Transient wave recording type intelligent fault indicator

Abstract

The utility model discloses a transient state wave recording type intelligent fault indicator, comprising an acquisition unit and a collection unit, the acquisition unit comprises a current acquisition module and a first MCU; the first MCU is connected with the current acquisition module and is used for receiving load current information and judging a fault type; the current acquisition module comprises a large current acquisition channel and a small current acquisition channel, and the amplification factor of the large current acquisition channel is smaller than that of the small current acquisition channel. The wave recording device is large in wave recording range and high in acquisition precision in application.

Description

Technical Field

[0001] The utility model relates to the technical field of distribution automation fault detection, in particular to a transient recording type intelligent fault indicator. Background Technique

[0002] At present, only simple protection devices such as lightning arresters + drop fuses / load switches are installed on some lines built more than five years ago in our country, which do not have intelligent monitoring functions. Once a fault occurs at a certain point on the line, the entire line needs to be checked for problems, wasting a lot of manpower and material resources. In many cases, the fault point cannot be found, resulting in long-term power outages and potential hazards to personal safety. When a transient fault occurs in the power system, a transient recording type fault indicator can record the waveform information of the fault event, including the transient changes of current and voltage. These records can be used for subsequent analysis and diagnosis to help determine the location and type of the fault, thus accelerating the speed of fault location. And detailed information about the fault event, such as fault duration, current peak value, and drastic voltage changes, can be obtained through the waveform recording. These data are very valuable for understanding the nature and scope of the fault, as well as evaluating the stability and reliability of the power system. Moreover, compared with the primary and secondary intelligent pole-mounted circuit breakers, the transient recording type fault indicator has a low price and high cost performance, and can basically be installed at any location, can be installed while energized, and does not require power outage.

[0003] For newly built lines, the transient recording type fault indicator can monitor transient fault events in the power system in real time and transmit the recorded data to the operation and maintenance personnel. By analyzing these data, potential problems and abnormal conditions in the system can be found, so as to take preventive maintenance measures, reduce the possibility of faults occurring, and improve the reliability and stability of the power system. By cooperating with the primary and secondary integrated switches, rapid fault location and rapid fault removal can be achieved, realizing intelligent monitoring of the line.

[0004] The existing transient recording type fault indicator has a small recording range and low acquisition accuracy. Content of the Utility Model

[0005] The purpose of the utility model is to overcome the deficiencies existing in the prior art, and provides a transient recording type intelligent fault indicator, which has a large recording range and high acquisition accuracy when in application.

[0006] The purpose of the utility model is mainly achieved by the following technical solutions:

[0007] A transient recording type intelligent fault indicator, comprising an acquisition unit and an aggregation unit. The acquisition unit is used to judge and indicate various short-circuit faults, acquire and capture characteristic data of single-phase grounding faults, acquire load current information, and upload the fault information and load current information to the aggregation unit; the aggregation unit is used to receive and process the distribution line fault and current information uploaded by the acquisition unit, and communicate with the distribution main station. It is characterized in that the acquisition unit includes a current acquisition module and a first MCU; the first MCU is connected to the current acquisition module and is used to receive the load current information and judge the fault type; the current acquisition module includes a large current acquisition channel and a small current acquisition channel, and the amplification factor of the large current acquisition channel is less than that of the small current acquisition channel; when the acquired current is greater than the critical current, the acquired current is defined as a large current; when the acquired current is less than the critical current, the acquired current is defined as a small current; the critical current is defined as the critical value for the acquired current to be acquired through the large current acquisition channel or the small current acquisition channel; when the acquired current is acquired by the large current acquisition channel and the small current acquisition channel and enters the first MCU, the acquired current is compared with the preset critical current in the first MCU, and the final sampling result is selected as the current value acquired by the large current acquisition channel or the current value acquired by the small current acquisition channel according to the comparison result.

[0008] Further, the large current acquisition channel includes a first operational amplifier U31. The non-inverting input terminal of the first operational amplifier U31 is connected to a first resistor R13. The other end of the first resistor R13 connected to the first operational amplifier U31 is connected to a reference voltage. The inverting input terminal of the first operational amplifier U31 is connected to a second resistor R17. A third resistor R20 is connected between the inverting input terminal and the output terminal of the first operational amplifier U31. A first capacitor C22 is connected in parallel across both ends of the third resistor R20. The output terminal of the first operational amplifier U31 is connected to a fourth resistor R26. The other end of the fourth resistor R26 connected to the first operational amplifier U31 is connected to a second capacitor C24. The other end of the second capacitor C24 connected to the fourth resistor R26 is grounded. The small current acquisition channel includes a second operational amplifier U42. The non-inverting input terminal of the second operational amplifier U42 is connected to a fifth resistor R152. The other end of the fifth resistor R152 connected to the second operational amplifier U42 is connected to a reference voltage. The inverting input terminal of the second operational amplifier U42 is connected to a sixth resistor R151. A seventh resistor R29 is connected between the inverting input terminal and the output terminal of the second operational amplifier U42. A third capacitor C27 is connected in parallel across both ends of the seventh resistor R29. The output terminal of the second operational amplifier U42 is connected to an eighth resistor R34. The other end of the eighth resistor R34 connected to the second operational amplifier U42 is connected to a fourth capacitor C30. The other end of the fourth capacitor C30 connected to the eighth resistor R34 is grounded.

[0009] Further, the current acquisition module further includes an input protection circuit and an integration circuit connected in sequence. The large current acquisition channel and the small current acquisition channel are connected in parallel, and the parallel circuit formed by the large current acquisition channel and the small current acquisition channel is connected to the integration circuit. The current acquisition module acquires current through a rigid Rogowski coil. The input protection circuit is used to filter the current acquired by the rigid Rogowski coil and protect the subsequent circuit. The integration circuit is used to perform secondary filtering on the current output by the input protection circuit.

[0010] Further, the acquisition unit further includes a first power supply module and a power management module. The first power supply module is used to supply power to the first MCU and includes a main power supply, an auxiliary power supply, and a backup power supply. The main power supply takes power from CT. The auxiliary power supply is a solar panel. The backup power supply includes a super capacitor, a rechargeable battery, and a dry battery. The power management module is used to manage the power supply of the first power supply module.

[0011] Further, the acquisition unit further includes a first positioning module, a first Lora communication module, a first storage module, and a temperature sensing module connected to the first MCU. Among them, the first positioning module is used to position and time the acquisition unit; the first Lora communication module is used for communication between the acquisition unit and the aggregation unit; the first storage module is used to store the data processed by the first MCU.

[0012] Further, the aggregation unit includes a second MCU and a second power supply module, a GPRS module, a second Lora communication module, a second storage module, a Bluetooth module, a second positioning module, and an encryption chip connected to the second MCU. Among them, the second MCU is used to receive and process the power distribution line faults and current information uploaded by the acquisition unit; the second power supply module is used to supply power to the second MCU; the GPRS module is used for communication between the aggregation unit and the power distribution main station; the second Lora communication module is used for communication between the aggregation unit and the acquisition unit; the Bluetooth module is used for human-computer interaction between maintenance personnel and the aggregation unit; the second positioning module is used to position the aggregation unit; the encryption chip is used to encrypt and protect data information; the second storage module is used to store the data processed by the second MCU.

[0013] Further, the second power supply module includes a solar power acquisition unit and a battery power supply unit.

[0014] Further, both the first MCU and the second MCU are STM32U575RGT6 chips or STM32L476RGT6 chips.

[0015] In summary, compared with the prior art, the present invention has the following beneficial effects: The present invention uses two acquisition channels with different amplification factors to acquire load current information and sets a critical current value. When the acquired current is greater than the critical current, the large current acquisition channel with a small amplification factor is used to acquire load current information, so as to ensure that the sampled current will not be distorted due to excessive amplification factor. When the acquired current is less than the critical current, the small current acquisition channel with a large amplification factor is used to acquire load current information, so as to ensure the sampling accuracy of the acquired current. Description of the Drawings

[0016] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, form a part of this application, and do not constitute a limitation to the embodiments of the present invention. In the drawings:

[0017] Figure 1 is the system block diagram of the acquisition unit in the embodiment of the present invention;

[0018] Figure 2 is the system block diagram of the aggregation unit in the embodiment of the present invention;

[0019] Figure 3 It is the structural block diagram of the current acquisition module in the embodiment of the present utility model;

[0020] Figure 4 It is the circuit schematic diagram of the current acquisition module in the embodiment of the present utility model;

[0021] Figure 5 It is the structural schematic diagram of the reference voltage generation circuit in the embodiment of the present utility model. Specific embodiments

[0022] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and the accompanying drawings. The illustrative embodiments of the present utility model and their descriptions are only used to explain the present utility model and are not intended to limit the present utility model.

[0023] Embodiment:

[0024] As Figure 3 shown, a transient recording type intelligent fault indicator includes an acquisition unit and a collection unit. The acquisition unit is used to judge and indicate various short-circuit faults, collect and capture single-phase grounding fault characteristic data, collect load current information, and upload the fault information and load current information to the collection unit; the collection unit is used to receive and process the distribution line faults and current information uploaded by the acquisition unit and communicate with the distribution main station. It is characterized in that the acquisition unit includes a current acquisition module and a first MCU; the first MCU is connected to the current acquisition module and is used to receive the load current information and judge the fault type; the current acquisition module includes a large current acquisition channel and a small current acquisition channel, and the amplification factor of the large current acquisition channel is less than that of the small current acquisition channel; when the collected current is greater than the critical current, the collected current is defined as a large current; when the collected current is less than the critical current, the collected current is defined as a small current; the critical current is defined as the critical value for the collected current to be collected through the large current acquisition channel or the small current acquisition channel; when the collected current is collected by the large current acquisition channel and the small current acquisition channel and enters the first MCU, the collected current is compared with the preset critical current in the first MCU, and the final sampling result is selected as the current value collected by the large current acquisition channel or the current value collected by the small current acquisition channel according to the comparison result.

[0025] In this embodiment, the current to be collected is collected through two current collection channels with different magnification factors, namely the large-current collection channel and the small-current collection channel. After the current to be collected is amplified by the two current collection channels and enters the first MCU, within the first MCU, the code value obtained by sampling through the large-current collection channel is compared with the code value converted from the critical current value. If the code value obtained by sampling through the large-current collection channel is greater than the code value converted from the critical current value, then in the first MCU, the sampling result of the current to be collected takes the sampling result of the large-current collection channel as the final sampling result; if the code value obtained by sampling through the large-current collection channel is less than the code value converted from the critical current value, then in the first MCU, the sampling result of the current to be collected takes the sampling result of the small-current collection channel as the final sampling result. Among them, the code value converted from the critical current value is equal to the code value obtained by sampling the critical current value through the large-current collection channel. Thus, in this embodiment, when the current value is too small, the sampling result of the small-current collection channel is taken as the final sampling result. Since the magnification factor of the small-current collection channel is higher, the sampling accuracy of small-current collection is ensured; when the current value is too large, the sampling result of the large-current collection channel is taken as the final sampling result. Since the magnification factor of the large-current collection channel is smaller, it is ensured that the large current will not have waveform distortion due to too high a magnification factor, and the waveform will not be clipped, enabling this embodiment to have a larger current sampling range. At the same time, since the current is sampled through the two collection channels simultaneously, when the current is near the critical value, current sampling distortion will not occur due to switching the collection channel, ensuring the current sampling accuracy.

[0026] Refer to Figure 4As shown, the high-current acquisition channel includes a first operational amplifier U31. The non-inverting input terminal of the first operational amplifier U31 is connected to a first resistor R13. The other end of the first resistor R13 connected to the first operational amplifier U31 is connected to the reference voltage A1VCC. The inverting input terminal of the first operational amplifier U31 is connected to a second resistor R17. A third resistor R20 is connected between the inverting input terminal and the output terminal of the first operational amplifier U31. A first capacitor C22 is connected in parallel across both ends of the third resistor R20. The output terminal of the first operational amplifier U31 is connected to a fourth resistor R26. The other end of the fourth resistor R26 connected to the first operational amplifier U31 is connected to a second capacitor C24. The other end of the second capacitor C24 connected to the fourth resistor R26 is grounded. The low-current acquisition channel includes a second operational amplifier U42. The non-inverting input terminal of the second operational amplifier U42 is connected to a fifth resistor R152. The other end of the fifth resistor R152 connected to the second operational amplifier U42 is connected to the reference voltage A1VCC. The inverting input terminal of the second operational amplifier U42 is connected to a sixth resistor R151. A seventh resistor R29 is connected between the inverting input terminal and the output terminal of the second operational amplifier U42. A third capacitor C27 is connected in parallel across both ends of the seventh resistor R29. The output terminal of the second operational amplifier U42 is connected to an eighth resistor R34. The other end of the eighth resistor R34 connected to the second operational amplifier U42 is connected to a fourth capacitor C30. The other end of the fourth capacitor C30 connected to the eighth resistor R34 is grounded. In this embodiment, the amplification factors of the high-current acquisition channel and the low-current acquisition channel are determined after adaptive testing according to the product housing, and the amplification factors are changed by changing the resistance values of the third resistor R20 and the seventh resistor R29. The critical current is obtained through testing according to the product accuracy requirements and written into the first MCU. Specifically, in this embodiment, the current amplification factor of the high-current acquisition channel is 1.8 times, the current amplification factor of the low-current acquisition channel is 16 times, and the critical current is 80A. Preferably, the models of the first operational amplifier U31 and the second operational amplifier U32 are TLV333IDBVR. Refer to Figure 3 As shown, the current acquisition module further includes an input protection circuit and an integration circuit connected in sequence. The high-current acquisition channel and the low-current acquisition channel are connected in parallel, and the parallel circuit formed by the high-current acquisition channel and the low-current acquisition channel is connected to the integration circuit. The current acquisition module acquires current through a rigid Rogowski coil. The input protection circuit is used to filter the current acquired by the rigid Rogowski coil and protect the subsequent circuit. The integration circuit is used to perform secondary filtering on the current output by the input protection circuit.

[0027] Specifically, refer to Figure 4As shown, in this embodiment, the input protection circuit includes a first bead L11, a second bead L12, a TVS diode D1, a ninth resistor R9, and a Schottky diode D25. The first bead L11 and the second bead L12 acquire the current collected by the rigid Rogowski coil. Both ends of the TVS diode D1 are respectively connected to the first bead L11 and the second bead L12. The ninth resistor R9 is connected in parallel with the TVS diode D1. The Schottky diode D25 is connected between the first bead L11 and the ninth resistor R9. It should be noted that in this embodiment, a tenth resistor R27 is connected between the second bead L12 and the ninth resistor R9, and the other end of the tenth resistor R27 connected to the second bead L12 is connected to the first MCU; the reference voltage A1VCC is input to the first MCU through the tenth resistor R27 as the zero-volt reference voltage. In this embodiment, the current collected by the rigid Rogowski coil filters out high-frequency clutter through the first bead L11 and the second bead L12 and is respectively input to the subsequent circuits. The function of the TVS diode D1 is to protect the subsequent circuits to prevent damage to the subsequent circuits due to excessive input current. The Schottky diode D25 is used for voltage clamping and plays a role in overvoltage protection. In this embodiment, the 1 end of the terminal J3 is grounded, the 2 end inputs the single-ended AC signal induced by the current collected by the rigid Rogowski coil, and the 3 end inputs the reference voltage, and the reference voltage is provided by the power supply system on the PCB board.

[0028] Specifically, in this embodiment, the integration circuit receives the AC signal from the first bead L11 through the eleventh resistor R8. The integration circuit includes a third operational amplifier U28, a twelfth resistor R150, a thirteenth resistor R156, a fifth capacitor C140, and a sixth capacitor C139; one end of the twelfth resistor R150 is connected to the non-inverting input terminal of the third operational amplifier U28, and the other end thereof is connected to the reference voltage A1VCC. The thirteenth resistor R156, the fifth capacitor C140, and the sixth capacitor C139 are all connected between the inverting input terminal and the output terminal of the third operational amplifier U28, and the thirteenth resistor R156, the fifth capacitor C140, and the sixth capacitor C139 are connected in parallel. Preferably, the model of the third operational amplifier U28 is TLV333IDBVR.

[0029] Specifically, in this embodiment, the reference voltage A1VCC is 1.5V, which is provided by the reference voltage generation circuit in the power supply system on the PCB board, such as Figure 5As shown in the figure, the reference voltage generation circuit includes a power chip U33. The VIN+ pin of the power chip U33 is connected to a fourteenth resistor R41 and a fifteenth resistor R42. Among them, the other end of the fourteenth resistor R41 connected to the power chip U33 is connected to a 3V voltage, the other end of the fifteenth resistor R42 connected to the power chip U33 is grounded, and a seventh capacitor C39 is connected in parallel at both ends of the fifteenth resistor R42; the VSS pin of the power chip U33 is grounded; the VDD pin of the power chip U33 is connected to a 3V voltage; the VOUT pin of the power chip U33 is connected to the VIN- pin of the power chip U33 to output a 1.5V reference voltage; the VIN- pin of the power chip U33 is connected to a capacitor bank, and the capacitor bank is connected to the other end of the power chip U33 and grounded. The capacitor bank includes an eighth capacitor C40, a ninth capacitor C41, a tenth capacitor C42, an eleventh capacitor C43, and a twelfth capacitor C44 connected in parallel. Preferably, the model of the power chip U33 is MCP6421T-E / OT.

[0030] Referring to Figure 1 As shown in the figure, the acquisition unit further includes a first power supply module and a power management module. The first power supply module is used to supply power to the first MCU, including a main power supply, an auxiliary power supply, and a backup power supply. The main power supply takes power from CT, the auxiliary power supply is a solar panel, and the backup power supply includes a super capacitor, a rechargeable battery, and a dry battery. The power management module is used to manage the power supply of the first power supply module. Specifically, in this embodiment, the super capacitor, the rechargeable battery, and the dry battery are used as backup power supplies. Among them, the super capacitor is a small-size lithium-ion super capacitor with a capacity of 3.8V / 200F, and the rechargeable battery uses a lithium iron phosphate battery of 3.25V / 7AH; the power management module performs charge and discharge management on the super capacitor and the rechargeable battery in the first power supply module, and at the same time selects the power supply for the first MCU to ensure that the acquisition unit is always in a regulated working state.

[0031] Furthermore, the acquisition unit further includes a first positioning module, a first Lora communication module, a first storage module, and a temperature sensing module connected to the first MCU. Among them, the first positioning module is used to position the acquisition unit; the first Lora communication module is used for communication between the acquisition unit and the aggregation unit; the first storage module is used to store the data processed by the first MCU. In this embodiment, the first positioning module is a GPS or Beidou positioning system, and the temperature sensing module is a temperature sensor. To reduce power consumption, in this embodiment, the first Lora communication module enters the sleep mode after the communication ends and periodically starts to receive and send signals, and the first positioning module enters the sleep mode after the satellite search ends and starts the time synchronization once an hour.

[0032] Referring to Figure 2As shown, the aggregation unit includes a second MCU and a second power supply module, a GPRS module, a second Lora communication module, a second storage module, a Bluetooth module, a second positioning module, and an encryption chip connected to the second MCU. Among them, the second power supply module is used to supply power to the second MCU; the GPRS module is used for communication between the aggregation unit and the power distribution main station; the second Lora communication module is used for communication between the aggregation unit and the acquisition unit; the Bluetooth module is used for human-computer interaction between the maintenance personnel and the aggregation unit; the second positioning module is used to position the aggregation unit; the encryption chip is used to encrypt and protect data information; the second storage module is used to store the data processed by the second MCU. The second power supply module includes a solar power acquisition unit and a battery power supply unit. Specifically, the data information encrypted and protected by the encryption chip includes oscillogram data information and fault data information. In this embodiment, the battery power supply unit is specifically a maintenance-free lead-acid battery or a lithium iron phosphate battery, and the battery capacity should not be less than 12V / 7AH.

[0033] Furthermore, both the first MCU and the second MCU are STM32U575RGT6 chips or STM32L476RGT6 chips. To reduce power consumption, in this embodiment, preferably, both the first MCU and the second MCU are STM32U575RGT6 chips.

[0034] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above description is only the specific embodiments of the present invention and is not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A transient waveform recording type intelligent fault indicator, comprising a collection unit and a collection unit, wherein the collection unit is used to judge and indicate various types of short-circuit faults, collect and capture single-phase grounding fault characteristic data, collect load current information, and upload the fault information and load current information to the collection unit; the collection unit is used to receive and process the distribution line fault and current information uploaded by the collection unit, and communicate with the distribution master station, characterized in that: The acquisition unit includes a current acquisition module and a first MCU; the first MCU is connected to the current acquisition module, and is used to receive load current information and determine the fault type; the current acquisition module includes a large current acquisition channel and a small current acquisition channel, and the amplification factor of the large current acquisition channel is smaller than that of the small current acquisition channel; When the collected current is greater than the critical current, the collected current is defined as a large current; When the collected current is less than the critical current, the collected current is defined as a small current; The critical current is defined as the critical value of the collected current being collected through the large current collection channel or the small current collection channel; After the collected current is collected by the large current collection channel and the small current collection channel and enters the first MCU, the collected current is compared with the preset critical current in the first MCU, and the final sampling result is selected as the current value collected by the large current collection channel or the current value collected by the small current collection channel according to the comparison result.

2. The transient waveform recording type intelligent fault indicator according to claim 1 is characterized in that: The large current acquisition channel includes a first operational amplifier U31, a first resistor R13 is connected to the in-phase input terminal of the first operational amplifier U31, the other end of the first resistor R13 connected to the first operational amplifier U31 is connected to a reference voltage, a second resistor R17 is connected to the inverting input terminal of the first operational amplifier U31, a third resistor R20 is connected between the inverting input terminal and the output terminal of the first operational amplifier U31, a first capacitor C22 is connected in parallel at both ends of the third resistor R20, a fourth resistor R26 is connected to the output terminal of the first operational amplifier U31, the other end of the fourth resistor R26 connected to the first operational amplifier U31 is connected to a second capacitor C24, and the other end of the second capacitor C24 connected to the fourth resistor R26 is grounded; The small current collection channel includes a second operational amplifier U42, the in-phase input terminal of the second operational amplifier U42 is connected to a fifth resistor R152, the other end of the fifth resistor R152 connected to the second operational amplifier U42 is connected to a reference voltage, the inverting input terminal of the second operational amplifier U42 is connected to a sixth resistor R151, a seventh resistor R29 is connected between the inverting input terminal and the output terminal of the second operational amplifier U42, and a third capacitor C27 is connected in parallel at both ends of the seventh resistor R29, the output terminal of the second operational amplifier U42 is connected to an eighth resistor R34, the other end of the eighth resistor R34 connected to the second operational amplifier U42 is connected to a fourth capacitor C30, and the other end of the fourth capacitor C30 connected to the eighth resistor R34 is grounded.

3. The transient waveform recording type intelligent fault indicator according to claim 1 is characterized in that: The current acquisition module also includes an input protection circuit and an integration circuit connected in sequence, the large current acquisition channel and the small current acquisition channel are connected in parallel, and the parallel circuit composed of the large current acquisition channel and the small current acquisition channel is connected to the integration circuit; the current acquisition module collects current through a rigid Rogowski coil, and the input protection circuit is used to filter the current collected by the rigid Rogowski coil and protect the subsequent circuit; the integration circuit is used to perform secondary filtering on the current output by the input protection circuit.

4. The transient waveform recording type intelligent fault indicator according to claim 1 is characterized in that: The acquisition unit also includes a first power supply module and a power management module. The first power supply module is used to power the first MCU, including a main power supply, an auxiliary power supply and a backup power supply. The main power supply is CT power, the auxiliary power supply is a solar panel, and the backup power supply includes a supercapacitor, a rechargeable battery and a dry battery. The power management module is used to perform power management on the first power supply module.

5. The transient waveform recording type intelligent fault indicator according to claim 1 is characterized in that: The collection unit also includes a first positioning module, a first Lora communication module, a first storage module and a temperature sensing module connected to the first MCU, wherein the first positioning module is used to locate and synchronize the collection unit; the first Lora communication module is used for communication between the collection unit and the collection unit; and the first storage module is used to store data processed by the first MCU.

6. The transient waveform recording type intelligent fault indicator according to claim 1 is characterized in that: The collection unit includes a second MCU and a second power supply module, a GPRS module, a second Lora communication module, a second storage module, a Bluetooth module, a second positioning module and an encryption chip connected to the second MCU, wherein the second MCU is used to receive and process the distribution line fault and current information uploaded by the collection unit; the second power supply module is used to power the second MCU; the GPRS module is used for communication between the collection unit and the power distribution master station; the second Lora communication module is used for communication between the collection unit and the collection unit; the Bluetooth module is used for human-computer interaction between maintenance personnel and the collection unit; the second positioning module is used to locate the collection unit; the encryption chip is used to encrypt and protect data information; the second storage module is used to store data processed by the second MCU.

7. A transient waveform recording type intelligent fault indicator according to claim 6, characterized in that: The second power supply module includes a solar power collection unit and a battery power supply unit.

8. The transient waveform recording type intelligent fault indicator according to claim 7 is characterized in that: The first MCU and the second MCU are both STM32U575RGT6 chips or STM32L476RGT6 chips.

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