Wafer cutting ring cleaning device

Abstract

The utility model relates to a wafer cutting ring cleaning device which comprises a placing platform and a cleaning assembly, and is characterized in that the cleaning assembly comprises a driving mechanism, a reciprocating rod, a support, a sliding part, a pipeline and a cleaning mechanism, the sliding part is connected with the reciprocating rod and arranged on guide rails of the support, and the two guide rails are arranged in the length direction of the placing platform; the reciprocating rod is connected with the driving mechanism, the reciprocating rod is parallel to the guide rail, the driving mechanism drives the reciprocating rod to reciprocate, the cleaning mechanism is connected with the sliding part and comprises a cleaning part, a connecting rod and a supporting rod, one end of the connecting rod is connected with the cleaning part, the other end of the connecting rod is connected with the reciprocating rod, and the cleaning part faces the placing platform and communicates with the pipeline; cleaning liquid is conveyed to the cleaning part through a pipeline, the supporting rod penetrates through the connecting rod, and the two ends of the supporting rod are connected with the two sliding parts. A plurality of workpieces can be placed on the platform, the workpieces are cleaned repeatedly, and the cleaning effect and efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting ring processing equipment, in particular to a wafer cutting ring cleaning device. Background Art

[0002] A wafer cutting ring refers to a device used in the process of wafer cutting. It helps to keep the wafer stable during the cutting process and prevent it from being damaged due to vibration and impact during the cutting process. During the processing of the wafer cutting ring, processes such as grinding are carried out, and debris will remain on the surface, so cleaning is required. For example, the patent with the publication number CN117427926A discloses a wafer bonding ring cleaning device and method, a wafer cutting device and method. The wiping part adsorbs a cleaning solvent, and the wiping part is in extrusion contact with the wafer bonding ring; a moving unit is used to make a relative extrusion movement between the wiping part and the wafer bonding ring, so that the wiping part releases the cleaning solvent to the wafer bonding ring, and then wipes the wafer bonding ring. The above technical solution discloses a cleaning method by brushing. However, it uses a relative rotation method between the wafer bonding ring and the wiping part. When processing the wafer bonding ring, if multiple wafers need to be cleaned synchronously, it is difficult to rotate and wipe synchronously, and the single wafer rotation wiping efficiency is low. Summary of the Utility Model

[0003] In order to solve the problems of the prior art, the utility model provides a wafer cutting ring cleaning device that can perform repeated cleaning and can clean multiple workpieces synchronously.

[0004] The specific technical solution is as follows: A wafer cutting ring cleaning device includes a placement platform and a cleaning assembly. It is characterized in that the cleaning assembly includes a driving mechanism, a reciprocating rod, a bracket, a sliding part, a pipeline and a cleaning mechanism. The sliding part is connected to the reciprocating rod and is arranged on the guide rail of the bracket. The two guide rails are arranged along the length direction of the placement platform. The reciprocating rod is connected to the driving mechanism and is arranged parallel to the guide rail. The driving mechanism drives the reciprocating rod to reciprocate. The cleaning mechanism is connected to the sliding part. The cleaning mechanism includes a cleaning part, a connecting rod and a support rod. One end of the connecting rod is connected to the cleaning part, and the other end is connected to the reciprocating rod. The cleaning part faces the placement platform and is communicated with the pipeline. The cleaning liquid is conveyed to the cleaning part through the pipeline. The support rod passes through the connecting rod, and both ends of the support rod are connected to the two sliding parts.

[0005] In some embodiments, the driving mechanism includes a motor, a driving gear and a transmission gear. The motor is connected to the driving gear, the transmission gear is meshed with the driving gear, the rotating shaft of the transmission gear is arranged on the bracket, the transmission gear and the driving gear are arranged vertically, and the reciprocating rod is eccentrically connected to the transmission gear.

[0006] In some embodiments, the sliding part is provided with a clamping groove, and the support rod is arranged in the clamping groove.

[0007] In some embodiments, the connecting rod includes a fixed rod and an adjusting rod. The adjusting rod is inserted into the fixed rod and locked by a locking assembly.

[0008] In some embodiments, a connecting seat is provided at the lower end of the adjusting rod, and the connecting seat is threadedly connected to the cleaning part.

[0009] In some embodiments, a spring is provided between the connecting seat and the cleaning part. The spring is arranged in the accommodating cavity of the connecting seat, and the spring presses against the adjusting rod and the cleaning part.

[0010] In some embodiments, the cleaning part includes a cleaning brush, and the cleaning brush is connected to the connecting seat.

[0011] In some embodiments, there are two groups of cleaning assemblies, and the two groups of cleaning assemblies are arranged vertically opposite to each other.

[0012] Technical effects of the present utility model: A wafer cutting ring cleaning device of the present utility model can place multiple workpieces on the platform, clean the workpieces repeatedly, and improve the cleaning effect and efficiency. Description of the Drawings

[0013] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 is a schematic diagram of a wafer cutting ring cleaning device according to an embodiment of the present utility model.

[0015] Figure 2 is a schematic diagram of the cleaning mechanism according to an embodiment of the present utility model.

[0016] Figure 3 is a schematic diagram of the connecting rod according to an embodiment of the present utility model.

[0017] Figure 4 is a schematic diagram of a wafer cutting ring cleaning device according to another embodiment of the present utility model. Detailed Embodiments

[0018] The following will clearly and completely describe the technical solutions of the present utility model with reference to the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.

[0019] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0021] The following will describe in detail the specific embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present utility model and are not used to limit the present utility model.

[0022] As Figures 1 to 4As shown in the figure, a wafer cutting ring cleaning device according to this embodiment includes a placement platform 1 and a cleaning assembly 2. The cleaning assembly 2 includes a driving mechanism 3, a reciprocating rod 4, a bracket 5, a sliding part 6, a pipeline 7 and a cleaning mechanism 8. The sliding part 6 is connected to the reciprocating rod 4 and is arranged on the guide rails 51 of the bracket 5. The two guide rails 51 are arranged along the length direction of the placement platform 1. The reciprocating rod 4 is connected to the driving mechanism 3 and is arranged parallel to the guide rails 51. The driving mechanism 3 drives the reciprocating rod 4 to reciprocate. The cleaning mechanism 8 is connected to the sliding part 6, and the sliding part 6 drives the cleaning mechanism 8 to reciprocate. The cleaning mechanism 8 includes a cleaning part 81, a connecting rod 82 and a support rod 83. One end of the connecting rod 82 is connected to the cleaning part 81, and the other end is connected to the reciprocating rod 4. The cleaning part 81 faces the placement platform 1 and is communicated with the pipeline 7. The pipeline 7 is connected to a liquid supply device 9, and the liquid supply device 9 can adopt existing devices such as a water pump and a water tank. The cleaning liquid is conveyed to the cleaning part 81 through the pipeline 7. The support rod 83 passes through the connecting rod 82, and both ends of the support rod 83 are connected to the two sliding parts 6. In the above technical solution, the wafer cutting rings 10 are placed on the placement platform 1, and multiple cutting rings can be placed adjacent to each other, so that multiple cutting rings can be cleaned synchronously. The driving mechanism 3 drives the reciprocating rod 4 to move, so that the sliding part 6 can drive the cleaning mechanism 8 to reciprocate, so that the cleaning part 81 can repeatedly clean the wafer cutting rings 10. By setting the support rod 83, the cleaning part 81 can be stably supported between the two sliding parts 6, making the movement smoother. The pipeline 7 can continuously supply the cleaning liquid for flushing and cleaning, improving the cleaning effect. Through the above technical solution, multiple workpieces can be placed on the platform, and the workpieces can be repeatedly cleaned, improving the cleaning effect and efficiency.

[0023] In this embodiment, the driving mechanism 3 includes a motor 31, a driving gear 32, and a transmission gear 33. The motor 31 is connected to the driving gear 32, the transmission gear 33 meshes with the driving gear 32, the rotating shaft 331 of the transmission gear 33 is arranged on the bracket 5, the transmission gear 33 and the driving gear 32 are vertically arranged, and the reciprocating rod 4 is eccentrically connected to the transmission gear 33. In the above technical solution, the motor 31 drives the driving gear 32 to rotate, thereby driving the transmission gear 33 to rotate. One end of the reciprocating rod 4 is eccentrically connected to the transmission gear 33 through a shaft rod 41, so that the reciprocating rod 4 can be driven by the transmission gear 33 to reciprocate. In this embodiment, the driving gear and the transmission gear are driven by bevel gears. The sliding part 6 is provided with a clamping groove 61, and the support rod 83 is arranged in the clamping groove 61, which is convenient for the connection between the support rod 83 and the sliding part 6. The connecting rod 82 includes a fixed rod 821 and an adjusting rod 822. The adjusting rod 822 is inserted into the fixed rod 821 and locked by a locking assembly 20. The adjusting rod 822 can be locked or released by the locking assembly 20. When the thickness of the workpiece changes, the adjusting rod 822 can slide relative to the fixed rod 821, so as to adjust the height of the cleaning part 81. The locking assembly 20 includes a bolt 201 and a nut 202. The bolt passes through a plurality of adjusting holes 823 on the adjusting rod 822 and is locked or released by the nut 202. The lower end of the adjusting rod 822 is provided with a connecting seat 824, and the connecting seat 824 is threadedly connected to the cleaning part 81, which is convenient for the assembly and disassembly of the cleaning part 81. A spring 825 is arranged between the connecting seat 824 and the cleaning part 81. The spring 825 is arranged in the accommodating cavity of the connecting seat 824. The spring 825 presses against the adjusting rod and the cleaning part 81, so that during cleaning, the cleaning part 81 can be pressed tightly against the surface of the workpiece. The cleaning part 81 includes a cleaning brush 811. The cleaning brush 811 is connected to the connecting seat 824. The workpiece can be brushed by the cleaning brush 811. Through holes 812 can be opened in the cleaning brush 811 to communicate with the pipeline 7, so that the cleaning liquid can flow out through the through holes 812 to the surface of the workpiece, so as to wash while brushing.

[0024] As an improvement, there are two groups of cleaning assemblies 2 in this embodiment. The two groups of cleaning assemblies 2 are arranged up and down opposite to each other. During use, the workpiece 10 can be clamped by existing fixtures such as a robotic arm, and the upper and lower surfaces can be synchronously cleaned by the upper and lower two groups of cleaning assemblies 2, realizing synchronous cleaning of two surfaces.

[0025] A wafer cutting ring cleaning device in this embodiment can place multiple workpieces on a platform, clean the workpieces repeatedly, and improve the cleaning effect and efficiency.

[0026] The above describes a wafer cutting ring cleaning device of the present invention. However, the present invention is not limited to the above specific embodiments. As long as it does not deviate from the scope of the claims, various deformations or changes can be made. The present invention includes various deformations and changes within the scope of the claims.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer cutting ring cleaning device, comprising a placement platform and a cleaning component, characterized in that: The cleaning assembly includes a driving mechanism, a reciprocating rod, a bracket, a sliding part, a pipeline and a cleaning mechanism. The sliding part is connected to the reciprocating rod, and the sliding part is arranged on the guide rail of the bracket. The two guide rails are arranged along the length direction of the placement platform. The reciprocating rod is connected to the driving mechanism. The reciprocating rod is arranged parallel to the guide rail. The driving mechanism drives the reciprocating rod to reciprocate. The cleaning mechanism is connected to the sliding part. The cleaning mechanism includes a cleaning part, a connecting rod and a support rod. One end of the connecting rod is connected to the cleaning part, and the other end is connected to the reciprocating rod. The cleaning part faces the placement platform, the cleaning part is connected to the pipeline, and the cleaning liquid is transported to the cleaning part through the pipeline. The support rod passes through the connecting rod, and both ends of the support rod are connected to the two sliding parts.

2. The wafer cutting ring cleaning device according to claim 1, characterized in that: The driving mechanism includes a motor, a driving gear and a transmission gear. The motor is connected to the driving gear, the transmission gear is meshed with the driving gear, the rotating shaft of the transmission gear is arranged on the bracket, the transmission gear and the driving gear are arranged vertically, and the reciprocating rod is eccentrically connected to the transmission gear.

3. The wafer cutting ring cleaning device according to claim 2, characterized in that: The sliding part is provided with a slot, and the support rod is arranged in the slot.

4. The wafer cutting ring cleaning device according to claim 1, characterized in that: The connecting rod comprises a fixed rod and an adjusting rod, wherein the adjusting rod is inserted into the fixed rod and locked by a locking assembly.

5. The wafer cutting ring cleaning device according to claim 4, characterized in that: A connecting seat is provided at the lower end of the adjusting rod, and the connecting seat is threadedly connected to the cleaning part.

6. The wafer cutting ring cleaning device according to claim 5, characterized in that: A spring is provided between the connecting seat and the cleaning portion. The spring is arranged in the accommodating cavity of the connecting seat, and the spring presses the adjusting rod and the cleaning portion.

7. The wafer cutting ring cleaning device according to claim 6, characterized in that: The cleaning part comprises a cleaning brush, and the cleaning brush is connected to the connecting seat.

8. The wafer cutting ring cleaning device according to any one of claims 1 to 7, characterized in that: There are two groups of cleaning components, and the two groups of cleaning components are arranged opposite to each other up and down.

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