Glue plate of spin coater and spin coater

Abstract

The utility model provides a spin coater glue disc and a spin coater, the spin coater glue disc comprises a glue disc base, a glue disc inner ring and a glue disc cover, the glue disc base comprises a circular first disc surface and a positioning wall surrounding the edge of the first disc surface and extending upwards, a first through hole is formed in the center of the first disc surface, and a first alignment part is arranged around the first through hole; the rubber disc inner ring comprises a circular second disc surface and a check ring arranged around the center of the second disc surface; the second disc surface is smaller than the first disc surface; a second through hole is formed in the center of the second disc face, the check ring surrounds the second through hole, and at least part of the first alignment component can be embedded into the second through hole. The glue disc cover comprises a check ring wall which is encircled to form a glue spraying opening, and the check ring wall can be embedded into the positioning wall; after the glue disc base, the glue disc inner ring and the glue disc cover are installed in a nested mode, the first through hole, the second through hole and the glue spraying opening are concentric. The second disc surface and the check ring are integrally formed, so that the labor intensity of operators is reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of photoresist spin coating, and in particular to a photoresist glue disc and a photoresist spin coating machine. Background Art

[0002] A coating machine is a film-making device that uses centrifugal force to evenly spin-coat glue liquid on the surface of a substrate. It is widely used in the field of thin film preparation such as photoresist coating in the chip manufacturing process. The equipment has a simple structure, is relatively easy to operate, and produces relatively uniform thin films. During the coating process of the coating machine, the coating machine's glue disc can prevent excess glue liquid from being thrown into the operating environment under the action of centrifugal force, thereby polluting the operating environment on a large scale and harming the operator's body. Therefore, the coating machine's glue disc is an essential part of the coating machine.

[0003] The glue disc of the glue spreader is generally equipped with a glue disc cover to reduce the splashing of excess glue upwards. At present, the glue disc of the glue spreader mostly adopts a separate glue disc cover, but it is found that it has certain defects during use. For example, the glue disc cover needs to be removed when dripping glue, or the flip-up glue disc cover is used. These glue disc covers require additional operations when using. In addition, some substrates need to be back-washed during operation, and the existing glue disc of the glue spreader cannot meet the needs of both substrates that need back-washing and those that do not need back-washing. Utility Model Content

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present application provides a glue disc of a glue spreader and a glue spreader, characterized in that the glue disc of the glue spreader includes a glue disc base, a glue disc inner ring and a glue disc cover.

[0005] The rubber disk base includes a circular first disk surface and a positioning wall surrounding the edge of the first disk surface and extending upward. A first through hole is arranged at the center of the first disk surface, and a first alignment component is arranged around the first through hole.

[0006] The inner ring of the rubber disc includes a circular second disc surface and a retaining ring arranged around the center of the second disc surface; the size of the second disc surface is smaller than that of the first disc surface; a second through hole is arranged at the center of the second disc surface, the retaining ring surrounds the second through hole, and at least part of the first alignment component can be nested in the second through hole; the second disc surface and the retaining ring are integrally formed.

[0007] The glue disc cover comprises a retaining ring wall which encloses and forms a glue spraying opening, and the retaining ring wall can be embedded in the positioning wall.

[0008] After the glue disc base, the glue disc inner ring and the glue disc cover are nested and installed, the first through hole, the second through hole and the glue spraying opening are concentric.

[0009] In a possible implementation, the glue disk base includes at least one liquid guiding pipe, and the liquid guiding pipe extends downward from the first disk surface.

[0010] In a possible implementation, the first disk surface further includes a liquid collecting groove that surrounds the first through hole and is recessed downward, and the liquid guiding pipe extends vertically downward from the bottom of the liquid collecting groove.

[0011] In a possible implementation, the glue disk base further includes at least two exhaust pipes, the exhaust pipes extend vertically downward from the first disk surface, and the inlets of the exhaust pipes are higher than the bottom of the liquid collecting groove.

[0012] In a possible implementation, the at least two exhaust pipes are symmetrically arranged about the center of the first disk surface.

[0013] In a possible implementation, the liquid collecting groove is located at a position of the exhaust pipe away from the center of the first disk surface.

[0014] In a possible implementation, a third through hole is provided at a position of the glue disk base away from its center, a fourth through hole is provided at a position of the inner circle of the glue disk away from its center, the fourth through hole is located within the retaining ring, and after the glue disk base, the inner circle of the glue disk and the glue disk cover are nested and installed, the orthographic projection of the fourth through hole on the glue disk base at least partially coincides with the third through hole.

[0015] In a possible implementation, the materials used for the glue disk of the spin coater include nylon and polypropylene materials.

[0016] The present application further provides a spin coater, and the spin coater includes the glue disk of the spin coater described in any one of the above.

[0017] In a possible implementation, the spin coater further includes a rotating motor and a tray for placing wafers, a rotating shaft is provided on the rotating motor, and the rotating shaft is used to move the glue disk of the spin coater vertically up and down along its axis.

[0018] Compared with the prior art, the present application has the following beneficial effects:

[0019] A glue disk of a spin coater and a spin coater provided by the present application include a glue disk base, an inner circle of the glue disk and a glue disk cover. By integrally forming the second disk surface and the retaining ring and setting the nested structure of the glue disk base and the glue disk cover, the labor intensity of operators is reduced and the work efficiency is improved. Description of the Drawings

[0020] To more clearly illustrate the technical solution of this embodiment, the following will briefly introduce the attached drawings required in the embodiment. It should be understood that the following attached drawings only show some embodiments of the present application, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant attached drawings can also be obtained based on these attached drawings.

[0021] Figure 1 Schematic perspective view of the glue disk of the spin coater provided in this embodiment;

[0022] Figure 2 One of the schematic perspective views of the glue disk base provided in this embodiment;

[0023] Figure 3 Another schematic perspective view of the glue disk base provided in this embodiment;

[0024] Figure 4 Schematic perspective view of the inner ring of the glue disk provided in this embodiment;

[0025] Figure 5 Schematic perspective view of the glue disk cover provided in this embodiment;

[0026] Figure 6 Top view of the spin coater during operation provided in this embodiment.

[0027] Reference numerals: 10 - glue disk of the spin coater, 100 - glue disk base, 110 - first disk surface, 120 - positioning wall, 130 - first through hole, 140 - first alignment member, 150 - liquid guiding pipe, 160 - liquid collecting tank, 170 - exhaust pipe, 180 - third through hole, 200 - inner ring of the glue disk, 210 - second disk surface, 220 - retaining ring, 230 - second through hole, 240 - fourth through hole, 300 - glue disk cover, 310 - retaining ring wall, 410 - tray, 420 - rotating shaft. Detailed implementation manners

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the attached drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the attached drawings here can be arranged and designed in various different configurations.

[0029] Accordingly, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0030] It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0031] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is customarily placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0032] In addition, terms such as "horizontal", "vertical", "hanging" do not mean that the component is required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0033] In the description of the present application, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0034] The following will describe in detail the specific embodiments of the present application with reference to the accompanying drawings.

[0035] A spin coater chuck 10 provided by the present application is characterized in that, please refer to Figure 1 , and it includes a chuck base 100, a chuck inner ring 200, and a chuck cover 300.

[0036] Please refer to Figure 2, the glue tray base 100 includes a circular first disk surface 110 and a positioning wall 120 that extends upward around the edge of the first disk surface 110. A first through hole 130 is provided at the center position of the first disk surface 110, and a first alignment member 140 is provided around the first through hole 130.

[0037] Please refer to Figure 4 , the inner ring 200 of the glue tray includes a circular second disk surface 210 and a retaining ring 220 provided around the center of the second disk surface 210; the size of the second disk surface 210 is smaller than that of the first disk surface 110; a second through hole 230 is provided at the center of the second disk surface 210, the retaining ring 220 surrounds the second through hole 230, and at least part of the first alignment member 140 can be nested into the second through hole 230; the second disk surface 210 and the retaining ring 220 are integrally formed.

[0038] Please refer to Figure 5 , the glue tray cover 300 includes a retaining ring wall 310 that encloses a glue spraying opening, and the retaining ring wall 310 can be embedded into the positioning wall 120.

[0039] After the glue tray base 100, the inner ring 200 of the glue tray, and the glue tray cover 300 are nested and installed, the first through hole 130, the second through hole 230, and the glue spraying opening are concentric.

[0040] In this embodiment, the glue spreading machine glue tray 10 is strengthened by a stepped design of the inner ring edge of the glue tray cover 300, making it more fitting when cooperatively installed with the glue tray base 100, preventing the overflow of glue liquid, and at the same time increasing the sealing performance; the second disk surface 210 of the inner ring 200 of the glue tray and the retaining ring are integrally designed, not only integrally formed for anti-sputtering, but also simplifying the replacement steps; the first alignment member 140 includes a first step and a second step. To ensure smooth air exhaust and liquid drainage, when the inner ring 200 of the glue tray is nested with the glue tray base 100, it only engages with the first step away from the glue tray base 100.

[0041] In some possible implementation manners, please refer to Figure 2 , the glue tray base 100 includes at least one liquid guiding pipe 150, and the liquid guiding pipe 150 extends downward from the first disk surface 110.

[0042] In this embodiment, since the excess glue liquid will be thrown into the glue spreading machine glue tray 10 during the glue spreading process, in order to extend the service life of the glue spreading machine glue tray 10, the liquid guiding pipe 150 is provided on the glue tray base 100, and the inlet of the liquid guiding pipe 150 is provided on the first disk surface 110.

[0043] In a possible implementation manner, please refer to Figure 2, the first disk surface 110 further includes a liquid collecting groove 160 that surrounds the first through hole 130 and is recessed downward, and the liquid guiding pipe 150 extends vertically downward from the bottom of the liquid collecting groove 160.

[0044] In this embodiment, in order to enable the glue solution to be smoothly discharged from the liquid guiding pipe 150 after being thrown onto the glue disk 10 of the spin coater, a liquid collecting groove 160 is further provided on the glue disk 10 of the spin coater.

[0045] In some possible implementation manners, please refer to Figure 3 , the glue disk base 100 further includes at least two exhaust pipes 170, the exhaust pipes 170 extend vertically downward from the first disk surface 110, and the inlets of the exhaust pipes 170 are higher than the bottom of the liquid collecting groove 160.

[0046] During the spin coating process, the drying speed of the photoresist depends not only on the volatility of the photoresist itself, but also on the air conditions around the silicon wafer during the spin coating process. Therefore, it is very important to reduce the air flow on the silicon wafer and the disorder caused by the air flow; while the photoresist is being thrown towards the edge of the silicon wafer, due to the evaporation of the solvent, the drying of the photoresist causes the film thickness of the photoresist to be unevenly distributed in the radial direction.

[0047] In this embodiment, in order to control the air flow on the silicon wafer and make the film thickness uniformity of the photoresist on the silicon wafer surface better, at least two of the exhaust pipes 170 are further provided on the glue disk base 100.

[0048] In some possible implementation manners, please refer to Figure 3 , at least two of the exhaust pipes 170 are symmetrically arranged along the center of the first disk surface 110.

[0049] In this embodiment, in order to make at least two of the exhaust pipes 170 be evenly distributed on the glue disk base 100, at least two of the exhaust pipes 170 are symmetrically arranged along the center of the first disk surface 110.

[0050] In some possible implementation manners, please refer to Figure 2 , the liquid collecting groove 160 is located at a position away from the center of the first disk surface 110 of the exhaust pipe 170.

[0051] In this embodiment, in order to ensure that the excess glue solution flows into the liquid guiding pipe 150 along the liquid collecting groove 160 and is discharged, the liquid collecting groove 160 is located at a position away from the center of the first disk surface 110 of the exhaust pipe 170.

[0052] In some possible implementation manners, please refer to Figure 2 , a third through hole 180 is provided at a position away from the center of the glue disk base 100. Please refer to Figure 4, a fourth through-hole 240 is provided at a position away from the center of the inner ring 200 of the glue tray. The fourth through-hole 240 is located within the retaining ring 220. After the glue tray base 100, the inner ring 200 of the glue tray, and the glue tray cover 300 are nested and installed, at least a part of the orthographic projection of the fourth through-hole 240 on the glue tray base 100 coincides with the third through-hole 180.

[0053] In this embodiment, the third through-hole 180 on the glue tray base 100 is provided at a back-milling position where it can be nested and installed with the body of the spin coater. The back-milling liquid spray head can pass through the third through-hole 180 and the fourth through-hole 240 to the lower side of the silicon wafer to spray back-washing liquid on the silicon wafer. The back-milling liquid can polish the burrs on the back side of the glue-dropping surface of the silicon wafer smooth and dissolve the excess glue liquid that has fallen on the back side of the glue-dropping surface at the same time. The back-milling position of the glue tray base 100 is designed in a general mode, and the body of the spin coater can be installed whether it has a back-milling function or not.

[0054] In this embodiment, to reduce the pollution of the back-milling liquid by the excess glue liquid, the fourth through-hole 240 on the inner ring 200 of the glue tray is located within the retaining ring 220.

[0055] In some possible implementation manners, the materials used for the spin coater glue tray 10 include nylon and polypropylene materials.

[0056] The original material of the spin coater glue tray 10 is made of aluminum by stamping in one step, and the manufacturing cost is relatively high. In this embodiment, through actual measurement drawing and independent outer shape design drawing, and using new materials such as nylon or polypropylene for processing or 3D printing, the cost is extremely low, it can be processed in large batches, and the practical value and economic value of the spin coater glue tray 10 can be better realized.

[0057] The embodiment of the present application further provides a spin coater, and the spin coater includes the spin coater glue tray 10 described in any one of the foregoing.

[0058] In some possible implementation manners, please refer to Figure 6 , the spin coater further includes a rotating motor and a tray 410 for placing a silicon wafer. A rotating shaft 420 is provided on the rotating motor, and the rotating shaft 420 is used to move the spin coater glue tray 10 up and down along the vertical direction on its axis.

[0059] In this embodiment, to enable the suction cup and the silicon wafer to be fixed on the rotating shaft 420 when the rotating motor rotates, a vacuum adsorption switch is provided on the rotating motor. The vacuum adsorption switch is used to vacuum-adsorb the tray 410 and the silicon wafer with a smooth adsorption surface. For the convenience of the operator, in this embodiment, the operation of placing the silicon wafer on the tray 410 is selected outside the glue dispensing machine glue tray 10. After firm adsorption, the glue dispensing machine glue tray 10 placed on the rotating shaft 420 is then moved axially upward to place the silicon wafer into the glue dispensing machine glue tray 10, and then operations such as glue dropping are carried out.

[0060] For example, when using the glue dispensing machine glue tray 10, first insert the rotating shaft 420 of the rotating motor into the first through hole 130, the second through hole 230 and the glue spraying opening on the glue dispensing machine glue tray 10, place the tray 410 on the rotating shaft 420, place the silicon wafer on the tray 410, turn on the vacuum adsorption switch of the rotating motor, and the tray 410 and the silicon wafer are firmly adsorbed on the rotating shaft 420. At this time, the glue dispensing machine glue tray 10 is moved upward along the rotating shaft 420 to place the silicon wafer into the glue dispensing machine glue tray 10.

[0061] In summary, a glue dispensing machine glue tray 10 and a glue dispensing machine provided by the present application include a glue tray base 100, a glue tray inner ring 200 and a glue tray cover 300. The glue tray base 100 includes a circular first disk surface 110 and a positioning wall 120 that extends upward around the edge of the first disk surface 110. A first through hole 130 is provided at the central position of the first disk surface 110, and a first alignment member 140 is provided around the first through hole 130; the glue tray inner ring 200 includes a circular second disk surface 210 and a retaining ring 220 provided around the center of the second disk surface 210; the size of the second disk surface 210 is smaller than that of the first disk surface 110; a second through hole 230 is provided at the center of the second disk surface 210, and the retaining ring 220 surrounds the second through hole 230, and at least part of the first alignment member 140 can be nested into the second through hole 230; the glue tray cover 300 includes a retaining ring wall 310 that encloses to form a glue spraying opening, and the retaining ring wall 310 can be embedded into the positioning wall 120; after the glue tray base 100, the glue tray inner ring 200 and the glue tray cover 300 are nested and installed, the first through hole 130, the second through hole 230 and the glue spraying opening are concentric. By integrally forming the second disk surface 210 and the retaining ring 220, the present application reduces the labor intensity of the operator and improves the work efficiency.

[0062] The foregoing is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A glue disc for a glue spreader, characterized in that: The glue plate of the glue spreader includes a glue plate base, a glue plate inner ring and a glue plate cover; The rubber disk base includes a circular first disk surface and a positioning wall surrounding the edge of the first disk surface and extending upward, a first through hole is provided at the center of the first disk surface, and a first alignment component is provided around the first through hole; The inner ring of the rubber disk includes a circular second disk surface and a retaining ring arranged around the center of the second disk surface; the size of the second disk surface is smaller than that of the first disk surface; a second through hole is arranged at the center of the second disk surface, the retaining ring surrounds the second through hole, and at least a part of the first alignment component can be nested in the second through hole; the second disk surface and the retaining ring are integrally formed; The glue disc cover comprises a retaining ring wall which encloses and forms a glue spraying opening, and the retaining ring wall can be embedded in the positioning wall; After the glue disc base, the glue disc inner ring and the glue disc cover are nested and installed, the first through hole, the second through hole and the glue spraying opening are concentric.

2. The glue disc of the glue machine according to claim 1, characterized in that: The glue tray base includes at least one liquid-conducting channel, and the liquid-conducting channel extends downward from the first tray surface.

3. The glue disc of the glue machine according to claim 2, characterized in that: The first disk surface also includes a liquid collecting groove which surrounds the first through hole and is recessed downward, and the liquid guiding pipe extends vertically downward from the bottom of the liquid collecting groove.

4. The glue disc of the glue machine according to claim 3, characterized in that: The rubber disk base further includes at least two exhaust pipes, which extend vertically downward from the first disk surface, and the inlets of the exhaust pipes are higher than the bottom of the liquid collecting tank.

5. The glue disc of the glue machine according to claim 4, characterized in that: At least two of the exhaust ducts are symmetrically arranged along the center of the first disk surface.

6. The glue disc of the glue machine according to claim 4, characterized in that: The liquid collecting tank is located at a position of the exhaust pipe away from the center of the first disk surface.

7. The glue disc of the glue machine according to claim 1, characterized in that: The rubber disc base is provided with a third through hole away from its center position, the rubber disc inner ring is provided with a fourth through hole away from its center position, the fourth through hole is located in the retaining ring, and after the rubber disc base, the rubber disc inner ring and the rubber disc cover are nested and installed, the orthographic projection of the fourth through hole on the rubber disc base at least partially overlaps with the third through hole.

8. The glue disc of the glue machine according to claim 1, characterized in that: The materials used for the rubber disc of the glue spreader include nylon and polypropylene.

9. A glue homogenizing machine, characterized in that: The glue spreader comprises the glue spreader disc as described in any one of claims 1-8.

10. The glue spreading machine according to claim 9, characterized in that: The glue spreader also includes a rotating motor and a tray for placing silicon wafers. The rotating motor is provided with a rotating shaft, and the rotating shaft is used to move the glue tray of the glue spreader up and down along the axis in a vertical direction.

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