Pressure sensor and electronic device

Abstract

The utility model discloses a pressure sensor and electronic equipment, relates to sensor technical field, pressure sensor includes shell, chipset and waterproof structure, shell includes shell and substrate, shell is provided in the substrate, shell and substrate enclose to form the inner cavity, shell forms the air hole that communicates the inner cavity, chipset all or part is provided in the inner cavity, waterproof structure is provided in the waterproof structure. The waterproof structure comprises a first film body and a heating net, the first film body and the heating net are arranged on the shell and cover the air hole, and the heating net is used for generating heat. The utility model aims to actively evaporate water vapor through the pressure sensor, avoid water vapor gathering, and improve the measurement accuracy and the working performance of the pressure sensor in a relatively humid environment.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, and particularly to a pressure sensor and an electronic device. Background Art

[0002] With the rise of wearable products such as smart watches and bracelets, air pressure sensors / pressure sensors have become essential standard components. An air pressure sensor can measure air pressure, and its data can be used to determine the altitude of the location where the product is located.

[0003] In order to improve the waterproof level and product performance of wearable devices, pressure sensors usually also need to have a relatively high waterproof level accordingly to adapt to a relatively humid environment. Although a type of existing pressure sensor can passively prevent water vapor from invading in a short time, when it is in a humid environment for a long time, water vapor will inevitably invade its interior, affecting the measurement accuracy of the pressure sensor in a special environment. Another type of sensor, in order to improve the long-term waterproof performance, will use waterproof glue to fill the entire chamber of the sensor to completely wrap the chip of the sensor to achieve passive blocking and waterproofing. However, the waterproof glue will release a large amount of gas in a high-temperature environment such as reflow soldering of the pressure sensor, forming irregularly distributed bubbles in the glue body, also causing the overall measurement accuracy of the pressure sensor to decline. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a pressure sensor and an electronic device, aiming to actively evaporate water vapor through the pressure sensor, avoid the accumulation of water vapor, and improve the measurement accuracy and working performance of the pressure sensor in a relatively humid environment.

[0005] To achieve the above purpose, the utility model proposes a pressure sensor, which includes:

[0006] A housing, which includes an outer shell and a substrate. The outer shell is disposed on the substrate, and the outer shell and the substrate enclose an inner cavity. The outer shell forms an air hole communicating with the inner cavity;

[0007] A chipset, all or part of which is disposed in the inner cavity; and

[0008] A waterproof structure, which includes a first film body and a heating grid. The first film body and the heating grid are disposed on the outer shell and cover the air hole. The heating grid is used to generate heat.

[0009] In one embodiment, the outer shell is a metal housing, the outer shell is electrically connected to the substrate, and the heating grid is electrically connected to the outer shell.

[0010] In one embodiment, the waterproof structure further includes a conductive adhesive layer disposed around the air holes. One side of the conductive adhesive layer is bonded to the housing, and the other side of the conductive adhesive layer is bonded to the heating grid.

[0011] In one embodiment, the substrate is a circuit board, and the heating grid is electrically connected to the substrate.

[0012] In one embodiment, the heating grid is electrically connected to the chipset.

[0013] In one embodiment, the chipset is provided with a humidity detection module, the humidity detection module is a humidity-sensitive resistor or a humidity-sensitive capacitor, and the humidity detection module is electrically connected to the heating grid.

[0014] In one embodiment, the heating grid is located in the inner cavity, and the first film body is disposed on a side of the housing facing away from the inner cavity, so that part of the housing and the air holes are located between the first film body and the heating grid.

[0015] In one embodiment, the first film body and the heating grid are disposed on a side of the housing facing away from the inner cavity, and the first film body is connected to a side of the heating grid facing away from the housing.

[0016] In one embodiment, the waterproof structure further includes a second film body disposed on the substrate and located in the inner cavity, and the second film body surrounds all or part of the chipset.

[0017] In one embodiment, the waterproof structure further includes a support wall disposed on the substrate and located in the inner cavity;

[0018] The second film body is connected to the support wall, and the second film body, the support wall and part of the substrate enclose a waterproof cavity, and all or part of the chipset is located in the waterproof cavity.

[0019] In one embodiment, the chipset includes a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are electrically connected, the MEMS chip is disposed on a surface of the substrate facing the housing side, and the ASIC chip is disposed inside the substrate.

[0020] The present invention also provides an electronic device, and the electronic device includes the above-mentioned pressure sensor.

[0021] The pressure sensor in the technical solution of the present utility model includes a housing, a chipset, and a waterproof structure. The housing includes an outer shell and a substrate. The outer shell is disposed on the substrate, and the outer shell and the substrate enclose an inner cavity. Moreover, the outer shell is formed with air holes communicating with the inner cavity so that the chipset is disposed in the inner cavity. Among them, the waterproof structure includes a first film body and a heating grid. The first film body and the heating grid are both disposed on the outer shell and cover the air holes. The heating grid is used to generate heat. By providing the heating grid, the moisture invading the pressure sensor can be evaporated in a timely and active manner by the heat generated by the heating grid, preventing the moisture from aggregating into water droplets, which may have a greater impact on the pressure sensor, effectively improving the measurement accuracy and product performance of the pressure sensor in a relatively humid environment, and enhancing the versatility and applicability of the pressure sensor. Brief Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0023] Figure 1 It is a schematic structural diagram of a pressure sensor in an embodiment of the present utility model;

[0024] Figure 2 is Figure 1 a partial enlarged view of part A in

[0025] Figure 3 It is a schematic structural diagram of a pressure sensor in another embodiment of the present utility model.

[0026] Explanation of the Reference Numerals in the Drawings:

[0027] 100, pressure sensor; 1, housing; 11, outer shell; 12, substrate; 13, inner cavity; 14, air holes; 2, chipset; 21, MEMS chip; 22, ASIC chip; 3, waterproof structure; 31, first film body; 32, heating grid; 33, conductive adhesive layer; 34, second film body; 35, support wall; 36, waterproof cavity.

[0028] The realization of the purpose, functional features, and advantages of the present utility model will be further described in conjunction with the embodiments and with reference to the drawings. Detailed Embodiments

[0029] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0030] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0031] In addition, if there are descriptions such as "first" and "second" involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0032] To achieve the above object, please refer to Figures 1 to 3 As shown, the present utility model provides a pressure sensor 100. The pressure sensor 100 includes a housing 1, a chip set 2, and a waterproof structure 3. The housing 1 includes an outer shell 11 and a substrate 12. The outer shell 11 is disposed on the substrate 12. The outer shell 11 and the substrate 12 enclose an inner cavity 13. The outer shell 11 forms an air hole 14 communicating with the inner cavity 13. The chip set 2 is disposed entirely or partially in the inner cavity 13. The waterproof structure 3 includes a first film body 31 and a heating grid 32. The first film body 31 and the heating grid 32 are disposed on the outer shell 11 and cover the air hole 14. The heating grid 32 is used to generate heat.

[0033] In this embodiment, as Figure 1 and Figure 3As shown, the housing 1 is a structural support component of the pressure sensor 100, used for installing and placing the chipset 2 and the waterproof structure 3. The housing 1 includes a housing shell 11 and a substrate 12. The substrate 12 is a circuit board for installing and placing chips. At the same time, the substrate 12 can be electrically connected to the chipset 2 and external electronic devices through solder or gold wires to enable the normal operation of the pressure sensor 100. The housing shell 11 covers the substrate 12. The housing shell 11 can be a metal housing shell 11, a plastic housing shell 11, or a ceramic housing shell 11. The housing shell 11 and the substrate 12 enclose to form an inner cavity 13. The chipset 2 is arranged in the inner cavity 13. On the one hand, the housing shell 11 is used to protect the internal chipset 2. On the other hand, the housing shell 11 can form electromagnetic shielding to reduce the electromagnetic interference and thermal noise generated by the outside on the chipset 2.

[0034] In this embodiment, the pressure sensor 100 further includes a waterproof structure 3. The waterproof structure 3 includes a first film body 31 and a heating mesh 32. The first film body 31 is a waterproof and breathable film, and its material can be polytetrafluoroethylene. The waterproof and breathable film has micropores with diameters between 100 nanometers and 500 nanometers, enabling air to freely pass through the waterproof and breathable film while water molecules cannot pass through.

[0035] It can be understood that the first film body 31 is arranged on the housing shell 11 and is set to cover the air holes 14, so that through the first film body 31, the external liquid intrusion into the inner cavity 13 where the chipset 2 is located can be effectively isolated. Thus, while protecting the internal chipset 2 from external liquid and water intrusion, it can also ensure that the pressure in the inner cavity 13 of the pressure sensor 100 and the external space remains balanced, avoiding the decrease in the detection accuracy of the pressure sensor 100 due to the pressure difference inside and outside.

[0036] Furthermore, since the micropores of the existing waterproof and breathable film can only block large - molecule water molecules and still cannot block water vapor molecules, when in a humid environment for a long time, there will still be some water vapor intruding into the inner cavity 13, eroding the chipset 2 and causing the detection accuracy of the entire pressure sensor 100 to decrease.

[0037] It can be understood that, based on the defects of the above waterproof and breathable film (the first film body 31), the waterproof structure 3 is also provided with a heating grid 32. The heating grid 32 is arranged on the housing 1 and is also arranged to cover the air holes 14. The heating grid 32 can generate heat. For example, the heating grid 32 is an electric heating wire. By energizing the heating grid 32 to generate heat, the water vapor invading the inner cavity 13 from the air holes 14 can be actively evaporated, so as to protect the internal chipset 2 from the erosion of water vapor. Moreover, the first film body 31 and the heating grid 32 act together. The first film body 31 is used to passively block the external large molecule water and keep the waterproof structure 3 breathable, so that the air pressure in the inner cavity 13 is consistent with the external air pressure. While the heating grid 32 is used to actively evaporate the invading water vapor to achieve active and passive dehumidification, effectively improving the waterproof performance of the pressure sensor 100, avoiding the accumulation of water vapor, enhancing the measurement accuracy and working performance of the pressure sensor 100 in a relatively humid environment, and expanding the use environment and use scenarios of the pressure sensor 100.

[0038] The pressure sensor 100 in this technical solution includes a housing 1, a chipset 2 and a waterproof structure 3. The housing 1 includes an outer shell 11 and a substrate 12. The outer shell 11 is arranged on the substrate 12. The outer shell 11 and the substrate 12 enclose to form an inner cavity 13. And the outer shell 11 is formed with air holes 14 communicating with the inner cavity 13, so that the chipset 2 is arranged in the inner cavity 13. Among them, the waterproof structure 3 includes a first film body 31 and a heating grid 32. The first film body 31 and the heating grid 32 are both arranged on the outer shell 11 and are arranged to cover the air holes 14. The heating grid 32 is used to generate heat. By arranging the heating grid 32, the moisture invading the pressure sensor 100 can be actively evaporated in time by the heat generated by the heating grid 32, avoiding the moisture aggregating into water droplets, which may cause a greater impact on the pressure sensor 100, effectively improving the measurement accuracy and product performance of the pressure sensor 100 in a relatively humid environment, and enhancing the versatility and applicability of the pressure sensor 100.

[0039] In an embodiment, as Figures 1 to 3 shown, the outer shell 11 is a metal housing 1. The outer shell 11 is electrically connected to the substrate 12, and the heating grid 32 is electrically connected to the outer shell 11.

[0040] In this embodiment, the outer shell 11 is a metal outer shell 11. When the outer shell 11 is connected to the substrate 12 to form the inner cavity 13, the outer shell 11 is also electrically connected to the grounding end of the substrate 12 to ground the entire outer shell 11. At the same time, the heating grid 32 is also electrically connected to the outer shell 11. The heating grid 32 and / or the outer shell 11 can be electrically connected by setting gold wires to achieve electrical communication between the heating grid 32 and the outer shell 11. A silver paste conductive layer or a conductive adhesive layer 33 can also be provided between the heating grid 32 and the outer shell 11. On the basis of electrically connecting the heating grid 32 and the outer shell 11, the heating grid 32 can be attached to the inner wall of the outer shell 11 on one side of the inner cavity 13 or the outer wall facing away from the inner cavity 13, and the air hole 14 can be covered.

[0041] It can be understood that on the basis that the outer shell 11 is a metal shell 1, the heating grid 32 can be arranged on the outer shell 11 and directly electrically connected to the outer shell 11, so that the heating grid 32 can generate heat by providing current through the metal shell 1. This not only makes the structure of the pressure sensor 100 more compact, but also can actively evaporate the water vapor invading at the air hole 14 through the heat generated by the heating grid 32, avoiding the invasion and aggregation of water vapor into water droplets at the air hole 14, thereby improving the waterproof performance of the pressure sensor 100 in a relatively humid and high-water-pressure environment.

[0042] In one embodiment, as Figure 2 shown, the waterproof structure 3 further includes a conductive adhesive layer 33. The conductive adhesive layer 33 is arranged around the air hole 14. One side of the conductive adhesive layer 33 is bonded to the outer shell 11, and the other side of the conductive adhesive layer 33 is bonded to the heating grid 32.

[0043] In this embodiment, the conductive adhesive layer 33 is a connection layer structure formed by conductive adhesive. The conductive adhesive is an adhesive with conductive particles (such as metals like gold, silver, copper, etc.) and a matrix resin material. The conductive adhesive layer 33 formed by the conductive adhesive is arranged around the periphery of the air hole 14, so that one side of the conductive adhesive layer 33 is bonded to the outer shell 11, and the other side of the conductive adhesive layer 33 is bonded to the heating grid 32. Through the conductive adhesive layer 33, not only can the bonding connection between the heating grid 32 and the outer shell 11 be realized, but also the electrical connection between the heating grid 32 and the outer shell 11 can be realized to provide current for the heating grid 32 to generate heat.

[0044] It can be understood that by setting the conductive adhesive layer 33, the heating grid 32 is bonded to the outer shell 11 at the periphery of the air hole 14, thereby effectively improving the connection and sealing performance between the heating grid 32 and the outer shell 11, avoiding water vapor from invading the inside of the pressure sensor 100 from the connection between the heating grid 32 and the outer shell 11, and at the same time ensuring that all the heat dissipated by the heating grid 32 can enter the air hole 14 to actively evaporate the water vapor invading from the air hole 14, effectively improving the active waterproof effect.

[0045] In one embodiment, the substrate 12 is a circuit board, and the heating grid 32 is electrically connected to the substrate 12.

[0046] It can be understood that when the substrate 12 is a circuit board, the heating grid 32 can also be electrically connected to the substrate 12 through gold wires to provide more sufficient power supply for the heating grid 32. At the same time, by integrating a control circuit, such as a current control circuit, in the substrate 12, the magnitude of the current flowing into the heating grid 32 can be controlled, thereby controlling the amount of heat generated by the heating grid 32 and achieving more precise active dehumidification and waterproofing.

[0047] In one embodiment, the heating grid 32 is electrically connected to the chipset 2. The chipset 2 is provided with a humidity detection module. The humidity detection module is a humidity-sensitive resistor or a humidity-sensitive capacitor, and the humidity detection module is electrically connected to the heating grid 32.

[0048] In this embodiment, a humidity detection module is arranged inside the chipset 2. The humidity detection module includes a humidity sensor and a control circuit electrically connected to the humidity sensor. Among them, the humidity sensor can be a humidity-sensitive resistor or a humidity-sensitive capacitor. Through the humidity sensor, the humidity value inside the pressure sensor 100 can be detected. At the same time, the control circuit is electrically connected to the heating grid 32.

[0049] It can be understood that the control circuit in the humidity detection module is electrically connected to the heating grid 32, so that on the basis of supplying power to the heating grid 32, the real-time humidity situation inside the pressure sensor 100 can be associated with the operation situation of the heating grid 32. Specifically, the humidity value inside the pressure sensor 100 is detected by the humidity sensor in the humidity detection module. When the humidity value is relatively high, that is, when more water vapor invades inside the pressure sensor 100, it means that the pressure sensor 100 is in a relatively humid environment or a high water pressure environment at this time. At this time, the control circuit controls the heating grid 32 to start operating, and according to the real-time humidity value, the magnitude of the current of the heating grid 32 is controlled to actively evaporate and dehumidify the water vapor inside the pressure sensor 100, and at the same time, the heat generation of the heating grid 32 can be adjusted in real time according to the humidity value; when the humidity sensor detects that the humidity value inside the pressure sensor 100 is relatively low, the control circuit can control the heating grid 32 to stop running to reduce the energy consumption of the pressure sensor 100, thereby achieving precise adjustment and precise dehumidification and waterproofing and improving the working performance of the pressure sensor 100.

[0050] In one embodiment, as Figure 1 and Figure 2 shown, the heating grid 32 is located in the inner cavity 13, and the first film body 31 is arranged on the side of the outer shell 11 facing away from the inner cavity 13, so that part of the outer shell 11 and the air holes 14 are located between the first film body 31 and the heating grid 32.

[0051] In this embodiment, the heating grid 32 is connected to one side of the outer shell 11 inside the inner cavity 13, and at the same time, the first film body 31 is arranged on the side of the outer shell 11 facing away from the inner cavity 13. At this time, the heating grid 32 and the first film body 31 are on both sides of the outer shell 11 and simultaneously cover the air holes 14.

[0052] It can be understood that the first film body 31 is always on the side of the outer shell 11 facing away from the inner cavity 13 to form the first waterproof barrier of the pressure sensor 100, so as to passively protect against the inflowing water and water vapor from the outside and prevent them from entering the inside of the pressure sensor 100. However, in a humid environment for a long time or in an environment with a large water pressure, water vapor will still invade the inside of the pressure sensor 100. At this time, the water vapor can be actively evaporated by the heating grid 32 located in the inner cavity 13 to achieve the purpose of dehumidification and waterproofing.

[0053] At the same time, the heating grid 32 and the first film body 31 are arranged on both sides of the outer shell 11, so that the heating grid 32 and the first film body 31 cover both ends of the air hole 14, and the heating grid 32 and the first film body 31 enclose a sealed cavity with the pore wall of the air hole 14. On the basis of ensuring that the air pressure inside the inner cavity 13 is the same as that outside, the water vapor invading the sealed cavity can be actively evaporated to improve the dehumidification and waterproofing performance.

[0054] In one embodiment, as Figure 3 shown, the first film body 31 and the heating grid 32 are arranged on the side of the outer shell 11 facing away from the inner cavity 13, and the first film body 31 is connected to the side of the heating grid 32 facing away from the outer shell 11.

[0055] It can be understood that both the first film body 31 and the heating grid 32 are arranged on the side of the outer shell 11 facing away from the inner cavity 13, and the heating grid 32 is bonded to the outer shell 11 through the conductive adhesive layer 33. The first film body 31 is hermetically bonded to the side of the heating grid 32 facing away from the outer shell 11 to form a layered waterproof structure 3, so that the heating grid 32 can more actively heat and dehumidify the external space on the side of the air hole 14 facing away from the inner cavity 13 to prevent water vapor from invading the inner cavity 13 of the pressure sensor 100 through the air hole 14 and improve the active waterproof performance.

[0056] In one embodiment, as Figure 1 and Figure 3 shown, the waterproof structure 3 further includes a second film body 34. The second film body 34 is arranged on the substrate 12 and is located inside the inner cavity 13. The second film body 34 surrounds all or part of the chipset 2.

[0057] In this embodiment, the waterproof structure 3 further includes a second membrane body 34 different from the first membrane body 31. The second membrane body 34 is disposed on the substrate 12 and located in the inner cavity 13. The second membrane body 34, like the first membrane body 31, is a waterproof and breathable membrane. The periphery of the second membrane body 34 is connected to the substrate 12, such as by bonding or press-fitting. Moreover, the main body part of the second membrane body 34 faces away from the surface of the substrate 12 on the side facing the inner cavity 13, making the second membrane body 34 in a dome-shaped structure. That is, at this time, the second membrane body 34 and the surface of the substrate 12 on the side facing the inner cavity 13 enclose a waterproof cavity 36, and all or part of the chipset 2 is disposed in the waterproof cavity 36. Among them, when all of the chipset 2 is disposed on the surface of the substrate 12 facing the inner cavity 13, the second membrane body 34 surrounds all of the chipset 2. When a part of the chipset 2 is disposed on the surface of the substrate 12 facing the inner cavity 13 and the other part is disposed inside the substrate 12, the second membrane body 34 surrounds the part of the chipset 2 disposed on the surface of the substrate 12 facing the inner cavity 13, so as to seal the chipset 2 and ensure the moisture-proof and waterproof performance of the chipset 2.

[0058] It can be understood that the second membrane body 34 is disposed in the orientation where the chipset 2 senses the external air pressure change. The second membrane body 34 itself has a certain deformation ability. For example, when the external air pressure is affected by an increase in pressure, the air pressure increases, and the external air acts on the second membrane body 34, causing the second membrane body 34 to deform and concave. In this way, the volume of the waterproof cavity 36 is deformed and reduced under the pressure. Moreover, the second membrane body 34 can not only prevent moisture from invading into the chipset 2, but also play a role in dust prevention, avoiding dust from falling into the chipset 2. At the same time, the second membrane body 34 is disposed inside the pressure sensor 100. In this way, the distance between the second membrane body 34 and the chipset 2 becomes smaller. While ensuring the waterproof function of the pressure sensor 100, the second membrane body 34 can also effectively transmit the pressure change of the external environment through the position exposed to the outside world. Thereby improving the response sensitivity of the sensor.

[0059] In one embodiment, as Figure 1 and Figure 3 shown, the waterproof structure 3 further includes a support wall 35. The support wall 35 is disposed on the substrate 12 and located in the inner cavity 13. The second membrane body 34 is connected to the support wall 35. The second membrane body 34, the support wall 35, and a part of the substrate 12 enclose a waterproof cavity 36, and all or part of the chipset 2 is located in the waterproof cavity 36.

[0060] In this embodiment, the waterproof structure 3 further includes a support wall 35. The support wall 35 is located in the inner cavity 13 and is disposed on the surface of the substrate 12 facing the inner cavity 13. The support wall 35 is arranged in a ring around the chip group 2, and the support wall 35 can be arranged in an arc-shaped ring or a polygonal ring according to the shape of the chip group 2 provided on the substrate 12, which is not limited herein. The support wall 35 extends from the surface of the substrate 12 facing the inner cavity 13 in a direction away from the substrate 12, so that the height of the support wall 35 in the direction perpendicular to the plate surface of the substrate 12 is higher than the height of the chip group 2 in the direction perpendicular to the plate surface of the substrate 12.

[0061] Further, one end of the support wall 35 away from the substrate 12 is connected to the second film body 34, that is, the periphery of the second film body 34 is connected to the end face of the support wall 35 by means of adhesion or hot pressing. At this time, the second film body 34, the support wall 35 and the substrate 12 jointly enclose a waterproof cavity 36 to prevent moisture and water from the entire or part of the internal chip group 2.

[0062] It can be understood that the support wall 35 can also play a role in waterproofing. By setting the second film body 34, the moisture and water prevention effect on the internal chip group 2 is further improved. At the same time, setting the height of the support wall 35 in the direction perpendicular to the plate surface of the substrate 12 to be higher than the height of the chip group 2 in the direction perpendicular to the plate surface of the substrate 12 can also provide a certain space for the waterproof cavity 36, ensuring that the second film body 34 has a certain margin of movement under the condition of being compressed and deformed. Thus, on the basis of waterproofing, it is ensured that the chip group 2 can normally sense the external air pressure change.

[0063] In one embodiment, as Figure 1 and Figure 3 shown, the chip group 2 includes a MEMS chip 21 and an ASIC chip 22. The MEMS chip 21 and the ASIC chip 22 are electrically connected. The MEMS chip 21 is disposed on the surface of the substrate 12 facing the housing 11, and the ASIC chip 22 is disposed inside the substrate 12.

[0064] In this embodiment, the chipset 2 includes a MEMS chip 21 and an ASIC chip 22. The MEMS chip 21 and the ASIC chip 22 can be electrically connected by gold wires. By constructing different mechanical structures on the silicon substrate of the MEMS chip 21, external physical and chemical signals can be converted into electrical signals. Taking the pressure sensor 100 of the present application as an example, the MEMS chip 21 includes an upper pressure-receiving part and a bottom. A vacuum chamber is formed between the upper pressure-receiving part and the bottom. When the upper pressure-receiving part is subjected to pressure, the distance between the upper pressure-receiving part and the bottom changes, resulting in a change in the capacitance in the vacuum chamber and a change in the voltage between the two ends. Therefore, an analog signal of the voltage change can be obtained by measuring the circuit voltage, and then through the conversion and amplification of the ASIC chip 22, the analog signal is converted into a digital signal to achieve the detection of pressure (such as air pressure).

[0065] It can be understood that the substrate 12 is a PCB circuit board, and at the same time, the substrate 12 is also the basic support structure of the pressure sensor 100. The substrate 12 is formed with a mounting surface, so that the MEMS chip 21 can be disposed on the mounting surface, and the MEMS chip 21 can be disposed on the surface of the substrate 12 by surface mounting. At the same time, the substrate 12 is also electrically connected to the ASIC chip 22, such as by gold wire connection, solder joint connection or ultrasonic bonding, etc., to achieve the electrical connection between the pressure sensor 100 and an external circuit. Among them, the ASIC chip 22 is pre-buried inside the substrate 12. For example, the metal conductive layer is removed in a partial area inside the substrate 12, so that the ASIC chip 22 can be completely embedded in the epoxy resin medium to achieve the embedding of the ASIC chip 22, which not only effectively improves the waterproof effect of the ASIC chip 22, but also can reduce the overall volume of the pressure sensor 100 and improve the installation convenience. At the same time, the electromagnetic interference and thermal noise generated by the outside on the ASIC chip 22 can also be reduced through the conductive layer and dielectric layer inside the substrate 12.

[0066] The present utility model also proposes an electronic device, which includes a device main body and the above-mentioned pressure sensor 100, and the pressure sensor 100 is disposed on the device main body. The specific structure of the pressure sensor 100 refers to the foregoing embodiment. Since this electronic device adopts all the technical solutions of all the foregoing embodiments, it at least has all the beneficial effects brought by the technical solutions of the foregoing embodiments, which will not be elaborated herein one by one.

[0067] It can be understood that the above-mentioned electronic device can be a portable wearable device, such as a smart phone, a smart watch, a smart bracelet or an IPAD, which is not limited herein.

[0068] The above are only exemplary embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. A pressure sensor, characterized in that: The pressure sensor comprises: A shell, the shell comprising an outer shell and a substrate, the outer shell is arranged on the substrate, the outer shell and the substrate enclose an inner cavity, and the outer shell forms an air hole communicating with the inner cavity; a chipset, wherein the chipset is entirely or partially disposed in the inner cavity; and A waterproof structure, the waterproof structure comprising a first membrane and a heating net, the first membrane and the heating net are arranged on the housing and cover the air holes, and the heating net is used to generate heat; Among them, the waterproof structure also includes a second membrane body and a supporting wall, the supporting wall is arranged on the substrate and located in the inner cavity, the second membrane body is connected to the supporting wall, the second membrane body, the supporting wall and part of the substrate are enclosed to form a waterproof cavity, and all or part of the chipset is located in the waterproof cavity.

2. The pressure sensor according to claim 1, characterized in that The shell is a metal shell, the shell is electrically connected to the substrate, and the heating network is electrically connected to the shell.

3. The pressure sensor according to claim 2, characterized in that The waterproof structure further comprises a conductive adhesive layer, which is arranged around the air hole, one side of the conductive adhesive layer is bonded to the shell, and the other side of the conductive adhesive layer is bonded to the heating net.

4. The pressure sensor according to claim 1, wherein: The substrate is a circuit board, and the heating network is electrically connected to the substrate.

5. The pressure sensor according to claim 1, wherein: The heating network is electrically connected to the chipset.

6. The pressure sensor according to claim 5, characterized in that: The chipset is provided with a humidity detection module, which is a humidity-sensitive resistor or a humidity-sensitive capacitor, and the humidity detection module is electrically connected to the heating network.

7. The pressure sensor according to any one of claims 1 to 6, characterized in that: The heating net is located in the inner cavity, and the first membrane body is arranged on a side of the outer shell facing away from the inner cavity, so that part of the outer shell and the air hole are located between the first membrane body and the heating net.

8. The pressure sensor according to any one of claims 1 to 6, characterized in that: The first film body and the heating net are arranged on a side of the shell facing away from the inner cavity, and the first film body is connected to a side of the heating net facing away from the shell.

9. The pressure sensor according to any one of claims 1 to 6, characterized in that: The chipset comprises a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are electrically connected, the MEMS chip is arranged on the surface of the substrate facing the housing, and the ASIC chip is arranged inside the substrate.

10. An electronic device, characterized in that: The electronic device comprises the pressure sensor according to any one of claims 1 to 9.

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