Wafer-level environment reliability test carrier and test machine

Abstract

The utility model discloses a wafer-level environment reliability test carrier and a test machine, and relates to the technical field of semiconductor manufacturing, the wafer-level environment reliability test carrier comprises a base, the base is provided with a plurality of groups of first half tubes, second half tubes, vacuum plugs and temperature sensors, and the outer surfaces of the two sides of the first half tubes and the second half tubes are provided with connecting mechanisms. Under the matching action of a second box body and the like, a rotary knob is rotated, so that a screw rod is driven to rotate, the screw rod rotates and drives a sliding block to move, two rotating plates on the two sides are driven to rotate, and a first connecting rod, a second connecting rod and a clamping plate on the two sides are driven to be away from each other; therefore, the elastic parts in the first half pipe and the second half pipe can be conveniently detached, replaced or maintained, the manual labor cost is reduced, and certain working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer-level environmental reliability test carrier and a test machine. Background Art

[0002] In the field of semiconductor manufacturing, wafer testing is a key link in determining wafer quality and performance. With the development of semiconductor technology, the demand for environmental reliability testing of wafers is increasing to evaluate their performance under various extreme conditions.

[0003] After searching, the patent with Chinese patent authorization announcement number CN206505156U discloses a wafer-level environmental reliability test carrier and test machine, including a base and a plurality of suction nozzles arranged on the base; wherein, the base includes a vacuum chamber, and when the pressure applied to the suction nozzle is greater than a predetermined pressure.

[0004] A wafer-level environmental reliability test carrier and test machine in the above-mentioned patent have the following deficiencies: although the device reduces the contact area between the test wafer and the carrier, ensures air circulation, and thus improves the accuracy of the test, the elastic components in the outer tube of the device will accelerate the metal fatigue phenomenon of the elastic components under long-term repeated compression and reset. Therefore, the elastic components in the outer tube need to be disassembled, replaced or maintained, and the outer tube of the device is an integrated setting, which is not convenient for quick disassembly and replacement of the elastic components inside it, thereby increasing labor costs and reducing work efficiency. Utility Model Content

[0005] The purpose of the utility model is to solve or at least alleviate the problem in the prior art that the outer tube of the device is an integrated arrangement, which makes it difficult to quickly disassemble and replace the elastic components inside it, thereby increasing labor costs and reducing work efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer-level environmental reliability test carrier and a test machine, comprising a base, on which a plurality of groups of first half tubes, second half tubes, vacuum plugs and temperature sensors are respectively provided, and both sides of the outer surfaces of the first half tubes and the second half tubes are provided with connection mechanisms;

[0007] The connecting mechanism includes a second box body fixedly installed on the first half tube and a mounting frame fixedly installed on the second half tube, a sliding block is slidably installed in the second box body, two rotating plates are symmetrically rotatably installed on the outer wall of one side of the sliding block, the same first connecting rod is rotatably installed on the two rotating plates, a second connecting rod is fixedly installed on the outer wall of one side of the two first connecting rods, a clamping plate is fixedly installed on the two second connecting rods, and a driving mechanism is provided on the sliding block.

[0008] With the above technical solution, the rotation of the screw will drive the sliding block to move, and drive the two rotating plates on both sides to rotate, driving the first connecting rods, the second connecting rods and the clamping plates on both sides to move away from each other.

[0009] Optionally, the driving mechanism includes a screw rod that penetrates and is screwed on the sliding block, and one end of the screw rod penetrates the top outer wall of the second box body and is fixedly installed with a knob.

[0010] With the above technical solution, by rotating the knob, the rotation of the knob will drive the screw rod to rotate.

[0011] Optionally, first limit posts are penetrated and slidably installed on both of the first connecting rods, and the first limit posts are fixedly installed on the inner walls of both sides of the second box body.

[0012] With the above technical solution, by providing the first limit posts, the first connecting rods can be limited in movement.

[0013] Optionally, second limit posts are penetrated and rotatably installed on both of the rotating plates, and the two second limit posts are fixedly installed in the second box body.

[0014] With the above technical solution, by providing the second limit posts, the rotating plates can be limited in movement.

[0015] Optionally, an installation groove is provided on the outer wall of one side of the second box body, and the mounting frame is slidably installed in the installation groove.

[0016] With the above technical solution, by providing the installation groove, the mounting frame can be limited in movement.

[0017] Optionally, clamping grooves are provided on the outer walls of both sides of the mounting frame, and clamping blocks are slidably installed in the two clamping grooves, and the two clamping blocks are fixedly connected to the corresponding clamping plates.

[0018] With the above technical solution, by providing the clamping grooves and the clamping blocks, the function of strengthening the installation and fixation can be achieved.

[0019] Optionally, a placement groove is provided on the outer wall of one side of the first box body, and the temperature sensor is slidably installed in the placement groove.

[0020] With the above technical solution, by providing the placement groove, it is convenient for the temperature sensor to be slidably installed therein.

[0021] Optionally, telescopic rods are fixedly installed on the inner walls of both sides of the first box body, and telescopic springs are sleeved on the two telescopic rods. Positioning plates are fixedly installed on the ends of the two telescopic rods close to each other, and a pull plate is fixedly installed on one of the positioning plates. A sliding groove for sliding installation of the pull plate is opened on the first box body.

[0022] By adopting the above technical solution, by pulling the pull plate, the pull plate moves, thereby driving the positioning plate to move and compress the telescopic rod and the telescopic spring. At this time, the temperature sensor can be prevented from being inside the first box body, and the pull plate is released. Then, under the automatic resetting action of the telescopic rod and the telescopic spring, the positioning plate is driven to position and install the temperature sensor, thereby facilitating the installation or removal of the temperature sensor.

[0023] The present application also proposes a testing machine, which includes a wafer-level environmental reliability testing vehicle as described above.

[0024] In summary, the beneficial effects of this application are as follows:

[0025] 1. The new model of the present application adopts the cooperation of the second box body, etc., by rotating the knob, the rotation of the knob will drive the screw to rotate, the rotation of the screw will drive the sliding block to move, and drive the two rotating plates on both sides to rotate and drive the first connecting rod, the second connecting rod and the clamping plate on both sides to move away from each other, so that the first half tube and the second half tube can be disassembled, so it is convenient to disassemble, replace or maintain the elastic components inside the first half tube and the second half tube, reducing labor costs and improving work efficiency to a certain extent.

[0026] 2. The new model of the present application adopts the cooperation of telescopic springs, etc., by pulling the pull plate, the pull plate moves, which will drive the positioning plate to move and compress the telescopic rod and the telescopic spring. At this time, the temperature sensor can be prevented from being in the first box body, and the pull plate is released. Then, through the automatic resetting action of the telescopic rod and the telescopic spring, the positioning plate is driven to position and install the temperature sensor, thereby facilitating the installation or removal of the temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the entire application;

[0028] Figure 2 It is a schematic diagram of the mounting frame of this application;

[0029] Figure 3 It is a schematic diagram of the clamping plate of this application.

[0030] Figure 4 This is a schematic diagram of the first box body of this application.

[0031] Figure 5This is a schematic diagram of the telescopic spring of this application.

[0032] Description of the reference numerals in the drawings: In the figure: 1, base; 2, first half pipe; 3, second half pipe; 4, vacuum plug; 5, first box body; 6, second box body; 7, installation groove; 8, mounting bracket; 9, knob; 10, screw; 11, sliding block; 12, rotating plate; 13, first connecting rod; 14, second connecting rod; 15, clamping plate; 16, clamping groove; 17, clamping block; 18, first limiting post; 19, second limiting post; 20, temperature sensor; 21, sliding groove; 22, pull plate; 23, telescopic rod; 24, telescopic spring; 25, positioning plate; 26, placement groove. Detailed implementation manners

[0033] The following will Figures 1-5 describe this application in further detail with reference to the attached drawings.

[0034] Please refer to Figures 1-3 , a wafer-level environmental reliability test carrier and test machine, including a base 1, on which multiple groups of first half pipes 2, second half pipes 3, vacuum plugs 4 and temperature sensors 20 are respectively provided, and a connecting mechanism provided on the first half pipes 2 and the second half pipes 3, and a mounting mechanism provided on the vacuum plugs 4 for mounting the temperature sensors 20.

[0035] The connecting mechanism includes a second box body 6 fixedly installed on the first half pipe 2, a mounting bracket 8 fixedly installed on the second half pipe 3, a sliding block 11 slidably installed in the second box body 6, two rotating plates 12 rotatably installed on the sliding block 11, the same first connecting rod 13 rotatably installed on the two rotating plates 12, a second connecting rod 14 fixedly installed on the two first connecting rods 13, a clamping plate 15 fixedly installed on the two second connecting rods 14, and a driving mechanism provided on the sliding block 11 for driving the sliding block 11 to move.

[0036] During use, by rotating the screw 10, the screw 10 rotates and drives the sliding block 11 to move, and drives the two rotating plates 12 on both sides to rotate and drive the first connecting rods 13, second connecting rods 14 and clamping plates 15 on both sides to move away from each other, so as to complete the disassembly of the first half pipe 2 and the second half pipe 3.

[0037] Referring to Figure 1 and Figure 3 , the driving mechanism includes a screw 10 penetrating and screwed on the sliding block 11, a knob 9 fixedly connected to one end of the screw 10, a first limiting post 18 penetrating and sliding through the two first connecting rods 13, and a first limiting post 18 fixedly installed in the second box body 6. By rotating the knob 9, the knob 9 rotates and drives the screw 10 to rotate.

[0038] Referring to Figure 4 andFigure 5 The mounting mechanism includes a second limiting column 19 rotatably mounted on the two rotating plates 12, a mounting groove 7 opened on the outer wall of one side of the second box body 6, and a mounting frame 8 slidably mounted in the mounting groove 7, a card slot 16 opened on the outer walls of both sides of the mounting frame 8, a card block 17 slidably mounted in the card slot 16, a first box body 5 fixedly mounted on the vacuum plug 4, two telescopic rods 23 fixedly mounted in the first box body 5, and a telescopic spring 24 sleeved on the two telescopic rods 23, and a positioning plate 25 fixedly mounted on one end of the two telescopic rods 23 close to each other, and a pull plate 22 fixedly mounted on one of the positioning plates 25, and a sliding groove 21 opened for the pull plate 22 to slide and limit.

[0039] Reference Figure 4 and Figure 5 A placement groove 26 is provided on one side outer wall of the first box body 5, and the temperature sensor 20 is slidably installed in the placement groove 26. By providing the placement groove 26, the temperature sensor 20 can be limitedly installed.

[0040] By pulling the pull plate 22, the pull plate 22 moves, thereby driving the positioning plate 25 to move and compress the telescopic rod 23 and the telescopic spring 24. At this time, the temperature sensor 20 can be prevented in the first box body 5, and the pull plate 22 is released. Then, under the automatic resetting action of the telescopic rod 23 and the telescopic spring 24, the positioning plate 25 is driven to position and install the temperature sensor 20, thereby facilitating the installation or removal of the temperature sensor 20.

[0041] The present application also proposes a test machine, which includes a wafer-level environmental reliability test carrier. The specific structure of the wafer-level environmental reliability test carrier refers to the above-mentioned embodiment. Since the present test machine adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0042] The implementation principle of the present application is as follows: when in use, the adsorption surfaces on the first half tube 2 and the second half tube 3 are used to adsorb and fix the test wafer, thereby improving the stability of the placement of the test wafer and avoiding the problem of fragmentation caused by the hard contact between the test wafer and the carrier; further, only the suction nozzle constituting the adsorption surface of the entire carrier contacts the test wafer, thereby reducing the contact area between the test wafer and the carrier, ensuring air circulation, and thus improving the accuracy of the test;

[0043] When it is necessary to disassemble the first half pipe 2 and the second half pipe 3, first rotate the knob 9. The rotation of the knob 9 will drive the screw rod 10 to rotate. The rotation of the screw rod 10 will drive the sliding block 11 to move, and drive the two rotating plates 12 on both sides to rotate, driving the first connecting rod 13, the second connecting rod 14 and the clamping plates 15 on both sides to move away from each other. The mutual separation of the two clamping plates 15 can release the connection and fixation of the mounting frame 8, the first half pipe 2 and the second half pipe 3, and thus the disassembly of the first half pipe 2 and the second half pipe 3 can be completed. Therefore, it is convenient to disassemble, replace or maintain the elastic components inside the first half pipe 2 and the second half pipe 3, reducing the labor cost and improving the work efficiency to a certain extent;

[0044] By pulling the pull plate 22, the movement of the pull plate 22 will drive the positioning plate 25 to move accordingly and compress the telescopic rod 23 and the telescopic spring 24. At this time, the temperature sensor 20 can be placed in the first box body 5, and the pull plate 22 is released. Then, under the automatic reset action of the telescopic rod 23 and the telescopic spring 24, the positioning plate 25 is driven to position and install the temperature sensor 20. Therefore, it is convenient to install or disassemble the temperature sensor 20.

[0045] The above are all the preferred embodiments of this application, and the protection scope of this application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape and principle of this application should be covered within the protection scope of this application.

Claims

1. A wafer-level environmental reliability test carrier, comprising a base (1), wherein the base (1) is provided with a plurality of groups of first half tubes (2), second half tubes (3), vacuum plugs (4) and temperature sensors (20), characterized in that: The outer surfaces of both sides of the first half tube (2) and the second half tube (3) are provided with connection mechanisms; The connecting mechanism comprises a second box body (6) fixedly mounted on the first half pipe (2) and a mounting frame (8) fixedly mounted on the second half pipe (3); a sliding block (11) is slidably mounted in the second box body (6); two rotating plates (12) are symmetrically rotatably mounted on one side outer wall of the sliding block (11); the same first connecting rod (13) is rotatably mounted on the two rotating plates (12); second connecting rods (14) are fixedly mounted on one side outer wall of the two first connecting rods (13); clamping plates (15) are fixedly mounted on the two second connecting rods (14); and a driving mechanism is provided on the sliding block (11).

2. The wafer-level environmental reliability test vehicle according to claim 1, characterized in that: The driving mechanism comprises a screw rod (10) which passes through and is screwed onto a sliding block (11); one end of the screw rod (10) passes through the top outer wall of the second box body (6) and is fixedly mounted with a knob (9).

3. The wafer-level environmental reliability test vehicle according to claim 1, characterized in that: A first limiting column (18) is passed through and slidably mounted on each of the two first connecting rods (13); the first limiting column (18) is fixedly mounted on the inner walls on both sides of the second box body (6).

4. The wafer-level environmental reliability test carrier according to claim 3, characterized in that: A second limiting column (19) is passed through and rotatably mounted on both of the two rotating plates (12), and both of the second limiting columns (19) are fixedly mounted in the second box body (6).

5. The wafer-level environmental reliability test carrier according to claim 4, characterized in that: An installation groove (7) is provided on one side outer wall of the second box body (6), and the installation frame (8) is slidably installed in the installation groove (7).

6. The wafer-level environmental reliability test carrier according to claim 5, characterized in that: The outer walls of both sides of the mounting frame (8) are provided with a card slot (16), and a card block (17) is slidably installed in each of the two card slots (16), and the two card blocks (17) are fixedly connected to the corresponding clamping plates (15).

7. The wafer-level environmental reliability test vehicle according to claim 1, characterized in that: A first box body (5) is fixedly mounted on one side of the vacuum plug (4); a placement groove (26) is provided on an outer wall of one side of the first box body (5); and the temperature sensor (20) is slidably mounted in the placement groove (26).

8. The wafer-level environmental reliability test carrier according to claim 7, characterized in that: Telescopic rods (23) are fixedly mounted on the inner walls of both sides of the first box body (5), and telescopic springs (24) are sleeved on the two telescopic rods (23). Positioning plates (25) are fixedly mounted on the ends of the two telescopic rods (23) close to each other, and a pull plate (22) is fixedly mounted on one of the positioning plates (25). The first box body (5) is provided with a sliding groove (21) for slidingly mounting the pull plate (22).

9. A testing machine, characterized in that: The testing machine includes a wafer-level environmental reliability testing carrier as described in any one of claims 1-8.

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