IC mounting structure of optical mouse

Abstract

The utility model discloses an integrated circuit (IC) mounting structure of an optical mouse, which comprises a main circuit board and an encoder, and the encoder is mounted and welded on the main circuit board. A light-emitting module is mounted and welded on the main circuit board, and a through hole matched with the light-emitting module is formed in the main circuit board; the light-emitting module comprises a micro circuit board and a light-emitting assembly, the light-emitting assembly is welded to the front face of the micro circuit board in a surface-mounted mode, and the front face of the micro circuit board is welded to the front face of the main circuit board in a surface-mounted The light-emitting component is indirectly mounted and welded on the main circuit board through the micro circuit board, so that the assembly efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic mice, and particularly to an IC mounting structure of an optoelectronic mouse. Background Art

[0002] The mouse IC, namely the main control chip of the mouse, is the core component inside the mouse, responsible for coordinating the work of each component in the optoelectronic mouse, communicating with the external circuit, and transmitting and receiving various optoelectronic signals. The encoder and the light-emitting component are important components on the optoelectronic mouse IC. The mouse encoder can convert the movement and rotation of the mouse into digital signals that the computer can understand; the light-emitting component of the mouse is mainly responsible for emitting, reflecting, and receiving light signals, and converting these signals into digital signals that the computer can recognize, so as to realize the positioning and movement control of the mouse. In the prior art, when the encoder is mounted and welded to the front side of the circuit board, generally, due to the mounting and welding, the light-emitting surface of the light-emitting component cannot face the back side of the circuit board. Therefore, the light-emitting component is usually welded to the circuit board by means of pin welding, so that the light-emitting surface of the light-emitting component can face the back side of the circuit board, and the light-emitting component immediately sends the light signal to the desktop and then is reflected back to the light-emitting component by the lens component. However, pin welding is not conducive to the integration of mouse IC components and has the defect of low welding efficiency. Content of the Utility Model

[0003] To solve the above technical problems, the utility model provides an IC mounting structure of an optoelectronic mouse.

[0004] The technical solution of the utility model is: an IC mounting structure of an optoelectronic mouse, including a main circuit board and an encoder, and the encoder is mounted and welded on the main circuit board. A light-emitting module is mounted and welded on the main circuit board, and a through hole for cooperating with the light-emitting module is provided on the main circuit board; the light-emitting module includes a micro circuit board and a light-emitting component, the light-emitting component is mounted and welded on the front side of the micro circuit board, and the front side of the micro circuit board is mounted and welded on the front side of the main circuit board.

[0005] Further, a first solder joint is provided at a position corresponding to the encoder on the front side of the main circuit board.

[0006] Further, a second solder joint is provided at a position corresponding to the light-emitting module on the front side of the main circuit board, and the second solder joint is located on both sides of the through hole.

[0007] Further, a third solder joint is provided at a position corresponding to the second solder joint on the front side of the micro circuit board, and the light-emitting component passes through the through hole to the back side of the main circuit board.

[0008] Further, a light-emitting port is provided on one side of the light-emitting component, and a photosensitive port is provided on the other side; a lens component is provided on the back side of the main circuit board corresponding to the light-emitting component.

[0009] Further, a chamfer is provided at one end of the light-emitting component, and the through hole is matched with the chamfer.

[0010] Compared with the prior art, the advantages of the present utility model are as follows: The light-emitting component is mounted on the micro circuit board, with high soldering efficiency, reduced volume occupied by the light-emitting component, and improved overall integration of the mouse IC. Since the surface mounting soldering process is adopted, there is no need to set up a socket, reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0012] Figure 1 is a front view of the whole of the present utility model;

[0013] Figure 2 is a back view of the whole of the present utility model;

[0014] Figure 3 is a front view of the main circuit board of the present utility model;

[0015] Figure 4 is a front view of the light-emitting module of the present utility model.

[0016] Wherein: 1, main circuit board; 2, light-emitting module; 3, encoder; 4, lens assembly; 11, first solder joint; 12, second solder joint; 13, through hole; 21, micro circuit board; 22, light-emitting component; 211, third solder joint; 221, light-emitting port; 222, photosensitive port; 223, chamfer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] To make the objectives, technical solutions, and advantages of the present utility model clearer, the following will clearly and completely describe the technical solutions of the present utility model. Obviously, the described embodiments are only some of the embodiments of the present utility model, rather than all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope protected by the present utility model.

[0018] The following will describe the specific embodiments of the present utility model in conjunction with the drawings:

[0019] As Figures 1 to 4As shown in the figure, an optical mouse IC mounting structure includes a main circuit board 1 and an encoder 3. A first solder joint 11 is provided on the front surface of the main circuit board 1 at a position corresponding to the encoder 3, and the encoder 3 is mounted and welded on the main circuit board 1 through the first solder joint 11. A light-emitting module 2 is mounted and welded on the main circuit board, and a through hole 13 for cooperating with the light-emitting module 2 is provided on the main circuit board 1.

[0020] The light-emitting module 2 includes a micro circuit board 21 and a light-emitting component 22. A second solder joint 12 is provided on the front surface of the main circuit board 1 at a position corresponding to the micro circuit board 21, and the second solder joint 12 is located on both sides of the through hole 13. The micro circuit board 21 is mounted and welded on the front surface of the main circuit board 1 through the second soldering. A third solder joint 211 is provided on the front surface of the micro circuit board 21 at a position corresponding to the second solder joint 12, and the light-emitting component 22 is mounted and welded on the front surface of the micro circuit board 21 through the third solder joint 211. One side of the light-emitting component 22 passes through the through hole 13 to the back surface of the main circuit board 1. A chamfer 223 is provided at one end of the light-emitting component 22, and the contour of the through hole 13 cooperates with the chamfer 223 to facilitate quickly determining the welding position of the light-emitting component 22. A light-emitting port 221 and a photosensitive port 222 are provided on the side of the light-emitting component 22 passing through the through hole 13, and a lens assembly 4 is provided on the back surface of the main circuit board 1 corresponding to the light-emitting component 22. Since the micro circuit board 21 has a certain thickness, in order to ensure that the lens assembly 4 maintains a good focal length, the height of the lens assembly 4 relative to the light-emitting component 22 in this technical solution is higher than the thickness of the micro circuit board 21 compared with the conventional lens assembly 4. The light-emitting port 221 emits a light signal, and the light signal returns to the photosensitive port 222 under the reflection of the lens assembly 4.

[0021] The working principle of the specific embodiment of the present utility model is as follows: The light-emitting component 22 is mounted and welded to the micro circuit board 21 to form the light-emitting module 2. Then the light-emitting module 2 is passed through the through hole 13, and the micro circuit board 21 is mounted and welded to the main circuit board 1 through the third solder joint 211, so that the light-emitting component 22 is indirectly electrically connected to the main circuit board 1.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "upper", "lower", "left", "right", "front", "rear" and similar expressions used herein are only for the purpose of illustration.

[0023] The above are only the preferred embodiments of the present invention and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An optical mouse IC mounting structure, comprising a main circuit board (1) and an encoder (3), wherein the encoder (3) is mounted and welded on the main circuit board (1), characterized in that: The main circuit board (1) is mounted and welded with a light-emitting module (2), and the main circuit board (1) is provided with a through hole (13) for matching with the light-emitting module (2); the light-emitting module (2) comprises a micro circuit board (21) and a light-emitting component (22), the light-emitting component (22) is mounted and welded on the front side of the micro circuit board (21), and the front side of the micro circuit board (21) is mounted and welded on the front side of the main circuit board (1).

2. The optical mouse IC mounting structure according to claim 1, characterized in that: A first welding point (11) is provided on the front side of the main circuit board (1) at a position corresponding to the encoder (3).

3. The optical mouse IC mounting structure according to claim 1, characterized in that: A second soldering point (12) is provided on the front side of the main circuit board (1) at a position corresponding to the light-emitting module (2), and the second soldering point (12) is located on both sides of the through hole (13).

4. The optical mouse IC mounting structure according to claim 3, characterized in that: A third soldering point (211) is provided on the front side of the micro circuit board (21) at a position corresponding to the second soldering point (12), and the light-emitting component (22) passes through the through hole (13) to the back side of the main circuit board (1).

5. The optical mouse IC mounting structure according to claim 1, characterized in that: A light-emitting port (221) is provided on one side of the light-emitting component (22), and a light-sensing port (222) is provided on the other side; a lens component (4) is provided on the back side of the main circuit board (1) corresponding to the light-emitting component (22).

6. The optical mouse IC mounting structure according to claim 1, characterized in that: One end of the light-emitting component (22) is provided with a chamfer (223), and the through hole (13) matches the chamfer (223).

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