Chip stress measuring device

Abstract

The utility model discloses a chip stress measuring device which comprises a base, a stress test piece and a protective cover, the top wall of the base is provided with a support, the top end of the protective cover is rotatably hinged to the side wall of the top of the support, the side wall of the support is provided with a driving piece, and the driving piece drives the protective cover to turn upwards or downwards. And the stress test piece is arranged on the bracket. The utility model belongs to the technical field of stress measuring devices, and particularly relates to a chip stress measuring device.

Description

Technical Field

[0001] The utility model belongs to the technical field of stress measurement devices, and specifically refers to a chip stress measurement device. Background Art

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small in size and is often part of a computer or other electronic device. A chip is a general term for semiconductor component products and is the carrier of an integrated circuit, which is divided from a wafer.

[0003] In chip processing, various performances of the chip need to be tested. Among them, the stress test of the chip is an important item, and the chip stress can reflect performances such as the strength and bending degree of the chip.

[0004] Patent CN220322940U discloses a chip stress measurement device. When this patent is in use, although the broken chips can leak out from the grille, there will still be some fragments stuck in the grille, which is not convenient for cleaning. Content of the Utility Model

[0005] The technical problem to be solved by the utility model is that when the existing patent is in use, although the broken chips can leak out from the grille, there will still be some fragments stuck in the grille, which is not convenient for cleaning.

[0006] To achieve the above functions, the technical solution adopted by the utility model is as follows: A chip stress measurement device includes a base, a stress test piece, and a protective cover. A bracket is provided on the top wall of the base. The top end of the protective cover is rotatably hinged to the side wall of the top of the bracket. A driving member is provided on the side wall of the bracket. The driving member drives the protective cover to flip up or down. The stress test piece is arranged on the bracket.

[0007] Preferably, the driving member includes a connecting plate. A telescopic member is provided on the side wall of the bracket. The top end of the connecting plate is rotatably arranged on the side wall of the protective cover. The telescopic member is arranged on the side wall of the bracket. The bottom end of the connecting plate is rotatably connected to the telescopic member.

[0008] Preferably, the telescopic member includes a lead screw, a lead screw pair, and a slide bar. A support plate is provided on the side wall of the bracket. The two ends of the lead screw are rotatably arranged on the support plate. The two ends of the slide bar are arranged on the support plate. The lead screw pair is in threaded connection with the lead screw and slides on the slide bar. A driving motor is provided on the support plate. The output end of the driving motor rotatably penetrates through the support plate and is connected to the lead screw.

[0009] Preferably, the stress test piece includes an electric telescopic rod, a fixed seat and a sliding column. The electric telescopic rod is arranged on the bracket. The movable end of the electric telescopic rod slides through the bracket and extends out. The fixed seat is arranged on the electric telescopic rod. A chute is arranged on the fixed seat. The sliding column slides on the chute. A pressure sensor is arranged on the top wall of the chute. A pressing plate is arranged at the bottom end of the sliding column.

[0010] Preferably, the bracket is arranged in a U-shaped structure.

[0011] Preferably, the protective cover is made of a transparent material.

[0012] The beneficial effects of the present utility model adopting the above structure are as follows: Place the chip on the base. The driving member drives the protective cover to turn downward to cover the chip. The stress test piece tests the chip. After the test is completed, the driving member drives the protective cover to turn upward. At this time, it is convenient to clean the debris on the base. Description of the Drawings

[0013] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present utility model Figure 1 ;

[0014] Figure 2 It is a schematic diagram of the overall structure of an embodiment of the present utility model Figure 2 ;

[0015] Figure 3 It is a schematic diagram of the overall structure of an embodiment of the present utility model Figure 3 ;

[0016] Figure 4 It is a cross-sectional view of an embodiment of the present utility model.

[0017] Among them, 1. Base, 2. Stress test piece, 3. Protective cover, 4. Bracket, 5. Driving member, 6. Linking plate, 7. Telescopic member, 8. Lead screw, 9. Lead screw pair, 10. Slide bar, 11. Support plate, 12. Driving motor, 13. Electric telescopic rod, 14. Fixed seat, 15. Sliding column, 16. Chute, 17. Pressure sensor, 18. Pressing plate. Detailed Embodiment

[0018] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0019] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. The following further describes the present utility model in detail with reference to the drawings.

[0020] As Figures 1-4 shown, a chip stress measurement device proposed by the present utility model includes a base 1, a stress test piece 2 and a protective cover 3. A bracket 4 is provided on the top wall of the base 1. The bracket 4 is arranged in a U-shaped structure. The top end of the protective cover 3 is rotatably hinged to the side wall of the top of the bracket 4. The protective cover 3 is made of a transparent material to facilitate observing the state of the chip. A driving member 5 is provided on the side wall of the bracket 4. The driving member 5 drives the protective cover 3 to flip up or down. The stress test piece 2 is arranged on the bracket 4. The chip is placed on the base 1. The driving member 5 drives the protective cover 3 to flip down to cover the chip. The stress test piece 2 tests the chip. After the test is completed, the driving member 5 drives the protective cover 3 to flip up. At this time, it is convenient to clean the debris on the base 1.

[0021] As Figures 1-2 shown, the driving member 5 includes a connecting plate 6. A telescopic member 7 is provided on the side wall of the bracket 4. The top end of the connecting plate 6 is rotatably arranged on the side wall of the protective cover 3. The telescopic member 7 is arranged on the side wall of the bracket 4. The bottom end of the connecting plate 6 is rotatably connected to the telescopic member 7. The telescopic member 7 drives the protective cover 3 to flip up or down through the connecting plate 6.

[0022] As Figures 2-3 shown, the telescopic member 7 includes a lead screw 8, a lead screw pair 9 and a slide bar 10. A support plate 11 is provided on the side wall of the bracket 4. The two ends of the lead screw 8 are rotatably arranged on the support plate 11. The two ends of the slide bar 10 are arranged on the support plate 11. The lead screw pair 9 is threadedly connected to the lead screw 8 and slides on the slide bar 10. A driving motor 12 is provided on the support plate 11. The output end of the driving motor 12 rotatably penetrates through the support plate 11 and is connected to the lead screw 8. The driving motor 12 is started to drive the lead screw 8 to rotate, then the lead screw pair 9 drives the protective cover 3 to flip up or down through the connecting plate 6.

[0023] As Figure 4As shown, the stress test piece 2 includes an electric telescopic rod 13, a fixed seat 14 and a sliding column 15. The electric telescopic rod 13 is arranged on the bracket 4. The movable end of the electric telescopic rod 13 slides through the bracket 4 and extends out. The fixed seat 14 is arranged on the electric telescopic rod 13. A chute 16 is arranged on the fixed seat 14. The sliding column 15 is slidably arranged on the chute 16. A pressure sensor 17 is arranged on the top wall of the chute 16. A pressing plate 18 is arranged at the bottom end of the sliding column 15. The electric telescopic rod 13 drives the fixed seat 14 to move downwards. When the pressing plate 18 touches the chip, the sliding column 15 slides in the chute 16. The top end of the sliding column 15 touches the pressure sensor 17 and applies force to it. The pressure on the chip on the pressing plate 18 is transmitted to the pressure sensor 17 to perform stress testing on the chip seat.

[0024] During specific use, place the chip on the base 1, start the driving motor 12, and drive the lead screw 8 to rotate. Then, the lead screw pair 9 drives the protective cover 3 to flip downwards through the connecting plate 6 to cover the chip.

[0025] The electric telescopic rod 13 drives the fixed seat 14 to move downwards. When the pressing plate 18 touches the chip, the sliding column 15 slides in the chute 16. The top end of the sliding column 15 touches the pressure sensor 17 and applies force to it. The pressure on the chip on the pressing plate 18 is transmitted to the pressure sensor 17 to perform stress testing on the chip seat.

[0026] After the testing is completed, the driving member 5 drives the protective cover 3 to flip upwards. At this time, it is convenient to clean the debris on the base 1.

[0027] The above describes the present invention and its implementation manners. This description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and without departing from the creative purpose of the present invention, they design similar structural manners and embodiments to this technical solution without creative efforts, which shall fall within the protection scope of the present invention.

Claims

1. A chip stress measurement device, characterized in that: It includes a base, a stress test piece and a protective cover. The top wall of the base is provided with a bracket. The top end of the protective cover is rotatably hinged on the side wall at the top of the bracket. The side wall of the bracket is provided with a driving member. The driving member drives the protective cover to flip upward or downward. The stress test piece is arranged on the bracket.

2. A chip stress measurement device according to claim 1, characterized in that: The driving member comprises a connecting plate, a telescopic member is arranged on the side wall of the bracket, the top end of the connecting plate is rotatably arranged on the side wall of the protective cover, the telescopic member is arranged on the side wall of the bracket, and the bottom end of the connecting plate is rotatably connected to the telescopic member.

3. A chip stress measurement device according to claim 2, characterized in that: The telescopic part includes a screw, a screw pair and a sliding rod. The side wall of the bracket is provided with a support plate. Both ends of the screw are rotatably arranged on the support plate. Both ends of the sliding rod are arranged on the support plate. The screw pair is threadedly connected to the screw and is slidably arranged on the sliding rod. A driving motor is provided on the support plate. The output end of the driving motor rotates through the support plate and is connected to the screw.

4. A chip stress measurement device according to claim 1, characterized in that: The stress testing piece includes an electric telescopic rod, a fixed seat and a sliding column. The electric telescopic rod is arranged on a bracket. The movable end of the electric telescopic rod slides through the bracket and extends out. The fixed seat is arranged on the electric telescopic rod. A sliding groove is provided on the fixed seat. The sliding column is slidably arranged on the sliding groove. A pressure sensor is provided on the top wall of the sliding groove. A pressure plate is provided at the bottom end of the sliding column.

5. The chip stress measurement device according to claim 1, characterized in that: The bracket is arranged in a U-shaped structure.

6. The chip stress measurement device according to claim 1, characterized in that: The protective cover is made of transparent material.

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