Device for detecting packaging density

Abstract

The utility model provides a device for detecting packaging density, which relates to the technical field of chip packaging detection and comprises a rotating mechanism, and a detection mechanism is arranged at the top of the rotating mechanism. During use, according to chip packaging thickness parameters, the electric push rod can drive the lifting platform to ascend and descend to a proper height, laser beams are attached to the packaging top of a chip, the matrix type laser transmitter transmits the laser beams, the matrix type laser receiver receives optical signals, converts the optical signals into electric signals and sends the electric signals to an external PLC for analysis and processing, and meanwhile, the electric push rod can drive the lifting platform to ascend and descend to a proper height to enable the laser beams to be attached to the packaging top of the chip. The motor, the driving gear and the gear rotating disc are matched to achieve the effect of driving chip packaging to rotate and detect at the same time, the flatness of the top plane of the chip packaging can be detected according to the signal receiving condition, and on the whole, the device is simple in structure and high in automation degree, the defects of manual naked eye detection are effectively overcome, and the detection efficiency is improved. The accuracy of a detection result is difficult to guarantee, and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging detection, in particular to a device for detecting packaging density. Background Technique

[0002] In industries such as electronics and semiconductors, packaging density is one of the important indicators to measure product quality and performance. Chip density usually refers to the quantity and distribution of components, circuits or functional units integrated within a specific area of the chip.

[0003] At present, the circuits and pins inside the chip package are mainly detected by electrical methods. The evenness of the material distribution around the chip in the chip package will directly affect the flatness of the top surface of the package. Therefore, detecting the flatness of the top surface of the package is also one of the important means for detecting packaging density. In the prior art, detecting the flatness of the top surface of the package mainly relies on manual vision to observe and judge whether it is flat. This not only involves a huge workload, is time-consuming and laborious, but also the accuracy of the detection results is difficult to guarantee. Therefore, in view of the above problems, we propose a novel device for detecting packaging density. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problem in the prior art that detecting the flatness of the top surface of the package mainly relies on manual vision to observe and judge whether it is flat, which not only involves a huge workload, is time-consuming and laborious, but also the accuracy of the detection results is difficult to guarantee, and to propose a device for detecting packaging density.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A device for detecting packaging density, including a rotating mechanism, a detection mechanism is arranged on the top of the rotating mechanism. The detection mechanism includes a lifting platform. Electric push rods are installed at positions close to the four corners at the bottom of the lifting platform. A matrix laser emitter is installed at a position close to the front side edge at the bottom of the lifting platform. A matrix laser receiver is installed at a position close to the rear side edge at the bottom of the lifting platform. The matrix laser emitter and the matrix laser receiver cooperate with each other. The center of the top of the lifting platform is provided with a hollow.

[0006] Preferably, the rotating mechanism includes a support platform, and an embedded groove is opened on the top of the support platform.

[0007] Preferably, a driving gear is rotatably connected to a position close to the left side at the inner bottom of the embedded groove, and a gear turntable is rotatably connected to a position close to the right side at the inner bottom of the embedded groove.

[0008] Preferably, a first mounting plate is installed at a position above the driving gear on the top of the support platform, and a motor is installed on the top of the first mounting plate.

[0009] Preferably, the output end of the motor rotates through the top of the first mounting plate and extends downward. The output end of the motor is fixedly connected to the center of the top of the driving gear, and the driving gear is meshed with the gear turntable.

[0010] Preferably, a plurality of support columns are fixedly connected to the top of the gear turntable. A detection table is fixedly connected between the tops of the plurality of support columns. A limiting frame is fixedly connected to the top of the detection table near the middle position. An inwardly inclined notch is provided on the inner surface of the limiting frame near the top.

[0011] Preferably, a suction cup is embedded near the center of the detection table. A second mounting plate is fixedly connected to the bottom of the detection table. A vacuum pump is installed on the outer surface of the second mounting plate. The suction end of the vacuum pump is fixedly communicated with the bottom of the suction cup.

[0012] Compared with the prior art, the advantages and positive effects of the present utility model are as follows.

[0013] 1. In the present utility model, during use, according to the chip packaging thickness parameter, the electric push rod drives the lifting table to rise and fall to a suitable height, so that the laser beam fits the top of the chip packaging. The matrix laser emitter emits a laser beam, and the matrix laser receiver receives the optical signal and converts it into an electrical signal and sends it to the external PLC controller for analysis and processing. Moreover, through the cooperation of the motor, the driving gear and the gear turntable, the chip packaging is driven to rotate and be detected at the same time. According to the signal reception situation, the flatness of the top plane of the chip packaging can be detected. Generally speaking, the device has a simple structure and a high degree of automation, effectively solving the drawbacks of manual visual inspection, such as time-consuming, laborious, and difficult to guarantee the accuracy of the detection results.

[0014] 2. In the present utility model, when the chip packaging is placed on the detection table through the limiting frame for detection, starting the vacuum pump can evacuate the inside of the suction cup to a vacuum state. The top of the suction cup is attached to the bottom of the chip packaging. When a vacuum state is formed inside, it plays a role in adsorbing and fixing the chip packaging under the action of atmospheric pressure, thereby ensuring the stability of the chip packaging during detection and further improving the accuracy of the detection results. Description of the Drawings

[0015] Figure 1 is a three-dimensional view of a device for detecting packaging density proposed by the present utility model;

[0016] Figure 2 is a structural schematic diagram of the rotating mechanism of a device for detecting packaging density proposed by the present utility model;

[0017] Figure 3 is a structural schematic diagram of the detection mechanism of a device for detecting packaging density proposed by the present utility model;

[0018] Figure 4 This is a partial structural schematic diagram of a device for detecting packaging density proposed by the present utility model.

[0019] Legend: 1. Rotating mechanism; 101. Support table; 102. Embedded groove; 103. First mounting plate; 104. Gear turntable; 105. Driving gear; 106. Motor; 2. Detection mechanism; 201. Lifting table; 202. Electric push rod; 203. Matrix laser emitter; 204. Matrix laser receiver; 3. Support column; 31. Detection table; 32. Limit frame; 33. Bevel; 4. Second mounting plate; 41. Vacuum pump; 42. Suction cup. Specific embodiments

[0020] In order to more clearly understand the above objects, features and advantages of the present utility model, the present utility model will be further described below with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0021] In the following description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the specific embodiments disclosed in the following specification.

[0022] Embodiment 1: As Figures 1 - 4As shown in the figure, the present utility model provides a device for detecting packaging density, including a rotating mechanism 1. A detection mechanism 2 is arranged on the top of the rotating mechanism 1. The detection mechanism 2 includes a lifting platform 201. Electric push rods 202 are installed at positions near the four corners of the bottom of the lifting platform 201. A matrix laser emitter 203 is installed at a position near the front side edge of the bottom of the lifting platform 201. A matrix laser receiver 204 is installed at a position near the rear side edge of the bottom of the lifting platform 201. The matrix laser emitter 203 and the matrix laser receiver 204 cooperate with each other. The top center of the lifting platform 201 is provided with a hollow. The rotating mechanism 1 includes a support platform 101. An embedded groove 102 is formed on the top of the support platform 101. A driving gear 105 is rotatably connected to a position near the left side of the inner bottom of the embedded groove 102. A gear turntable 104 is rotatably connected to a position near the right side of the inner bottom of the embedded groove 102. A first mounting plate 103 is installed at a position above the driving gear 105 on the top of the support platform 101. A motor 106 is installed on the top of the first mounting plate 103. The output end of the motor 106 rotatably penetrates through the top of the first mounting plate 103 and extends downward. The output end of the motor 106 is fixedly connected to the center of the top of the driving gear 105. The driving gear 105 is meshed with the gear turntable 104. A plurality of support columns 3 are fixedly connected to the top of the gear turntable 104. A detection table 31 is fixedly connected between the tops of the plurality of support columns 3. A limiting frame 32 is fixedly connected to a position near the middle of the top of the detection table 31. An inwardly inclined bevel 33 is provided on the inner surface of the limiting frame 32 near the top.

[0023] The effect achieved by the entire Example 1 is that the matrix laser emitter 203 and the matrix laser receiver 204 in this device are supporting equipment. Its working principle is to control the matrix laser emitter 203 to emit a series of laser beams in a specific pattern, and then use the matrix laser receiver 204 to receive these laser beams and convert them into electrical signals. Through the analysis and processing of these signals or images by an external PLC controller, the flatness information of the object can be obtained. When in use, the chip package to be detected is placed in the limit frame 32 for positioning. Subsequently, the matrix laser emitter 203 emits laser beams and the matrix laser receiver 204 receives the emitted optical signals, and then converts them into electrical signals and sends them to the external PLC controller for analysis and processing. During the process, according to the chip package thickness parameter, the electric push rod 202 is started to drive the lifting platform 201 to rise or fall to an appropriate height, so that the laser beam fits the top of the chip package. Subsequently, the motor 106 is started to drive the driving gear 105 to rotate. When the driving gear 105 rotates, it will drive the gear turntable 104 to slowly rotate, thereby driving the detection table 31 and the chip package to rotate. When the surface of the chip package is uneven, the laser beam will be blocked and the signal will be lost. According to the signal reception situation, the flatness of the top plane of the chip package can be detected. The overall structure is simple and the degree of automation is relatively high, solving the problems of time-consuming and laborious manual visual inspection and difficult to guarantee the accuracy of the inspection results. The support column 3 is mainly used to connect the detection table 31 and the gear turntable 104. The limit frame 32 is mainly used to position the chip package, and the inclined opening 33 at the top plays a guiding role, facilitating the placement of the chip package.

[0024] Example 2: As Figures 1 - 4 shown, a suction cup 42 is embedded near the center inside the detection table 31. A second mounting plate 4 is fixedly connected to the bottom of the detection table 31. A vacuum pump 41 is installed on the outer surface of the second mounting plate 4. The suction end of the vacuum pump 41 is fixedly communicated with the bottom of the suction cup 42.

[0025] The effect achieved by the entire Example 2 is that when the chip package is placed on the detection table 31 through the limit frame 32 for detection, starting the vacuum pump 41 can evacuate the inside of the suction cup 42 to a vacuum state, and the top of the suction cup 42 fits the bottom of the chip package. When a vacuum state is formed inside, it plays a role in adsorbing and fixing the chip package under the action of atmospheric pressure, thereby ensuring the stability during the detection of the chip package and further improving the accuracy of the detection results.

[0026] Working principle: During use, the chip package to be detected is placed in the limit frame 32 for limiting. Subsequently, the matrix laser emitter 203 emits laser beams, and the matrix laser receiver 204 receives the emitted optical signals. Then, they are converted into electrical signals and sent to the external PLC controller for analysis and processing. During this process, according to the chip package thickness parameter, the electric push rod 202 is activated to drive the lifting platform 201 to rise and fall to an appropriate height, so that the laser beam fits the top of the chip package. Subsequently, the motor 106 is activated to drive the driving gear 105 to rotate. When the driving gear 105 rotates, it will drive the gear turntable 104 to slowly rotate, thereby driving the detection table 31 and the chip package to rotate. When the surface of the chip package is uneven, the laser beam will be blocked and the signal will be lost. According to the signal reception situation, the flatness of the top plane of the chip package can be detected. The overall structure is simple and the degree of automation is relatively high, solving the problems of time-consuming and laborious manual visual inspection and difficult to guarantee the accuracy of the detection results. Moreover, when the chip package is placed on the detection table 31 through the limit frame 32 for detection, the vacuum pump 41 is activated to evacuate the inside of the suction cup 42 into a vacuum state. The top of the suction cup 42 fits the bottom of the chip package. When a vacuum state is formed inside, it plays a role in adsorbing and fixing the chip package under the action of atmospheric pressure, thereby ensuring the stability during the detection of the chip package and further improving the accuracy of the detection results.

[0027] The above are only the preferred embodiments of the present invention, and are not limitations on the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A device for detecting packaging density, comprising a rotating mechanism (1), characterized in that: A detection mechanism (2) is provided on the top of the rotating mechanism (1); The detection mechanism (2) comprises a lifting platform (201), electric push rods (202) are installed at positions near the four corners of the bottom of the lifting platform (201), a matrix laser transmitter (203) is installed at the bottom of the lifting platform (201) near the front edge, and a matrix laser receiver (204) is installed at the bottom of the lifting platform (201) near the rear edge. The matrix laser transmitter (203) and the matrix laser receiver (204) cooperate with each other, and the top center of the lifting platform (201) is hollowed out.

2. The device for detecting packaging density according to claim 1, characterized in that: The rotating mechanism (1) comprises a support platform (101), and an embedded groove (102) is provided on the top of the support platform (101).

3. The device for detecting packaging density according to claim 2, characterized in that: A driving gear (105) is rotatably connected to a position near the left side of the inner bottom of the embedded groove (102), and a gear rotating disk (104) is rotatably connected to a position near the right side of the inner bottom of the embedded groove (102).

4. The device for detecting packaging density according to claim 3, characterized in that: A first mounting plate (103) is installed on the top of the support platform (101) at a position above the driving gear (105), and a motor (106) is installed on the top of the first mounting plate (103).

5. The device for detecting packaging density according to claim 4, characterized in that: The output end of the motor (106) rotates through the top of the first mounting plate (103) and extends to the bottom, the output end of the motor (106) is fixedly connected to the top center of the driving gear (105), and the driving gear (105) is meshedly connected to the gear rotating disk (104).

6. The device for detecting packaging density according to claim 5, characterized in that: The top of the gear turntable (104) is fixedly connected to a plurality of support columns (3), the tops of the plurality of support columns (3) are fixedly connected to a detection platform (31), the top of the detection platform (31) is fixedly connected to a limit frame (32) near the middle, and the inner surface wall of the limit frame (32) is provided with an inwardly inclined oblique opening (33) near the top.

7. The device for detecting packaging density according to claim 6, characterized in that: A suction cup (42) is embedded near the center of the detection platform (31); a second mounting plate (4) is fixedly connected to the bottom of the detection platform (31); a vacuum pump (41) is installed on the outer surface of the second mounting plate (4); and a suction end of the vacuum pump (41) is fixedly connected to the bottom of the suction cup (42).

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