Automatic sorting equipment for LED chip processing
By designing an automatic sorting equipment for LED chip processing and using four sorting drive mechanisms for chip sorting, the problem of inefficiency of existing equipment is solved and efficient chip sorting and processing is achieved.
Patent Information
- Application Number
- CN202421674221.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-16
AI Technical Summary
Existing chip sorting equipment usually only has one load-bearing device, which leads to inefficient chip sorting efficiency and seriously affects working efficiency.
An automatic sorting device for LED chip processing is designed, including four sorting driving mechanisms. The chip is placed on different sorting driving mechanisms through the feeding mechanism, and driven and transmitted through the sorting driving mechanism to realize simultaneous sorting of multiple chips.
By setting up four sorting drive mechanisms, multiple chips can be processed simultaneously, which improves sorting efficiency, reduces working time, and improves overall work efficiency.
Smart Images
Figure CN223011213U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip sorting equipment, in particular to an automatic sorting equipment for LED chip processing. Background Art
[0002] The so-called chip sorting is a process of classifying and sorting chips according to certain rules and requirements. Some of the main parameters involved include resistance, capacitance, inductance, frequency, temperature, etc. The purpose of chip sorting is to ensure the stability of chip performance and quality, improve chip production, reduce the rejection rate and cost, and at the same time meet customer requirements.
[0003] At present, the existing sorting equipment generally only has one loading device. After placing the chip on the loading device, it is necessary to move the chip before sorting the next chip, which seriously affects work efficiency. Summary of the Utility Model
[0004] In view of this, the utility model discloses an automatic sorting equipment for LED chip processing, which can improve sorting efficiency.
[0005] The utility model discloses an automatic sorting equipment for LED chip processing, including a sorting platform, on which a fixture mechanism, a feeding mechanism, a sorting driving mechanism, a discharging mechanism and a discharging transmission mechanism are arranged. Among them,
[0006] The sorting driving mechanism is located between the fixture mechanism and the discharging transmission mechanism in the X-axis direction. The feeding mechanism is used to move the chip to the sorting driving mechanism, and the discharging mechanism is used to move the chip on the sorting driving mechanism to the discharging transmission mechanism;
[0007] The number of the sorting driving mechanisms is four, and the four sorting driving mechanisms are arranged in an array in the Y-axis direction. The feeding mechanism can place different chips on different sorting driving mechanisms respectively.
[0008] Further, the fixture mechanism includes a placing component and a fixture plate. The placing component includes a placing plate, on which an adsorbing member is arranged. The fixture plate is adsorbed on the placing plate through the adsorbing member; a plurality of chip placing grooves are arranged on the fixture plate; the feeding mechanism grabs the chip in the chip placing groove.
[0009] Further, the feeding mechanism includes a feeding support, a first slide table, a second slide table, a third slide table, and a grasping assembly. The feeding support is fixed to the sorting platform. The first slide table is installed on the feeding support. The first slide table can drive the second slide table to move in the Y-axis direction. The second slide table can drive the third slide table to move in the X-axis direction. The third slide table is used to drive the grasping assembly to move in the Z-axis direction. The grasping assembly is located above the placement tray and is used to grasp the chips on the placement tray.
[0010] Further, the grasping assembly includes a grasping support. The grasping support is connected to the output end of the third slide table. A plurality of first vacuum suction heads are arranged on the grasping support. The first vacuum suction heads are used to grasp the chips.
[0011] Further, the four sorting driving mechanisms are installed above the sorting platform through a support frame. The sorting driving mechanism includes a fourth slide table and a sorting support plate. The sorting support plate is placed at the output end of the fourth slide table. The fourth slide table can drive the sorting support plate to move in the X-axis direction. The feeding mechanism is used to place the chips on the sorting support plates of different sorting driving mechanisms.
[0012] Further, the discharging mechanism includes a fifth slide table, a sixth slide table, a seventh slide table, and a discharging assembly. The fifth slide table is fixed above the sorting platform through a discharging support. The fifth slide table can drive the sixth slide table to move in the Y-axis direction. The sixth slide table can drive the seventh slide table to move in the X-axis direction. When the sorting support plate moves to the discharging transmission mechanism, the discharging transmission mechanism performs discharging transmission on the sorting support plate.
[0013] Further, the discharging assembly includes a double-acting cylinder. The two output shafts of the double-acting cylinder are respectively connected to clamping jaws. The double-acting cylinder drives the two clamping jaws to move towards or away from each other to clamp or release the sorting support plate.
[0014] Further, the discharging transmission mechanism includes a transmission support, a driving device, and a driving belt. The transmission support is fixed to the sorting platform. The driving belt is arranged inside the transmission support and is rotationally matched with the transmission support through a pulley. The driving belt is connected to a placement plate and drives the placement plate to move in the X-axis direction. The placement plate is used to place the sorting support plate.
[0015] Further, the number of the discharging transmission mechanisms is multiple. The multiple discharging transmission mechanisms work independently and are arranged in an array along the Y-axis direction.
[0016] The technical solution disclosed by the present utility model, compared with the prior art, has the beneficial effects that:
[0017] By setting four sorting driving mechanisms, the feeding mechanism can place different sorted chips on different said sorting driving mechanisms, and drive and transmit them through different sorting driving mechanisms, without affecting the continuous operation of the feeding mechanism, and can improve work efficiency. Brief Description of the Drawings
[0018] Figure 1 It is a schematic structural diagram of an automatic sorting device;
[0019] Figure 2 It is a schematic structural diagram of a fixture mechanism;
[0020] Figure 3 It is a schematic structural diagram of a feeding mechanism;
[0021] Figure 4 It is a schematic structural diagram of a grasping component;
[0022] Figure 5 It is a schematic structural diagram of a sorting driving mechanism and a blanking mechanism;
[0023] Figure 6 It is a schematic structural diagram of a blanking component;
[0024] Figure 7 It is a schematic structural diagram of a blanking transmission mechanism. Detailed Embodiments
[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or there may be an intermediate component at the same time. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. It should also be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.
[0026] It should also be noted that in the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0027] As Figure 1 shown, the present utility model discloses an automatic sorting device 100 for LED chip processing, including a sorting platform 10. A fixture mechanism 20, a feeding mechanism 30, a sorting driving mechanism 40, a discharging mechanism 50 and a discharging transmission mechanism 60 are arranged on the sorting platform 10. Among them, the fixture mechanism 20 is used to carry the chips to be sorted, the feeding mechanism 30 is used to move the chips to the sorting driving mechanism 40, the sorting driving mechanism 40 is used to move the chips to a preset passing position, and the discharging mechanism 50 moves the chips at the preset position to the discharging transmission mechanism 60 for discharging.
[0028] Furthermore, the sorting driving mechanism 40 is located between the fixture mechanism 20 and the discharging transmission mechanism 60. The feeding mechanism 30 is used to move the chips to the sorting driving mechanism 40, and the discharging mechanism 50 is used to move the chips on the sorting driving mechanism 40 to the discharging transmission mechanism 60. Along the X-axis direction, the fixture mechanism 20, the sorting driving mechanism 40 and the discharging transmission mechanism 60 are sequentially arranged on the sorting platform 10. The feeding mechanism 30 and the discharging mechanism 50 are used to grab the chips, and the feeding mechanism 30 and the discharging mechanism 50 are located directly above the sorting platform 10.
[0029] As Figure 2 shown, specifically, the fixture mechanism 20 includes a placement component 21 and a fixture plate 22. The placement component 211 includes a placement plate 21, and an adsorbing member is arranged on the placement plate 21. The fixture plate 22 is adsorbed on the placement plate 211 through the adsorbing member; a plurality of chip placement grooves 221 are arranged on the fixture plate 2. The feeding mechanism 30 grabs the chips in the chip placement grooves 221. In this application, the fixture plate 22 for placing the chips is placed on the placement plate 211. The placement positions of the chips on the fixture plate 22 are identified on other mechanisms, and the position information has been transmitted to the feeding mechanism 30. The feeding mechanism 30 is used to grab the corresponding chips from the corresponding placement grooves 221 of the fixture plate 22 and move them to the sorting driving mechanism 40.
[0030] As Figure 3 shown, the loading mechanism 30 includes a loading bracket 31, a first slide 32, a second slide 33, a third slide 34, and a grasping component 35. The loading bracket 31 is fixed to the sorting platform 10. The first slide 32 is installed on the loading bracket 31. The first slide 32 can drive the second slide 33 to move in the Y-axis direction. The second slide 33 can drive the third slide 34 to move in the X-axis direction. The third slide 34 is used to drive the grasping component 35 to move in the Z-axis direction. The grasping component 35 is located above the placement tray 211 and is used to grasp chips on the placement tray 211. Specifically, the loading mechanism 30 can drive the grasping component 35 within a certain space range through the first slide 32, the second slide 33, and the third slide 34, so that the grasping component 35 can grasp chips on the jig tray 22 and move them to the sorting driving mechanism 40.
[0031] In this application, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other in pairs.
[0032] As Figure 3 and Figure 4 shown, further, the grasping component 35 includes a grasping bracket 351. The grasping bracket 352 is connected to the output end of the third slide 34. A plurality of first vacuum suction heads 352 are arranged on the grasping bracket 351. The first vacuum suction heads 352 are used to grasp the chips. The grasping component 35 can grasp a plurality of the chips at one time through the first vacuum suction heads 352.
[0033] As Figure 5 shown, further, the number of the sorting driving mechanisms 40 is four. The four sorting driving mechanisms 40 are arranged in an array in the Y-axis direction. The loading mechanism 30 can place different chips on different sorting driving mechanisms 40 respectively. Specifically, the four sorting driving mechanisms 40 are installed above the sorting platform 10 through a support frame 42. The sorting driving mechanism 40 includes a fourth slide 41 and a sorting support plate 43. The sorting support plate 43 is placed at the output end of the fourth slide 41. The fourth slide 4 can drive the sorting support plate 43 to move in the X-axis direction. The loading mechanism 30 is used to place chips on the sorting support plates 40 of different sorting driving mechanisms 40. In this application, by setting four sorting driving mechanisms 40, they can be respectively used to carry different chips.
[0034] In the present application, a horizontally placed plate member may be provided at the output end of the fourth slide table 41, and the sorting support plate 43 may be placed on this plate member. Specifically, an adsorbing member may be provided on the plate member, and the sorting support plate 43 may be adsorbed on the plate member through the adsorbing member.
[0035] As Figure 5 and Figure 6 shown, further, the blanking mechanism 50 includes a fifth slide table 52, a sixth slide table 53, a seventh slide table 54, and a blanking assembly 55. The fifth slide table 52 is fixed above the sorting platform 10 through a blanking support 51. The fifth slide table 52 drives the sixth slide table 53 to move in the Y-axis direction, and the sixth slide table 53 can drive the seventh slide table 54 to move in the X-axis direction. The sorting support plate 43 moves to the blanking transmission mechanism 60, and the blanking transmission mechanism 60 performs blanking transmission on the sorting support plate 43. In the present application, the blanking mechanism 50 can drive the blanking assembly 55 to move within a certain spatial range through the fifth slide table 52, the sixth slide table 53, and the seventh slide table 54, and can move the sorting support plate 43 on which the chips are placed to the blanking transmission mechanism 60. In the present application, the driving force of the blanking mechanism 50 is greater than the adsorption force of the adsorbing member on the sorting support plate 43.
[0036] Further, the blanking assembly 55 includes a double-acting cylinder 551. Two output shafts of the double-acting cylinder 551 are respectively connected to clamping jaws 552. The double-acting cylinder 551 drives the two clamping jaws 552 to move in a direction close to or away from each other to clamp or release the sorting support plate 43.
[0037] As Figure 7 shown, the blanking transmission mechanism 60 includes a transmission support 61, a driving device, and a driving belt 62. The transmission support 61 is fixed to the sorting platform 10. The driving belt 62 is arranged inside the transmission support 61 and is rotationally matched with the transmission support 61 through a pulley 63. The driving belt 62 is connected to a placement plate and drives the placement plate to move in the X-axis direction; the placement plate is used to place the sorting support plate 43.
[0038] The number of the blanking transmission mechanisms 60 is multiple. The multiple blanking transmission mechanisms 60 work independently and are arranged in an array along the Y-axis direction. The blanking transmission mechanisms 60 can correspond one-to-one with the blanking driving mechanisms 40 and are used to respectively transmit the sorting support plates 43 carrying different chips.
[0039] Without departing from the broad spirit and scope of the present utility model, it can be set into various embodiments and deformations. The above embodiments are used to illustrate the utility model, but do not limit the scope of the present utility model.
Claims
1. An automatic sorting device for LED chip processing, characterized in that: It includes a sorting platform, on which a fixture mechanism, a feeding mechanism, a sorting drive mechanism, a feeding mechanism and a feeding transmission mechanism are arranged, wherein: The sorting drive mechanism is located between the fixture mechanism and the unloading transmission mechanism in the X-axis direction, the loading mechanism is used to move the chip to the sorting drive mechanism, and the unloading mechanism is used to move the chip on the sorting drive mechanism to the unloading transmission mechanism; There are four sorting drive mechanisms, which are arranged in an array in the Y-axis direction. The loading mechanism can place different chips on different sorting drive mechanisms.
2. The automatic sorting equipment for LED chip processing according to claim 1, characterized in that: The fixture mechanism includes a placement component and a fixture tray, the placement component includes a placement tray, the placement tray is provided with an adsorption component, and the fixture tray is adsorbed on the placement tray through the adsorption component; the fixture tray is provided with a plurality of chip placement slots; the loading mechanism grabs the chip in the chip placement slot.
3. The automatic sorting equipment for LED chip processing according to claim 2, characterized in that: The loading mechanism includes a loading bracket, a first slide, a second slide, a third slide and a grabbing assembly. The loading bracket is fixed to the sorting platform, the first slide is installed on the loading bracket, the first slide can drive the second slide to move in the Y-axis direction, the second slide can drive the third slide to move in the X-axis direction, the third slide is used to drive the grabbing assembly to move in the Z-axis direction, and the grabbing assembly is located above the placement tray and is used to grab chips on the placement tray.
4. The automatic sorting equipment for LED chip processing according to claim 3, characterized in that: The grabbing assembly includes a grabbing bracket, the grabbing bracket is connected to the output end of the third slide, and a plurality of first vacuum adsorption heads are arranged on the grabbing bracket, and the first vacuum adsorption heads are used to grab the chip.
5. The automatic sorting equipment for LED chip processing according to claim 1, characterized in that: The four sorting drive mechanisms are installed above the sorting platform through a support frame, and the sorting drive mechanism includes a fourth slide and a sorting support plate. The sorting support plate is placed at the output end of the fourth slide, and the fourth slide can drive the sorting support plate to move in the X-axis direction; the loading mechanism is used to place the chips on the sorting support plates of different sorting drive mechanisms.
6. The automatic sorting equipment for LED chip processing according to claim 5, characterized in that: The unloading mechanism includes a fifth slide, a sixth slide, a seventh slide and an unloading assembly. The fifth slide is fixed above the sorting platform through an unloading bracket. The fifth slide drives the sixth slide to move in the Y-axis direction. The sixth slide can drive the seventh slide to move in the X-axis direction. The sorting support plate moves to the unloading transmission mechanism, and the sorting support plate is unloaded and transmitted through the unloading transmission mechanism.
7. The automatic sorting equipment for LED chip processing according to claim 6, characterized in that: The unloading assembly comprises a bidirectional cylinder, two output shafts of which are respectively connected to clamping jaws, and the bidirectional cylinder drives the two clamping jaws to move towards or away from each other to clamp or release the sorting support plate.
8. The automatic sorting equipment for LED chip processing according to claim 5, characterized in that: The unloading transmission mechanism includes a transmission bracket, a driving device and a driving belt. The transmission bracket is fixed to the sorting platform. The driving belt is arranged inside the transmission bracket and rotates with the transmission bracket through a pulley. The driving belt is connected to the placement plate and drives the placement plate to move along the X-axis direction; the placement plate is used to place the sorting support plate.
9. The automatic sorting equipment for LED chip processing according to claim 8, characterized in that: There are multiple material unloading and conveying mechanisms, and the multiple material unloading and conveying mechanisms work independently and are distributed in an array along the Y-axis direction.