Punching die of semiconductor vehicle gauge grade silicon carbide power module

Abstract

The utility model relates to the technical field of punching die cover closing, and discloses a punching die of a semiconductor vehicle gauge grade silicon carbide power module, which comprises a template, a base plate, a fixed seat and a cover plate which are sequentially arranged from bottom to top, a product to be punched is placed between the fixed seat and the cover plate, and a movable reed clamped with the cover plate is hinged on the fixed seat. A first spring is connected between the movable reed and the fixed seat; the cover plate is connected with an elastic piece, and the other end of the elastic piece sequentially penetrates through the fixing base and the base plate and makes contact with the template. A movable reed clamped with a cover plate is hinged to a fixed seat, and a first spring is connected between the movable reed and the fixed seat; according to the punching die of the semiconductor vehicle gauge grade silicon carbide power module, the cover plate can be rapidly clamped through the movable reed, the cover plate can be conveniently popped out through the first spring, a to-be-punched product can be conveniently taken and placed, rapid covering of the cover plate is achieved, maintenance of the punching die is facilitated, and operation is safer.

Description

Technical Field

[0001] The utility model relates to the technical field of cover closing of punching dies, in particular to a punching die for semiconductor automotive-grade silicon carbide power modules. Background Art

[0002] In the prior art, during the punching preparation process of semiconductor automotive-grade silicon carbide power modules, a punching die is required to install and fix them. However, due to the split and fixed design of the cover plate, it is very inconvenient to maintain the die, unsafe to operate, and there are safety risks and other problems.

[0003] Therefore, how to provide a punching die for semiconductor automotive-grade silicon carbide power modules to achieve rapid cover closing of the cover plate and facilitate the maintenance of the punching die has become an urgent technical problem to be solved. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a punching die for semiconductor automotive-grade silicon carbide power modules to achieve rapid cover closing of the cover plate and facilitate the maintenance of the punching die.

[0005] To this end, according to the first aspect, an embodiment of the utility model discloses a punching die for semiconductor automotive-grade silicon carbide power modules, including: a template, a backing plate, a fixed seat, and a cover plate sequentially arranged in the up-and-down direction. A product to be punched is placed between the fixed seat and the cover plate. An active reed hinged to the fixed seat and clamped to the cover plate is provided on the fixed seat, and a first spring is connected between the active reed and the fixed seat; an elastic member is connected to the cover plate, and the other end of the elastic member sequentially passes through the fixed seat and the backing plate and contacts the template.

[0006] The utility model is further provided that a shock-absorbing block for damping the cover closing operation of the cover plate is installed on the fixed seat.

[0007] The utility model is further provided that the shock-absorbing block is made of an elastic material.

[0008] The utility model is further provided that the elastic member includes a positioning shaft sleeve fixedly connected to the template. An active rod is movably embedded in the positioning shaft sleeve. One end of the active rod is fixedly connected to the cover plate, and a second spring is sleeved on the active rod and abuts against the positioning shaft sleeve.

[0009] The utility model is further provided that the number of the active reeds and the first springs is set to four, and the four active reeds are clamped at the four corners of the cover plate.

[0010] The utility model is further provided that a clamping notch is provided on the cover plate, and a clamping portion that is clamped and matched with the clamping notch is provided on the active reed.

[0011] The present utility model is further configured such that one side of the movable reed is provided with a pressing portion which is inclined.

[0012] The present utility model is further configured such that the pressing portion and the movable reed are of an integrally formed structure.

[0013] The present utility model has the following beneficial effects: A movable reed hinged to a fixing seat and clamped with a cover plate is provided, and a first spring is connected between the movable reed and the fixing seat; an elastic member is connected to the cover plate, thereby providing a punching die for a semiconductor automotive-grade silicon carbide power module. The cover plate can be quickly clamped by the movable reed, and the first spring facilitates the ejection of the cover plate, which is convenient for taking and placing the product to be punched, realizes the quick closing of the cover plate, and is convenient for maintaining the punching die, and the operation is safer. Description of the Drawings

[0014] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0015] Figure 1 It is a three-dimensional structural schematic diagram of a punching die for a semiconductor automotive-grade silicon carbide power module disclosed in this embodiment;

[0016] Figure 2 It is a connection structural schematic diagram of a punching die for a semiconductor automotive-grade silicon carbide power module disclosed in this embodiment;

[0017] Figure 3 It is a structural schematic diagram of the movable reed in a punching die for a semiconductor automotive-grade silicon carbide power module disclosed in this embodiment.

[0018] Reference numerals: 1, template; 2, backing plate; 3, fixing seat; 4, cover plate; 41, clamping notch; 5, movable reed; 51, clamping portion; 52, pressing portion; 6, first spring; 7, shock-absorbing block; 8, positioning bushing; 9, movable rod; 10, second spring. Detailed Embodiments

[0019] In order to make the purpose, technical solutions and advantages of the present utility model more clear, the following further details the present utility model in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0020] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can also be the communication inside two components. It can be a wireless connection or a wired connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0021] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0022] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0023] An embodiment of the present utility model discloses a punching die for a semiconductor automotive-grade silicon carbide power module, as Figures 1 - 3 shown, including: a template 1, a backing plate 2, a fixed seat 3, and a cover plate 4 arranged in sequence from bottom to top. A product to be punched is placed between the fixed seat 3 and the cover plate 4. A movable latch 5 that is hinged to the fixed seat 3 and is clamped to the cover plate 4 is provided on the fixed seat 3. A first spring 6 is connected between the movable latch 5 and the fixed seat 3; an elastic member is connected to the cover plate 4, and the other end of the elastic member sequentially passes through the fixed seat 3 and the backing plate 2 and contacts the template 1.

[0024] It should be noted that by providing a movable latch 5 that is hinged to the fixed seat 3 and is clamped to the cover plate 4 on the fixed seat 3, and a first spring 6 is connected between the movable latch 5 and the fixed seat 3; an elastic member is connected to the cover plate 4, a punching die for a semiconductor automotive-grade silicon carbide power module is provided. The cover plate 4 can be quickly clamped by the movable latch 5, and the first spring 6 facilitates the ejection of the cover plate 4, facilitating the taking and placing of the product to be punched, realizing the quick closing of the cover plate 4, and facilitating the maintenance of the punching die, and the operation is safer.

[0025] As Figures 1 - 3As shown, a shock-absorbing block 7 for damping the closing operation of the cover plate 4 is installed on the fixed seat 3. It should be noted that through the setting of the shock-absorbing block 7, the closing operation of the cover plate 4 can be damped, enhancing the user's operation experience and ensuring the operation safety and service life of the device.

[0026] As Figures 1 - 3 shown, the shock-absorbing block 7 is made of an elastic material.

[0027] As Figures 1 - 3 shown, the elastic member includes a positioning bushing 8 fixedly connected to the template 1. An activity rod 9 is movably embedded in the positioning bushing 8. One end of the activity rod 9 is fixedly connected to the cover plate 4. A second spring 10 is sleeved on the activity rod 9, and the second spring 10 abuts against the positioning bushing 8. In the specific implementation process, the other end of the activity rod 9 is limited and movable within the positioning bushing 8.

[0028] It should be noted that when the cover plate 4 presses the punching product, by pressing the activity reed 5, the cover plate 4 moves away from the fixed seat 3 under the elastic force of the second spring 10, thereby realizing the rapid opening of the cover plate 4 and facilitating the taking and placing of the product to be punched.

[0029] As Figures 1 - 3 shown, the number of the activity reeds 5 and the first springs 6 is set to four, and the four activity reeds 5 are clamped at the four corners of the cover plate 4. It should be noted that through the setting of the four activity reeds 5, the connection stability between the cover plate 4 and the fixed seat 3 is improved.

[0030] As Figures 1 - 3 shown, the cover plate 4 is provided with a clamping notch 41, and the activity reed 5 is provided with a clamping portion 51 that is clamped and matched with the clamping notch 41. It should be noted that through the setting of the clamping portion 51 and the clamping notch 41, the activity reed 5 is clamped and matched with the cover plate 4, facilitating the fastening installation of the cover plate 4.

[0031] As Figure 3 shown, one side of the activity reed 5 is provided with an inclined pressing portion 52. It should be noted that through the setting of the pressing portion 52, it is convenient for the operator's finger to press the activity reed 5, so that the cover plate 4 is quickly ejected by the second spring 10.

[0032] As Figure 3 shown, the pressing portion 52 and the activity reed 5 are of an integrally formed structure.

[0033] In the specific implementation process, initially, under the clamping action of the activity reed 5, the cover plate 4 is locked on the fixed seat 3; by pressing the pressing portion 52 of the activity reed 5, the clamping portion 51 of the activity reed 5 is separated from the clamping notch 41 of the cover plate 4, and the cover plate 4 rises under the action of the second spring 10, and the cover plate 4 moves away from the fixed seat 3, facilitating the taking and placing of the product to be punched; since the first spring 6 plays a pulling role, it is convenient for the activity reed 5 to reset.

[0034] Working principle: A movable reed 5 that is hinged to a fixed seat 3 and is clamped to a cover plate 4 is provided. A first spring 6 is connected between the movable reed 5 and the fixed seat 3; an elastic member is connected to the cover plate 4, thereby providing a punching die for a semiconductor automotive-grade silicon carbide power module. The cover plate 4 can be quickly clamped by the movable reed 5, and the first spring 6 facilitates the ejection of the cover plate 4, facilitating the quick placement and removal of the product to be punched, realizing the quick closing of the cover plate 4, and facilitating the maintenance of the punching die, making the operation safer.

[0035] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present utility model.

Claims

1. A punching die for semiconductor automotive grade silicon carbide power module, characterized in that: include: A template (1), a backing plate (2), a fixed seat (3) and a cover plate (4) are arranged in sequence from bottom to top; a product to be punched is placed between the fixed seat (3) and the cover plate (4); a movable reed (5) is hingedly connected to the fixed seat (3) and is clamped to the cover plate (4); a first spring (6) is connected between the movable reed (5) and the fixed seat (3); An elastic member is connected to the cover plate (4), and the other end of the elastic member passes through the fixing seat (3) and the pad (2) in sequence and contacts the template (1).

2. The punching die for semiconductor automotive-grade silicon carbide power module according to claim 1, characterized in that: A shock absorbing block (7) for absorbing shock during the closing operation of the cover plate (4) is installed on the fixing seat (3).

3. The punching die for semiconductor automotive-grade silicon carbide power module according to claim 2, characterized in that: The shock absorbing block (7) is made of elastic material.

4. The punching die for semiconductor automotive-grade silicon carbide power module according to claim 1, characterized in that: The elastic member comprises a positioning sleeve (8) fixedly connected to the template (1), a movable rod (9) movably embedded in the positioning sleeve (8), one end of the movable rod (9) being fixedly connected to the cover plate (4), a second spring (10) being sleeved on the movable rod (9), and the second spring (10) being in contact with the positioning sleeve (8).

5. The punching die for semiconductor automotive-grade silicon carbide power module according to any one of claims 1 to 4, characterized in that: The number of the movable reed (5) and the first spring (6) is set to four, and the four movable reeds (5) are clamped at the four corners of the cover plate (4).

6. The punching die for semiconductor automotive-grade silicon carbide power module according to claim 5, characterized in that: The cover plate (4) is provided with a clamping notch (41), and the movable reed (5) is provided with a clamping portion (51) that is clamped and matched with the clamping notch (41).

7. The punching die for semiconductor automotive-grade silicon carbide power module according to claim 5, characterized in that: A pressing portion (52) is arranged in an inclined shape on one side of the movable reed (5).

8. The punching die for semiconductor automotive-grade silicon carbide power module according to claim 7, characterized in that: The pressing portion (52) and the movable reed (5) are an integrally formed structure.

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