Electronic component

Abstract

The present disclosure provides an electronic component capable of reducing capacitance variation of a capacitor during manufacturing while suppressing a ratio of an area occupied by the capacitor in the electronic component. A filter device (100), which is an example of an electronic component of the present disclosure, comprises: an insulator (3) having a pair of main surfaces facing each other and side surfaces connecting the main surfaces; and a capacitor (C1) in which elements comprising electrodes respectively formed in each of the at least three layers in the insulator (3) are connected in series. In the capacitor (C1), the electrode patterns (5f-5h) formed in each layer are arranged at positions overlapping each other in a plan view from the lamination direction, and at least one wiring pattern (6h) is electrically connected to at least the electrode pattern (5h) formed in one layer. At least a portion of the wiring pattern (6h) protrudes from one side of the electrode pattern (5g) that overlaps in a plan view from the stacking direction.

Description

Technical Field

[0001] The present disclosure relates to electronic components. Background Art

[0002] There is known an electronic component which is a filter device formed by integrating an inductor (coil) and a capacitor (condenser) inside an insulator formed by laminating a plurality of insulator layers. As an example of the filter device, a filter device having an inductor and a capacitor built in an insulator formed with an external electrode is described in Japanese Unexamined Patent Application Publication No. 2013-21449 (Patent Document 1). In this filter device, when the insulator is viewed from the top surface side, the inductor is laminated on the capacitor.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013-21449 Summary of the Utility Model

[0006] Problems to be Solved by the Utility Model

[0007] In the case of realizing a filter device with a small-sized component, in the portion constituting the capacitor, while ensuring a desired capacitance, each electrode needs to be designed to be small. As factors for capacitance variation of the capacitor in the process of manufacturing the component, there are the area of the electrode and the distance between the electrodes. In particular, as factors for area variation of the electrode, there are electrode position deviation, electrode size deviation, and the like. In the case of miniaturizing the electronic component, it is desirable to have a structure that suppresses the proportion of the area occupied by the capacitor in the electronic component while reducing the capacitance variation of the capacitor in the manufacturing process.

[0008] Therefore, an object of the present disclosure is to provide an electronic component that can suppress the proportion of the area occupied by the capacitor in the electronic component while reducing the capacitance variation of the capacitor in the manufacturing process.

[0009] Solution to the Problem

[0010] An electronic component according to one aspect of the present disclosure includes: an insulator having a pair of main surfaces facing each other and side surfaces connecting the main surfaces; and a capacitor formed by serially connecting elements each composed of electrodes formed in at least three layers in the insulator. In the capacitor, the electrodes formed in each layer are arranged at overlapping positions when viewed from the lamination direction, and at least one wiring pattern is electrically connected to at least one of the electrodes formed in one layer. At least a part of the wiring pattern extends from one side of the electrodes that overlap when viewed from the lamination direction and the side opposite to the one side.

[0011] Alternatively, the capacitor may be composed of three layers, including: a first electrode formed on a first layer; a second electrode formed on a second layer, which overlaps with the first electrode when viewed from above in the stacking direction; and a third electrode formed on a third layer, which overlaps with the second electrode when viewed from above in the stacking direction, and at least a part of the wiring pattern connected to the third electrode extends from one side of the second electrode.

[0012] Alternatively, the area of the second electrode of the capacitor is larger than the area of the first electrode and larger than the area of the third electrode.

[0013] Alternatively, the electronic component further includes an external electrode provided on the side surface of the insulator, and the wiring pattern is electrically connected to the external electrode.

[0014] Alternatively, the electronic component further includes an inductor formed on a layer different from the capacitor, and the inductor is connected in series with the capacitor.

[0015] Alternatively, when viewed from above in the stacking direction, the shape of the electrode of the capacitor is a rectangular shape, and the wiring width of the wiring pattern is shorter than the length of one side of the electrode connected to the wiring pattern.

[0016] Alternatively, the wiring width of the wiring pattern is the same as the length of one side of the electrode connected to the wiring pattern.

[0017] Alternatively, when viewed from above in the stacking direction, the combined shape of the electrode of the capacitor and the wiring pattern connected to the electrode is a cross shape or a letter T shape.

[0018] Alternatively, the inductor has a first inductor and a second inductor connected in parallel with the first inductor.

[0019] Alternatively, the second inductor is magnetically coupled with the first inductor.

[0020] Effects of the utility model

[0021] According to one aspect of the present disclosure, in a capacitor formed by serially connecting elements each composed of electrodes formed on at least three different layers, since there is an electrode connected to a wiring pattern, and the wiring pattern extends from one side of the overlapping electrodes, it is possible to reduce the capacitance variation of the capacitor during the manufacturing process while suppressing the proportion of the area occupied by the capacitor in the electronic component. Description of the drawings

[0022] Figure 1 It is a perspective view of the filter device of the embodiment.

[0023] Figure 2 It is a side view of the filter device of the embodiment.

[0024] Figure 3 It is a circuit diagram of the filter device of the embodiment.

[0025] Figure 4 It is an exploded top view showing the structure of the filter device of the embodiment.

[0026] Figure 5 It is a top view of the electrode of the capacitor constituting the filter device of the embodiment.

[0027] Figure 6 It is a top view of the electrode of the capacitor serving as the comparison object.

[0028] Figure 7 It is a top view of the electrode of the capacitor constituting Modification 1.

[0029] Figure 8 It is a top view of the electrode of the capacitor constituting Modification 2. Detailed Embodiment

[0030] Hereinafter, as an example of an electronic component of the embodiment, a filter device will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding parts in the drawings are denoted by the same reference numerals, and their description will not be repeated. Furthermore, the electronic component of the embodiment is not limited to the filter device.

[0031] (Embodiment)

[0032] [Structure of Filter Device]

[0033] First, the filter device of the embodiment will be described with reference to the accompanying drawings. Figure 1 It is a perspective view of the filter device 100 of the embodiment. Figure 2 It is a side view of the filter device 100 of the embodiment. Here, in Figure 1 and Figure 2 the short side direction of the filter device 100 is set as the X direction, the long side direction is set as the Y direction, and the height direction is set as the Z direction.

[0034] The filter device 100 is a rectangular parallelepiped chip component formed by laminating two inductors and one capacitor in the Z direction. As shown in Figure 1 and Figure 2As shown, the filter device 100 includes an insulator 3 formed by laminating a plurality of insulating substrates (insulator layers) on which a conductor pattern of inductor L1, a conductor pattern of inductor L2, and an electrode pattern of capacitor C1 are formed. In addition, the stacking direction of the insulating substrates is represented by the Z direction, and the arrow direction represents the upper layer direction. Further, the insulating substrates are formed of materials such as insulating materials mainly composed of borosilicate glass, alumina, zirconia, insulating resins such as polyimide resin, etc. There are also cases where the interfaces of the plurality of insulating substrates become unclear due to processes such as firing and curing of the insulator 3.

[0035] In addition, the filter device 100 is formed with external electrodes 4a (first external electrodes) and external electrodes 4b (second external electrodes) at two positions in the Y direction of the insulator 3 as Figure 1 shown. In addition, the insulator 3 has a pair of main surfaces facing each other, Figure 1 and the lower main surface is the mounting surface, which faces the circuit board. In the present embodiment, the Figure 1 lower main surface is also referred to as the bottom surface, and the Figure 1 upper main surface is also referred to as the top surface.

[0036] The external electrodes 4a and the external electrodes 4b are formed with electrode patterns not only on the bottom surface of the insulator 3 but also on the side surfaces connecting the main surfaces of the insulator 3. When observing the insulator 3 from the short side surface (XZ plane), the external electrodes 4a and the external electrodes 4b are in the shape of the letter U. Therefore, the electrode patterns of the external electrodes 4a provided on the opposite side surfaces and the bottom surface of the insulator 3 are at the same potential. Similarly, the electrode patterns of the external electrodes 4b provided on the opposite side surfaces and the bottom surface of the insulator 3 are at the same potential.

[0037] Both the external electrodes 4a and the external electrodes 4b are described as having electrode patterns provided on three surfaces of the insulator 3. However, this is not limited thereto, and as long as both the external electrodes 4a and the external electrodes 4b have electrode patterns provided on at least one surface of the insulator 3. For example, it may also be that the external electrodes 4a have electrode patterns provided on two surfaces of the long side surface (YZ plane) of the insulator 3, and the external electrodes 4b have electrode patterns provided only on one surface of the short side surface (XZ plane) of the insulator 3.

[0038] As Figure 1 shown, the conductor pattern 1a of the inductor L1 and the external electrode 4a are electrically connected on the side surface of the insulator 3 by means of a wiring pattern 11a. Although not shown in Figure 1 , the conductor pattern 1c of the inductor L1 and the external electrode 4b are electrically connected on the side surface of the insulator 3 by means of a wiring pattern 11c (refer to Figure 4 ). In addition, the conductor pattern 2d of the inductor L2 and the external electrode 4b are in Figure 1Although not shown in the figure, the side of the insulator 3 is electrically connected by means of the wiring pattern 12d (see Figure 4 ).

[0039] like Figure 1 As shown, the electrode pattern 5f of the capacitor C1 and the conductor pattern 2e of the inductor L2 are electrically connected by a via conductor 34 (interlayer conductor). Figure 1 As shown, the electrode pattern 5h of the capacitor C1 and the external electrode 4a are electrically connected via the wiring pattern 6h on the side surface of the insulator 3. The electrode pattern 5h and the external electrode 4a are also electrically connected on the bottom surface of the insulator 3 via the via conductor 35 and the via conductor 37 (see Figure 4 ).

[0040] like Figure 2 As shown, the inductor L1 has a plurality of conductor patterns 1a, 1b, and 1c stacked parallel to the main surface of the insulator 3. The conductor pattern 1a and the conductor pattern 1b are electrically connected by a via conductor 31, and the conductor pattern 1b and the conductor pattern 1c are electrically connected by a via conductor 32. Figure 2 As shown, in the inductor L2 , a plurality of conductor patterns 2 d and 2 e are stacked in parallel with the main surface of the insulator 3 in the lower layer of the inductor L1 . The conductor pattern 2 d and the conductor pattern 2 e are electrically connected by a via conductor 33 .

[0041] like Figure 2 As shown, multiple electrode patterns 5f, 5g, and 5h of capacitor C1 are stacked on the lower layer of inductor L2 through an insulating layer. In other words, capacitor C1 is a structure in which two capacitor elements composed of electrode patterns 5f, 5g, and 5h formed in each layer of the three layers are connected in series. Capacitor C1 is arranged in an area with less overlap with inductor L1 and inductor L2 when viewed from the stacking direction. In addition, inductor L1 and inductor L2 are arranged in an overlapping manner when viewed from the stacking direction. In addition, inductor L2 and capacitor C1 are connected in series in insulator 3 to form an LC series circuit.

[0042] Figure 3 : is a circuit diagram of a filter device 100 according to an embodiment. The filter device 100 includes a first terminal P1, an inductor L1 connected to the first terminal P1, an inductor L2 connected to the first terminal P1 in parallel with the inductor L1, a capacitor C1 connected in series with the inductor L2, and a second terminal P2 connected to the inductor L1 and the capacitor C1. Figure 1 The second terminal P2 corresponds to the external electrode 4b shown in FIG. Figure 1 The outer electrode 4a shown corresponds.

[0043] In addition, the inductor L1 and the inductor L2 are magnetically coupled to each other (coupling coefficient k). As a result, a mutual inductance M is generated between the inductor L1 and the inductor L2. Of course, the filter device 100 is not limited to the case where the inductor L1 and the inductor L2 are magnetically coupled to each other, and may also have a structure in which the inductor L1 and the inductor L2 are not magnetically coupled to each other. In addition, when current flows out from the wiring pattern 11c, the directions of the magnetic fields generated by the inductor L1 and the inductor L2 are not limited to the case where they are in opposite directions as shown in Figure 1 but may also be in the same direction.

[0044] [Exploded top view of the filter device]

[0045] Next, the structure of each layer will be described using the exploded top view. Figure 4 is an exploded top view showing the structure of the filter device 100 according to the embodiment. First, as shown in Figure 4 , the conductor patterns 1a to 1c, 2d, 2e, the wiring patterns 11a, 11c, 12d, 6h, 7h, 8h to 8j, 9i, 9j, and the electrode patterns 5f, 5g, 5h are respectively formed on the insulating substrates 3a to 3j by a printing process method.

[0046] A conductor pattern 1a forming a part of the inductor L1 is formed on the insulating substrate 3a. The conductor pattern 1a is formed in a manner of rotating approximately 3 / 4 of a turn clockwise from the upper left side of the insulating substrate 3a in the figure. The starting end of the conductor pattern 1a is electrically connected to the external electrode 4a through the wiring pattern 11a. A connection portion 31a connected to the via conductor 31 is provided near the terminal end of the conductor pattern 1a.

[0047] A conductor pattern 1b forming a part of the inductor L1 is formed on the insulating substrate 3b. The conductor pattern 1b is formed in a manner of rotating approximately 3 / 4 of a turn clockwise from the lower left side of the insulating substrate 3b in the figure. A connection portion 31b connected to the via conductor 31 is provided near the starting end of the conductor pattern 1b. A connection portion 32b connected to the via conductor 32 is provided near the terminal end of the conductor pattern 1b.

[0048] A conductor pattern 1c forming a part of the inductor L1 is formed on the insulating substrate 3c. The conductor pattern 1c is formed in a manner of rotating approximately 3 / 4 of a turn clockwise from the lower right side of the insulating substrate 3c in the figure. A connection portion 32c connected to the via conductor 32 is provided near the starting end of the conductor pattern 1c. The terminal end of the conductor pattern 1c is electrically connected to the external electrode 4b through the wiring pattern 11c. The inductor L1 is formed by connecting the conductor patterns 1a to 1c in series to form a coil of approximately two turns.

[0049] On the insulating substrate 3d, a conductor pattern 2d that forms a part of the inductor L2 is formed. The conductor pattern 2d is formed in a manner that rotates approximately 3 / 4 of a turn clockwise from the upper right side of the insulating substrate 3d in the figure. The starting end of the conductor pattern 2d is electrically connected to the external electrode 4b via the wiring pattern 12d. A connection portion 33d connected to the via conductor 33 is provided near the terminal end of the conductor pattern 2d.

[0050] On the insulating substrate 3e, a conductor pattern 2e that forms a part of the inductor L2 is formed. The conductor pattern 2e is formed in a manner that rotates approximately 3 / 4 of a turn clockwise from the upper left side of the insulating substrate 3e in the figure. A connection portion 33e connected to the via conductor 33 is provided near the starting end of the conductor pattern 2e. A connection portion 34e connected to the via conductor 34 is provided near the terminal end of the conductor pattern 2e. The inductor L2 is formed by connecting the conductor patterns 2e and 2f in series to form a coil of approximately 1.5 turns.

[0051] On the insulating substrate 3f, an electrode pattern 5f that forms one electrode (the first electrode) of the capacitor C1 is formed. Since the electrode pattern 5f is provided at a position overlapping the center of the region that does not overlap the openings of the inductors L1 and L2 when viewed from the stacking direction, it does not interfere with the magnetic field at the center of the opening, which is particularly vulnerable to the magnetic field formed by the inductors L1 and L2, and the filter device 100 can be realized with small components. The electrode pattern 5f has a connection portion 34f connected to the via conductor 34.

[0052] On the insulating substrate 3g, an electrode pattern 5g that forms one electrode (the second electrode) of the capacitor C1 is formed. The electrode pattern 5g is provided at a position overlapping the electrode pattern 5f formed on the insulating substrate 3f when viewed from the stacking direction. The area of the electrode pattern 5g is larger than the area of the electrode pattern 5f.

[0053] On the insulating substrate 3h, an electrode pattern 5h that forms one electrode (the third electrode) of the capacitor C1 is formed. The electrode pattern 5h is provided at a position overlapping the electrode pattern 5g formed on the insulating substrate 3g when viewed from the stacking direction. The area of the electrode pattern 5h is smaller than the area of the electrode pattern 5g. The electrode pattern 5h is electrically connected to the external electrode 4a via the wiring pattern 6h. In addition, although the wiring pattern 6h is illustrated as two wirings extending from the long side of the electrode pattern 5h to the external electrode 4a, it may also be composed of one wiring or three or more wirings. Furthermore, the wiring pattern 6h has a connection portion 35h connected to the via conductor 35.

[0054] The capacitor C1 is configured such that the electrode patterns 5f to 5h formed in each of the three layers are arranged to overlap when viewed from above in the stacking direction, so that two capacitor elements each composed of three electrodes are connected in series. In the capacitor C1, the area of the electrode of the electrode pattern 5g (the electrode pattern of the second electrode) is larger than the area of the electrode of the electrode pattern 5f (the electrode pattern of the first electrode) and larger than the area of the electrode of the electrode pattern 5h (the electrode pattern of the third electrode). In addition, at least a part of the wiring pattern 6h connected to the electrode pattern 5h extends from one side of the electrode pattern 5g. By configuring the capacitor C1 in this way, it is possible to reduce the capacitance variation of the capacitor C1 during the manufacturing process while suppressing the proportion of the area occupied by the capacitor C1 in the filter device 100, as will be described later.

[0055] A wiring pattern 7h and a wiring pattern 8h are also formed on the insulating substrate 3h. The wiring pattern 7h and the wiring pattern 8h partially overlap and are electrically connected. In addition, the wiring pattern 8h has a connection portion 36h connected to the via conductor 36. The wiring pattern 7h is electrically connected to the external electrode 4b (see Figure 1 ) formed on the long side of the insulating substrate 3h. Therefore, the wiring pattern 7h functions as a wiring for electrically connecting the external electrode 4b and the wiring pattern 8h.

[0056] A wiring pattern 8i and a wiring pattern 9i are formed on the insulating substrate 3i. The wiring pattern 8i is arranged at a position overlapping the wiring pattern 8h formed on the insulating substrate 3h when viewed from above in the stacking direction. The wiring pattern 9i is arranged at a position overlapping the wiring pattern 6h formed on the insulating substrate 3h when viewed from above in the stacking direction. The wiring pattern 8i has a connection portion 36i connected to the via conductor 36. The wiring pattern 9i has a connection portion 35i connected to the via conductor 35 and a connection portion 37i connected to the via conductor 37.

[0057] A wiring pattern 8j and a wiring pattern 9j are formed on the insulating substrate 3j. The wiring pattern 8j is arranged at a position overlapping the wiring pattern 8i formed on the insulating substrate 3i when viewed from above in the stacking direction. The wiring pattern 9j is arranged at a position overlapping the wiring pattern 9i formed on the insulating substrate 3i when viewed from above in the stacking direction. The wiring pattern 8j has a connection portion 36j connected to the via conductor 36. The wiring pattern 9j has a connection portion 37j connected to the via conductor 37.

[0058] On the insulating substrate 3k, connection portions 37k that connect the external electrode 4a and the via conductor 37 and connection portions 36k that connect the external electrode 4b and the via conductor 36 are formed. The wiring pattern 6h is electrically connected not only to the side surface of the external electrode 4a but also to the bottom surface of the external electrode 4a via the via conductor 35 and the via conductor 37. Thus, even when the electrical connection is cut off in the path between the external electrode 4a formed on the side surface of the insulator 3 and the external electrode 4a formed on the bottom surface of the insulator 3, the electrical connection can be maintained using the path through the wiring pattern 6h, the via conductor 35, and the via conductor 37 within the insulator 3. Of course, if such a redundant structure is not required, the wiring patterns 9i, 9j and the via conductors 35, 37 may not be provided.

[0059] The wiring pattern 7h is electrically connected not only to the side surface of the external electrode 4b but also to the bottom surface of the external electrode 4b via the wiring pattern 8h and the via conductor 36. Thus, even when the electrical connection is cut off in the path between the external electrode 4b formed on the side surface of the insulator 3 and the external electrode 4b formed on the bottom surface of the insulator 3, the electrical connection can be maintained using the path through the wiring pattern 7h, 8h and the via conductor 36 within the insulator 3. Of course, if such a redundant structure is not required, the wiring patterns 7h, 8h - 8j and the via conductor 36 may not be provided.

[0060] [Structure of capacitor C1]

[0061] In the filter device 100, a capacitor C1 having a structure in which two capacitor elements each constituted by three electrodes (electrode patterns 5f - 5h) are connected in series is adopted. Further, the capacitor C1 is configured such that at least a part of the wiring pattern 6h connected to the electrode pattern 5h protrudes from one side of the electrode pattern 5g. The structure of this capacitor C1 will be described in more detail.

[0062] Figure 5 is a top view of the electrodes of the capacitor C1 that constitutes the filter device 100 of the embodiment. Figure 6 is a top view of the electrodes of the capacitor serving as a comparison object. The capacitor C1 has a structure in which Figure 5 the electrode patterns 5f - 5h shown are arranged to overlap in the stacking direction, so that the capacitor element C1a constituted by the electrode pattern 5f and the electrode pattern 5g and the capacitor element C1b constituted by the electrode pattern 5g and the electrode pattern 5h (including a part of the wiring pattern 6h) are connected in series. In the capacitor C1, the electrode patterns 5f, 5h having a smaller area are arranged above and below the electrode pattern 5g having a larger area in the stacking direction.

[0063] Since the capacitance of a capacitor is determined by the area where the opposing electrodes overlap, in the capacitor element C1a composed of the electrode pattern 5g with a larger area and the electrode pattern 5f with a smaller area, the capacitance is determined by the area of the electrode pattern 5f. Similarly, in the capacitor element C1b composed of the electrode pattern 5g with a larger area and the electrode pattern 5h (including a part of the wiring pattern 6h) with a smaller area, the capacitance is determined by the area of the electrode pattern 5h (including a part of the wiring pattern 6h).

[0064] Therefore, even if Figure 5 as shown, the area of the electrode pattern 5g becomes larger like the electrode pattern 51g due to dimensional deviations during the manufacturing process, the capacitance of the capacitor C1 will not change. On the other hand, if the areas of the electrode patterns 5f and 5h become larger like the electrode patterns 51f and 51h due to dimensional deviations during the manufacturing process, the capacitance of the capacitor C1 will change.

[0065] As Figure 6 shown in (a) of, the capacitor Ca composed of the electrode pattern 5a and the electrode pattern 5b is a capacitor composed of two layers of electrodes with the same interlayer distance as the electrode patterns 5f and 5g Figure 5 shown. Therefore, in order to achieve the same capacitance as the capacitor C1 Figure 5 shown, it is necessary to reduce the area of each electrode of the capacitor Ca. Since the dimensional deviations during the manufacturing process are constant regardless of the electrode size, if the electrode pattern 5a becomes the electrode pattern 51a, the capacitance of the capacitor Ca will change. In the capacitor Ca, since the area of the electrode pattern 5a, which is smaller than the areas of the electrode patterns 5f and 5h Figure 5 shown, changes, the rate of change of the capacitance of the capacitor Ca will change to a greater extent. That is to say, in the present embodiment, by using the electrode patterns 5f and 5h with an area larger than that of the electrode pattern 5a Figure 6 shown in (a), even if the area of either one of them changes due to dimensional deviations during the manufacturing process, the rate of change of the capacitance of the capacitor C1 is reduced compared to the capacitor Ca.

[0066] In addition, by configuring the electrode patterns 5f and 5h, which are smaller in area than the electrode pattern 5g, above and below in the stacking direction to form the capacitor C1, even if the positions of the electrode patterns 5f and 5h deviate from the electrode pattern 5g due to the manufacturing process, as long as it is within the range overlapping with the electrode pattern 5g, the capacitance of the capacitor C1 will not change.

[0067] Furthermore, in the present embodiment, as Figure 5As shown, a wiring pattern 6h is connected to the electrode pattern 5h. Therefore, the overlapping portion of the wiring pattern 6h and the electrode pattern 5g when viewed from the stacking direction is also included in the capacitance of the capacitor C1. When the area of the wiring pattern 6h varies due to dimensional deviations during the manufacturing process, it becomes the wiring pattern 61h as shown in Figure 5 . When changing from the wiring pattern 6h to the wiring pattern 61h, the overlapping area of the wiring pattern 6h and the electrode pattern 5g only varies in the wiring width direction of the wiring pattern 6h, and does not vary in the length direction of the wiring pattern 6h. The wiring pattern 6h extends from one side of the electrode pattern 5g and the side opposite to the one side in its length direction.

[0068] On the other hand, as shown in (b) of Figure 6 , in the capacitor Cb formed by the electrode pattern 5c, the electrode pattern 5d, and the electrode pattern 5e, no wiring pattern is connected to the electrode pattern 5e. Therefore, the portion of the electrode pattern 5e where no wiring pattern is connected also varies as the overlapping area with the electrode pattern 5g, and dimensional deviations of the electrodes will affect the capacitance variation of the capacitor Cb. Therefore, in the present embodiment, by connecting the wiring pattern 6h to the electrode pattern 5h, the variation of the area of the wiring pattern 6h in the length direction of the wiring pattern 6h can be ignored, and thus the capacitance variation of the capacitor C1 can be reduced.

[0069] Furthermore, specific numerical values are used to illustrate the case where the capacitance variation of the capacitor C1 can be reduced. When applying the error propagation theory, the capacitance variation of the capacitor C1 can be expressed as in Equation 1.

[0070]

Equation 1

[0071]

[0072] Here, let the capacitance of the capacitor C1 be C, the relative permittivity be ε r , the area of the electrode pattern be S, and the distance between the electrode patterns be D.

[0073] According to Equation 1, in order to suppress the variation of the capacitance C of the capacitor C1, it is necessary to reduce at least one of the variation of the relative permittivity ε r , the variation of the area S of the electrode pattern, and the variation of the distance D between the electrode patterns. In the present embodiment, attention is focused on the variation of the area S of the electrode pattern to suppress the variation of the capacitance C of the capacitor C1.

[0074] In the following description, with the area S of the electrode pattern kept constant, the variation amount ΔS of the area that varies due to dimensional deviations during the manufacturing process is evaluated to confirm whether the variation in the capacitance C of the capacitor C1 can be reduced. The simulation results described below were calculated with dimensional deviations during the manufacturing process set to 50 μm and the position offset set to 50 μm.

[0075] In Figure 5 the capacitor C1 shown, the area of the electrode pattern 5f is 150 μm × 300 μm, the area of the electrode pattern 5g is 200 μm × 350 μm, the area of the electrode pattern 5h is 150 μm × 300 μm, and the area of the portion of the wiring pattern 6h extending from the electrode pattern 5h is 100 μm × 100 μm × 2 strips. The area of the electrode that is effective as capacitance in the capacitor element C1a formed by the electrode pattern 5f and the electrode pattern 5g becomes the area of the electrode pattern 5f with the smaller area (150 μm × 300 μm). The area of the electrode that is effective as capacitance in the capacitor (a part of the capacitor element C1b) formed by the electrode pattern 5g and the electrode pattern 5h becomes the area of the electrode pattern 5h with the smaller area (150 μm × 300 μm). Further, the area of the electrode that is effective as capacitance in the capacitor (a part of the capacitor element C1b) formed by the portion of the wiring pattern 6h extending from the electrode pattern 5h and the electrode pattern 5g becomes 25 μm × 100 μm × 2.

[0076] The capacitor C1 has a structure in which the capacitor element C1a formed by the electrode pattern 5f and the electrode pattern 5g is connected in series with the capacitor element C1b formed by the electrode pattern 5g and the electrode pattern 5h (including a part of the wiring pattern 6h). Therefore, the capacitance of the capacitor C1 can be obtained by dividing the product of the capacitances of the capacitor element C1a and the capacitor element C1b by the sum of the two. Similarly, the area of the electrode that is effective as capacitance in the capacitor C1 can be obtained by dividing the product of the area of the electrode effective for the capacitor element C1a (the area of the electrode pattern 5f) and the area of the electrode effective for the capacitor element C1b (the area including the electrode pattern 5h and a part of the wiring pattern 6h) by the sum of the two. Therefore, in the above specific example, the area of the electrode that is effective as capacitance in the capacitor C1 can be obtained as approximately 23684 μm 2 .

[0077] To make Figure 6 the area of the electrode that is effective as capacitance in the capacitor Cb shown in (b) of 2 become approximately 23684 μm 2 , it is necessary to set the area of the electrode pattern 5c to 150 μm × 315.8 μm, the area of the electrode pattern 5d to 200 μm × 365.8 μm, and the area of the electrode pattern 5e to 150 μm × 315.8 μm.

[0078] Since the dimensional deviations in the manufacturing process occur as independent events with respect to the electrode pattern, when calculating based on the idea of error propagation that the dimensional deviation is 50 μm, the change amount ΔS of the area of the electrodes in the capacitor C1 is approximately 35355 μm 2 . On the other hand, Figure 6 the change amount ΔS of the area of the electrodes in the capacitor Cb shown in (b) of 2 is approximately 36471 μm

[0079] The capacitor C1 can suppress the change amount ΔS of the electrode area by about 3% compared to the capacitor Cb. This is because, in the capacitor C1, the change in the area of the wiring pattern 6h in the length direction of the wiring pattern 6h can be ignored. Therefore, in the capacitor C1, since there is the wiring pattern 6h, which extends from the side of the electrode pattern 5g that overlaps when viewed from above in the stacking direction, the capacitance variation of the capacitor C1 during the manufacturing process can be reduced.

[0080] In addition, the area of the electrode pattern 5g of the capacitor C1 becomes 200 μm × 350 μm = 70000 μm 2 , but Figure 6 the area of the electrode pattern 5d of the capacitor Cb shown in (b) of 2 does not have the wiring pattern 6h of the capacitor C1, so the electrode pattern 5e needs to be increased, and by including a margin considering the offset during manufacturing, it becomes 200 μm × 365.8 μm = 73160 μm

[0081] [Modified Example of Capacitor C1]

[0082] Next, a modified example of the capacitor C1 will be described. Figure 7 is a top view of the electrodes constituting the capacitor C1 of Modified Example 1. In Figure 7 , (a) shows an electrode in which the wiring pattern 6ha extends from the central part of the long side of the electrode pattern 5h. In addition, the wiring pattern 61ha shown by the dashed line represents the shape of the wiring pattern 6ha after the dimensional deviation occurs. The shape of the electrode pattern 5h when viewed from above in the stacking direction is a rectangular shape, and the wiring width of the wiring pattern 6ha is shorter than the length of one side of the electrode pattern 5h. Therefore, when viewing the combined shape of the electrode pattern 5h and the wiring pattern 6ha shown in (a) of Figure 7 from above in the stacking direction, this combined shape becomes a cross shape. In addition, it is not necessary to be like Figure 7In the case of (a), the connection position above and below the wiring pattern 6ha and the electrode pattern 5h is at the center, and furthermore, this connection position can also be at different positions above and below.

[0083] In Figure 7 the wiring pattern 6ha shown in (a) of [], the wiring width is shorter than the length of one side of the electrode pattern 5h, but in Figure 7 the wiring pattern 6hb shown in (b) of [], the wiring width is the same as the length of one side of the electrode pattern 5h. In Figure 7 (b) of [], an electrode where the wiring pattern 6hb extends from the long side of the electrode pattern 5h is illustrated. In addition, the wiring pattern 61hb shown by a dashed line represents the shape of the wiring pattern 6hb after dimensional deviation occurs. When looking down at the combined shape of the electrode pattern 5h and the wiring pattern 6hb from the stacking direction, this combined shape becomes a rectangular shape. In Figure 7 the case of (b) of [], in an actual structure, since the boundary between the electrode pattern 5h and the wiring pattern 6hb is not clear, when looking down from the stacking direction, with respect to the stacked electrode pattern 5g, the integrated pattern of the electrode pattern 5h and the wiring pattern 6hb only needs to extend from any one side of the electrode pattern 5g.

[0084] In Figure 7 (a) of [], wiring patterns 6ha are connected to the two long sides (opposite sides) of the electrode pattern 5h respectively, but it can also be a structure where a wiring pattern 6ha is connected to any one long side. Similarly, in Figure 7 (b) of [], wiring patterns 6hb are connected to the two long sides (opposite sides) of the electrode pattern 5h respectively, but it can also be a structure where a wiring pattern 6hb is connected to any one long side.

[0085] In addition, the wiring pattern is not limited to a structure connected to the long side of the electrode pattern 5h, and it can also be a structure connected to the short side of the electrode pattern 5h. In Figure 7 (c) of [], an electrode where the wiring pattern 6hc extends from the short side of the electrode pattern 5h is illustrated. In addition, the wiring pattern 61hc shown by a dashed line represents the shape of the wiring pattern 6hc after dimensional deviation occurs. When looking down at the combined shape of the electrode pattern 5h and the wiring pattern 6hc from the stacking direction, this combined shape becomes a letter T shape. Of course, although in Figure 7 (c) of [], a wiring pattern 6hc is connected to one short side of the electrode pattern 5h, it can also be a structure where wiring patterns 6hc are connected to both short sides. It is not necessary that Figure 7 in (c) of [] the connection position of the wiring pattern 6hc and the electrode pattern 5h is at the center, and it can also be made to be close to either the upper or lower side.

[0086] The capacitor C1 is described as having a structure in which two capacitor elements formed by electrode patterns 5f, 5g, and 5h respectively formed in each of three layers are connected in series, but it may also have a structure in which a plurality of capacitor elements formed by electrode patterns formed in each of four or more layers are connected in series. Figure 8 is a top view of the electrodes constituting the capacitor C1A of Modification 2. As Figure 8 shown, the capacitor C1A has a structure in which four capacitor elements formed by electrode patterns 5i to 5m respectively formed in each of five layers are connected in series.

[0087] The electrode pattern 5i has a rectangular shape, and wiring patterns 6i are connected to two short sides (opposite sides). In addition, the electrode pattern 51i indicated by a dashed line represents the shape of the electrode pattern 5i after dimensional deviation. The wiring pattern 61i indicated by a dashed line represents the shape of the wiring pattern 6i after dimensional deviation. The electrode pattern 5j has a rectangular shape with a larger area than the electrode pattern 5i. In addition, the electrode pattern 51j indicated by a dashed line represents the shape of the electrode pattern 5j after dimensional deviation.

[0088] The electrode pattern 5k has a rectangular shape with a smaller area than the electrode pattern 5j. In addition, the electrode pattern 51k indicated by a dashed line represents the shape of the electrode pattern 5k after dimensional deviation. The structure of the electrode patterns 5j to 5k is such that the electrode pattern 5i with a smaller area and the electrode pattern 5k sandwich the electrode pattern 5j with a larger area in the stacking direction.

[0089] Furthermore, the electrode pattern 5l has a rectangular shape with a larger area than the electrode pattern 5k. In addition, the electrode pattern 51l indicated by a dashed line represents the shape of the electrode pattern 5l after dimensional deviation.

[0090] The electrode pattern 5m has a rectangular shape, and wiring patterns 6m are connected to two long sides (opposite sides). In addition, the electrode pattern 51m indicated by a dashed line represents the shape of the electrode pattern 5m after dimensional deviation. The wiring pattern 61m indicated by a dashed line represents the shape of the wiring pattern 6m after dimensional deviation. The structure of the electrode patterns 5k to 5m is such that the electrode pattern 5k with a smaller area and the electrode pattern 5m sandwich the electrode pattern 5l with a larger area in the stacking direction.

[0091] The capacitor C1A can ignore the change in the area of the wiring pattern 6i in the length direction of the wiring pattern 6i by connecting the wiring pattern 6i to the electrode pattern 5i, and can ignore the change in the area of the wiring pattern 6m in the length direction of the wiring pattern 6m by connecting the wiring pattern 6m to the electrode pattern 5m, and thus can suppress the change in capacitance.

[0092] The capacitor C1A only needs to have a structure in which two electrode patterns with a smaller area sandwich an electrode pattern with a larger area in the up and down directions of the stacking direction, and in each structure, a wiring pattern is connected to one of the electrode patterns with a smaller area. The wiring pattern only needs to extend at least partially from one side of the electrode that overlaps when viewed from the stacking direction.

[0093] As for the capacitor C1A, as Figure 8 shown, the areas of the electrode patterns 5i, 5k, and 5m provided above and below the electrode patterns 5j and 5l with a larger area in the stacking direction can be either all the same area or different areas. That is to say, the areas of the electrode patterns 5i, 5k, and 5m only need to be smaller than the areas of the electrode patterns 5j and 5l.

[0094] Similarly, as for the capacitor C1, as Figure 5 shown, the areas of the electrode patterns 5f and 5h provided above and below the electrode pattern 5g with a larger area in the stacking direction can be either all the same area or different areas. That is to say, the areas of the electrode patterns 5f and 5h only need to be smaller than the area of the electrode pattern 5g.

[0095] Figure 1 The structure in which the wiring pattern 6h is electrically connected to the external electrode 4a is illustrated for the capacitor C1 shown, but it can also be a structure in which the wiring pattern 6h is not electrically connected to the external electrode 4a. Similarly, the wiring patterns 6i and 6m of the capacitor C1A can also be either a structure electrically connected to the external electrode or a structure not electrically connected to the external electrode.

[0096] An example in which the capacitors C1 and C1A are used in a filter device is illustrated, but as long as it is an electronic component in which capacitors are formed by connecting in series elements composed of electrodes formed in at least three layers respectively, the structures of the capacitors C1 and C1A can be adopted in any component.

[0097] As described above, the filter device 100 of the embodiment includes: an insulator 3 having a pair of main surfaces facing each other and side surfaces connecting the main surfaces; and a capacitor C1 formed by connecting in series elements composed of electrodes formed in at least three layers in the insulator 3. In the capacitor C1, the electrode patterns 5f to 5h formed in each layer are arranged at overlapping positions when viewed from the stacking direction, and at least one wiring pattern 6h is electrically connected to the electrode pattern 5h formed in at least one layer. At least a part of the wiring pattern 6h extends from one side of the overlapping electrode pattern 5g when viewed from the stacking direction.

[0098] Thus, in the filter device 100 of the embodiment, the capacitor C1 formed by serially connecting elements each constituted by electrode patterns 5f to 5h formed in respective layers of at least three layers includes the electrode pattern 5h connected to the wiring pattern 6h, and the wiring pattern 6h extends from one side of the overlapping electrode pattern 5g. Therefore, while suppressing the proportion of the area occupied by the capacitor C1 in the filter device 100, it is possible to reduce the capacitance variation of the capacitor C1 during the manufacturing process.

[0099] (Solution)

[0100] (1) The electronic component of the present disclosure includes: an insulator having a pair of main surfaces facing each other and side surfaces connecting the main surfaces; and a capacitor formed by serially connecting elements each constituted by electrodes formed in respective layers of at least three layers in the insulator. In the capacitor, the electrodes formed in respective layers are arranged at overlapping positions when viewed from the stacking direction, and at least one wiring pattern is electrically connected to the electrode formed in at least one layer, and at least a part of the wiring pattern extends from one side of the electrode that overlaps when viewed from the stacking direction.

[0101] Thus, in the electronic component of the present disclosure, the capacitor formed by serially connecting elements each constituted by electrodes formed in respective layers of at least three layers includes the electrode connected to the wiring pattern, and the wiring pattern extends from one side of the overlapping electrode. Therefore, while suppressing the proportion of the area occupied by the capacitor in the electronic component, it is possible to reduce the capacitance variation of the capacitor during the manufacturing process.

[0102] (2) Based on the electronic component described in (1), the capacitor is composed of three layers, including: a first electrode formed in the first layer; a second electrode formed in the second layer, which overlaps the first electrode when viewed from the stacking direction; and a third electrode formed in the third layer, which overlaps the second electrode when viewed from the stacking direction. At least a part of the wiring pattern connected to the third electrode extends from one side of the second electrode. Thus, in the capacitor composed of three layers, while suppressing the proportion of the area occupied by the capacitor in the electronic component, it is possible to reduce the capacitance variation of the capacitor during the manufacturing process.

[0103] (3) Based on the electronic component described in (2), the area of the second electrode of the capacitor is larger than the area of the first electrode and larger than the area of the third electrode. Thus, the capacitance of the capacitor is determined by the areas of the first electrode and the third electrode.

[0104] (4) Based on the electronic component described in any one of (1) to (3), a part of the wiring pattern extends from one side of the electrode that overlaps when viewed from the stacking direction and the side opposite to the one side. Thus, the change in the area of the wiring pattern in the extending direction does not affect the capacitance change of the capacitor.

[0105] (5) Based on the electronic component described in any one of (1) to (4), the electronic component further includes an external electrode provided on the side surface of the insulator, and the wiring pattern is electrically connected to the external electrode. Thus, power can be supplied from the external electrode to the electrode through the wiring pattern.

[0106] (6) Based on the electronic component described in any one of (1) to (5), the electronic component further includes an inductor formed on a layer different from the capacitor, and the inductor is connected in series with the capacitor. Thus, the electronic component can constitute a filter device with the inductor and the capacitor.

[0107] (7) Based on the electronic component described in any one of (1) to (6), the shape of the electrode of the capacitor when viewed from the stacking direction is a rectangular shape, and the wiring width of the wiring pattern is shorter than the length of one side of the electrode connected to the wiring pattern. Thus, the degree of freedom in the position where the wiring pattern is connected to the electrode is increased.

[0108] (8) Based on the electronic component described in any one of (1) to (6), the wiring width of the wiring pattern is the same as the length of one side of the electrode connected to the wiring pattern. Thus, the shape of the electrode connected to the wiring pattern becomes a rectangular shape.

[0109] (9) Based on the electronic component described in any one of (1) to (7), when viewing the combined shape of the electrode of the capacitor and the wiring pattern connected to the electrode from the stacking direction, the combined shape is a cross shape or a letter T shape. Thus, the degree of freedom in the position where the wiring pattern is connected to the electrode is increased.

[0110] (10) Based on the electronic component described in (6), the inductor has a first inductor and a second inductor connected in parallel with the first inductor. Thus, the electronic component can constitute a filter device with multiple inductors and a capacitor.

[0111] (11) Based on the electronic component described in (10), the second inductor is magnetically coupled with the first inductor. Thus, the electronic component can utilize the mutual inductance between the first inductor and the second inductor.

[0112] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The scope of the present utility model is shown by the claims, rather than by the above description, and the scope of the present utility model is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

[0113] Description of Reference Numerals

[0114] 1a to 1c, 2d to 2f, conductor patterns; 3, insulator; 3a to 3k, insulating substrates; 4a, 4b, external electrodes; 31 to 37, via conductors; 100, filter device; C1, C1A, Ca, Cb, capacitors; C1a, C1b, capacitor elements; L1, L2, inductors.

Claims

1. An electronic component, characterized in that, the electronic component includes: an insulator having a pair of main surfaces facing each other and side surfaces connecting the main surfaces; and a capacitor formed by connecting in series elements each composed of electrodes formed in at least three layers in the insulator, in the capacitor, the electrodes formed in each layer are arranged at overlapping positions when viewed from above in the stacking direction, at least one wiring pattern is electrically connected to the electrodes formed in at least one layer, at least a part of the wiring pattern extends from one side of the electrodes that overlap when viewed from above in the stacking direction and the side opposite to the one side.

2. The electronic component according to claim 1, characterized in that, the capacitor is composed of three layers, including: a first electrode formed in the first layer; a second electrode formed in the second layer, which overlaps the first electrode when viewed from above in the stacking direction; and a third electrode formed in the third layer, which overlaps the second electrode when viewed from above in the stacking direction, at least a part of the wiring pattern connected to the third electrode extends from one side of the second electrode.

3. The electronic component according to claim 2, characterized in that, the area of the second electrode of the capacitor is larger than the area of the first electrode and larger than the area of the third electrode.

4. The electronic component according to any one of claims 1 to 3, characterized in that, the electronic component further includes an external electrode provided on the side surface of the insulator, the wiring pattern is electrically connected to the external electrode.

5. The electronic component according to any one of claims 1 to 3, characterized in that, the electronic component further includes an inductor formed in a layer different from the capacitor, the inductor is connected in series with the capacitor.

6. The electronic component according to any one of claims 1 to 3, characterized in that, the shape of the electrodes of the capacitor when viewed from above in the stacking direction is a rectangular shape, the wiring width of the wiring pattern is shorter than the length of one side of the electrode connected to the wiring pattern.

7. The electronic component according to any one of claims 1 to 3, characterized in that, the wiring width of the wiring pattern is the same as the length of one side of the electrode connected to the wiring pattern.

8. The electronic component according to any one of claims 1 to 3, characterized in that, when viewing the combined shape of the electrodes of the capacitor and the wiring pattern connected to the electrodes from above in the stacking direction, the combined shape is a cross shape or a letter T shape.

9. The electronic component according to claim 5, characterized in that, the inductor has a first inductor and a second inductor connected in parallel with the first inductor.

10. The electronic component according to claim 9, characterized in that, the second inductor is magnetically coupled with the first inductor.

Images