Thermoelectric refrigeration chip structure

Abstract

The utility model discloses a thermoelectric refrigeration chip structure, which is applied to the field of refrigeration modules and comprises a chip body, a cold surface and a hot surface are arranged on the chip body, a water cooling mechanism is arranged on the hot surface, and a packaging mechanism is arranged on the side wall of the chip body. Firstly, cooling liquid is poured into the liquid flow channel through the through opening, heat exchange is carried out through the cooling liquid and the hot face, then efficient heat dissipation is carried out on the hot face, then the liquid flow channel can be fixed to the hot face through the positioning sleeve, sealing treatment is carried out on the liquid flow channel through the sealing cover, and when the heat dissipation effect is reduced, only the sealing cover needs to be opened. And the cooling liquid in the liquid flow channel is discharged, and new cooling liquid is filled into the liquid flow channel.

Description

Technical Field

[0001] The utility model belongs to the technical field of refrigeration modules, and particularly relates to a thermoelectric refrigeration chip structure. Background Art

[0002] Electro-refrigeration technology is based on the Peltier effect. That is, when direct current passes through a thermocouple composed of an N-type semiconductor and a P-type semiconductor, heat absorption and heat release phenomena will occur at the joints. One side absorbs heat to form a cold end, and the other side releases heat to form a hot end.

[0003] At present, the Chinese utility model patent announced as CN205316734U discloses a refrigeration chip provided with a heat sink. It is provided with a refrigeration chip body, and a heat dissipation plate is arranged on the heating surface of the refrigeration chip body. Through the above settings, a refrigeration chip with a heat sink can be reliably connected to the power supply line, the heat sink is convenient to disassemble, and the connection between the heat sink and the heat dissipation plate can still be reliably thermally connected after wear, solving the problems of poor reliability and inconvenient disassembly when the existing refrigeration chip is connected to the power supply.

[0004] This patent only dissipates heat from the hot end of the chip through the heat sink, and its heat dissipation effect is poor. If a large amount of heat generated during the operation of the chip cannot be dissipated in time, it will seriously affect its performance, stability and service life. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a thermoelectric refrigeration chip structure, which solves the problem that the existing refrigeration chip with a heat sink only dissipates heat from the hot end of the chip through the heat sink, and its heat dissipation effect is poor.

[0006] The above technical purpose of the utility model is achieved through the following technical solutions. A thermoelectric refrigeration chip structure includes a chip body. A cold surface and a hot surface are arranged on the chip body. A water cooling mechanism is arranged on the hot surface, and a packaging mechanism is arranged on the side wall of the chip body;

[0007] The water cooling mechanism includes a liquid flow channel, a positioning sleeve, a through port and a sealing cover. The liquid flow channel is arranged on the hot surface. The liquid flow channel is arranged in a serpentine shape. The inside of the liquid flow channel is filled with a coolant. The positioning sleeve is arranged on the hot surface to fix the liquid flow channel. The through port is arranged at both ends of the liquid flow channel, and the sealing cover is threadedly connected to the through port.

[0008] Adopting the above technical solution, by setting a chip body, a cold surface, a hot surface, a water cooling mechanism and a packaging mechanism, during use, first, the chip body can be packaged by the packaging mechanism. Then, when the chip body works, it has a cold surface and a hot surface. Then, the water cooling mechanism can efficiently dissipate the heat of the hot surface on the chip body. The water cooling mechanism includes a liquid flow channel, a positioning sleeve, a through port and a sealing cover. During use, first, the coolant is poured into the liquid flow channel through the through port, and heat exchange is carried out between the coolant and the hot surface, thereby efficiently dissipating the heat of the hot surface. Then, the positioning sleeve can fix the liquid flow channel on the hot surface, and the liquid flow channel is sealed by the sealing cover. Then, when the heat dissipation effect decreases, only need to open the sealing cover, drain the coolant inside the liquid flow channel, and fill in new coolant.

[0009] Further: The packaging mechanism includes a packaging board, a mortise and tenon opening and a fixing rod. The packaging board is arranged on the side wall of the chip body. The number of the packaging boards is four. The packaging boards are trapezoidally arranged. The mortise and tenon opening is opened on the packaging board. The fixing rod is arranged in the mortise and tenon opening for fixing the packaging board.

[0010] Adopting the above technical solution, by setting a packaging board, a mortise and tenon opening and a fixing rod, during use, first, the chip body can be packaged by the packaging board. Then, insert the fixing rod into the mortise and tenon openings at both ends of the packaging board, and the fixation of the packaging board can be realized, which is convenient to use.

[0011] Further: A micro fan is arranged on the liquid flow channel. The number of the micro fans is two and they are symmetrically arranged. A fixing plate is arranged on the hot surface. The number of the fixing plates is two and they are symmetrically arranged. Heat dissipation fins are arranged on the fixing plate. The number of the heat dissipation fins is several and they are evenly arranged.

[0012] Adopting the above technical solution, by setting a micro fan, a fixing plate and heat dissipation fins, during use, first, the fixing plate can fixedly install the heat dissipation fins. The micro fan can enhance air flow and accelerate the heat dissipation on the heat dissipation fins, further improving the heat dissipation efficiency of the hot surface.

[0013] Further: Heat pipes are arranged on the hot surface. The other ends of the heat pipes are in contact with the heat dissipation fins. The number of the heat pipes is several and they are evenly arranged.

[0014] Adopting the above technical solution, by setting heat pipes, during use, the heat pipes have high thermal conductivity and can quickly conduct the heat of the hot surface to the heat dissipation fins, enhancing the heat dissipation effect on the hot surface.

[0015] Further: Mounting plates are arranged on the side walls of the packaging board. The number of the mounting plates is four and they are symmetrically arranged. Mounting holes are opened on the mounting plates.

[0016] With the above technical solution, by setting the mounting plate and the mounting holes, during use, the mounting plate is fixed on the encapsulation board, and the fixing and mounting effect of the chip body can be achieved through the mounting holes on the mounting plate.

[0017] Furthermore: The heat dissipation fins have a variable cross-section design, and the thickness of the heat dissipation fins gradually decreases from the side close to the hot surface.

[0018] With the above technical solution, by setting the shape of the heat dissipation fins, the variable cross-section design enables the air flow rate to gradually increase when passing through the heat dissipation fins, enhancing the convective heat transfer effect.

[0019] Furthermore: The chip body is made of a high-performance semiconductor material, such as bismuth telluride-based alloy.

[0020] With the above technical solution, by setting the material of the chip body, the high-performance semiconductor material has a higher thermoelectric figure of merit coefficient, which can more effectively convert electrical energy into a heat energy difference, thereby improving the refrigeration efficiency.

[0021] Furthermore: The encapsulation board is made of an insulating and heat-resistant ceramic material.

[0022] With the above technical solution, by setting the material of the encapsulation board, using an insulating and heat-resistant ceramic material as the encapsulation board can protect the internal circuit from the external environment.

[0023] In summary, the present utility model has the following beneficial effects:

[0024] By setting the water cooling mechanism, during use, first, the coolant is poured into the liquid flow channel through the through port, and heat exchange is carried out between the coolant and the hot surface, thereby efficiently dissipating heat from the hot surface. Then, the positioning sleeve can fix the liquid flow channel on the hot surface, and the liquid flow channel is sealed by the sealing cover. When the heat dissipation effect decreases, only need to open the sealing cover, drain the coolant inside the liquid flow channel, and fill in new coolant.

[0025] By setting the micro fan, the fixing plate and the heat dissipation fins, during use, first, the fixing plate can fix and install the heat dissipation fins, and the micro fan can enhance the air flow and accelerate the heat dissipation on the heat dissipation fins, further improving the heat dissipation efficiency of the hot surface.

[0026] Based on the above improvement points, the overall technical effect achieved by this device is that the hot surface can be cooled by two methods of water cooling and heat dissipation fins, which can improve the heat dissipation efficiency of the hot surface and avoid affecting the performance of the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is the overall structural schematic diagram of the present utility model;

[0028] Figure 2 It is a schematic structural diagram of the micro fan, fixed plate and heat dissipation fins of the present utility model;

[0029] Figure 3 It is a schematic structural diagram of the water cooling mechanism of the present utility model;

[0030] Figure 4 It is a schematic structural diagram of the encapsulation mechanism of the present utility model.

[0031] In the figure, 1 is the chip body; 2 is the cold surface; 3 is the hot surface; 4 is the water cooling mechanism; 5 is the encapsulation mechanism; 6 is the micro fan; 7 is the fixed plate; 8 is the heat dissipation fins; 9 is the heat pipe; 10 is the mounting plate; 11 is the mounting hole; 401 is the liquid flow channel; 402 is the positioning sleeve; 403 is the through port; 404 is the sealing cover; 501 is the encapsulation plate; 502 is the mortise and tenon opening; 503 is the fixing rod. Specific embodiments

[0032] The present utility model will be further described in detail below with reference to the accompanying drawings.

[0033] Embodiment:

[0034] Please refer to Figures 1-4 , the present utility model provides a technical solution: a thermoelectric refrigeration chip structure, including a chip body 1, a cold surface 2 and a hot surface 3 are arranged on the chip body 1, a water cooling mechanism 4 is arranged on the hot surface 3, and an encapsulation mechanism 5 is arranged on the side wall of the chip body 1;

[0035] The water cooling mechanism 4 includes a liquid flow channel 401, a positioning sleeve 402, a through port 403 and a sealing cover 404. The liquid flow channel 401 is arranged on the hot surface 3, the liquid flow channel 401 is arranged in a snake shape, the inside of the liquid flow channel 401 is filled with a coolant, the positioning sleeve 402 is arranged on the hot surface 3 for fixing the liquid flow channel 401, the through port 403 is arranged at both ends of the liquid flow channel 401, and the sealing cover 404 is threadedly connected to the through port 403.

[0036] By setting the chip body 1, the cold surface 2, the hot surface 3, the water cooling mechanism 4 and the encapsulation mechanism 5, during use, first, the chip body 1 can be encapsulated by the encapsulation mechanism 5. Then, when the chip body 1 works, it has a cold surface 2 and a hot surface 3. Then, the water cooling mechanism 4 can efficiently dissipate the heat of the hot surface 3 on the chip body 1. The water cooling mechanism 4 includes a liquid flow channel 401, a positioning sleeve 402, a through port 403 and a sealing cover 404. During use, first, coolant is poured into the liquid flow channel 401 through the through port 403, and heat exchange is carried out between the coolant and the hot surface 3, thereby efficiently dissipating the heat of the hot surface 3. Then, the positioning sleeve 402 can fix the liquid flow channel 401 on the hot surface 3, and the liquid flow channel 401 is sealed by the sealing cover 404. Then, when the heat dissipation effect decreases, only need to open the sealing cover 404, drain the coolant inside the liquid flow channel 401, and fill in new coolant.

[0037] Reference Figure 4 , the encapsulation mechanism 5 includes an encapsulation board 501, a mortise and tenon mouth 502 and a fixing rod 503. The encapsulation board 501 is arranged on the side wall of the chip body 1. The number of encapsulation boards 501 is four, and the encapsulation boards 501 are trapezoidally arranged. The mortise and tenon mouth 502 is opened on the encapsulation board 501, and the fixing rod 503 is arranged in the mortise and tenon mouth 502 to fix the encapsulation board 501. By setting the encapsulation board 501, the mortise and tenon mouth 502 and the fixing rod 503, during use, first, the chip body 1 can be encapsulated by the encapsulation board 501, and then the fixing rod 503 is inserted into the mortise and tenon mouths 502 at both ends of the encapsulation board 501, and the fixation of the encapsulation board 501 can be achieved, which is convenient to use.

[0038] Reference Figure 3 , two micro fans 6 are arranged on the liquid flow channel 401 and are symmetrically arranged. Two fixing plates 7 are arranged on the hot surface 3 and are symmetrically arranged. Heat dissipation fins 8 are arranged on the fixing plates 7, and the number of heat dissipation fins 8 is several and evenly arranged. By setting the micro fans 6, the fixing plates 7 and the heat dissipation fins 8, during use, first, the fixing plates 7 can fixedly install the heat dissipation fins 8, and the micro fans 6 can enhance air flow and accelerate the heat dissipation on the heat dissipation fins 8, further improving the heat dissipation efficiency of the hot surface 3.

[0039] Reference Figure 3 , several heat pipes 9 are arranged on the hot surface 3, and the other ends of the heat pipes 9 are in contact with the heat dissipation fins 8. The number of heat pipes 9 is several and evenly arranged. By setting the heat pipes 9, during use, the heat pipes 9 have high thermal conductivity and can quickly conduct the heat of the hot surface 3 to the heat dissipation fins 8, enhancing the heat dissipation effect on the hot surface 3.

[0040] Reference Figure 1, there is a mounting plate 10 provided on the side wall of the encapsulation board 501. The number of mounting plates 10 is four and they are symmetrically arranged. There are mounting holes 11 on the mounting plate 10. By setting the mounting plate 10 and the mounting holes 11, during use, the mounting plate 10 is fixed on the encapsulation board 501, and the chip body 1 can be fixedly installed through the mounting holes 11 on the mounting plate 10.

[0041] Reference Figure 2 , the heat dissipation fins 8 have a variable cross-section design. The thickness of the heat dissipation fins 8 gradually decreases from the side close to the hot surface 3. By setting the shape of the heat dissipation fins 8, the variable cross-section design makes the air flow rate gradually increase when passing through the heat dissipation fins 8, enhancing the convective heat transfer effect.

[0042] Reference Figure 4 , the chip body 1 is made of a high-performance semiconductor material, such as bismuth telluride-based alloy. By setting the material of the chip body 1, the high-performance semiconductor material has a higher thermoelectric figure of merit coefficient, and can convert electrical energy into a thermal energy difference more effectively, thereby improving the refrigeration efficiency.

[0043] Reference Figure 4 , the encapsulation board 501 is made of an insulating and heat-resistant ceramic material. By setting the material of the encapsulation board 501, using the insulating and heat-resistant ceramic material as the encapsulation board 501 can protect the internal circuit from the external environment.

[0044] Brief description of the usage process:

[0045] During use, first, the coolant is poured into the liquid flow channel 401 through the through port 403. Heat exchange is carried out between the coolant and the hot surface 3, thereby efficiently dissipating the heat of the hot surface 3. Then, the positioning sleeve 402 can fix the liquid flow channel 401 on the hot surface 3, and the liquid flow channel 401 is sealed by the sealing cover 404. When the heat dissipation effect decreases, only need to open the sealing cover 404, drain the coolant inside the liquid flow channel 401, and fill in new coolant;

[0046] Then, the fixing plate 7 can fixedly install the heat dissipation fins 8. The micro fan 6 can enhance the air flow and accelerate the heat dissipation on the heat dissipation fins 8, further improving the heat dissipation efficiency of the hot surface 3. The heat pipe 9 has high thermal conductivity and can quickly conduct the heat of the hot surface 3 to the heat dissipation fins 8, enhancing the heat dissipation effect on the hot surface 3. The variable cross-section design makes the air flow rate gradually increase when passing through the heat dissipation fins 8, enhancing the convective heat transfer effect;

[0047] Finally, the chip body 1 can be encapsulated by the encapsulation board 501, and then the fixing rod 503 is inserted into the mortise and tenon openings 502 at both ends of the encapsulation board 501, and the fixation of the encapsulation board 501 can be achieved, which is convenient to use.

[0048] This specific embodiment is only an interpretation of the present utility model and does not limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment that do not contribute creatively as needed, but as long as it is within the scope of the claims of the present utility model, it is protected by the patent law.

Claims

1. A thermoelectric cooling chip structure, comprising a chip body (1), characterized in that: The chip body (1) is provided with a cold surface (2) and a hot surface (3), the hot surface (3) is provided with a water cooling mechanism (4), and the side wall of the chip body (1) is provided with a packaging mechanism (5); The water cooling mechanism (4) comprises a liquid flow channel (401), a positioning sleeve (402), a through port (403) and a sealing cover (404); the liquid flow channel (401) is arranged on the hot surface (3); the liquid flow channel (401) is arranged in a serpentine shape; the liquid flow channel (401) is filled with cooling liquid; the positioning sleeve (402) is arranged on the hot surface (3) for fixing the liquid flow channel (401); the through port (403) is arranged at both ends of the liquid flow channel (401); and the sealing cover (404) is threadedly connected to the through port (403).

2. A thermoelectric cooling chip structure according to claim 1, characterized in that: The packaging mechanism (5) comprises a packaging plate (501), a mortise and tenon joint (502) and a fixing rod (503); the packaging plate (501) is arranged on the side wall of the chip body (1); there are four packaging plates (501); the packaging plates (501) are arranged in a trapezoidal shape; the mortise and tenon joint (502) is opened on the packaging plate (501); and the fixing rod (503) is arranged in the mortise and tenon joint (502) for fixing the packaging plate (501).

3. The thermoelectric cooling chip structure according to claim 1, characterized in that: The liquid flow channel (401) is provided with a micro fan (6), the number of which is two and which are symmetrically arranged; the heat surface (3) is provided with a fixing plate (7), the number of which is two and which are symmetrically arranged; the fixing plate (7) is provided with heat dissipation fins (8), the number of which is a plurality and which are evenly arranged.

4. The thermoelectric cooling chip structure according to claim 3, characterized in that: A heat pipe (9) is arranged on the heat surface (3), the other end of the heat pipe (9) is in contact with the heat dissipation fin (8), and the heat pipes (9) are multiple and evenly arranged.

5. The thermoelectric cooling chip structure according to claim 2, characterized in that: A mounting plate (10) is arranged on the side wall of the packaging plate (501), the mounting plates (10) are four in number and are symmetrically arranged, and mounting holes (11) are provided on the mounting plates (10).

6. The thermoelectric cooling chip structure according to claim 4, characterized in that: The heat dissipation fins (8) are designed with a variable cross-section, and the thickness of the heat dissipation fins (8) gradually decreases from a side close to the hot surface (3).

7. The thermoelectric cooling chip structure according to claim 1, characterized in that: The chip body (1) is made of high-performance semiconductor material.

8. The thermoelectric cooling chip structure according to claim 2, characterized in that: The packaging plate (501) is made of insulating and heat-resistant ceramic material.

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