Surface treatment device for wire body machining
By designing the structure of the circulating reaction solution and spoiler in the surface treatment device for inline processing, the problem of uneven reactions in the prior art is solved, and the quality and efficiency of the surface treatment of the linear body is improved.
Patent Information
- Application Number
- CN202421837294.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-30
AI Technical Summary
In the existing linear surface treatment methods, solute deposition is prone to occur during the reaction process, resulting in uneven reaction on the linear surface and affecting the processing quality.
A surface treatment device for linear processing is designed, including a reaction box, a central shaft, a reel and a spoiler. The device ensures that the reaction solution evenly contacts the surface of the line by forming a circulating reaction solution in the working chamber and installing a spoiler on the flow path of the reaction solution.
Through the design of circulating reaction solution and spoiler, the reaction rate of the linear surface and the solute uniformity of the reaction solution are improved, and the surface treatment quality of the linear surface is significantly improved.
Smart Images
Figure CN223016982U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wire processing, in particular to a surface treatment device for wire processing. Background Art
[0002] In the process of processing metal wires, it is necessary to perform surface treatment on their surfaces, such as degreasing, activation, removing oxide layers and other surface treatments on the wires.
[0003] Most of the existing wire surface treatment methods are to immerse the wire in a reaction solution and convey the wire through a traction device. The wire needs to ensure the reaction time in the reaction solution during the conveying process to ensure the surface processing effect. However, the solute in the reaction solution is likely to deposit during the reaction process, and it is difficult to ensure the uniformity of the reaction on the wire surface within the limited reaction time, which affects the processing quality of the wire. Summary of the Invention
[0004] In view of the deficiencies of the prior art, the utility model provides a surface treatment device for wire processing that can improve the stability of the wire surface treatment effect.
[0005] To achieve the above objectives, the utility model is realized through the following technical solutions.
[0006] The present application provides a surface treatment device for wire processing, including:
[0007] A reaction tank with a working chamber inside. On the inner walls of the two opposite sides of the working chamber, there are respectively an inlet hole and an outlet hole that penetrate through the corresponding side end faces of the reaction tank and are located on the same horizontal plane;
[0008] Two central shafts are rotatably arranged on the inner wall of the working chamber close to the ground;
[0009] A winding wheel is fixedly arranged on the central shaft and is linearly arrayed with a plurality of first winding grooves along the axial direction;
[0010] Two conveying ports are arranged at intervals along the connection line of the two winding wheels on the bottom wall of the working chamber, located between the two winding wheels, and one of them is used to input the reaction solution into the working chamber and the other is used to discharge the reaction solution in the working chamber;
[0011] Among them, the two winding wheels are respectively located at the corresponding positions of the inlet hole and the outlet hole. The central axes of the inlet hole and the outlet hole are parallel to the plane where the central axes of the two central shafts are located, and the central axes of the inlet hole and the outlet hole are respectively tangent to the first winding grooves on the corresponding winding wheels;
[0012] On the inner wall of the working chamber, two sets of spoiler plates are symmetrically and fixedly arranged with respect to the plane where the central axes of the two central axes are located. Each set of spoiler plates includes a plurality of spoiler plates linearly arranged in the direction of the connection line of the two wire reels;
[0013] The wire bodies wound on the two wire reels are located between the two sets of spoiler plates, and the spoiler plates are inclined towards the side of the delivery port for inputting the reaction solution into the working chamber.
[0014] The utility model has at least the following beneficial effects:
[0015] A circulating reaction solution is formed in the working chamber, and spoiler plates are arranged on the flow path of the reaction solution. Since the spoiler plates face the inlet of the reaction solution, when the reaction solution circulates, it will flow towards the side close to the wire body under the guiding action of the spoiler plates, thereby increasing the reaction rate on the surface of the wire body. At the same time, under the disturbing action of the spoiler plates, the solute of the reaction solution can maintain uniformity, further improving the surface treatment quality of the wire body. Description of the Drawings
[0016] Figure 1 It is a schematic structural diagram of the surface treatment device for wire body processing in the embodiment of the present application;
[0017] Figure 2 It is a schematic structural diagram of the surface treatment device for wire body processing in the embodiment of the present application;
[0018] Figure 3 It is a schematic structural diagram of the surface treatment device for wire body processing in the embodiment of the present application;
[0019] Figure 4 It is a structural sectional view of the "guide chamber 150" part in the surface treatment device for wire body processing in the embodiment of the present application;
[0020] Figure 5 It is a schematic internal structure diagram of the "working chamber" in the surface treatment device for wire body processing in the embodiment of the present application;
[0021] Figure 6 It is a structural sectional view of the "spoiler plate 700" in the surface treatment device for wire body processing in the embodiment of the present application.
[0022] Reference Signs
[0023] Reaction chamber - 100, inlet hole - 110, outlet hole - 120, reaction cavity - 130, circulation cavity - 140, cleaning cavity - 150, guiding cavity - 160, lead groove - 170, sewage outlet - 180, conveying port - 190, central shaft - 210, winding wheel - 220, wire guiding wheel - 300, first jet unit - 410, second jet unit - 420, guiding assembly - 500, connecting plate - 510, first guiding wheel - 520, second guiding wheel - 530, water replenishing device - 600, flow disturbing plate - 700, flow disturbing groove - 710, bottom groove - 720. Detailed implementation manners
[0024] The following will clearly describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.
[0025] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.
[0026] The following will, with reference to the accompanying drawings, describe in detail the surface treatment device for wire processing provided by the embodiments of the present application through specific embodiments and their application scenarios.
[0027] As Figures 1 to 6 shown, the embodiments of the present application provide a surface treatment device for wire processing, including a reaction chamber 100. A working chamber is provided inside the reaction chamber 100, and an inlet hole 110 and an outlet hole 120 that penetrate through the corresponding side end faces of the reaction chamber 100 and are located on the same horizontal plane are respectively provided on the inner walls of the two opposite sides of the working chamber.
[0028] Two central shafts 210 with parallel central axes are rotatably provided on the inner wall of the working chamber of the reaction chamber 100 close to the ground. A winding wheel 220 is fixedly provided on the central shaft 210, and a plurality of first winding grooves are linearly arranged along the axial direction on the winding wheel 220.
[0029] Two winding wheels 220 are respectively located at the corresponding positions of the inlet hole 110 and the outlet hole 120. The central axes of the inlet hole 110 and the outlet hole 120 are parallel to the plane where the central axes of the two central shafts 210 are located, and the central axes of the inlet hole 110 and the outlet hole 120 are respectively tangent to the first winding grooves on the winding wheels 220 at the corresponding positions.
[0030] On the bottom wall of the working chamber of the reaction tank 100, two conveying ports 190 are arranged at intervals along the connection line of the two winding wheels 220. The two conveying ports 190 are located between the two winding wheels 220, and one of them is used to input the reaction solution into the working chamber, and the other is used to discharge the reaction solution in the working chamber.
[0031] Among them, on the inner wall of the working chamber, two groups of spoiler plates 700 are symmetrically and fixedly arranged with respect to the plane where the central axes of the two central shafts 210 are located. Each group of spoiler plates 700 includes a plurality of spoiler plates 700 linearly arranged along the connection line direction of the two winding wheels 220.
[0032] The wire bodies wound on the two winding wheels 220 can be located between the two groups of spoiler plates 700, and the spoiler plates 700 are inclined towards the side of the conveying port 190 for inputting the reaction solution into the working chamber.
[0033] It can be understood that the wire body penetrating into the working chamber of the reaction tank 100 from the inlet hole 110 can be reciprocally wound between the two winding wheels 220 and finally pass through the outlet hole 120 to penetrate out of the reaction tank 100; during surface treatment, the reaction solution in the working chamber of the reaction tank 100 is circulated through the two conveying ports 190. The reaction solution in the working chamber of the reaction tank 100 does not exceed the inlet hole 110 and the outlet hole 120. The wire bodies wound on the two winding wheels 220 are located between the two groups of spoiler plates 700. With the traction and conveying of the wire bodies, the wire bodies wound on the two winding wheels 220 can react in the reaction solution and penetrate out of the reaction tank 100 after the reaction is completed.
[0034] In the embodiment of the present application, by adopting the above-mentioned surface treatment device for wire body processing, a circulating reaction solution is formed in the working chamber, and spoiler plates 700 are arranged on the flow path of the reaction solution. Since the spoiler plates 700 face the inlet of the reaction solution, when the reaction solution circulates, it will flow towards the side close to the wire body under the guiding action of the spoiler plates 700, thereby improving the reaction efficiency on the surface of the wire body. At the same time, under the disturbing action of the spoiler plates 700, the solute of the reaction solution can maintain uniformity, further improving the surface treatment quality of the wire body.
[0035] In a preferred embodiment, as Figures 1 to 5As shown, the working chamber of the reaction chamber 100 includes a reaction chamber 130 provided inside the reaction chamber 100 and two guiding chambers 160 symmetrically arranged with respect to the reaction chamber 130. A lead wire groove 170 for threading the wire between the two wire reels 220 is provided through the inner wall on the side of the guiding chamber 160 close to the reaction chamber 130 and the corresponding inner wall of the reaction chamber 130.
[0036] Among them, the spoiler 700 is fixedly arranged on the inner wall of the reaction chamber 130, and the two central shafts 210 are respectively rotatably arranged on the bottom walls of the two guiding chambers 160.
[0037] In a preferred embodiment, as Figures 1 to 3 、 Figure 5 shown, a first jet unit 410 for blowing air on one side of the wire between the two wire reels 220 is fixedly arranged on the inner wall of the guiding chamber 160.
[0038] It can be understood that when the traction device drives the wire between the two wire reels 220 to be conveyed, the first jet unit 410 can blow air on the surface of the corresponding position wire, so as to blow away the impurities on the wire surface and improve the surface cleanliness of the wire.
[0039] In a preferred embodiment, as Figures 1 to 3 、 Figure 5 shown, a sewage discharge port 180 for sewage discharge is provided on the bottom wall of the guiding chamber 160.
[0040] In a preferred embodiment, as Figures 1 to 3 、 Figure 5 shown, the working chamber of the reaction chamber 100 further includes two circulation chambers 140 provided inside the reaction chamber 100 and symmetrically arranged with respect to the reaction chamber 130. The two circulation chambers 140 are located between the two guiding chambers 160.
[0041] Among them, the lead wire groove 170 penetrates the guiding chamber 160, and two conveying ports 190 are respectively provided on the bottom walls of the two circulation chambers 140.
[0042] In a preferred embodiment, as Figures 1 to 5 shown, the working chamber of the reaction chamber 100 further includes two cleaning chambers 150 provided inside the reaction chamber 100 and symmetrically arranged with respect to the reaction chamber 130. The two cleaning chambers 150 are respectively located between the corresponding circulation chambers 140 and guiding chambers 160.
[0043] Among them, the lead wire groove 170 penetrates the cleaning chamber 150, and a second jet unit 420 for blowing air on the wire on the side away from the first jet unit 410 between the two wire reels 220 is fixedly arranged on the inner wall of the cleaning chamber 150.
[0044] It can be understood that through the cooperation of the first jet unit 410 and the second jet unit 420, the wire body between the two winding wheels 220 can be cleaned comprehensively, thereby improving the surface treatment quality of the wire body.
[0045] In a preferred embodiment, the first jet unit 410 and the second jet unit 420 are specifically arranged as cylinders fixedly connected to the inner wall of the working chamber of the reaction tank 100, and a plurality of jet ports are arranged in an axial array on the cylinders. One end of the cylinder away from the reaction tank 100 is connected to an external air blowing device. When the air blowing device conveys gas to the cylinder, the cylinder can blow and clean the wire body at different positions through the plurality of jet ports.
[0046] In a preferred embodiment, as Figures 1 to 3 , Figure 5 shown, a water replenishing device 600 for replenishing water into the working chamber of the reaction tank 100 is fixedly arranged on the inner wall of the guiding cavity 160.
[0047] It can be understood that through the water replenishing device 600, water can be replenished into the working chamber of the reaction tank 100, thereby adjusting the concentration of the reaction solution.
[0048] In a preferred embodiment, as Figures 1 to 3 , Figure 5 shown, two wire guiding wheels 300 are symmetrically arranged about the central axis 210 of the central axis on the bottom wall of the guiding cavity 160 and are rotatably arranged.
[0049] Among them, a plurality of second wire winding grooves corresponding to the positions of the plurality of first wire winding grooves are linearly arranged in an axial array on the wire guiding wheels 300, and the penetrating directions of the wire leading grooves 170 are respectively tangent to the second wire winding grooves of the two wire guiding wheels 300.
[0050] It can be understood that through the wire guiding wheels 300, the wire body between the two winding wheels 220 can be guided, thereby extending the reaction stroke of the wire body in the working chamber of the reaction tank 100, further increasing the surface treatment time of the wire body, and ensuring the surface treatment effect of the wire body.
[0051] In a preferred embodiment, as Figures 1 to 3 , Figure 5 shown, a guiding assembly 500 is arranged on the bottom wall of the guiding cavity 160 on the side close to the wire outlet hole 120. The guiding assembly 500 is located between the winding wheel 220 at the corresponding position and the wire outlet hole 120 and is used for guiding the wire body wound out from the winding wheel 220 to pass through the wire outlet hole 120.
[0052] In a preferred embodiment, as Figures 1 to 3 , Figure 5As shown in the figure, the guiding component 500 includes an adapter plate 510 fixedly arranged on the bottom wall of the guiding cavity 160 near one side of the wire outlet hole 120. A first guide wheel 520 and a second guide wheel 530 are rotatably arranged on the adapter plate 510.
[0053] Among them, the top of the first guide wheel 520 is tangent to the central axis of the wire outlet hole 120, and the bottom of the second guide wheel 530 is tangent to the first winding groove on the closest side to the ground on the corresponding winding wheel 220.
[0054] It can be understood that in order to ensure the height of the reaction solution, the wire body is wound into the first winding groove on the farthest side from the ground on the winding wheel 220 and led out through the first winding groove on the closest side to the ground on the winding wheel 220. The wire body led out from the winding wheel 220 can successively bypass the bottom of the second guide wheel 530 and the top of the first guide wheel 520 and pass through the wire outlet hole 120.
[0055] In a preferred embodiment, as Figures 1 to 3 、 Figure 5 、 Figure 6 shown, a plurality of flow disturbance grooves 710 are linearly arranged in the vertical direction on one end face of the flow disturbance plate 700 close to the plane where the central axes of the two winding wheels 220 are located.
[0056] Among them, the horizontal cross-sectional shape of the flow disturbance groove 710 is conical, and the opening side faces the side of the delivery port 190 for discharging the reaction solution in the working cavity.
[0057] It can be understood that through the angle setting of the flow disturbance grooves 710, when the reaction solution flushes the flow disturbance plate 700, the solute of the reaction solution will not accumulate in the flow disturbance grooves 710, thus ensuring the flow disturbance stability of the flow disturbance plate 700.
[0058] In a preferred embodiment, as Figures 1 to 3 、 Figure 5 、 Figure 6 shown, a bottom groove 720 is provided through the bottom of the flow disturbance plate 700.
[0059] It can be understood that when the reaction solution flushes the flow disturbance plate 700, the flow disturbance plate 700 can avoid the reaction solution solute deposited at the bottom of the reaction cavity 130 through the bottom groove 720, thus ensuring the circulation stability of the reaction solution.
[0060] It should be noted that, in this text, the terms "including", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including such element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in a reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
[0061] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.
Claims
1. A surface treatment device for wire processing, characterized in that: include: The reaction box has a working chamber inside, and inner walls on opposite sides of the working chamber are respectively provided with a wire inlet hole and a wire outlet hole which penetrate the corresponding side end surface of the reaction box and are located on the same horizontal plane; Two central shafts are rotatably provided on the inner wall of the working chamber close to the ground; The winding wheel is fixedly arranged on the central axis and is provided with a plurality of first winding grooves in a linear array along the axial direction; Two delivery ports are provided on the bottom wall of the working chamber along the line connecting the two winding wheels, located between the two winding wheels, and one of them is used to input the reaction solution into the working chamber, and the other is used to discharge the reaction solution in the working chamber; The two winding wheels are respectively located at positions corresponding to the wire inlet hole and the wire outlet hole, the central axes of the wire inlet hole and the wire outlet hole are parallel to the planes where the central axes of the two central shafts are located, and the central axes of the wire inlet hole and the wire outlet hole are respectively tangent to the first winding grooves on the winding wheels at the corresponding positions; Two groups of spoilers are fixedly arranged symmetrically about the plane where the central axes of the two central axes are located on the inner wall of the working chamber, and each group of spoilers includes a plurality of spoilers arranged in a linear array along the direction connecting the two winding wheels; The wire bodies wound on the two winding wheels are located between two groups of spoilers, and the spoilers are inclined toward one side of the delivery port for inputting the reaction solution into the working chamber.
2. A surface treatment device for wire processing according to claim 1, characterized in that: The spoiler is provided with a plurality of spoiler grooves in a linear array in the vertical direction on the end surface of the side close to the plane where the central axes of the two winding wheels are located; The horizontal cross-section of the spoiler groove is conical, and the opening side faces the delivery port for discharging the reaction solution in the working chamber.
3. A surface treatment device for wire processing according to claim 1 or 2, characterized in that: A bottom groove is provided through the bottom of the spoiler.
4. The surface treatment device for wire processing according to claim 1, characterized in that: The working chamber comprises a reaction chamber arranged in a reaction box and two guide chambers symmetrically arranged with respect to the reaction chamber; A wire guide groove for guiding the wire between the two winding wheels is provided between the inner wall of the guide cavity on the side close to the reaction cavity and the inner wall on the side corresponding to the reaction cavity; The spoiler is fixedly arranged on the inner wall of the reaction chamber, and the two central shafts are rotatably arranged on the bottom walls of the two guide chambers respectively.
5. The surface treatment device for wire processing according to claim 4, characterized in that: A first air-jet unit for blowing air to one side of the wire body between the two winding wheels is fixedly provided on the inner wall of the guide cavity; Wherein, a sewage outlet is provided on the bottom wall of the guide cavity.
6. The surface treatment device for wire processing according to claim 4, characterized in that: The working chamber further comprises two circulation chambers arranged in the reaction box and symmetrically arranged with respect to the reaction chamber, wherein the two circulation chambers are located between the two guide chambers; The wire guide groove passes through the guide cavity, and the two delivery ports are respectively arranged on the bottom walls of the two circulation cavities.
7. A surface treatment device for wire processing according to any one of claims 4 to 6, characterized in that: The working chamber also includes two cleaning chambers arranged in the reaction box and symmetrically arranged with respect to the reaction chamber, wherein the two cleaning chambers are respectively located between the circulation chamber and the guide chamber at corresponding positions; The wire guide groove passes through the cleaning chamber, and a second jet unit for blowing air to the wire body between the two winding wheels and away from the first jet unit is fixedly provided on the inner wall of the cleaning chamber.
8. A surface treatment device for wire processing according to claim 1 or 4, characterized in that: A water replenishing device is fixedly provided on the inner wall of the guide cavity of the working cavity.
9. A surface treatment device for wire processing according to claim 1 or 4, characterized in that: Two guide wheels are symmetrically and rotatably arranged on the bottom wall of the guide cavity of the working cavity about the central axis of the central axis; Wherein, a plurality of second winding grooves corresponding to the positions of the plurality of first winding grooves are arranged in an axial linear array on the guide wheel, and the penetration direction of the guide grooves is tangent to the second winding grooves of the two guide wheels respectively.
10. A surface treatment device for wire processing according to claim 1 or 4, characterized in that: A connection plate is fixedly provided on the bottom wall of the guide cavity near the outlet hole, and a first guide wheel and a second guide wheel are rotatably provided on the connection plate; Among them, the top of the first guide wheel is tangent to the central axis of the wire outlet hole, and the bottom of the second guide wheel is tangent to the first winding groove on the side of the winding wheel at the corresponding position closest to the ground.