the connection between the connecting rod 203d and the circuit board 202a and the fireplace 100.

[0042] The side of the limiting plate 203a away from the sliding rod 203b is arc-shaped, which improves the fault tolerance when the two limiting plates 203a collide with the flap 201 and the steel sheet 202c.

[0043] The force of the copper sheet 202b and the steel sheet 202c expanding and tilting due to heat is greater than the sum of the gravity of the flap 201, the limiting plate 203a and the sliding rod 203b.

[0044] In summary, by providing the copper sheet 202b and the steel sheet 202c, when the temperature inside the fireplace 100 reaches a certain value, the copper sheet 202b and the steel sheet 202c are thermally expanded by the heat conducting plate 202d and deflect and warp away from the conductive sheet 202e. This causes the copper sheet 202b to not only disconnect from the electrical connection with the conductive sheet 202e, cutting off the power supply to the circuit board 202a to prevent continued control of the fireplace 100 from heating, but also causes the steel sheet 202c to contact the limit disk 203a at the bottom end of the slide bar 203b and push the limit disk 203a at the bottom end of the slide bar 203b, causing the slide bar 203b and the limit disk 203a at the top end of the slide bar 203b to contact the flap 201 and push the flap 201 to deflect and warp, opening the placement groove. As a result, the heat in the placement groove is discharged for heat dissipation, preventing the circuit board 202a from thermally expanding and deforming due to high temperature, preventing stress from being generated on the components and connection points on the circuit board 202a, and avoiding affecting its electrical performance and reliability.

[0045] Embodiment 3

[0046] Referring to Figures 1-5 , this is the third embodiment of the present utility model. Different from the previous embodiment, by providing the slide bar 203b and the fixed collar 203c, the gravity of the flap 201, the limit disk 203a, and the slide bar 203b is prevented from applying pressure to the copper sheet 202b and the steel sheet 202c, preventing an increase in the metal fatigue of the copper sheet 202b and the steel sheet 202c.

[0047] Specifically, there is a gap between the outer wall of the slide bar 203b and the inner wall of the fixed collar 203c.

[0048] Among them, the limit disk 203a and the slide bar 203b are made of metal, the fixed collar 203c is made of heat-insulating material, and there is a gap between the outer wall of the slide bar 203b and the inner wall of the fixed collar 203c, facilitating the heat of the steel sheet 202c to be conducted to the limit disk 203a and the slide bar 203b, causing the slide bar 203b to thermally expand.

[0049] In summary, by setting the sliding rod 203b and the fixed collar 203c, when the copper sheet 202b and the steel sheet 202c expand due to heat and deflect and push the limit disc 203a and the sliding rod 203b, since the steel sheet 202c pushes the limit disc 203a at the bottom end of the sliding rod 203b so that the limit disc 203a at the bottom end of the sliding rod 203b is limited by the bottom end of the fixed collar 203c, the heat of the steel sheet 202c continues to be conducted to the limit disc 203a and the sliding rod 203b through the fireplace 100 and the heat conducting plate 202d, causing the sliding rod 203b to thermally expand and block the gap between the sliding rod 203b and the fixed collar 203c, making the sliding rod 203b be clamped and limited. When the fireplace 100 stops heating and the heat in the placement groove is discharged and the temperature in the placement groove drops to a certain value, the copper sheet 202b and the steel sheet 202c contract and reset due to cooling, and the copper sheet 202b continues to make electrical connection with the conductive sheet 202e, enabling the circuit 202a to resume operation. The sliding rod 203b will not slide off the limit with the fixed collar 203c under the action of gravity until it cools and contracts. Until the limit disc 203a at the top end of the sliding rod 203b is limited by the top end of the fixed collar 203c, the flap 201 continues to close the placement groove at this time to prevent dust from falling into the placement groove and contaminating the circuit board 202a. Since the descending time of the limit disc 203a, the sliding rod 203b and the flap 201 is after that of the copper sheet 202b and the steel sheet 202c, it not only prevents the gravity of the flap 201, the limit disc 203a and the sliding rod 203b from applying pressure to the copper sheet 202b and the steel sheet 202c during the descending process, thus preventing the increase of metal fatigue of the copper sheet 202b and the steel sheet 202c, but also when the sliding rod 203b and the limit disc 203a at the top end of the sliding rod 203b push open the flap 201, since the thermally expanded sliding rod 203b blocks the gap and is clamped and limited to the fixed collar 203c, the gravity of the flap 201, the limit disc 203a and the sliding rod 203b still will not apply pressure to the copper sheet 202b and the steel sheet 202c, avoiding the increase of metal fatigue of the copper sheet 202b and the steel sheet 202c.

[0050] Importantly, it should be noted that the construction and arrangement of the present application shown in multiple different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who refer to this disclosure should easily understand that many modifications are possible without substantially departing from the novel teachings and advantages of the subject matter described in this application (e.g., changes in the dimensions, scales, structures, shapes and proportions of various elements, as well as parameter values (such as temperature, pressure, etc.), installation arrangements, use of materials, colors, orientations, etc.). For example, an element shown as integrally formed may be composed of multiple parts or elements, the positions of the elements may be inverted or otherwise changed, and the nature, number or position of discrete elements may be altered or changed. Accordingly, all such modifications are intended to be included within the scope of the present utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any clause of "circuit board heat dissipation system plus function" is intended to cover the structures performing the functions described herein, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present utility model. Therefore, the present utility model is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0051] In addition, in order to provide a concise description of the exemplary embodiments, not all features of the actual embodiments may be described (i.e., those features that are not relevant to the currently considered best mode of implementing the present utility model or those features that are not relevant to the implementation of the present utility model).

[0052] It should be understood that in the development of any actual implementation, as in any engineering or design project, a large number of specific implementation decisions may be made. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, without excessive experimentation, such development efforts will be a routine task of design, manufacturing and production.

[0053] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and not to limit them. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present utility model, and all of them should be covered by the scope of the claims of the present utility model.

Claims

1. A circuit board heat dissipation system, characterized in that: include, A fireplace (100), wherein a placement groove is provided on the top of the fireplace (100); A heat dissipation component (200) comprising a flap (201) provided on the fireplace (100), a conductive member (202) provided on the inner wall of the bottom of the placement groove, and a lifting member (203) provided on the side wall of the placement groove; The conductive member (202) includes a conductive sheet (202e), a copper sheet (202b) electrically connected to the conductive sheet (202e) under normal conditions, and a steel sheet (202c) disposed on a side of the copper sheet (202b) away from the conductive sheet (202e); The lifting member (203) comprises a limit plate (203a) that contacts the steel sheet (202c) during operation, a slide bar (203b) provided on the limit plate (203a), and a fixed collar (203c) that is slidably sleeved with the slide bar (203b).

2. The circuit board heat dissipation system according to claim 1, characterized in that: The end of the flap (201) is bent and contacts the side wall of the fireplace (100) in a normal state, a circuit board (202a) is arranged on the conductive sheet (202e), and the ends of the copper sheet (202b) and the steel sheet (202c) are both provided with the same heat conducting plate (202d).

3. The circuit board heat dissipation system according to claim 2, characterized in that: The vertical projection areas of the copper sheet (202b) and the steel sheet (202c) can cover the vertical projection area of ​​the circuit board (202a), and a plurality of anti-slip grooves are provided on a side of the steel sheet (202c) away from the copper sheet (202b).

4. The circuit board heat dissipation system according to claim 3, characterized in that: The lifting member (203) is close to the raised ends of the copper sheet (202b) and the steel sheet (202c), and a connecting rod (203d) fixedly connected to the side wall of the placement groove is provided on the fixing ring (203c).

5. The circuit board heat dissipation system according to claim 4, characterized in that: The top end and the bottom end of the sliding rod (203b) are both fixedly connected to the limiting plate (203a), and the side of the limiting plate (203a) away from the sliding rod (203b) is arc-shaped.

6. The circuit board heat dissipation system according to claim 5, characterized in that: There is a gap between the outer wall of the sliding rod (203b) and the inner wall of the fixing ring (203c).

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