Wafer processing equipment
By designing equipment for wafer processing, using multi-functional load fixtures and operating tables, the problem of wafer ID identification and inconvenient operation is solved, and a safer and more efficient processing of wafers is achieved.
Patent Information
- Application Number
- CN202422130962.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-08-30
AI Technical Summary
In the prior art, wafer IDs are easily unrecognized during wafer manufacturing, and are inconvenient to the operation of the wafer when writing or pasting labels, which can easily cause wafer damage.
A wafer processing device is designed, including a cutting device and a operating table, on which the first and second load bearing fixtures are provided. The first load-bearing fixture is used to support the wafer when writing the wafer ID, and the second load-bearing fixture is used to support the wafer when pasting the label. By setting the bearing surface and positioning structure of different areas, it is ensured that damage to the wafer is reduced during operation.
It effectively reduces the damage to the wafer by writing wafer ID and pasting labels, improves the reliability and efficiency of operations, and ensures that the wafer ID transmission process is more reliable.
Smart Images
Figure CN223006743U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer processing device. Background Art
[0002] At present, each wafer of each product has and only has a unique ID. As important traceability information in the packaging operation process, it is crucial to ensure that the wafer ID is transmitted and recorded correctly during the manufacturing process.
[0003] In the prior art, the wafer ID is lithographed at a fixed position on the wafer during the wafer manufacturing process. Since it exists on the wafer, when the wafer is cut and processed, the wafer ID will become unrecognizable under the cutting of the blade. In addition, during the processing, to check the wafer ID, personnel need to manually confirm the wafer ID on the wafer. Since the position on the wafer where the wafer ID is reflected is small and the metal layer reflects light, it is very inconvenient to view the wafer ID during the manufacturing process. In addition, the transfer of the wafer ID is also realized by relying on a two-dimensional code label containing the wafer ID information. The label is manually pasted to a preset position on the wafer.
[0004] For the above operations, whether writing the wafer ID or pasting the label, a certain pressure needs to be applied to the wafer, and improper operation is likely to cause damage to the wafer.
[0005] Therefore, there is an urgent need for a wafer processing device to solve the above problems. Summary of the Utility Model
[0006] Based on the above, the purpose of the utility model is to provide a wafer processing device, which reduces the damage to the wafer caused by the operations of writing the wafer ID or pasting the label, and at the same time, the information transfer process is more reliable and the personnel operation is more labor-saving.
[0007] To achieve the above object, the utility model adopts the following technical solutions:
[0008] A wafer processing device, comprising:
[0009] A cutting device for cutting the wafer, and the wafer is provided with a feature code pasting position;
[0010] An operating table, on which a first carrying fixture and a second carrying fixture are arranged. The first carrying fixture is used for carrying the wafer before cutting, and the second carrying fixture is used for carrying the wafer after cutting. The first carrying fixture is provided with a first supporting surface for carrying the wafer, and the second carrying fixture is provided with a second supporting surface for carrying the wafer. The area of the first supporting surface is larger than the area of the second supporting surface, and the second supporting surface is arranged below the feature code pasting position.
[0011] As a preferred solution of the wafer processing equipment, the first carrier fixture includes a first carrier plate and an annular support protrusion disposed on the first carrier plate, and an upper surface of the annular support protrusion forms the first supporting surface.
[0012] As a preferred solution of the wafer processing equipment, the first carrier fixture includes a first carrier plate and a limit support base disposed on the first carrier plate. There are at least three limit support bases. A support platform is disposed inside the limit support base, and the support platform is used to support the wafer. A limit retaining wall is disposed outside the support platform.
[0013] As a preferred solution of the wafer processing equipment, the limit support bases are slidably disposed on the first carrier plate to approach or move away from each other.
[0014] As a preferred solution of the wafer processing equipment, the limit support bases are slidably disposed on the first carrier plate, and a reset member is disposed between the limit support bases and the first carrier plate. The reset member is configured to make the limit support bases have a tendency to move closer to each other.
[0015] As a preferred solution of the wafer processing equipment, the second carrier fixture includes a second carrier plate and a support block disposed on the second carrier plate. The support block is adapted to the shape of the feature code pasting position, and an upper surface of the support block forms the second supporting surface.
[0016] As a preferred solution of the wafer processing equipment, the second carrier fixture includes a second carrier plate and a positioning post disposed on the second carrier plate. The positioning post is disposed away from the second supporting surface.
[0017] As a preferred solution of the wafer processing equipment, a plurality of mounting grooves are formed on the second carrier plate, and the positioning post can be selectively placed in one of the mounting grooves.
[0018] As a preferred solution of the wafer processing equipment, the wafer processing equipment further includes a handling device, and the handling device is configured to transport the wafer from the first carrier fixture to the cutting device, or transport the wafer from the cutting device to the second carrier fixture.
[0019] As a preferred solution of the wafer processing equipment, an adsorption head is disposed at an end of the handling device. The adsorption head adsorbs the wafer, and adsorbs the wafer above the first supporting surface and the second supporting surface correspondingly.
[0020] The beneficial effects of the present utility model are:
[0021] The utility model realizes the support of a wafer when writing a wafer ID and pasting a label by providing a first carrying fixture and a second carrying fixture respectively; the area of the first supporting surface is set to be larger than that of the second supporting surface, so that the first carrying fixture has a larger supporting surface for the wafer, and thus is more suitable for supporting the wafer when writing the wafer ID; by arranging the second supporting surface below the feature code pasting position, the second supporting surface can more specifically support the pasted label, so that no damage to the wafer will be caused during the process of writing the wafer ID or pasting the label. At the same time, the first carrying fixture and the second carrying fixture are integrated on the operating table, so that the operator can perform two operations at the same position, which is more time-saving and labor-saving and effectively improves the efficiency. In addition, the first carrying fixture is used to carry the wafer before cutting, and the second carrying fixture is used to carry the wafer after cutting, that is, writing the wafer ID is set before cutting, which is convenient for the operator to view the wafer ID during the cutting process, and pasting the label is set after cutting, effectively avoiding the quality risk caused by the label contacting water for a long time during wafer cutting, chemical substances dissolving in the water and contaminating the wafer. While ensuring the good quality of the wafer, it also makes the transmission process of the wafer ID more reliable. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description in the embodiments of the present utility model. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the content of the embodiments of the present utility model and these drawings without creative efforts.
[0023] Figure 1 is a top view of a wafer processing device provided by the specific embodiment of the present utility model;
[0024] Figure 2 is a schematic diagram of a first carrying fixture of a wafer processing device provided by the specific embodiment of the present utility model;
[0025] Figure 3 is a schematic diagram of a second carrying fixture of a wafer processing device provided by the specific embodiment of the present utility model.
[0026] In the figure:
[0027] 100, operating table; 110, first carrying fixture; 111, first supporting surface; 112, first carrying plate; 113, annular supporting protrusion; 120, second carrying fixture; 121, second supporting surface; 122, second carrying plate; 123, supporting block; 124, positioning post; 130, limiting support seat; 131, supporting platform; 132, limiting retaining wall;
[0028] 200. Handling device; 210. Adsorption head. Detailed implementation manners
[0029] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation to the present utility model.
[0030] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.
[0031] Unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "fixed" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0032] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is lower than that of the second feature.
[0033] The technical solution of the present utility model will be further described below in conjunction with the drawings and through specific implementation manners.
[0034] As Figures 1 - 3As shown in the figure, this embodiment provides a wafer processing device, which includes a cutting device and an operation table 100. The cutting device is used to cut the wafer, and the wafer is provided with a feature code sticking position. On the operation table 100, a first carrying fixture 110 and a second carrying fixture 120 are provided. The first carrying fixture is used to carry the wafer before cutting, and the second carrying fixture is used to carry the wafer after cutting. The first carrying fixture 110 is provided with a first supporting surface 111 for carrying the wafer, and the second carrying fixture 120 is provided with a second supporting surface 121 for carrying the wafer. The area of the first supporting surface 111 is larger than that of the second supporting surface 121, and the second supporting surface 121 is arranged below the feature code sticking position.
[0035] By providing the first carrying fixture 110 and the second carrying fixture 120, they are respectively used to support the wafer when writing the wafer ID and sticking the label. The area of the first supporting surface 111 is set to be larger than that of the second supporting surface 121, so that the supporting surface of the first carrying fixture 110 for the wafer is larger, and thus it is more suitable for supporting the wafer when writing the wafer ID. By arranging the second supporting surface 121 below the feature code sticking position, the second supporting surface 121 can more specifically support the sticking label, so that no damage to the wafer will be caused during the process of writing the wafer ID or sticking the label. At the same time, the first carrying fixture 110 and the second carrying fixture 120 are integrated on the operation table 100, enabling the operator to perform two operations at the same position, which is thus more time-saving and labor-saving and effectively improves the efficiency. In addition, the first carrying fixture is used to carry the wafer before cutting, and the second carrying fixture is used to carry the wafer after cutting, that is, writing the wafer ID is set before cutting, which is convenient for the operator to view the wafer ID during the cutting process, and sticking the label is set after cutting, effectively avoiding the quality risk caused by the label contacting water for a long time during wafer cutting, the chemical substances dissolving in the water and contaminating the wafer. While ensuring the quality of the wafer, it also makes the transfer process of the wafer ID more reliable.
[0036] Specifically, the first carrying fixture 110 includes a first carrying plate 112 and an annular supporting protrusion 113 arranged on the first carrying plate 112. The upper surface of the annular supporting protrusion 113 forms the first supporting surface 111. By providing the annular supporting protrusion 113, it is used to increase the area of the first supporting surface 111. At the same time, the annular first supporting surface 111 supports the wafer more dispersedly, and is more adaptable to the situation where the positions where forces are applied to the wafer when writing the wafer ID are more dispersed. In addition, the middle part of the annular first supporting surface 111 does not contact the wafer, avoiding damage to the wafer by foreign objects while ensuring the support.
[0037] Further, the first carrier fixture 110 includes a first carrier plate 112 and a limit support base 130 disposed on the first carrier plate 112. There are at least three limit support bases 130. A support platform 131 is disposed inside the limit support base 130. The support platform 131 is used to support the wafer. A limit retaining wall 132 is disposed outside the support platform 131. It can be understood that the support platform 131 and the first supporting surface 111 are in the same plane. By providing the limit support base 130, while supporting the wafer, the positioning of the wafer on the horizontal plane is also achieved, avoiding the actions of the wafer shaking and rotating, and ensuring that the process of writing the wafer ID is more reliable. Similarly, the above-mentioned limit support base 130 is also provided on the second carrier fixture 120. Optionally, there are four limit support bases 130, and the support is more reliable.
[0038] Preferably, the limit support base 130 is slidably disposed on the first carrier plate 112 to approach or separate from each other. By sliding the limit support bases 130 to approach and separate from each other, the support for wafers of different sizes can be achieved, improving the versatility of the wafer processing equipment. To fix the limit support base 130 and the first carrier plate 112, a locking member can be used for locking.
[0039] In other embodiments, the limit support base 130 is slidably disposed on the first carrier plate 112, and a reset member is disposed between the limit support base 130 and the first carrier plate 112. The reset member is configured to make the limit support base 130 have a tendency to move closer to each other. When placing the wafer, the reset force of the reset member needs to be overcome; when the wafer is placed on the limit support base 130, the limit support base 130 can also apply a certain clamping force to the wafer, making the placement of the wafer more stable.
[0040] As an alternative solution for the wafer processing equipment, the second carrier fixture 120 includes a second carrier plate 122 and a support block 123 disposed on the second carrier plate 122. The support block 123 is adapted to the shape of the feature code pasting position. The upper surface of the support block 123 forms a second supporting surface 121. By providing the support block 123 adapted to the shape of the feature code pasting position, the wafer is supported more specifically, and at the same time, the contact between other positions and the wafer is reduced, which can effectively avoid damage to the wafer by foreign objects.
[0041] Further, the second carrier fixture 120 includes a second carrier plate 122 and a positioning post 124 disposed on the second carrier plate 122. The positioning post 124 is disposed away from the second supporting surface 121. By providing the positioning post 124, it is used to define the specific position where the wafer is placed on the second carrier fixture 120, thereby ensuring that the feature code pasting position can accurately align with the second supporting surface 121, and ensuring the reliable support of the support block 123 for the wafer.
[0042] Optionally, a plurality of mounting grooves are provided on the second carrier plate 122, and the positioning post 124 can be selectively placed in one of the mounting grooves. That is, the positioning post 124 is detachably arranged relative to the second carrier plate 122. Specifically, by providing a plurality of mounting grooves, when the positioning post 124 cooperates with different mounting grooves, positioning of wafers of different sizes can be achieved, so that the second carrier fixture 120 can be used for accurately carrying wafers of different sizes, thereby improving the versatility of the second carrier fixture 120.
[0043] In this embodiment, the wafer processing equipment further includes a handling device 200, which is used to transfer wafers from the first carrier fixture 110 to the cutting device, or from the cutting device to the second carrier fixture 120. The setting of the handling device 200 effectively improves the automation degree of the wafer processing equipment, makes the transfer process more accurate and reliable, reduces the errors caused by manual operation, and at the same time reduces the labor intensity, so that the operator only needs to write the wafer ID and paste the label.
[0044] Specifically, an adsorption head 210 is provided at the end of the handling device 200, and the adsorption of the wafer is realized through the adsorption head 210, so as to improve the stability of the transfer process. It is worth noting that the adsorption head 210 adsorbs the wafer above the first supporting surface 111 and the second supporting surface 121, that is, the first supporting surface 111 and the second supporting surface 121 can also reliably support the wafer when adsorbing the wafer, reducing the damage to the wafer during the adsorption process.
[0045] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.
Claims
1. Wafer processing equipment, characterized in that include: A cutting device, used for cutting a wafer, wherein the wafer is provided with a feature code pasting position; An operating table (100), wherein a first supporting fixture (110) and a second supporting fixture (120) are arranged on the operating table (100), wherein the first supporting fixture is used to support the wafer before cutting, and the second supporting fixture is used to support the wafer after cutting, the first supporting fixture (110) is provided with a first supporting surface (111) for supporting the wafer, and the second supporting fixture (120) is provided with a second supporting surface (121) for supporting the wafer, the area of the first supporting surface (111) is larger than the area of the second supporting surface (121), and the second supporting surface (121) is arranged below the feature code pasting position.
2. The wafer processing equipment according to claim 1, characterized in that: The first carrying fixture (110) comprises a first carrying plate (112) and an annular supporting protrusion (113) arranged on the first carrying plate (112), and the upper surface of the annular supporting protrusion (113) forms the first supporting surface (111).
3. The wafer processing equipment according to claim 1, characterized in that: The first carrying fixture (110) comprises a first carrying plate (112) and a limiting support seat (130) arranged on the first carrying plate (112), at least three limiting support seats (130) are provided, a supporting platform (131) is provided on the inner side of the limiting support seat (130), the supporting platform (131) is used to support the wafer, and a limiting retaining wall (132) is provided on the outer side of the supporting platform (131).
4. The wafer processing equipment according to claim 3, characterized in that: The position-limiting support seat (130) is slidably disposed on the first supporting plate (112) to move closer to or farther from each other.
5. The wafer processing equipment according to claim 3, characterized in that: The position-limiting support seat (130) is slidably disposed on the first bearing plate (112), and a reset member is disposed between the position-limiting support seat (130) and the first bearing plate (112), and the reset member is configured to enable the position-limiting support seat (130) to have a tendency to move toward each other.
6. The wafer processing equipment according to claim 1, characterized in that: The second carrying fixture (120) comprises a second carrying plate (122) and a supporting block (123) arranged on the second carrying plate (122); the supporting block (123) is adapted to the shape of the feature code pasting position, and the upper surface of the supporting block (123) forms the second supporting surface (121).
7. The wafer processing equipment according to claim 1, characterized in that: The second carrying fixture (120) comprises a second carrying plate (122) and a positioning column (124) arranged on the second carrying plate (122), and the positioning column (124) is arranged away from the second supporting surface (121).
8. The wafer processing equipment according to claim 7, characterized in that: The second supporting plate (122) is provided with a plurality of installation slots, and the positioning column (124) can be selectively placed in one of the installation slots.
9. The wafer processing equipment according to claim 1, characterized in that: The wafer processing equipment also includes a transport device (200), and the transport device (200) is used to transport the wafer from the first carrying fixture (110) to the cutting device, or to transport the wafer from the cutting device to the second carrying fixture (120).
10. The wafer processing equipment according to claim 9, characterized in that: A suction head (210) is provided at the end of the transport device (200), and the suction head (210) suctions the wafer and suctions the wafer corresponding to the first supporting surface (111) and the second supporting surface (121).