Device for detecting wafer protrusion

Abstract

The utility model provides a device for detecting wafer protrusion. The device for detecting wafer protrusion comprises a tab rod, a rotating shaft, a pressing plate and a photoelectric switch, the optoelectronic switch is installed on the upper end face of a scanning module of the scanning device, the protruding piece rod is arranged on the upper end face of the scanning module, and the protruding piece rod is higher than the sensor in the vertical direction; the rotating shaft is fixedly arranged at the end of the upper end face of the scanning module through the pressing plate, the protruding piece rod is rotationally arranged on the rotating shaft, one end of the protruding piece rod penetrates through the rotating shaft and extends out of the scanning module, the other end of the protruding piece rod is located at the detection end of the optoelectronic switch, and the extending length of the protruding piece rod is smaller than the length of the protruding piece rod on the end face of the scanning module. According to the device for detecting wafer protrusion provided by the utility model, the defects that a protrusion piece detection device in the prior art needs to be provided with a sensor at each station, and a plurality of detectors can be installed under the condition of multiple stations, so that the cost is high are overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip transfer, in particular to a device for detecting wafer protrusion. Background Art

[0002] Generally, when transporting chips, we need to know how many wafers are in the wafer cassette. Therefore, sensors installed on the robot arm are used to scan the number of wafers to determine the position of the wafers. However, in this process, there may be a situation where the wafers protrude. If the sensor collides with the protruding wafer, the wafer will be damaged. Therefore, the prior art has developed a tab detection device to determine whether the wafer protrudes. It installs sensors at each station to determine whether the wafer protrudes. When the wafer protrudes, the sensor emits a light source from the emitting end. When it hits the protruding wafer above, the light source will be reflected to the receiving end to determine whether the wafer protrudes, and the robot arm will perform MAPPING to determine whether there is a protruding situation. However, if there are many stations, multiple detectors will be installed, increasing the installation cost.

[0003] In summary, the tab detection device of the prior art needs to install a sensor at each station. If there are many stations, multiple detectors will be installed, thus having the defect of high cost. Summary of the Utility Model

[0004] In order to solve the above problems, the utility model provides a device for detecting wafer protrusion to solve the above defects existing in the prior art.

[0005] According to the first aspect of the utility model, a device for detecting wafer protrusion is provided. The device for detecting wafer protrusion is installed on the scanning device of the robot arm and includes:

[0006] A tab rod, a rotating shaft, a pressing plate and a photoelectric switch;

[0007] The photoelectric switch is installed on the upper end surface of the scanning module of the scanning device. The tab rod is arranged on the upper end surface of the scanning module and is located in the middle of the sensors installed on both sides of the scanning module. The tab rod is set higher than the sensors in the vertical direction;

[0008] The rotating shaft is fixedly arranged at the end of the upper end surface of the scanning module through the pressing plate. The tab rod is rotatably arranged on the rotating shaft. One end of the tab rod extends through the rotating shaft to the outside of the scanning module. The other end of the tab rod is located at the detection end of the photoelectric switch, and the extended length of the tab rod is less than the length of the tab rod on the end surface of the scanning module.

[0009] Optionally, the vertical distance between the tab rod and the sensor is 3-5 mm.

[0010] Optionally, the material of the tab rod is polyetheretherketone semiconductor special plastic material.

[0011] Optionally, both the manipulator and the photoelectric switch are connected to the control system.

[0012] Optionally, one end of the scanning module is a large U-shaped structure, and a small U-shaped structure with the same orientation is provided inside the U-shaped opening of the large U-shaped structure. Two sensors are respectively installed on the large U-shaped structure, and the rotating shaft and the pressing plate are both installed on the small U-shaped structure.

[0013] With a device for detecting wafer protrusion of the present utility model, the device for detecting wafer protrusion is installed on the scanning device of the manipulator. The photoelectric switch is installed on the upper end surface of the scanning module of the scanning device. The tab rod is arranged on the upper end surface of the scanning module and is located in the middle of the sensors installed on both sides of the scanning module. The tab rod is set higher than the sensors in the vertical direction; the rotating shaft is fixedly arranged at the end of the upper end surface of the scanning module through the pressing plate, the tab rod is rotatably arranged on the rotating shaft, one end of the tab rod extends through the rotating shaft to the outside of the scanning module, the other end of the tab rod is located at the detection end of the photoelectric switch, and the length of the tab rod extending out is less than the length of the tab rod on the end surface of the scanning module. The structure of the present application is installed on the manipulator for detecting whether the wafer protrudes at multiple stations, reducing the installation cost. During use, the action of scanning the wafer is from the lowest point below the wafer cassette upwards. When the wafer is scanned and the wafer protrudes, the wafer will first touch the short side of the tab rod, which will cause the long side of the tab rod to tilt up and leave the detection end of the photoelectric switch. At this time, the photoelectric switch will judge as a stop action, causing the manipulator to stop and the wafer will not be damaged. Therefore, the present utility model solves the defect that the prior art tab detection device needs to install a sensor at each station. If there are many stations, multiple detectors will be installed, resulting in high costs. Description of the Drawings

[0014] Figure 1 FIG. 14 is a schematic structural diagram of the combination of the device for detecting wafer protrusion and the scanning device according to the present utility model;

[0015] Figure 2 FIG. 18 is a schematic structural diagram of the tab rod, the rotating shaft, the pressing plate and the photoelectric switch installed on the scanning module according to the present utility model;

[0016] Figure 3 FIG. 22 is a schematic structural diagram of the device for detecting wafer protrusion and the scanning device installed on the manipulator according to the present utility model;

[0017] Figure 4 FIG. 26 is a state diagram of detecting wafer protrusion according to the present utility model.

[0018] List of reference numerals:

[0019] 100, device for detecting wafer protrusion; 200, scanning device; 201, scanning module; 202, sensor; 10, tab rod; 20, rotating shaft; 30, pressing plate; 40, photoelectric switch. Detailed implementation manners

[0020] To make the objectives, technical solutions and advantages of the present utility model clearer, the following will further describe in detail the implementation manners of the present utility model with reference to the accompanying drawings.

[0021] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0022] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0023] Referring to Figures 1 to 4 , the present utility model provides a device for detecting wafer protrusion, which can solve the defect that the existing tab detection device needs to install a sensor at each station. If there are many stations, multiple detectors need to be installed, resulting in high costs.

[0024] A device for detecting wafer protrusion provided by the present utility model, the device 100 for detecting wafer protrusion is installed on the scanning device 200 of the manipulator, and includes:

[0025] Tab rod 10, rotating shaft 20, pressing plate 30 and photoelectric switch 40;

[0026] The photoelectric switch 40 is installed on the upper end surface of the scanning module 201 of the scanning device 200. The tab rod 10 is arranged on the upper end surface of the scanning module 201 and is located in the middle of the sensors 202 installed on both sides of the scanning module 201. The tab rod 10 is arranged higher than the sensors 202 in the vertical direction;

[0027] The rotating shaft 20 is fixedly arranged at the end of the upper end surface of the scanning module 201 through a pressing plate. The tab rod 10 is rotatably arranged on the rotating shaft 20. One end of the tab rod 10 passes through the rotating shaft 20 and extends to the outside of the scanning module 201. The other end of the tab rod 10 is located at the detection end of the photoelectric switch 40, and the extended length of the tab rod 10 is less than the length of the tab rod 10 on the end surface of the scanning module 201.

[0028] Among them, the tab rod 10, the rotating shaft 20, the pressing plate 30 and the photoelectric switch 40 are all existing products, and only need to achieve the effects and functions in this application.

[0029] The manipulator and the scanning device 200 are also both existing products. Among them, the manipulator can move up or down in the vertical direction, can rotate itself, and the arm can extend forward and backward.

[0030] A device for detecting wafer protrusion provided by the present utility model. The device 100 for detecting wafer protrusion is installed on the scanning device 200 of the manipulator. The photoelectric switch 40 is installed on the upper end surface of the scanning module 201 of the scanning device 200. The tab rod 10 is arranged on the upper end surface of the scanning module 201 and is located in the middle of the sensors 202 installed on both sides of the scanning module 201. The tab rod 10 is arranged higher than the sensors 202 in the vertical direction.

[0031] The rotating shaft 20 is fixedly arranged at the end of the upper end surface of the scanning module 201 through a pressing plate. The tab rod 10 is rotatably arranged on the rotating shaft 20. One end of the tab rod 10 passes through the rotating shaft 20 and extends to the outside of the scanning module 201. The other end of the tab rod 10 is located at the detection end of the photoelectric switch 40, and the extended length of the tab rod 10 is less than the length of the tab rod 10 on the end surface of the scanning module 201. By installing the structure of this application on the manipulator for detecting whether the wafers at multiple stations protrude, the installation cost is reduced. During the use process, the action of scanning the wafers is from the lowest position below the wafer cassette upwards. When scanning the wafers, in the case of wafer protrusion, the wafer will first touch the short side of the tab rod 10, which will cause the long side of the tab rod 10 to tilt up and leave the detection end of the photoelectric switch 40. At this time, the photoelectric switch 40 will judge it as a stop action, making the manipulator stop and the wafer will not be damaged. Therefore, the present utility model solves the defect that the existing tab detection device needs to install a sensor at each station. If there are many stations, multiple detectors will be installed, resulting in high costs.

[0032] Refer to Figure 4 , optionally, the vertical distance between the tab rod 10 and the sensor 202 is 3 - 5 mm.

[0033] Among them, the tab rod 10 is set higher than the sensor 202, so that when detecting from the lowest point to the highest point, the protruding part of the wafer first touches the tab rod 10. If the vertical distance between the tab rod 10 and the sensor 202 is less than 3 - 5 mm, the sensor 202 will touch the protruding part of the wafer. If the vertical distance between the tab rod 10 and the sensor 202 is greater than 3 - 5 mm, it is not conducive to the sensor to detect the number of wafers.

[0034] Optionally, the material of the tab rod 10 is a special plastic material for polyether ether ketone (PEEK) semiconductors.

[0035] Among them, when the tab rod 10 touches the wafer, due to the material of the above tab rod 10, the wafer will not be damaged, and when the tab rod 10 touches the wafer, it will rotate upward without causing damage to the wafer.

[0036] Optionally, both the manipulator and the photoelectric switch 40 are connected to the control system.

[0037] Among them, when the long end of the tab rod 10 leaves the detection end of the photoelectric switch 40, at this time, the photoelectric switch 40 will make a judgment of the stop action and transmit the signal to the control system. The control system controls the manipulator to stop moving, so that the wafer will not be damaged.

[0038] Refer to Figure 2 , optionally, one end of the scanning module 201 is a large U-shaped structure, and a small U-shaped structure with the same orientation is arranged inside the U-shaped opening of the large U-shaped structure. Two sensors 202 are respectively installed on the large U-shaped structure, and the rotating shaft 20 and the pressing plate 30 are both installed on the small U-shaped structure.

[0039] In summary, during the use process, the action of scanning the wafer is from the lowest point below the wafer cassette upwards. When the wafer is scanned and the wafer protrudes, the wafer will first touch the short side of the tab rod. The short side of the tab rod rotates downward relative to the rotating shaft, and the long side of the tab rod will be lifted up and leave the detection end of the photoelectric switch. At this time, the photoelectric switch 40 will make a judgment of the stop action and transmit the signal to the control system. The control system controls the manipulator to stop moving, so that the wafer will not be damaged.

[0040] It should be noted that not all steps and modules in the above-mentioned various processes and system structure diagrams are necessary, and some steps or modules can be ignored according to actual needs. The execution order of each step is not fixed and can be adjusted according to needs. The system structures described in the above-mentioned various embodiments can be physical structures or logical structures. That is, some modules may be implemented by the same physical entity, or some modules may be implemented by multiple physical entities respectively, or some components in multiple independent devices can be jointly implemented.

[0041] In the above embodiments, the hardware module can be implemented mechanically or electrically. The present utility model has been shown and described in detail above through the drawings and preferred embodiments. However, the present utility model is not limited to these disclosed embodiments. Based on the above-mentioned multiple embodiments, those skilled in the art can know that code review means in different above-mentioned embodiments can be combined to obtain more embodiments of the present utility model, and these embodiments are also within the protection scope of the present utility model.

Claims

1. A device (100) for detecting wafer protrusion, the device (100) for detecting wafer protrusion being installed on a scanning device (200) of a robot, characterized in that: include: A tab rod (10), a rotating shaft (20), a pressing plate (30) and a photoelectric switch (40); The photoelectric switch (40) is mounted on the upper end surface of the scanning module (201) of the scanning device (200); the protruding bar (10) is arranged on the upper end surface of the scanning module (201) and is located in the middle of the sensors (202) mounted on both sides of the scanning module (201); the protruding bar (10) is arranged higher than the sensors (202) in the vertical direction; The rotating shaft (20) is fixedly arranged at the end of the upper end surface of the scanning module (201) through the pressure plate, and the protruding rod (10) is rotatably arranged on the rotating shaft (20), one end of the protruding rod (10) passes through the rotating shaft (20) and extends to the outside of the scanning module (201), and the other end of the protruding rod (10) is located at the detection end of the photoelectric switch (40), and the extended length of the protruding rod (10) is less than the length of the protruding rod (10) at the end surface of the scanning module (201).

2. The device for detecting wafer protrusion according to claim 1, characterized in that: The vertical distance between the tab rod (10) and the sensor (202) is 3-5 mm.

3. The device for detecting wafer protrusion according to claim 2, characterized in that: The material of the protruding piece rod (10) is a plastic material specially used for polyetheretherketone semiconductors.

4. The device for detecting wafer protrusion according to claim 3, characterized in that: The manipulator and the photoelectric switch (40) are both connected to a control system.

5. The device for detecting wafer protrusion according to claim 4, characterized in that: One end of the scanning module (201) is a large U-shaped structure, and a small U-shaped structure with the same orientation is provided inside the large U-shaped opening. The two sensors (202) are respectively mounted on the large U-shaped structure, and the rotating shaft (20) and the pressure plate (30) are both mounted on the small U-shaped structure.

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