Case and electric device

Abstract

The utility model is suitable for the technical field of energy storage, and provides a case and an electric device. The case comprises a case body; an accommodating cavity is formed in the box body, and the box body comprises a first box wall and a second box wall; the first box wall is provided with an air inlet hole and a first flow channel; the first flow channels and the air inlet holes are arranged at intervals; the second box wall is provided with an air outlet hole, and the air outlet hole communicates with the air inlet hole through the containing cavity. The first box wall is the bottom wall of the box body and comprises a first part and a second part, the first flow channel is formed in the first part, the air inlet hole is formed in the second part, and the first part faces the containing cavity and protrudes out of the second part. The case and the electric device provided by the utility model are high in heat dissipation efficiency.

Description

Technical Field

[0001] This application belongs to the technical field of energy storage, and particularly relates to a chassis and an electrical device. Background Art

[0002] The secondary control system of a battery generally includes an energy storage inverter, an energy management system, a battery management system, a power control system, a safety monitoring system, etc. At least one cabinet is generally provided among or between the above systems. At least one chassis is provided in the cabinet, and generally multiple circuit boards are provided in the chassis, and multiple electronic components are provided on the circuit boards. And some of the electronic components generate a large amount of heat. The current chassis structure has a low heat dissipation efficiency and cannot meet the usage requirements. Summary of the Utility Model

[0003] In view of the above problems, this application provides a chassis and an electrical device, aiming to solve the technical problem of how to improve the heat dissipation efficiency.

[0004] In a first aspect, an embodiment of this application provides a chassis, including a box body; an accommodation cavity is provided inside the box body, and the box body includes a first box wall and a second box wall; the first box wall is provided with an air inlet hole and a first flow channel; the first flow channel and the air inlet hole are arranged at intervals; the second box wall is provided with an air outlet hole, and the air outlet hole communicates with the air inlet hole through the accommodation cavity.

[0005] For the chassis provided by the embodiment of this application, a first flow channel and an air inlet hole are provided on the first box wall of the box body, wherein the first flow channel can allow a cooling medium to pass through, and the above cooling medium can adopt a cooling medium with a temperature lower than the ambient temperature as needed, so that the gas entering the accommodation cavity of the box body through the first box wall can be cooled during the process of passing through the air inlet hole, and further the temperature difference between the gas after entering the accommodation cavity and the temperature of the circuit board is larger, which helps to quickly cool the circuit board. Using the chassis provided by the embodiment of this application, compared with the chassis with an air-cooled heat dissipation structure in the related art, the heat dissipation efficiency is higher.

[0006] In some embodiments, the first box wall is the bottom wall of the box body, the first box wall includes a first part and a second part, the first flow channel is arranged on the first part, the air inlet hole is arranged on the second part, and the first part protrudes towards the accommodation cavity from the second part. With this solution, the condensed water can flow along the outer wall of the first part to the air inlet hole and be discharged from the box body through the air inlet hole.

[0007] In some embodiments, the first flow channel includes a first branch and a second branch, there are multiple first branches, the multiple first branches are arranged at intervals, and the multiple first branches are connected through the second branch. The first branch and / or the second branch are provided with openings for communicating with an external cooling medium supply system, and the air inlet hole is located between two adjacent first branches. Such a setting can make the structure on the first box wall of the box body simple and facilitate the outflow of condensed water, achieving multiple benefits with one action.

[0008] In some embodiments, there are two second branches, which are respectively arranged at opposite ends of the first branch and are respectively communicated with a plurality of first branches. In this embodiment, the same second branch is respectively communicated with a plurality of first branches, and the first branch and the second branch form a plurality of communication paths, so that after the cooling medium enters the first flow channel, it can flow quickly through different flow paths. Compared with the case where the first flow channel only includes one flow path, different regions of the first box wall can be cooled in time, which helps to adjust the temperature uniformity of different regions in the first box wall and the accommodation cavity.

[0009] In some embodiments, there are two openings, which are respectively arranged on the two second branches. Setting two openings can reduce the number of openings in the first flow channel, which is convenient for connecting the first flow channel with an external cooling medium supply system.

[0010] In some embodiments, the second branch has a first end and a second end arranged opposite to each other; one of the openings is located at the first end of one of the second branches, and the other opening is located at the second end of the other second branch. The two openings are respectively arranged at different ends of the two second branches, so that the cooling medium entering the first flow channel through one of the openings (the above-mentioned inlet) will flow through a longer path in any flow path before being discharged from the other opening (the above-mentioned outlet). In this way, the residence time of the cooling medium in the first flow channel can be longer, which helps to make full use of the cooling medium.

[0011] In some embodiments, there are a plurality of air inlet holes distributed at intervals along the extending direction of the first branch between two adjacent first branches. By adopting the solution provided in this embodiment, the number of air inlet holes can be large, which is convenient for gas to enter the box body through the air inlet holes and helps to improve the heat dissipation efficiency.

[0012] In some embodiments, a circuit board is arranged in the accommodation cavity, the first branch is located below the circuit board, and the extending direction of the first branch is arranged at an angle with the board surface of the circuit board. The extending direction of the first branch is arranged at an angle with the board surface of the circuit board. On the one hand, it can make the length of the flow path formed by the first branch and the second branch larger, so that the residence time of the cooling medium in the first flow channel is longer, which helps to make full use of the cooling medium; on the other hand, such an arrangement can ensure that no matter how the circuit board is arranged, it is not easy to completely block the air inlet holes between the first branches, which helps the chassis to dissipate heat.

[0013] In some embodiments, the first branch is arranged at an interval from the circuit board. The first branch is arranged at an interval from the circuit board and does not directly contact the circuit board. Compared with the solution of arranging a liquid cooling plate on the circuit board in the related art, it does not affect the plugging and unplugging of the circuit board. Therefore, the chassis provided by the embodiments of the present application can meet the heat dissipation requirements without affecting the plugging and unplugging operation of the circuit board.

[0014] In some embodiments, the extending direction of the first branch is perpendicular to the board surface of the circuit board. This can make the extending direction of the first branch parallel to the width direction or the length direction of the first box wall, facilitating the design and processing of the first branch.

[0015] In some embodiments, the dimension of the air inlet hole along the first direction is greater than the dimension of the air inlet hole along the second direction. The first direction and the second direction are respectively perpendicular to the through direction of the air inlet hole, and the first direction is the extending direction of the first branch. By adopting the solution provided in this embodiment, the opening area of the air inlet hole can be made larger, facilitating the rapid cooling of the chassis.

[0016] In some embodiments, a heat dissipation structure is provided on the side of the first box wall away from the accommodating cavity. The setting of the heat dissipation structure can increase the contact area between the first box wall and the gas outside the box, improve the heat exchange efficiency between the gas entering the accommodating cavity through the air inlet hole and the first box wall, further increase the temperature difference between the gas and the circuit board after the gas enters the accommodating cavity, and contribute to the rapid cooling of the chassis.

[0017] In some embodiments, the heat dissipation structure includes a plurality of heat dissipation fins. The plurality of heat dissipation fins are parallel to each other and arranged at intervals along the first direction. At least part of the heat dissipation fins is located on the flow path of the gas flowing through the air inlet hole. The first direction is the extending direction of the first branch. The heat dissipation structure including a plurality of heat dissipation fins can make the structure of the heat dissipation structure simple, facilitating preparation and processing. And at least part of the heat dissipation fins being located on the flow path of the gas flowing through the air inlet hole can enable the gas entering the accommodating cavity through the air inlet hole to achieve partial heat exchange with the first box wall through the heat dissipation fins before entering the accommodating cavity, contributing to the rapid cooling of this part of the gas, and further contributing to the rapid cooling of the chassis.

[0018] In some embodiments, the length direction of the heat dissipation fins is perpendicular to the first direction; in the first direction, the dimension of the heat dissipation fins is smaller than the dimension of the air inlet hole. By adopting the solution provided in this embodiment, the part where the heat dissipation fins overlap with the air inlet hole does not completely block the air inlet hole, enabling the gas to smoothly pass through the air inlet hole and enter the accommodating cavity.

[0019] In some embodiments, the heat dissipation fins are perpendicular to the first box wall. This can make the frictional force between the gas and the heat dissipation fins smaller when the gas passes through the heat dissipation fins and enters the air inlet hole, facilitating the gas to smoothly pass through the air inlet hole and enter the accommodating cavity.

[0020] In some embodiments, the first box wall and the second box wall are arranged opposite to each other. By adopting the solution provided in this embodiment, it is convenient for the convection of the gas in the accommodating cavity of the box body, and thus convenient for the rapid discharge of the gas, contributing to the rapid heat dissipation of the chassis.

[0021] In some embodiments, the cabinet further includes a third cabinet wall located between the first cabinet wall and the second cabinet wall and connected to the first cabinet wall and the second cabinet wall, and at least one of the second cabinet wall and the third cabinet wall is provided with a second flow channel. This can further improve the heat dissipation efficiency of the chassis.

[0022] In some embodiments, the chassis further includes a water collection device provided on a side of the first cabinet wall away from the accommodation cavity. The provision of the water collection device can prevent condensed water from falling outside the chassis, and is applicable to an environment where there are other electrical appliances or devices that need to be waterproof below the first cabinet wall of the chassis.

[0023] In some embodiments, the thickness of the first cabinet wall is less than or equal to 2.3 mm. With this dimension, the thickness of the first cabinet wall can be made smaller, facilitating the miniaturized design of the chassis.

[0024] In some embodiments, the first cabinet wall is an expanded plate. With the solution provided in this embodiment, the air inlet holes can be arranged at the crimping positions of the expanded plate, which can make the thickness of the first cabinet wall thinner and facilitate preparation.

[0025] In a second aspect, an electrical device provided by an embodiment of the present application includes the chassis of any of the above solutions.

[0026] The electrical device provided by the embodiment of the present application includes the chassis of any of the above solutions and has a relatively high heat dissipation efficiency.

[0027] The above description is only an overview of the technical solutions of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the specific embodiments of the present application are specifically given below. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. And in all the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0029] Figure 1 is a schematic structural diagram of a cabinet provided by some embodiments of the present application, and the cabinet door is not shown in the figure;

[0030] Figure 2 is a schematic structural diagram of a chassis provided by some embodiments of the present application;

[0031] Figure 3 is a schematic structural diagram of the first cabinet wall in a chassis provided by some embodiments of the present application;

[0032] Figure 4 is Figure 3 the front view structural schematic diagram of the first box wall shown;

[0033] Figure 5 is Figure 3 the side view structural schematic diagram of the first box wall shown;

[0034] Figure 6 the structural schematic diagram of the chassis provided by another embodiment of the present application;

[0035] Figure 7 the assembly structural schematic diagram of the first box wall and the water collecting device in the chassis provided by an embodiment of the present application.

[0036] The reference numerals in the drawings in the specific embodiments are as follows:

[0037] 1000, cabinet;

[0038] 100, cabinet body; 200, chassis;

[0039] 10, box body; 11, accommodation cavity; 12, first box wall; 13, second box wall; 14, air outlet hole; 15, third box wall; 20, circuit board; 30, first flow channel; 31, first branch; 32, second branch; 33, opening; 40, air inlet hole; 50, heat dissipation structure; 51, heat sink; 60, second flow channel; 70, water collecting device; 80, ventilation flow channel;

[0040] X, the first direction / the extending direction of the first branch; Y, the length direction of the heat sink. Specific embodiments

[0041] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to illustrate the technical solutions of the present application more clearly, so they are only examples and cannot be used to limit the protection scope of the present application.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above accompanying drawings are intended to cover non-exclusive inclusion.

[0043] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, "a plurality" means more than two unless otherwise specifically defined.

[0044] Reference to "embodiments" in this specification means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0045] In the description of the embodiments of the present application, the term "and / or" is merely a description of the association relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally represents an "or" relationship between the associated objects before and after.

[0046] In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two). Similarly, "multiple groups" refers to two or more groups (including two groups), and "multiple pieces" refers to two or more pieces (including two pieces).

[0047] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application.

[0048] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "coupling", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0049] With the development of technology, power batteries are widely used in energy storage power systems such as hydraulic, thermal, wind and solar power stations, electric transportation means such as electric bicycles, electric motorcycles, electric vehicles, as well as military equipment and aerospace and other fields. Since the energy storage capacity of a single battery cell is relatively small, multiple battery cells are generally required in the same electrical device or energy storage system. However, power batteries such as lithium batteries are restricted by factors such as the materials and manufacturing processes of the electrode components, and there are often differences in internal resistance, capacity, voltage, etc. between different battery cells. Therefore, in actual applications, heat dissipation unevenness or overcharging and over-discharging are likely to occur in each battery cell. This is likely to lead to a shortened battery life. If the battery is in a severely overcharged state, there is also a risk of explosion.

[0050] To solve the above problems, a secondary control system for the battery is generally set in the electrical device or energy storage system. The secondary control system of the battery generally includes an energy storage converter, an energy management system, a battery management system, a power control system, a safety monitoring system, etc. At least one cabinet is generally set among the above systems or between these systems. At least one chassis is set in the cabinet, and multiple circuit boards are generally arranged in the chassis, and multiple electronic components are arranged on the circuit boards. And the heat generation of some electronic components is relatively large.

[0051] In order to make the use performance of the electronic components and the circuit boards stable and the service life long, a heat dissipation structure is generally set on or inside the chassis. The above heat dissipation structure can adopt an air-cooled structure, that is, the electronic components (such as control chips, etc.) and the circuit boards in the chassis are cooled by air cooling. The above air-cooled structure generally includes the following two types: the first type is natural convection; the second type is forced convection by driving air through a fan. The above two solutions are to fix the radiator on the surface of the electronic components that need to dissipate heat on the circuit board through a thermal interface material (such as thermal conductive glue, etc.), and take away the heat on the electronic components through the convection of the radiator and the air. This technology (i.e., air-cooled heat dissipation) has at least the following problems: low heat transfer efficiency, large volume of the equipment (including the air-cooled structure and the chassis), high noise, small heat dissipation heat flux density, insufficient heat transfer, etc. Among them, the reason for the insufficient heat transfer is that the chassis needs to meet the requirements of Electromagnetic Compatibility (EMC), the opening rate of the chassis is not high, and the air intake volume is small.

[0052] With the development of society, the requirements for battery control and data processing are getting higher and higher. The functions of circuit boards and the electronic components thereon are becoming more and more numerous, and are gradually developing towards high performance and high heat flux density. This results in some electronic components, such as Central Processing Unit (CPU) chips, Field-Programmable Gate Array (FPGA) chips, Artificial Intelligence (AI) chips, etc., generating huge amounts of heat. If the temperature cannot be lowered in time during use, these electronic components will experience problems such as performance degradation, reduced lifespan, and shutdown. Thus, the above-mentioned air-cooled structure cannot meet the cooling requirements.

[0053] To improve the above problems, or at least partially improve the above problems, an embodiment of the present application provides a chassis. The chassis is provided with a first flow channel and an air inlet hole on the first box wall of the box body, wherein the first flow channel can allow a cooling medium to pass through. The above cooling medium can be a cooling medium with a temperature lower than the ambient temperature as needed, so that the gas entering the accommodation cavity of the box body through the first box wall can be cooled during the process of passing through the air inlet hole, and further, the temperature difference between the gas after entering the accommodation cavity and the temperature of the circuit board is larger, which helps to quickly cool the circuit board. Using the chassis provided by the embodiment of the present application, compared with the chassis using an air-cooled heat dissipation structure in the related art, the heat dissipation efficiency is higher.

[0054] The chassis provided by the embodiment of the present application can be used in electrical devices with a chassis or various energy storage systems. The electrical device can be, but is not limited to, a cabinet, a computer system, a server, a power tool, a battery car, an electric vehicle, a ship, a spacecraft, etc. Among them, the spacecraft can include an airplane, a rocket, a space shuttle, a spaceship, etc. The energy storage system can include an energy storage cabinet, an energy storage valve, etc.

[0055] For the convenience of description in the following embodiments, a cabinet, which is an electrical device provided by an embodiment of the present application, is taken as an example for description.

[0056] Figure 1 The structural schematic diagram of the cabinet provided for some embodiments of the present application, the cabinet door is not shown in the figure. As Figure 1 shown, the cabinet 1000 includes a cabinet body 100 and a chassis 200 disposed inside the cabinet body 100. Among them, the cabinet body 100 is used to accommodate the chassis 200 and other electrical or electronic devices, and generally has a plurality of side plates, at least one side is open, or at least one side plate can be disassembled or opened and closed. The above-mentioned openable or dismountable side plate is generally used as the cabinet door of the cabinet body, which is not shown in the figure. The above side plate is usually made of cold-rolled steel plate or alloy, and can also be made of other materials (such as plastic, composite material, etc.).

[0057] Figure 2 Schematic structural diagram of the chassis provided by some embodiments of the present application. As Figure 2 shown, the chassis 200 generally includes a box body 10. In addition, the chassis 200 may also include other structures according to the usage requirements, such as electronic devices, heat dissipation structures, electronic control structures, etc., which can be determined specifically according to the usage requirements.

[0058] Among them, the box body 10 is generally also surrounded by a plurality of side plates, and has a receiving cavity and at least one opening communicating with the receiving cavity. Each side plate is usually made of a metal plate, having good protection performance, and can also be made of other materials (such as plastics, composite materials, etc.). In addition, in order to ensure the structural stability and vibration requirements of the chassis 200, in addition to the side plates, a support structure is generally provided inside the box body 10, such as a support column such as a square tube is provided at the connection of two adjacent side plates, and two adjacent support columns are connected by welding, plugging, etc.

[0059] Figure 3 Schematic structural diagram of the first box wall in the chassis provided by some embodiments of the present application. Please refer to Figure 2 and Figure 3 together. Some embodiments of the present application provide a chassis 200. The chassis 200 includes a box body 10. An accommodation cavity 11 is provided inside the box body 10. The box body 10 includes a first box wall 12 and a second box wall 13.

[0060] The first box wall 12 is provided with a first flow channel 30 and an air inlet hole 40. The first flow channel 30 and the air inlet hole 40 are arranged at intervals.

[0061] The second box wall 13 is provided with an air outlet hole 14. The air outlet hole 14 communicates with the air inlet hole 40 through the accommodation cavity 11.

[0062] The first box wall 12 and the second box wall 13 are respectively one of the side plates surrounding the box body 10.

[0063] The air inlet hole 40 is a through hole that penetrates the first box wall 12 in the thickness direction, and generally has a plurality of them, which can be distributed evenly or unevenly on the first box wall 12, and can be determined specifically according to the usage requirements. The air outlet hole 14 is a through hole that penetrates the second box wall 13 in the thickness direction, and generally has a plurality of them, which can be distributed evenly or unevenly on the second box wall 13, and can be determined specifically according to the usage requirements.

[0064] The first flow channel 30 is a structure such as a cavity or a channel for the cooling medium to pass through. The first flow channel 30 is a structure with both ends open. Both ends of the first flow channel 30 can be connected to an external cooling medium supply system, so that the cooling medium can flow and take away the heat absorbed by the first box wall 12 in the process of passing through the first flow channel 30 to achieve cooling. The cooling medium is a fluid, which means that the cooling medium is a medium that can be used for cooling and can flow, and can be a liquid, a gas-liquid mixture, a liquid-solid mixture, etc. When the cooling medium is a liquid, the cooling medium can be water, ethylene glycol solution, fluorinated liquid, cooling oil, and other media compatible with the box material.

[0065] The first flow channel 30 can be arranged on the first box wall 12 in a variety of ways. For example, the first flow channel 30 can be completely arranged in the first box wall 12 of the box body 10, or completely arranged on the surface of the first box wall 12, or partially arranged in the first box wall 12 and the other part is arranged to protrude from the first box wall 12.

[0066] The heat dissipation principle of the chassis 200 provided in the embodiment of the present application is as follows:

[0067] During the use of the chassis 200, the electronic components of the chassis 200, such as the circuit board 20, generate heat, causing the temperature of the gas in the accommodating chamber 11 of the box body 10 to be higher than the temperature of the gas outside the box body 10. This causes the gas in the box body 10 to continuously flow out of the accommodating chamber 11 through the air outlet 14, and the gas outside the box body 10 will enter the accommodating chamber 11 of the box body 10 through the air inlet 40 on the first box wall 12 under the action of air pressure. The lower temperature gas entering the accommodating chamber 11 will then exchange heat with the hot air in the accommodating chamber 11 and the circuit board 20, so that the temperature of the circuit board 20 is reduced.

[0068] Since the first box wall 12 is provided with the first flow channel 30, the first flow channel 30 is used for cooling medium to pass through. When in use, a cooling medium with a relatively low temperature can be introduced into the first flow channel 30. For example, if the temperature of the gas outside the box body 10 is 20°C, a cooling medium with a temperature of 10°C, 15°C or other temperatures can be introduced into the first flow channel 30; or if the temperature of the gas outside the box body 10 is 55°C, a cooling medium with a temperature of 20°C, 23°C or other temperatures can be introduced into the first flow channel 30.

[0069] In this way, when the gas outside the box 10 enters the containing chamber 11 of the box 10 through the air inlet 40, the gas will exchange heat with the first box wall 12 and the first flow channel 30 thereon when it contacts the first box wall 12 and the first flow channel 30, so that its own temperature is reduced, such as by 3°C-4°C or more. In this way, the temperature difference between the gas entering the containing chamber 11 and the temperature of the circuit board 20 is larger, which helps to quickly cool down the circuit board 20.

[0070] It is understandable that the temperature difference of the gas before and after passing through the air inlet hole 40 is affected by various factors, such as the influence of the temperature at the top of the box body on the temperature of the first box wall, as well as the flow rate and contact area of the cooling medium.

[0071] Of course, when devices such as fans are provided on the chassis 200, the air convection in the above process can be further accelerated, improving the temperature reduction effect.

[0072] It can be seen that in the chassis 200 provided by the embodiment of the present application, the first flow channel 30 and the air inlet hole 40 are provided on the first box wall 12 of the box body 10. The first flow channel 30 can allow the cooling medium to pass through. The above cooling medium can be a cooling medium with a temperature lower than the ambient temperature as needed, so that the gas entering the accommodation cavity 11 of the box body 10 through the first box wall 12 can be cooled during the process of passing through the air inlet hole 40. Furthermore, the temperature difference between the gas after entering the accommodation cavity 11 and the temperature of the circuit board 20 is larger, which helps to quickly cool the circuit board 20. Using the chassis 200 provided by the embodiment of the present application, compared with the chassis 200 with an air-cooled heat dissipation structure in the related art, the heat dissipation efficiency is higher.

[0073] As Figure 2 and Figure 3 shown, in some embodiments, the first box wall 12 is the bottom wall of the box body 10. The first box wall 12 includes a first part and a second part. The first flow channel 30 is provided in the first part, and the air inlet hole 40 is provided in the second part. The first part protrudes towards the accommodation cavity 11 from the second part.

[0074] The bottom wall is the wall body located at the bottom of the box body 10 and plays a supporting role.

[0075] Both the first part and the second part are parts of the first box wall 12.

[0076] The first part protruding towards the accommodation cavity 11 from the second part means that the surface of the first part facing the accommodation cavity 11 protrudes from the surface of the second part facing the accommodation cavity 11.

[0077] Due to the relatively high temperature of the gas in the accommodation cavity 11 during use and the relatively low temperature of the first box wall 12 due to the presence of the cooling medium, if the gas in the accommodation cavity 11 contains moisture, condensation will occur when it comes into contact with the protruding part (i.e., the first part) of the first box wall 12. Condensation is the phenomenon that a gas condenses into a liquid when it encounters cold. That is, the above gas will form condensed water on the first part. Since the first part protrudes from the second part, the condensed water can flow along the outer wall of the first part to the air inlet hole 40 and be discharged from the box body 10 through the air inlet hole 40.

[0078] As Figure 2 and Figure 3As shown, in some embodiments, the first flow channel 30 includes a first branch 31 and a second branch 32. There are multiple first branches 31. The multiple first branches 31 are arranged at intervals in sequence, and the multiple first branches 31 are communicated through the second branch 32. An opening 33 for communicating with an external cooling medium supply system is provided on the first branch 31 and / or the second branch 32. The air inlet hole 40 is located between two adjacent first branches 31.

[0079] Both the first branch 31 and the second branch 32 are components of the first flow channel 30 and are channels through which the cooling medium can flow. Arranged at intervals means that there is an interval between any two adjacent first branches 31.

[0080] It should be noted that in this embodiment, two adjacent first branches 31 can be arranged in parallel or at an angle. The interval between any two adjacent first branches 31 can be the same as or different from the interval between other two adjacent first branches 31, which can be determined according to actual use needs.

[0081] The external cooling medium supply system is a system located outside the chassis 200 that can supply the cooling medium into the first flow channel 30. The above system can also receive the cooling medium flowing out of the first flow channel 30.

[0082] The above opening 33 is an opening communicating with the external cooling medium supply system, which can be provided on the first branch 31 according to actual use needs, or on the second branch 32, or on both the first branch 31 and the second branch 32.

[0083] Since the first branch 31 protrudes from the planar part of the first box wall 12, a recessed structure will be formed between two adjacent first branches 31. The air inlet hole 40 is located between two adjacent first branches 31, so that when the hot air in the accommodation cavity 11 condenses to form condensed water after contacting the first branch 31, the condensed water can flow along the outer wall of the first branch 31 to the air inlet hole 40, thus facilitating the outflow of the condensed water through the air inlet hole 40. Such a setting can make the structure on the first box wall 12 of the box body 10 simple and facilitate the outflow of the condensed water, achieving multiple benefits at one stroke.

[0084] In some embodiments, there are two second branches 32. The two second branches 32 are respectively arranged at opposite ends of the first branch 31 and are respectively communicated with the multiple first branches 31.

[0085] In this embodiment, the same second branch 32 is respectively communicated with a plurality of first branches 31, and the first branches 31 and the second branch 32 form a plurality of communication paths, so that after the cooling medium enters the first flow channel 30, it can flow quickly through different flow paths. Compared with the first flow channel 30 having only one flow path, different regions of the first box wall 12 can be cooled in time, which helps to adjust the temperature uniformity of different regions in the first box wall 12 and the accommodation cavity 11.

[0086] In some embodiments, there are two openings 33, and the two openings 33 are respectively arranged on two second branches 32.

[0087] One of the two openings 33 can be used as an inlet and communicated with the water supply port of the external cooling medium supply system; the other opening 33 can be used as an outlet to discharge the cooling medium outward or to the external cooling medium supply system.

[0088] Setting two openings 33 can make the number of openings 33 of the first flow channel 30 less, which is convenient for the connection between the first flow channel 30 and the external cooling medium supply system.

[0089] In some embodiments, the second branch 32 has a first end and a second end arranged opposite to each other. One of the openings 33 is located at the first end of one of the second branches 32, and the other opening 33 is located at the second end of the other second branch 32.

[0090] The two openings 33 are respectively arranged at different ends of the two second branches 32, so that the cooling medium entering the first flow channel 30 through one of the openings 33 (the above-mentioned inlet) will flow through a longer path in any flow path before being discharged from the other opening 33 (the above-mentioned outlet). In this way, the residence time of the cooling medium in the first flow channel 30 can be longer, which helps to make full use of the cooling medium.

[0091] In some embodiments, there are a plurality of air inlet holes 40 distributed at intervals along the extension direction of the adjacent two first branches 31.

[0092] The extension direction of the first branch 31 is the length direction of the first branch 31, and it is also the flow direction of the cooling medium located in the first branch 31, and it is also Figure 3 the first direction X in

[0093] Adopting the solution provided by this embodiment can make the number of air inlet holes 40 relatively large, which is convenient for gas to enter the box body 10 through the air inlet holes 40, and helps to improve the heat dissipation efficiency.

[0094] Such as Figure 2 and Figure 3As shown, in some embodiments, a circuit board 20 is provided in the accommodation cavity 11. The first branch 31 is located below the circuit board 20. The extending direction of the first branch 31 is arranged at an angle to the board surface of the circuit board 20.

[0095] Generally, there are multiple circuit boards 20, and the number and functions of the electronic components on each circuit board 20 can be determined according to the usage requirements. The circuit board 20 can be inserted into the accommodation cavity 11 of the box body 10, or can be fixedly connected to the accommodation cavity 11 of the box body 10 through bolts or the like, which can be specifically determined according to the usage requirements.

[0096] It can be understood that Figure 2 only one circuit board 20 is shown in the figure. According to the usage requirements, other circuit boards can also be provided in the box body 10. The other circuit boards 20 can be arranged parallel to the shown circuit board 20, or can be arranged perpendicular to the shown circuit board 20, or at other angles.

[0097] The circuit board 20 is generally arranged perpendicular to the first box wall 12. The board surface of the circuit board 20 is generally parallel to the width direction of the first box wall 12 and perpendicular to the length direction of the first box wall 12. The extending direction of the first branch can be the length direction of the first box wall 12, or can be other directions at a certain angle to the length direction of the first box wall 12, which can be specifically determined according to the usage requirements.

[0098] It can be understood that when the board surface of the circuit board 20 is parallel to the length direction of the first box wall 12 and perpendicular to the width direction of the first box wall 12. The extending direction of the first branch 31 can then be the width direction of the first box wall 12, or can be other directions at a certain angle to the width direction of the first box wall 12, which can be specifically determined according to the usage requirements.

[0099] The extending direction of the first branch 31 is arranged at an angle to the board surface of the circuit board 20. On the one hand, it can make the length of the flow path formed by the first branch 31 and the second branch 32 larger, so that the residence time of the cooling medium in the first flow channel 30 is longer, which helps the full utilization of the cooling medium; on the second hand, such an arrangement can make it difficult for the circuit board to completely block the air inlet holes 40 between the first branches 31 no matter how it is arranged, which helps the heat dissipation of the chassis 200.

[0100] In some embodiments, the first branch 31 is spaced from the circuit board 20.

[0101] The spaced arrangement means that there is a certain distance between the first branch 31 and the circuit board 20, and the two do not directly contact.

[0102] The first branch 31 is arranged at an interval from the circuit board 20 and does not directly contact the circuit board 20. Compared with the solution of arranging a liquid cooling plate on the circuit board 20 in the related art, the insertion and extraction of the circuit board 20 can be not affected. Therefore, by using the chassis 200 provided in the embodiment of the present application, the insertion and extraction operation of the circuit board 20 can be not affected while meeting the heat dissipation requirement.

[0103] In some embodiments, the extending direction of the first branch 31 is perpendicular to the board surface of the circuit board 20.

[0104] This can make the extending direction of the first branch 31 parallel to the width direction or the length direction of the first box wall 12, facilitating the design and processing of the first branch 31.

[0105] In some embodiments, the dimension of the air inlet hole 40 along the first direction X is greater than the dimension of the air inlet hole 40 along the second direction. The first direction X and the second direction are respectively perpendicular to the through direction of the air inlet hole 40. And the first direction X is the extending direction of the first branch 31.

[0106] In this embodiment, the air inlet hole 40 is a long strip hole. A long strip hole refers to a hole whose dimension in the length direction is significantly greater than the dimensions in other directions. Significantly greater means that the dimension in the length direction is more than 1.5 times the dimension in other directions.

[0107] By adopting the solution provided in this embodiment, the opening area of the air inlet hole 40 can be made larger, facilitating the rapid cooling of the chassis 200.

[0108] In some embodiments, a heat dissipation structure 50 is provided on the side of the first box wall 12 away from the accommodation cavity 11.

[0109] The heat dissipation structure 50 can be a radiator, a heat sink, etc., as long as it can achieve heat dissipation.

[0110] The setting of the heat dissipation structure 50 can increase the contact area between the first box wall 12 and the gas located outside the box body 10, improve the heat exchange efficiency between the gas entering the accommodation cavity 11 through the air inlet hole 40 and the first box wall 12, further increase the temperature difference between the gas entering the accommodation cavity 11 and the circuit board 20, and contribute to the rapid cooling of the chassis 200.

[0111] In some embodiments, the heat dissipation structure 50 includes a plurality of heat sinks 51. The plurality of heat sinks 51 are parallel to each other and arranged at intervals along the first direction X. At least part of the heat sinks 51 is located on the flow path of the gas flowing through the air inlet hole 40. The first direction X is the extending direction of the first branch 31.

[0112] In this embodiment, the heat dissipation structure 50 can only include the heat sinks 51, or can also include other structures in addition to the heat sinks 51, such as heat dissipation blocks, flow guiding structures, etc.

[0113] The heat sink 51 can be arranged perpendicular to the first box wall 12 or at an angle to the first box wall 12, which can be determined according to specific usage requirements.

[0114] At least a part of the heat sink 51 being located on the flow path of the gas flowing through the air inlet hole 40 means that at least a part of the heat sink 51 is located on the inlet side of the air inlet hole 40, and its position corresponds to that of the air inlet hole 40. The gas entering the accommodation cavity 11 through the air inlet hole 40 will pass through this part of the heat sink 51 before entering the air inlet hole 40. Since the gas entering the accommodation cavity 11 of the box body 10 generally enters through the air inlet hole 40, the side of the air inlet hole 40 facing away from the accommodation cavity 11 is the above-mentioned inlet side.

[0115] The heat dissipation structure 50 includes a plurality of heat sinks 51, which can make the structure of the heat dissipation structure 50 simple and facilitate preparation and processing. And at least a part of the heat sink 51 being located on the flow path of the gas flowing through the air inlet hole 40 can enable the gas entering the accommodation cavity 11 through the air inlet hole 40 to achieve partial heat exchange with the first box wall 12 through the heat sink 51 before entering the accommodation cavity 11, contributing to the rapid cooling of this part of the gas and thus contributing to the rapid cooling of the chassis 200.

[0116] Figure 4 For Figure 3 The front view structural schematic diagram of the first box wall shown. As Figure 3 And Figure 4 Shown, in some embodiments, the length direction Y of the heat sink 51 is perpendicular to the first direction X. In the first direction X, the size a of the heat sink 51 is smaller than the size b of the air inlet hole 40.

[0117] The heat sink 51 is generally a three-dimensional structure with a certain length, width, and thickness.

[0118] Adopting the solution provided in this embodiment enables the overlapping part of the heat sink 51 and the air inlet hole 40 not to completely block the air inlet hole 40, allowing the gas to smoothly enter the accommodation cavity 11 through the air inlet hole 40.

[0119] Figure 5 For Figure 3 The side view structural schematic diagram of the first box wall shown. As Figure 5 Shown, in some embodiments, the heat sink 51 is perpendicular to the first box wall 12.

[0120] This can make the frictional force between the gas and the heat sink 51 smaller when the gas passes through the heat sink 51 and enters the air inlet hole 40, facilitating the gas to smoothly enter the accommodation cavity 11 through the air inlet hole 40.

[0121] As Figure 2 Shown, in some embodiments, the first box wall 12 and the second box wall 13 are arranged opposite to each other.

[0122] Relative arrangement means that the first box wall and the second box wall are arranged at intervals and face to face. For example, when the first box wall 12 is the bottom wall of the box body, the second box wall 13 is the top wall of the box body; when the first box wall 12 is the left side wall of the box body, the second box wall is the right side wall of the box body.

[0123] The solution provided in this embodiment is adopted to facilitate convection of gas in the accommodating cavity 11 of the box body 10, thereby facilitating rapid discharge of gas, which helps to quickly dissipate heat in the chassis 200.

[0124] Figure 6 This is a schematic diagram of the structure of a chassis provided by another embodiment of the present application. Figure 6 As shown, in some embodiments, the box body 10 further includes a third box wall 15. The third box wall 15 is located between the first box wall 12 and the second box wall 13, and is connected to the first box wall 12 and the second box wall 13. At least one of the second box wall 13 and the third box wall 15 is provided with a second flow channel 60.

[0125] The third box wall 15 is also one of the side walls of the box body 10 .

[0126] The second flow channel 60 is also used for cooling medium to flow through, and its structure and setting method can be the same as or different from the first flow channel 30, depending on the specific use requirements.

[0127] The second flow channel 60 may be provided on any side wall or multiple side walls of the box body 10 except the first box wall 12 , so as to further improve the heat dissipation efficiency of the chassis 200 .

[0128] It is understandable that if only the first flow channel is provided on the first box wall to meet the use requirements, the second flow channel 60 does not need to be provided.

[0129] Figure 7 This is a schematic diagram of the assembly structure of the first box wall and the water collecting device in the box provided in one embodiment of the present application. Figure 7 As shown, in some embodiments, the chassis further includes a water collecting device 70. The water collecting device 70 is disposed on a side of the first box wall 12 away from the accommodating cavity.

[0130] The water collecting device 70 is used to receive the condensed water discharged through the air inlet 40. A ventilation channel 80 is formed between the water collecting device 70 and the first box wall 12. The ventilation channel 80 communicates with the air inlet 40 and the external space.

[0131] The water collecting device 70 is a device for collecting condensed water, and may include a tray, a water collecting plate, etc., as long as the above functions can be achieved.

[0132] The water collection device 70 can be connected to the first box wall 12 or fixedly installed inside the cabinet, which can be determined according to the actual usage requirements.

[0133] The arrangement of the water collection device 70 can prevent the condensed water from falling outside the chassis 200, and is applicable to the environment where there are other electrical appliances or devices that require waterproofing below the first box wall 12 of the chassis 200.

[0134] In some embodiments, the thickness c of the first box wall 12 is less than or equal to 2.3 mm.

[0135] Adopting this size can make the thickness of the first box wall 12 smaller, which is convenient for the miniaturization design of the chassis 200.

[0136] In some embodiments, the first box wall 12 is an expanded plate.

[0137] During preparation, the designed first flow channel can be formed by sandwiching a graphite powder plate between two aluminum thin plates. Through the process of hot pressing combined with cold pressing, the non-flow channel part is compacted, and air inlet holes are processed in the compacted part. The type, size, and position of the air inlet holes can be designed and changed according to the optimization of the heat dissipation efficiency. The air inlet holes can also be made by punching, and the flanging is retained to increase the ventilation contact area and improve the heat exchange efficiency between the incoming air and the first box wall.

[0138] Adopting the solution provided in this embodiment, the air inlet holes can be arranged at the crimping position of the expanded plate, which can make the thickness of the first box wall 12 thinner and convenient for preparation.

[0139] According to some embodiments of the present application, the present application also provides an electrical device including the chassis of any of the above solutions.

[0140] The electrical device provided by the embodiments of the present application includes the chassis of any of the above solutions and has a relatively high heat dissipation efficiency.

[0141] Please refer to Figures 1 to 5 , according to some embodiments of the present application, a cabinet 1000 is provided. The cabinet 1000 can be a screen cabinet or other cabinets. The cabinet 1000 includes a cabinet body 100 and a chassis 200 arranged inside the cabinet body 100. The chassis 200 includes a box body 10 and a circuit board 20. The box body 10 has a receiving cavity 11 and a first box wall 12. The circuit board 20 is arranged inside the receiving cavity 11. The first box wall 12 is provided with a first flow channel 30 and air inlet holes 40. The first flow channel 30 is used for the cooling medium to pass through. The first flow channel 30 is arranged to avoid the air inlet holes 40, and at least part of the first flow channel 30 protrudes towards the receiving cavity 11. The protruding part of the first flow channel 30 is used to guide the condensed water towards the air inlet holes 40.

[0142] The first flow channel 30 includes a first branch 31 and a second branch 32. There are multiple first branches 31. The multiple first branches 31 are arranged at intervals in sequence, and the multiple first branches 31 are communicated through the second branch 32. The first branch 31 and / or the second branch 32 are provided with an opening 33 for communicating with an external cooling medium supply system. At least part of the first branch 31 protrudes towards the accommodation cavity 11. There are two second branches 32. The two second branches 32 are respectively arranged at both ends of the first branch 31 and are respectively communicated with the multiple first branches 31.

[0143] There are two openings 33, and the two openings 33 are respectively arranged on the two second branches 32. The second branch 32 has a first end and a second end arranged in opposite directions. One of the openings 33 is located at the first end of one of the second branches 32, and the other opening 33 is located at the second end of the other second branch 32.

[0144] The first branch 31 extends along the first direction X. The first direction X is perpendicular to the board surface of the circuit board. At least part of the second branch 32 protrudes towards the accommodation cavity 11. The air inlet hole 40 is located in the recessed structure surrounded by the first branch 31 and the second branch 32. The air inlet hole 40 includes a long strip hole. The length direction of the long strip hole is arranged along the first direction X.

[0145] The outer wall of the first box wall 12 is convexly provided with a heat dissipation structure 50. The heat dissipation structure 50 includes a plurality of heat dissipation fins 51. The plurality of heat dissipation fins 51 are parallel to each other and are arranged at intervals along the first direction X. At least part of the heat dissipation fins 51 is located on the flow path of the gas flowing through the air inlet hole 40. The length direction of the heat dissipation fins 51 is perpendicular to the first direction X, and the thickness of the heat dissipation fins 51 is less than the length of the air inlet hole 40. The heat dissipation fins 51 are perpendicular to the first box wall 12.

[0146] An air outlet hole 14 is provided on the second box wall 13 of the box body 10. A second flow channel 60 is provided on the first side wall of the box body 10. The first side wall is any one of the other side walls of the box body 10 except the first box wall 12. The first box wall 12 is the bottom wall of the box body 10, and the second box wall 13 is the top wall of the box body 10.

[0147] The first box wall 12 is made of an extruded sheet, the first flow channel 30 is arranged on the inner wall of the first box wall 12, the air inlet hole 40 is arranged at the crimping place, and the thickness of the extruded sheet is less than or equal to 2.3 mm.

[0148] The cabinet 1000 provided in this embodiment can be used in an energy storage valve system or other systems, and can be specifically determined according to the usage requirements.

[0149] In related technologies, a liquid cooling plate is fixed on a circuit board 20 through a thermal interface material and is in close contact with a chip on the circuit board 20. The heat of the chip is taken away by the refrigerant in the liquid cooling plate. Although this method has a high heat dissipation efficiency, there are at least the following problems: The boards in the chassis 200 need to be plugged and unplugged at any time. The heat dissipation method of the liquid cooling plate in contact with the chip is not flexible during the plugging and unplugging process, and long-term plugging and unplugging easily causes risks such as leakage; The boards and heat dissipation devices are not convenient for maintenance and are difficult to assemble; Condensation problems caused by environmental temperature and humidity problems can cause short circuits in the chips inside the boards; Since the installation of the liquid cooling plate is targeted, the heat generation design of multiple chips on the board is not flexible; The liquid cooling plate is fixed in contact with the board and the chip, resulting in high requirements for the board load-bearing.

[0150] Compared with air cooling, the cabinet 1000 provided in this embodiment has higher efficiency. Devices such as fans for forced air convection can be omitted, making the structure of the chassis 200 compact, small in size, and low in noise; Compared with the direct contact between the liquid cooling plate and the circuit board 20, the liquid cooling channel (i.e., the first flow channel) is designed inside the first box wall 12 of the chassis 200, so that the liquid cooling channel does not directly contact the circuit board 20. On the one hand, this does not affect the plugging and unplugging method of the circuit board 20 in the chassis 200 and is convenient for the separate maintenance of the circuit board 20 and the first box wall 12. On the other hand, the liquid cooling channel is arranged on the first box wall 12, which can reduce the temperature of the air entering through the air inlet (i.e., the air inlet hole 40) of the chassis 200, solve the problem of the higher inlet temperature after the temperature iteration of multiple chassis 200, and can reduce the temperature of the circuit board 20 and the chip inside the chassis 200 by means of forced air cooling or natural cooling. At the same time, the air inlet hole 40 is still reserved at the bottom of the chassis 200, so that the first box wall 12 can act as a heat exchanger to cool the air at the air inlet through a cooling medium.

[0151] In this embodiment, the first box wall 12 can be processed by the method of an extruded heat sink, and the thickness can be within 2.3 mm. Moreover, the design of the first flow channel 30 is flexible, which can effectively reduce the flow resistance of the cooling medium in the first flow channel 30.

[0152] In this embodiment, there are two openings 33, that is, there is only one pair of water inlet and outlet. Compared with setting more openings 33, the design inside the chassis 200 can be made simple, the risk of cooling medium leakage can be reduced to a certain extent, the reliability of the liquid cooling structure can be greatly improved, and it is convenient for maintenance.

[0153] The solution provided in this embodiment can cancel the fans originally fixed at the bottom of the chassis 200 and on the top of the screen cabinet after cooling the air by adopting the bottom liquid cooling structure, which reduces the system noise to a certain extent and improves the system life; By adopting the indirect liquid cooling and heat exchange method, the problems of difficult plugging and unplugging of the board and the risk of leakage caused by directly fixing the liquid cooling plate on the chip are avoided.

[0154] The chassis 200 has a total of 6 encapsulated surfaces. Since the direction of gravity in this solution is from top to bottom, the second box wall 13 and the first box wall 12 of the chassis 200 need to be perforated for natural or forced convection heat dissipation.

[0155] In this embodiment, the first box wall 12 is designed from the original aluminum sheet metal part into a thin liquid cooling plate. The types of this liquid cooling plate include but are not limited to the blown plate, and the air inlet and outlet openings are arranged at the welded joints of the liquid cooling plate (the crimping joints of the blown plate).

[0156] The solution provided in this embodiment optimizes the ambient temperature inside the chassis 200 by reducing the inlet air temperature, thereby reducing the temperature of the circuit board; forced convection (through a fan, etc.) can be combined for deeper cooling.

[0157] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered by the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A chassis, characterized in that: It comprises a box body; a containing cavity is arranged in the box body, and the box body comprises a first box wall and a second box wall; the first box wall is provided with an air inlet and a first flow channel; the first flow channel and the air inlet are arranged at intervals; the second box wall is provided with an air outlet, and the air outlet is connected to the air inlet through the containing cavity.

2. The chassis according to claim 1, characterized in that The first box wall is the bottom wall of the box body, the first box wall includes a first part and a second part, the first flow channel is arranged in the first part, the air inlet is arranged in the second part, and the first part protrudes from the second part toward the accommodating cavity.

3. The chassis according to claim 1 or 2, characterized in that: The first flow channel includes a first branch and a second branch. The first branch is provided with a plurality of first branches, and the plurality of first branches are arranged at intervals, and the plurality of first branches are connected through the second branch. The first branch and / or the second branch is provided with an opening for connecting to an external cooling medium supply system, and the air inlet is located between two adjacent first branches.

4. The chassis according to claim 3, characterized in that There are two second branches, which are arranged at two opposite ends of the first branch, and any one of the second branches is connected to a plurality of the first branches respectively.

5. The chassis according to claim 4, characterized in that: There are two openings, and the two openings are respectively arranged on two of the second branches.

6. The chassis according to claim 5, characterized in that The second branch has a first end and a second end that are arranged opposite to each other; one of the openings is located at the first end of one of the second branches, and the other opening is located at the second end of the other second branch.

7. The chassis according to any one of claims 3 to 6, characterized in that: A plurality of the air inlet holes are provided between two adjacent first branches and are distributed at intervals along the extension direction of the first branch.

8. The chassis according to any one of claims 3 to 7, characterized in that: A circuit board is arranged in the accommodating cavity, the first branch is located below the circuit board, and an extending direction of the first branch forms an angle with a board surface of the circuit board.

9. The chassis according to claim 8, characterized in that: The first branch is spaced apart from the circuit board.

10. The chassis according to claim 8 or 9, characterized in that: The extension direction of the first branch is perpendicular to the board surface of the circuit board.

11. The chassis according to any one of claims 3 to 10, characterized in that: The size of the air inlet hole along the first direction is greater than the size of the air inlet hole along the second direction. The first direction and the second direction are respectively perpendicular to the through direction of the air inlet hole, and the first direction is the extension direction of the first branch.

12. The chassis according to any one of claims 3 to 11, characterized in that: A heat dissipation structure is provided on a side of the first box wall away from the accommodating cavity.

13. The chassis according to claim 12, characterized in that The heat dissipation structure includes a plurality of heat sinks, which are parallel to each other and arranged at intervals along a first direction. At least a portion of the heat sinks are located on the flow path of the gas flowing through the air inlet hole. The first direction is the extension direction of the first branch.

14. The chassis according to claim 13, characterized in that The length direction of the heat sink is perpendicular to the first direction; In the first direction, the size of the heat sink is smaller than the size of the air inlet hole.

15. The chassis according to claim 13 or 14, characterized in that: The heat sink is perpendicular to the first box wall.

16. The chassis according to any one of claims 1 to 15, characterized in that: The first box wall and the second box wall are arranged opposite to each other.

17. The chassis according to any one of claims 1 to 16, characterized in that: The box body also includes a third box wall, which is located between the first box wall and the second box wall and connected to the first box wall and the second box wall. A second flow channel is disposed in at least one of the second box wall and the third box wall.

18. The chassis according to any one of claims 1 to 17, characterized in that: The chassis further comprises a water collecting device, and the water collecting device is arranged on a side of the first box wall away from the accommodating cavity.

19. The chassis according to any one of claims 1 to 18, characterized in that: The thickness of the first box wall is less than or equal to 2.3 mm.

20. The chassis according to any one of claims 1 to 19, characterized in that: The first box wall is a blown plate.

21. An electrical device, characterized in that: A chassis comprising any one of claims 1-20.

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