Die structure
By setting protrusions in the non-mold sealing area of the mold to press and support the product, the problem of product warping during selective mold sealing is solved, which significantly reduces the amount of warping, improves product quality and reduces costs.
Patent Information
- Application Number
- CN202421696847.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-17
AI Technical Summary
During the selective die sealing process, the product is most susceptible to stress, resulting in failure of warping inspection and affecting the post-station assembly operation.
A mold structure is designed, including an upper mold and a lower mold. The upper mold is provided with convex parts in the non-mold sealing area to press and support the product in a position where the product is prone to warping to reduce warping.
By setting up convex parts in the non-mold sealing area, effectively pressing and supporting the product, the warping amount of the product is significantly reduced, the quality of the product is improved, and the cost of generating defective products and inspection is reduced.
Smart Images
Figure CN223013663U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a mold structure. Background Art
[0002] Refer to Figure 1 , in the product 1 of selective molding, there are generally holes and grooves 2 left between units as positioning mark points for bonding or cutting. However, according to experiments, it is found that the product 1 is most vulnerable to stress at this position, resulting in warping and failing the warping inspection. Figure 2 The warping schematic diagram of the leftmost part of the product 1 of the prior art is shown at a relatively exaggerated warping angle, where the product 1 will warp at the other end due to the pressure of the upper mold 3, causing the unit warping amount of the product 1 to exceed the specification (out of specification, OOS) (the specification is less than 20 μm). Figure 1 After the product 1 is cut, according to the warping measurement results of single-piece products 1, it shows that about 3% - 5% of the products 1 have a unit warping amount OOS, affecting the assembly operation of the subsequent station.
[0003]
[0004] Refer to Figure 3 , according to the distribution results of the unit warping amount of the product 1, the positions where the unit warping amount of the product 1 exceeds the specification are concentrated, concentrated in the left and right regions 5, 6 and the middle region 7 ( Figure 1 Figure 2 and Figure 2 in the product 1 ( the framed area, corresponding to the non-molded area).
[0005] It can be evaluated to use other molding compounds to improve the warping of the product 1, but replacing materials requires a large amount of time, manpower and material resources to verify the reliability. In addition, it is difficult to achieve the purpose of improving the unit warping amount of the product 1 only by replacing materials. Summary of the Utility Model
[0006] Aiming at the problems existing in the related art, the purpose of the utility model is to provide a mold structure to at least reduce the warping of the product.
[0007] To achieve the above purpose, the utility model provides a mold structure for shaping and fixing the product during molding, including: a lower mold for carrying the product; an upper mold including a molded area and a non-molded area, the upper mold having a body portion and a convex portion protruding from the body portion, the convex portion being located in the non-molded area, the top of the convex portion being used to contact the product and apply a downward pressure to the product, in the molded area, the body portion and the lower mold define a molding space for accommodating the molded layer of the product.
[0008] In some embodiments, in the bottom view, the width of the encapsulation region is greater than the width of the non-encapsulation region.
[0009] In some embodiments, in the bottom view, the area of the encapsulation region is greater than the area of the non-encapsulation region.
[0010] In some embodiments, in the bottom view, the encapsulation region has a plurality of grooves.
[0011] In some embodiments, the encapsulation space includes a plurality of different heights.
[0012] In some embodiments, the height of the encapsulation space is greater than the length of the convex portion.
[0013] In some embodiments, the projection of the convex portion and the body portion in the horizontal direction do not overlap.
[0014] In some embodiments, a plurality of convex portions arranged at intervals are provided in the non-encapsulation region between adjacent encapsulation regions.
[0015] In some embodiments, the upper mold includes a plurality of encapsulation regions and a plurality of non-encapsulation regions.
[0016] In some embodiments, the encapsulation regions and the non-encapsulation regions are strip-shaped regions.
[0017] In some embodiments, the plurality of encapsulation regions and the plurality of non-encapsulation regions are arranged alternately.
[0018] In some embodiments, the outermost side of the upper mold is a non-encapsulation region.
[0019] In some embodiments, the sides of the upper mold and the lower mold are aligned.
[0020] In some embodiments, the horizontal dimension of the product is smaller than the horizontal dimensions of the upper mold and the lower mold.
[0021] An embodiment of the present application further provides a mold structure for shaping and fixing a product during encapsulation, including: a lower mold for carrying the product; an upper mold, the product includes strip-shaped encapsulation regions and non-encapsulation regions, the upper mold has a body portion and strip-shaped convex portions protruding from the body portion, the top ends of the convex portions are used to contact the non-encapsulation regions of the product and apply a downward pressure to the non-encapsulation regions, and the portion of the body portion corresponding to the encapsulation region is recessed away from the lower mold and accommodates the encapsulation layer of the product.
[0022] In some embodiments, the product includes a plurality of non-encapsulation regions and a plurality of encapsulation regions located between adjacent non-encapsulation regions.
[0023] In some embodiments, the plurality of non-encapsulation regions have different lateral dimensions.
[0024] In some embodiments, the first non-encapsulated region has a first lateral dimension, the second non-encapsulated region has a second lateral dimension, the first lateral dimension is greater than the second lateral dimension, and the convex portion contacts the first non-encapsulated region.
[0025] In some embodiments, the plurality of encapsulated regions have the same lateral dimension.
[0026] In some embodiments, the recess of the body portion is conformal with the encapsulation layer of the product.
[0027] The beneficial technical effects of the present utility model are as follows:
[0028] In the embodiments of the present application, convex portions are provided in the non-encapsulated regions to press / support the product at positions where the product is prone to warping, thereby reducing the warping of the product. Description of the Drawings
[0029] Figure 1 Shows a selectively encapsulated product of the prior art.
[0030] Figure 2 Shows the warping schematic diagram of the leftmost part of the product of the prior art at Figure 1 in a relatively exaggerated warping angle.
[0031] Figure 3 Shows the distribution result of the unit warping amount of Product 1.
[0032] Figure 4 Shows the bottom view of the upper mold of the mold according to the embodiment of the present application.
[0033] Figure 5 Shows the cross-sectional view of the mold and the product according to the embodiment of the present application.
[0034] Figure 6 Shows the warping schematic diagram of the leftmost part of the embodiment of the present application at Figure 4 in a relatively exaggerated warping angle. Detailed Description of the Embodiments
[0035] To better understand the spirit of the embodiments of the present application, the following further describes some preferred embodiments of the present application.
[0036] The embodiments of the present application will be described in detail below. Throughout the specification of the present application, components that are the same or similar and have the same or similar functions are denoted by like reference numerals. The embodiments related to the drawings described herein are illustrative, diagrammatic, and are used to provide a basic understanding of the present application. The embodiments of the present application should not be construed as a limitation of the present application.
[0037] As used herein, the terms "substantially", "generally", "essentially" and "about" are used to describe and account for minor variations. When used in conjunction with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely as well as instances where the event or circumstance occurs very nearly.
[0038] In this specification, unless specifically stated or limited otherwise, relative terms, such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "upper", "lower", "top", "bottom", and derivatives thereof (e.g., "horizontally", "downwardly", "upwardly", etc.) should be construed to refer to the orientation described in the discussion or shown in the figures. These relative terms are for descriptive convenience only and do not require the application to be constructed or operated in a particular orientation.
[0039] For convenience of description, "first", "second", "third", etc. may be used herein to distinguish different components of one figure or a series of figures. "First", "second", "third", etc. are not intended to describe corresponding components.
[0040] Figure 4 The bottom view of the upper mold 20 of the mold 100 according to an embodiment of the present application is shown, where the number of the encapsulation areas 30 and the non-encapsulation areas 32 is not limited and can be changed with the change of the product 200. The encapsulation layer 202 of the product 200 is also shown to indicate the position of the encapsulation area 30. The part of the upper mold 20 for contacting the product 200 is indicated by other shading to make the figure clearer. Figure 5 The cross-sectional view of the mold 100 and the product 200 according to an embodiment of the present application is shown. Figure 6 An embodiment of the present application is shown in Figure 4Schematic diagram of the warping of the leftmost part, where the convex part 24 is used to press against the product 200 in the non-molding area 32, reducing the warping of the product 200. The part of the product 200 located to the left of the convex part 24 is cut off in the subsequent step of singulation. Therefore, even if there is warping in this part, it has no impact on the finished product. An embodiment of the present application provides a mold structure 100 for shaping and fixing the product 200 during molding, including: a lower mold 10 for carrying the product 200; an upper mold 20 including a molding area 30 and a non-molding area 32. The upper mold 20 has a body part 22 and a convex part 24 protruding from the body part 22. The convex part 24 is located in the non-molding area 32, and the top of the convex part 24 is used to contact the product 200 and apply a downward pressure to the product 200. In the molding area 30, the body part 22 and the lower mold 10 define a molding space 40, and the molding space 40 accommodates the molding layer 202 of the product 200. The embodiment of the present application provides a convex part 24 in the non-molding area 32 to press / support the product 200 at a position where the product 200 is more likely to warp, reducing the warping of the product 200.
[0041] In some embodiments, in a bottom view, the width of the molding area 30 is greater than the width of the non-molding area 32. In some embodiments, in a bottom view, the area of the molding area 30 is greater than the area of the non-molding area 32. In some embodiments, in a bottom view, the molding area 30 has a plurality of grooves 32 corresponding to the molding layer 202 of the product 200.
[0042] In some embodiments, the molding space 40 includes a plurality of different heights, and the shape of the molding space 40 can be adjusted according to the molding layer 202 of the product 200. In some embodiments, the height of the molding space 40 is greater than the length of the convex part 24. In some embodiments, the projection of the convex part 24 and the body part 22 in the horizontal direction do not overlap. In some embodiments, a plurality of convex parts 24 arranged at intervals are provided in the non-molding area 32 (such as the middle non-molding area 32) between adjacent molding areas 30. In some embodiments, these plurality of convex parts 24 can also be a single convex part 24 with a larger lateral area. In some embodiments, the upper mold 20 includes a plurality of molding areas 30 and a plurality of non-molding areas 32.
[0043] See Figure 5 In some embodiments, the molding area 30 and the non-molding area 32 are strip-shaped areas, and the convex part 24 is also a strip-shaped structure.
[0044] In some embodiments, a plurality of molding areas 30 and a plurality of non-molding areas 32 are arranged alternately. In some embodiments, the outermost side of the upper mold 20 is the non-molding area 32. In some embodiments, the sides of the upper mold 20 and the lower mold 10 are aligned. In some embodiments, the horizontal dimension of the product 200 is smaller than the horizontal dimensions of the upper mold 20 and the lower mold 10.
[0045] An embodiment of the present application further provides a mold structure 100 for shaping and fixing a product 200 during mold encapsulation, including: a lower mold 10 for carrying the product 200; an upper mold 20, the product 200 includes a strip-shaped mold encapsulation area 30 and a non-mold encapsulation area 32, the upper mold 20 has a body portion 22 and a strip-shaped convex portion 24 protruding from the body portion 22, and the top of the convex portion 24 is used to contact the non-mold encapsulation area 32 of the product 200 and apply a downward pressure to the non-mold encapsulation area 32. The portion of the body portion 22 corresponding to the mold encapsulation area 30 is recessed away from the lower mold 10 and accommodates the mold encapsulation layer 202 of the product 200. The upper mold 20 of the embodiment of the present application is provided with a convex portion 24 for pressing against the non-mold encapsulation area 32 of the product 200, reducing the warping of the product 200.
[0046] In some embodiments, the product 200 includes a plurality of non-mold encapsulation areas 32 and a plurality of mold encapsulation areas 30 located between adjacent non-mold encapsulation areas 32. In some embodiments, the plurality of non-mold encapsulation areas 32 have different transverse dimensions. In some embodiments, the first part of the non-mold encapsulation areas 32 has a first transverse dimension, the second part of the non-mold encapsulation areas 32 has a second transverse dimension, the first transverse dimension is greater than the second transverse dimension, and the convex portion 24 contacts the first part of the non-mold encapsulation areas 32. In some embodiments, the plurality of mold encapsulation areas 30 have the same transverse dimension. In some embodiments, the recess of the body portion 22 is conformal with the mold encapsulation layer 202 of the product 200.
[0047] The product 200 of the embodiment of the present application can be used for System In a Package (SIP), 5G, and the product 200 can be a selectively mold-encapsulated product.
[0048] The embodiment of the present application designs a convex portion 24 on the mold structure 100 to support and disperse the pressure of the non-mold encapsulation area 32 to achieve the purpose of improving the warping of the product 200, improving the OOS ratio of the unit warping amount after singulating the product 100 from 3% - 5% to 0%, thereby reducing the generation of defective products, saving the cost of inspection machines, saving the labor cost of inspection, reducing material waste, and the cost of handling defective products.
[0049] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A mold structure, used to shape and fix the product during mold sealing, characterized in that: include: A lower mold, used for carrying the product; The upper mold includes a molding area and a non-molding area. The upper mold has a main body and a convex portion protruding from the main body. The convex portion is located in the non-molding area. The top of the convex portion is used to contact the product and apply downward pressure to the product. In the molding area, the main body and the lower mold define a molding space, and the molding space accommodates the molding layer of the product.
2. The mold structure according to claim 1, characterized in that: When looking up at the upper mold, the width of the mold sealing area is greater than the width of the non-mold sealing area.
3. The mold structure according to claim 2, characterized in that: When looking up at the upper mold, the area of the mold sealing area is larger than the area of the non-mold sealing area.
4. The mold structure according to claim 1, characterized in that: When looking up at the upper mold, the mold sealing area has a plurality of grooves.
5. The mold structure according to claim 1, characterized in that: The mold enclosure space includes a plurality of different heights.
6. The mold structure according to claim 5, characterized in that: The height of the molding space is greater than the length of the protrusion.
7. The mold structure according to claim 1, characterized in that: The projections of the convex portion and the main body portion in the horizontal direction do not overlap.
8. The mold structure according to claim 1, characterized in that: A plurality of convex portions arranged at intervals from each other are provided in the non-molding area between adjacent molding areas.
9. The mold structure according to claim 1, characterized in that: The upper mold includes a plurality of the molding areas and a plurality of the non-molding areas.
10. A mold structure for shaping and fixing a product during mold sealing, characterized in that: include: A lower mold, used for carrying the product; An upper mold, the product includes a strip-shaped mold-sealing area and a non-mold-sealing area, the upper mold has a main body and a strip-shaped convex portion protruding from the main body, the top of the convex portion is used to contact the non-mold-sealing area of the product and apply downward pressure to the non-mold-sealing area, and the portion of the main body corresponding to the mold-sealing area is recessed in a direction away from the lower mold and accommodates the mold-sealing layer of the product.