Silicon wafer cutting device for solar cell processing

Abstract

The utility model discloses a silicon wafer cutting device for solar cell processing, and relates to the technical field of solar cell production. The device comprises a workbench, a pushing mechanism is installed above the workbench, the pushing mechanism comprises a vertical plate, the outer wall of the vertical plate is fixedly connected with an electric push rod, one end of the electric push rod is fixedly connected with a placing plate, the bottom of the placing plate is in sliding connection with the outer wall of the workbench, and an inserting rod is connected to the upper portion of the placing plate in a buckled mode. Through the arrangement of the electric push rod, the placing plate, the pressing plate, the inserting rod and the bolt, a silicon wafer is placed on the placing plate, then the pressing plate is pushed to move, the pressing plate moves to drive the inserting rod to move, and when the inserting rod is clamped into the placing plate, the bolt is rotated to rotate on the pressing plate and enter the placing plate to enable the pressing plate to clamp and fix the silicon wafer. Manual pressing is avoided, after fixing is completed, an electric push rod pushes a containing plate to move, and the containing plate moves on a sliding groove to cut the bottom of the mechanism for machining.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar cell production, and particularly relates to a silicon wafer cutting device for solar cell processing. Background Technique

[0002] Solar energy refers to the thermal radiation energy of the sun, and its main manifestation is the commonly said sunlight. In modern times, it is generally used for power generation or providing energy for water heaters. Since the birth of life on earth, it has mainly survived on the thermal radiation energy provided by the sun. In the case of the decreasing fossil fuels, solar energy has become an important part of the energy used by humans and is constantly developing. The utilization of solar energy has two ways: photothermal conversion and photovoltaic conversion. Solar power generation is a new type of renewable energy. Existing solar cell wafers are composed of silicon wafers, and the silicon wafers are prepared into solar cell wafers after being cut.

[0003] In the existing cutting device, the silicon wafer is usually pressed manually and then cut, which has certain safety hazards.

[0004] Therefore, we provide a silicon wafer cutting device for solar cell processing to solve the above problems. Content of the Utility Model

[0005] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0006] The utility model is a silicon wafer cutting device for solar cell processing, including a workbench; a pushing mechanism is installed above the workbench. The pushing mechanism includes a vertical plate, an electric push rod is fixedly connected to the outer wall of the vertical plate, one end of the electric push rod is fixedly connected to a placement plate, and the bottom of the placement plate is slidably connected to the outer wall of the workbench. An insertion rod is snap-connected above the placement plate, the top end of the insertion rod is fixedly connected to a pressing plate, a bolt is threadedly connected to the outer wall of the pressing plate, and the end of the bolt extends into the placement plate, and the end of the vertical plate is fixedly connected above the workbench.

[0007] The utility model is further provided that a cutting mechanism is installed above the workbench. The cutting mechanism includes a group of support plates, a motor is installed on the outer wall of the right support plate, a threaded rod is fixedly connected to the power output end of the motor, a moving plate is threadedly connected to the outer wall of the threaded rod, a sliding rod is slidably connected to the inner wall of the moving plate, and both ends of the sliding rod are fixedly connected to the outer walls of a group of support plates. A laser machine is installed at the bottom of the moving plate, and the bottoms of a group of support plates are fixedly connected above the workbench.

[0008] The utility model is further provided that a chute adapted to the placement plate is opened on the outer wall of the workbench, and the bottom of the placement plate extends into the chute.

[0009] The present utility model is further configured such that a card slot adapted to the insertion rod is formed on the outer wall of the placement plate, and the end of the insertion rod is inserted into the card slot.

[0010] The present utility model is further configured such that threaded grooves adapted to the bolts are formed on the outer walls of the placement plate and the pressing plate.

[0011] The present utility model is further configured such that a rotating groove adapted to the threaded rod is formed on the outer wall of the left support plate, and one end of the threaded rod extends into the rotating groove.

[0012] The present utility model has the following beneficial effects:

[0013] 1. In the present utility model, through the provided electric push rod, placement plate, pressing plate, insertion rod and bolt, by placing the silicon wafer on the placement plate, then pushing the pressing plate to move, the movement of the pressing plate drives the insertion rod to move. When the insertion rod is inserted into the placement plate, then rotate the bolt to rotate on the pressing plate and enter the placement plate to clamp and fix the silicon wafer, avoiding manual pressing. After fixing, the electric push rod pushes the placement plate to move, and the placement plate moves on the sliding groove to the bottom of the cutting mechanism for processing.

[0014] 2. In the present utility model, through the provided motor, threaded rod, moving plate, sliding rod and laser machine, the motor drives the threaded rod to rotate, the threaded rod drives the moving plate to move, the moving plate restricts the moving direction of the moving plate by moving on the sliding rod, the moving plate drives the laser machine to move, and the laser machine moves to cut the silicon wafer.

[0015] Of course, it is not necessary for any product implementing the present utility model to achieve all the above advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present utility model.

[0018] Figure 2 It is an exploded structure schematic diagram of the present utility model.

[0019] Figure 3 It is a schematic diagram of the threaded rod structure of the present utility model.

[0020] In the drawings, the list of components represented by each reference numeral is as follows:

[0021] 1. Workbench; 101. Slide groove; 2. Cutting mechanism; 201. Support plate; 202. Motor; 203. Threaded rod; 204. Moving plate; 205. Slide bar; 206. Laser machine; 3. Pushing mechanism; 301. Vertical plate; 302. Electric push rod; 303. Placing plate; 304. Pressing plate; 305. Insert rod; 306. Bolt. Detailed implementation manner

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention. Specific embodiment

[0024] Please refer to Figures 1-3 , the present invention is a silicon wafer cutting device for solar cell processing, including a workbench 1; a pushing mechanism 3 is installed above the workbench 1. The pushing mechanism 3 includes a vertical plate 301. An electric push rod 302 is fixedly connected to the outer wall of the vertical plate 301. One end of the electric push rod 302 is fixedly connected to a placing plate 303. The bottom of the placing plate 303 is slidably connected to the outer wall of the workbench 1. An insert rod 305 is snap-connected above the placing plate 303. The top end of the insert rod 305 is fixedly connected to a pressing plate 304. A bolt 306 is threadedly connected to the outer wall of the pressing plate 304. The end of the bolt 306 extends into the placing plate 303. The end of the vertical plate 301 is fixedly connected above the workbench 1.

[0025] Specifically, by placing the silicon wafer on the placing plate 303, then pushing the pressing plate 304 to move. The movement of the pressing plate 304 drives the insert rod 305 to move. When the insert rod 305 is inserted into the placing plate 303, then rotate the bolt 306 to rotate on the pressing plate 304 and enter the placing plate 303 to make the pressing plate 304 clamp and fix the silicon wafer, avoiding manual pressing. After fixing, the electric push rod 302 pushes the placing plate 303 to move. The placing plate 303 moves to the bottom of the cutting mechanism 2 through the slide groove 101 for processing.

[0026] Furthermore, a slide groove 101 adapted to the placing plate 303 is opened on the outer wall of the workbench 1, and the bottom of the placing plate 303 extends into the slide groove 101.

[0027] Specifically, by opening a slide groove 101 adapted to the placing plate 303 on the outer wall of the workbench 1, it is convenient for the placing plate 303 to move on the workbench 1.

[0028] The outer wall of the placing plate 303 is provided with a clamping groove adapted to the inserting rod 305, and the end of the inserting rod 305 is inserted into the clamping groove.

[0029] Specifically, by providing a clamping groove adapted to the inserting rod 305 on the outer wall of the placing plate 303, it is convenient for the inserting rod 305 to be clamped into the placing plate 303.

[0030] The outer walls of both the placing plate 303 and the pressing plate 304 are provided with threaded grooves adapted to the bolts 306.

[0031] Specifically, by providing threaded grooves adapted to the bolts 306 on the outer walls of both the placing plate 303 and the pressing plate 304, it is convenient for the bolts 306 to rotate on the pressing plate 304 and enter the placing plate 303 to fix the pressing plate 304.

[0032] Such as Figures 1-3 As shown in the figure, a cutting mechanism 2 is installed above the workbench 1. The cutting mechanism 2 includes a group of support plates 201. A motor 202 is installed on the outer wall of the right support plate 201. The power output end of the motor 202 is fixedly connected to a threaded rod 203. A moving plate 204 is threadedly connected to the outer wall of the threaded rod 203. A sliding rod 205 is slidably connected to the inner wall of the moving plate 204, and both ends of the sliding rod 205 are fixedly connected to the outer walls of a group of support plates 201. A laser machine 206 is installed at the bottom of the moving plate 204, and the bottom of a group of support plates 201 is fixedly connected above the workbench 1.

[0033] Specifically, the motor 202 drives the threaded rod 203 to rotate. The threaded rod 203 drives the moving plate 204 to move. The moving plate 204 restricts the moving direction of the moving plate 204 by moving on the sliding rod 205. The moving plate 204 moves to drive the laser machine 206 to move, and the laser machine 206 moves to cut the silicon wafer.

[0034] Furthermore, a rotating groove adapted to the threaded rod 203 is provided on the outer wall of the left support plate 201, and one end of the threaded rod 203 extends into the rotating groove.

[0035] Specifically, by providing a rotating groove adapted to the threaded rod 203 on the outer wall of the left support plate 201, it is convenient for the threaded rod 203 to rotate on the support plate 201.

[0036] In the description of this specification, the description referring to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0037] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principle and practical application of the present utility model, so that those skilled in the relevant art can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A silicon wafer cutting device for processing solar cells, comprising a workbench (1); characterized in that: A pushing mechanism (3) is installed above the workbench (1), and the pushing mechanism (3) comprises a vertical plate (301), an electric push rod (302) is fixedly connected to the outer wall of the vertical plate (301), one end of the electric push rod (302) is fixedly connected to a placement plate (303), and the bottom of the placement plate (303) is slidably connected to the outer wall of the workbench (1), an insertion rod (305) is snap-connected to the top of the placement plate (303), and the top of the insertion rod (305) is fixedly connected to a pressure plate (304), the outer wall of the pressure plate (304) is threadedly connected to a bolt (306), and the end of the bolt (306) extends into the placement plate (303), and the end of the vertical plate (301) is fixedly connected to the top of the workbench (1).

2. The silicon wafer cutting device for solar cell processing according to claim 1, characterized in that: A cutting mechanism (2) is installed above the workbench (1), and the cutting mechanism (2) includes a group of support plates (201). A motor (202) is installed on the outer wall of the right support plate (201), and a threaded rod (203) is fixedly connected to the power output end of the motor (202). A movable plate (204) is threadedly connected to the outer wall of the threaded rod (203). A sliding rod (205) is slidably connected to the inner wall of the movable plate (204), and both ends of the sliding rod (205) are fixedly connected to the outer walls of the group of support plates (201). A laser machine (206) is installed at the bottom of the movable plate (204), and the bottom of the group of support plates (201) is fixedly connected to the top of the workbench (1).

3. The silicon wafer cutting device for solar cell processing according to claim 1, characterized in that: The outer wall of the workbench (1) is provided with a slide groove (101) adapted to the placement plate (303), and the bottom of the placement plate (303) extends into the slide groove (101).

4. The silicon wafer cutting device for solar cell processing according to claim 1, characterized in that: The outer wall of the placement plate (303) is provided with a slot adapted to the insertion rod (305), and the end of the insertion rod (305) is inserted into the slot.

5. The silicon wafer cutting device for solar cell processing according to claim 1, characterized in that: The outer walls of the placement plate (303) and the pressure plate (304) are both provided with thread grooves adapted to the bolts (306).

6. The silicon wafer cutting device for solar cell processing according to claim 2, characterized in that: A rotation groove matched with the threaded rod (203) is provided on the outer wall of the left support plate (201), and one end of the threaded rod (203) extends into the rotation groove.

Images